ESDCAN03-2BM3Y
Datasheet
Automotive dual-line TVS in DFN for CAN bus
Product status link
ESDCAN03-2BM3Y
Product summary
Order code ESDCAN03-2BM3Y
Features
• AEC-Q101 qualified
• Bidirectional dual-line ESD and EOS protection
• Trigger voltage, V
TRIG
min = 28 V and low clamping factor V
CL
/ V
TRIG
• QFN-3L 1.1 x 1.0 x 0.55 package also called DFN1110
• Max pulse current to 3.3 A (8/20 μs)
• Low leakage current
• ECOPACK2 ROHS compliant component
Complies with the following standards
• J-STD-020 MSL level 1 and UL94, V0
• IPC7531 footprint and JEDEC registered package
• ISO 16750-2 (Jump start and reversed battery tests)
• ISO 10605 / IEC 61000-4-2- C = 150 pF, R = 330 Ω, exceeds level 4:
– ±15 kV (contact discharge)
– ±30 kV (air discharge)
• ISO 10605 - C = 330 pF, R = 2 kΩ:
– ±30 kV (contact and air discharge)
• ISO 10605 - C = 330 pF, R = 330 Ω:
– ±12 kV (contact discharge)
– ±30 kV (air discharge)
• ISO 7637-3:
– Pulse 3a/3b: +/-150 V
– Pulse 2a: +/- 85 V
Applications
Automotive controller area network where an electrostatic discharge or another transient surge may damage the CAN transceiver or an integrated circuit (IC) featuring a CAN PHY. This product is compliant with most of automotive interfaces.
Description
This device is a dual-line transient voltage suppressor (TVS) specifically designed to protect the CAN H and CAN L pins of an automotive CAN transceiver against electrostatic discharge (ESD) and ISO 7637-3.
The ESDCAN03-2BM3Y complies with all the physical layer constraints (jump start, reverse polarity, …) without compromising the low clamping voltage for an efficient
CAN bus protection.
The low line capacitance of each ESD diode makes this CAN protection compatible not only with CAN-FD but also with high speed and high data rate buses like
FlexRay, USB and more.
DS13559 - Rev 3 - September 2021
For further information contact your local STMicroelectronics sales office.
www.st.com
ESDCAN03-2BM3Y
Characteristics
1
Characteristics
Symbol
V
PP
I
PP
T j
T stg
Table 1. Absolute ratings (T amb
= 25 °C)
Peak pulse voltage
Parameter
IEC 61000-4-2 / ISO 10605 - C = 150 pF, R = 330 Ω:
Contact discharge
Air discharge
ISO 10605 - C = 330 pF, R = 330 Ω:
Contact discharge
Air discharge
ISO 10605 - C = 330 pF, R = 2 kΩ:
Contact discharge
Air discharge
Peak pulse current (8/20 μs)
Operating junction temperature range
Storage temperature range
Figure 1. Electrical characteristics (definitions)
I
Symbol
V
Trig
V
CL
I
RM
V
RM
I
PP
R
D
V
H
C
LINE
=
=
=
=
=
=
=
=
Parameter
Trigger voltage
Clamping voltage
Leakage current @V
RM
Stand-off voltage
Peak pulse current
Dynamic resistance
Holding voltage
Input capacitance per line
V
CL
V
RM
V
Trig V
H
I
RM
I
PP
Value
±15
±30
±12
±30
±30
±30
3.3
-55 to +175
-55 to +175
Unit kV
A
°C
°C
R
D
V
DS13559 - Rev 3 page 2/15
ESDCAN03-2BM3Y
Characteristics
Table 2. Electrical characteristics (T amb
= 25 °C)
Symbol
V
Trig
Parameter
Trigger voltage, higher voltage than V
TRIG guarantees the protection turn-on
I
V
H
RM
Holding voltage, lower voltage than V
H
guarantees the protection turn-off
Leakage current
C
V
CL
LINE
ΔC
LINE
Clamping voltage
Line capacitance
Line capacitance variation between IO1 and IO2 versus GND
V
RM
= 24 V
ISO7637-3 pulse 3a at -150 V min.
ISO7637-3 pulse 3b at +150 V max.
8/20 µs waveform, I
PP
= 3 A
V
LINE
= 0 V, f = 1 MHz, V
OSC
= 30 mV
V
LINE
Test condition
= 0 V, f = 1 MHz, V
OSC
= 30 mV
Min. Typ. Max. Unit
28
24
-36
36
50 nA
V
32 36.5
3.3
3.6
pF
0.01 0.05
V
V pF
DS13559 - Rev 3 page 3/15
ESDCAN03-2BM3Y
Characteristics (curves)
1.1
Characteristics (curves)
Figure 2. Maximum peak current versus initial junction temperature (8/20 µs exponential waveform)
4
I
PP
(A)
8/20 µs
Figure 3. Maximum peak pulse current versus exponential pulse duration
10
I
PP
(A)
T j initial = 25 ° C
3
2 1
1
0
0 25 50 75 100 125 150 175
T j
(°C)
200
0.1
0.01
0.1
t p
(ms)
1
Figure 4. Peak pulse current versus clamping voltage
(8/20 µs exponential waveform)
10
I
PP
(A)
8/20 µs
Figure 5. Junction capacitance versus reverse applied voltage
10
C (pF) f = 1 MHz
V osc
T j
= 30 mV
= 25 °C
RMS
1
0.1
20 25 30 35
V
CL
(V)
40
Figure 6. Leakage current versus junction temperature
100
I
R (nA)
V
R = 24 V
10
1
0.1
25 50 75 100 125 150
Tj( ° C)
175
1
0 5 10 15 20
V
R
( V)
Figure 7. TLP
30
I (A)
20
10
0
-10
-20
-30
-50 -40 -30 -20 -10 0 10 20 30 40
V( V)
50
DS13559 - Rev 3 page 4/15
ESDCAN03-2BM3Y
Characteristics (curves)
Figure 8. Response to ISO 10605 -C = 150 pF, R = 330 Ω
(-8 kV contact)
Figure 9. Response to ISO 10605 - C = 150 pF, R = 330 Ω
(+8 kV contact )
Figure 10. Response to ISO 7637-3 Pulse 3a: -150 V Figure 11. Response to ISO 7637-3 Pulse 3b : +150 V
Figure 12. Response to ISO 7637-3 pulse 2a: -85 V Figure 13. Response to ISO 7637-3 pulse 2a: +85 V
Note: DCC (direct capacitive coupling) for
Figure 10 , Figure 11
,
Figure 12 and Figure 13
.
DS13559 - Rev 3 page 5/15
Figure 14. S21 measurements results
ESDCAN03-2BM3Y
Characteristics (curves)
DS13559 - Rev 3 page 6/15
2
2.1
ESDCAN03-2BM3Y
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com
. ECOPACK is an ST trademark.
QFN-3L 1.1 x 1.0 x 0.55 package information
Figure 15. QFN-3L 1.1 x 1.0 x 0.55 package outline
Note: The marking codes can be rotated to differentiate assembly location. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose.
DS13559 - Rev 3 page 7/15
ESDCAN03-2BM3Y
QFN-3L 1.1 x 1.0 x 0.55 package information
Table 3. QFN-3L 1.1 x 1.0 x 0.55 package mechanical data
Dimensions
Ref.
D2 e
E
E2
K
L
L1
A
A1 b
D
N
CD
CW
WF
Min.
0.51
0.00
0.20
0.95
0.25
1.05
0.65
0.20
0.15
0.00
0.23
0.02
0.14
Millimeters
Typ.
0.55
0.02
0.25
1.00
0.40
0.33
1.10
0.80
0.25
0.05
3
0.05
0.15
Max.
0.60
0.05
0.30
1.05
0.50
1.15
0.90
0.35
0.10
0.08
1. Values in inches are converted from mm and rounded to 4 decimal digits.
0.0091
0.0008
0.0055
Min.
0.0201
0.000
0.0079
0.0374
0.0098
0.0413
0.0256
0.0079
0.0059
0.000
0.0098
0.0020
3
0.0020
0.0059
Inches (1)
Typ.
0.0217
0.0008
0.0098
0.0394
0.0157
0.0130
0.0433
0.0315
Max.
0.0236
0.0020
0.0118
0.0413
0.0197
0.0453
0.0354
0.0138
0.0039
0.0031
DS13559 - Rev 3 page 8/15
ESDCAN03-2BM3Y
Packing information
2.2
Packing information
Figure 16. Marking
XX
Figure 17. Package orientation in reel
The marking can be rotated to differentiate assembly location
Figure 18. Tape and reel orientation
Figure 19. 7'' reel dimension values
Ø 180 max
14.4
2 ± 0.5
Ø 13
Ø 60 Ø 20.2 min
Figure 20. Inner box dimension values
30
205
205
DS13559 - Rev 3 page 9/15
Figure 21. Tape outline
ESDCAN03-2BM3Y
Packing information
DS13559 - Rev 3
Ref.
D0
D1
F
K0
P0
P1
P2
W
Min.
1.50
0.55
3.45
0.67
3.90
3.90
1.95
7.90
Table 4. Tape dimension values
Dimensions
Millimeters
Typ.
1.55
0.60
3.50
0.70
4.00
4.00
2.00
8.00
Max.
1.60
0.65
3.55
0.73
4.10
4.10
2.05
8.10
page 10/15
3
Recommendation on PCB assembly
3.1
Footprint
SMD footprint design is recommended.
Figure 22. Recommended footprint in mm
ESDCAN03-2BM3Y
Recommendation on PCB assembly
3.2
Stencil opening design
1.
Reference design a.
Stencil opening thickness: 100 μm / 4 mils b.
I/O (pin 1 and pin 2) pads stencil aperture ratio: 90% c.
GND (pin 3) pad stencil aperture ratio: 50%
Figure 23. Recommended stencil window position in mm
3.3
Wettable flank profile
Figure 24. Wettable flank profile
DS13559 - Rev 3 page 11/15
3.4
3.5
3.6
3.7
ESDCAN03-2BM3Y
Solder paste
Solder paste
1.
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2.
“No clean” solder paste is recommended.
3.
Offers a high tack force to resist component movement during high speed.
4.
Use solder paste with fine particles: powder particle size is 20-38 μm.
Placement
1.
Manual positioning is not recommended.
2.
It is recommended to use the lead recognition capabilities of the placement system, not the outline centering
3.
Standard tolerance of ±0.05 mm is recommended.
4.
1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages.
5.
To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool.
6.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools.
PCB design preference
1.
To control the solder paste amount, the closed via is recommended instead of open vias.
2.
The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away.
Reflow profile
Figure 25. ST ECOPACK recommended soldering reflow profile for PCB mounting
250
Temperature (°C)
200
150
100
50
0 30
0.9 °C/s
60
2 - 3 °C/s
240-245 °C
60 sec
(90 max)
-2 °C/s
-3 °C/s
-6 °C/s
90 120 150
Time (s)
180 210 240 270 300
Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020.
DS13559 - Rev 3 page 12/15
4
ESDCAN03-2BM3Y
Ordering information
Ordering information
Table 5. Ordering information
Order code
ESDCAN03-2BM3Y
Marking
YA
(1)
Package
QFN-3L 1.1 x 1.0 x 0.55
Weight
1.68 mg
1. The marking can be rotated by multiples of 90° to differentiate assembly location
Base qty.
5000
Delivery mode
Tape and reel
DS13559 - Rev 3 page 13/15
Revision history
Date
05-Nov-2020
08-Jan-2021
29-Sep-2021
Revision
1
2
3
Table 6. Document revision history
Changes
First issue.
Updated Table 1
and
Table 2
.
Updated Table 1
.
ESDCAN03-2BM3Y
DS13559 - Rev 3 page 14/15
ESDCAN03-2BM3Y
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© 2021 STMicroelectronics – All rights reserved
DS13559 - Rev 3 page 15/15
