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STTH802C
High efficiency ultrafast diode
$
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$
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$
Features
Suited for SMPS
Low losses
Low forward and reverse recovery time
High surge current capability
High junction temperature
ECOPACK
®
2 compliant component for DPAK on demand
Datasheet
-
production data
Description
Dual center tap rectifier suited for switched mode power supply and high frequency DC to DC converters.
Packaged in DPAK, this device is intended for use in low voltage, high frequency inverters, freewheeling and polarity protection applications.
Table 1. Device summary
Symbol Value
I
F(AV)
V
RRM
T j
(max)
V
F
(typ.) t rr
(typ.)
2 X 4 A
200 V
175 °C
0.81 V
13 ns
November 2016
This is information on a product in full production.
DocID8723 Rev 3 1/9 www.st.com
Characteristics
1 Characteristics
STTH802C
Table 2. Absolute ratings (limiting values at T j
= 25 °C per diode, unless otherwise specified)
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
Repetitive peak reverse voltage
Forward rms current
Average forward current,
= 0.5, square wave
T c
= 155 °C
T c
= 150 °C
Surge non repetitive forward current I
FSM
T stg
T j
Storage temperature range
Maximum operating junction temperature
Per diode
Per device t p
= 10 ms sinusoidal
200
10
4
8
50
-65 to +175
175
V
A
A
A
°C
°C
Symbol
Table 3. Thermal resistances
Parameter Unit
R th(j-c)
R th(c)
Junction to case
Coupling
Per diode
Total
Max. value
4
2.5
1.0
°C/W
When the diodes 1 and 2 are used simultaneously:
T j
(diode 1) = P(diode1) x R th(j-c)
(Per diode) + P(diode 2) x R th(c)
Table 4. Static electrical characteristics (per diode)
Parameter Test conditions Min.
Typ.
Symbol
I
R
(1)
V
F
(2)
Reverse leakage current
Forward voltage drop
T j
= 25 °C
T j
= 125 °C
T j
= 25 °C
T j
= 125 °C
T j
= 25 °C
T j
= 125 °C
V
R
= V
RRM
I
F
= 4 A
I
F
= 8 A
-
-
-
-
-
-
1.
Pulse test: t p
= 5 ms,
< 2%
2.
Pulse test: t p
= 380 µs,
< 2%
To evaluate the conduction losses, use the following equation:
P = 0.80 x I
F(AV)
+ 0.037 x I
F
2
(RMS)
2
0.81
0.95
Max.
4
40
1.10
0.95
1.25
1.10
Unit
µA
V
2/9 DocID8723 Rev 3
STTH802C Characteristics
Symbol t rr t fr
V
FP
Parameter
Table 5. Dynamic characteristics (per diode)
Test conditions
Min.
Typ.
Max.
Unit
Reverse recovery time
Forward recovery time
Forward recovery voltage
T j
= 25 °C
I
F
= 0.5 A
I
RR
= 0.25 A
I
R
= 1 A
I
F
= 4 A dI
F
/dt = 100 A/µs
V
FR
= 1.1 x V
Fmax
I
F
= 4A dI
F
/dt = 100 A/µs
-
-
13
50
2.4
20 ns ns
V
DocID8723 Rev 3 3/9
9
Characteristics STTH802C
Figure 1. Average forward power dissipation versus average forward current (per diode)
Figure 2. Forward voltage drop versus forward current (per diode)
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Figure 3. Relative variation of thermal impedance, junction to case, versus pulse duration
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Figure 4. Junction capacitance versus reverse applied voltage
(typical values, per diode)
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Figure 5. Reverse recovery charges versus dI
F
/dt (typical values, per diode)
Figure 6. Peak reverse recovery current versus dI
F
/dt (typical values, per diode)
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4/9 DocID8723 Rev 3
STTH802C Characteristics
Figure 7. Dynamic parameters versus junction temperature (reference: T j
= 125 °C)
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Figure 8. Thermal resistance, junction to ambient, versus copper surface under tab
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DocID8723 Rev 3 5/9
9
Package Information STTH802C
2.1
Epoxy meets UL94,V0
Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
DPAK package information
Figure 9. DPAK package outline
(
E
F
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7KHUPDOSDG
(
/
Note:
'
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+
/
5
H
H
E
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F
5
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9
*DXJH
SODQH
This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed.
6/9 DocID8723 Rev 3
STTH802C
Ref.
L
L2
L4
V2 e e1
H b b4 c c2
D
D1
E
E1
A
A1
A2
Package Information
Min.
2.18
0.90
0.03
0.64
4.95
0.46
0.46
5.97
4.95
6.35
4.32
4.40
9.35
1.00
0.60
-8°
Table 6. DPAK package mechanical data
Dimensions
Millimeters Inches
Typ.
Max.
2.40
1.10
0.23
0.90
5.46
0.61
0.60
6.22
5.60
6.73
5.50
Min.
0.085
0.035
0.001
0.025
0.194
0.018
0.018
0.235
0.194
0.250
0.170
Typ.
2.28
0.090
4.70
10.40
1.78
1.27
1.02
+8°
0.173
0.368
0.039
0.023
-8°
Figure 10. DPAK footprint dimensions (in mm)
0.185
0.409
0.070
0.050
0.040
8°
Max.
0.094
0.043
0.009
0.035
0.214
0.024
0.023
0.244
0.220
0.264
0.216
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DocID8723 Rev 3 7/9
9
Ordering Information STTH802C
Order code
STTH802CB-TR
Table 7. Ordering information
Marking Package Weight Base qty Delivery mode
STTH8 02CB DPAK 0.3 g 2500 Tape and reel
Date
26-Jun-2012
04-Nov-2014
02-Nov-2016
Table 8. Document revision history
Revision Description of Changes
1
2
3
First release.
Removed TO-220AB and TO-220FPAB package information.
Reformatted to current standard.
Updated DPAK package information and reformatted to current standard.
8/9 DocID8723 Rev 3
STTH802C
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2016 STMicroelectronics – All rights reserved
DocID8723 Rev 3 9/9
9
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