STPS15L45C
Datasheet
2 x 7.5 A - 45 V low drop power Schottky rectifier
K
A1
A2
K
K
A2
A1
DPAK
A1
A2
Features
• Very small conduction losses
• Negligible switching losses
• Extremely fast switching
• Low forward voltage drop
• Low capacitance
• Avalanche capability specified
• ECOPACK2 compliant component
Applications
• SMPS
• Freewheeling diodes
• Switching diodes
Description
Dual center tab Schottky rectifier suited for SMPS and high frequency DC to DC converters.
Packaged in DPAK, the STPS15L45C is intended for use in low voltage, high frequency inverters, freewheeling and polarity protection applications.
Product status link
STPS15L45C
Product summary
Symbol
I
F(AV)
V
RRM
T
j(max.)
V
F(typ.)
Value
2 x 7.5 A
45 V
150 °C
0.40 V
DS2653 - Rev 6 - April 2020
For further information contact your local STMicroelectronics sales office.
www.st.com
1
STPS15L45C
Characteristics
Characteristics
Table 1. Absolute ratings (limiting values, per diode, at 25 °C unless otherwise specified)
Symbol
V
RRM
I
F(RMS)
Repetitive peak reverse voltage
Forward rms current
Parameter
I
F(AV)
I
FSM
P
ARM
T stg
T j
Average forward current
Surge non repetitive forward current
Repetitive peak avalanche power
Storage temperature range
T c
= 140 °C, δ = 0.5 square wave
Maximum operating junction temperature
(1)
t
Per diode
Per device p t p
= 10 ms sinusoidal
= 10 µs, T
1. (dP tot
/dT j
) < (1/R th(j-a)
) condition to avoid thermal runaway for a diode on its own heatsink.
j
= 125 °C
Value
45
10
7.5
15
75
A
265
A
W
-65 to +175 °C
150 °C
Unit
V
A
Symbol
R th(j-c)
R th(c)
Junction to case
Coupling
Table 2. Thermal resistance parameters
Parameter
Per diode
Total
Max. value
4
2.4
0.7
Unit
°C/W
When the diodes 1 and 2 are used simultaneously :
Δ T j
(diode 1) = P(diode1) x R th(j-c)
(per diode) + P(diode 2) x R th(c)
For more information, please refer to the following application note :
• AN5088 : Rectifiers thermal management, handling and mounting recommendations
Symbol
I
R
(1)
V
F
(2)
Table 3. Static electrical characteristics (per diode)
Parameter
Reverse leakage current
Forward voltage drop
Test conditions
T j
= 25 °C
T j
= 125 °C
V
R
= V
RRM
T j
= 25 °C
T j
= 125 °C
T j
= 25 °C
T j
= 125 °C
T j
= 25 °C
T j
= 125 °C
I
I
I
F
F
F
= 7.5 A
= 12 A
= 15 A
Min.
-
-
-
-
-
-
-
-
1. Pulse test: t p
= 5 ms, δ < 2%
2. Pulse test: t p
= 380 μs, δ < 2%
To evaluate the conduction losses, use the following equation:
Typ.
60
0.40
0.49
0.53
Max.
500
120
0.52
0.46
0.60
0.57
0.64
0.63
Unit
µA mA
V
DS2653 - Rev 6 page 2/10
P = 0.29 x I
F(AV)
+ 0.023 x I
F
2
(RMS)
For more information, please refer to the following application notes related to the power losses :
• AN604: Calculation of conduction losses in a power rectifier
• AN4021: Calculation of reverse losses on a power diode
STPS15L45C
Characteristics
DS2653 - Rev 6 page 3/10
STPS15L45C
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Average forward power dissipation versus average forward current (per diode)
Figure 2. Average forward current versus ambient temperature (δ = 0.5, per diode)
PF(AV)(W)
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
δ = 0.05
δ = 0.1
δ = 0.2
δ = 0.5
δ = 1
1.5
1.0
0.5
0.0
IF(AV)(A)
δ = tp/T tp
0 1 2 3 4 5 6 7 8 9 10
IF(AV)(A)
Rth(j-a) = Rth(j-c)
Rth(j-a) = 70 °C/W
T tp
Tamb(°C)
δ = tp/T
0 25 50 75 100 125 150
Figure 3. Normalized avalanche power derating versus pulse duration (T j
= 125 °C)
1
P
ARM
(tp)
P
ARM
(10 µs)
0.1
0.01
0.001
1 10 100 1000
Figure 4. Relative variation of thermal impedance junction to case versus pulse duration
1.0
Zth(j-c)/Rth(j-c)
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Single pulse
0.0
1.E-03 1.E-02 tp(s)
1.E-01 1.E+00
DS2653 - Rev 6 page 4/10
STPS15L45C
Characteristics (curves)
Figure 5. Reverse leakage current versus reverse voltage applied (typical values, per diode)
1.E+03
I
R
(mA)
1.E+02
1.E+01
1.E+00
1.E-01
Tj = 150 °C
Tj = 125 °C
Tj = 100 °C
Tj = 75 °C
Tj = 50 °C
Tj = 25 °C
1.E-02
0 5 10 15 20
V
R
(V)
25 30 35 40
Figure 6.
10.0
C(nF)
1.0
45
0.1
1
Junction capacitance versus reverse voltage applied (typical values, per diode)
VR(V)
10
F = 1 MHz
V
OSC
= 30 mV
Tj = 25 °C
100
Figure 7. Forward voltage drop versus forward current
(per diode)
Figure 8. Thermal resistance junction to ambient versus copper surface under tab
100
IFM(A)
Tj = 125 °C
(Maximum values)
10
Tj = 125 °C
(Typical values)
Tj = 25 °C
(Maximum values)
VFM(V)
1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
100
R th(j-a)
(°C/W)
90 Epoxy printed circuit board, copper thickness: 35 µm
80
70
60
50
40
30
20
10
0
0 5 10 15 20 25 30
DPAK
S
Cu
(cm²)
35 40
DS2653 - Rev 6 page 5/10
2
2.1
STPS15L45C
Package information
Package information
•
•
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com
. ECOPACK is an ST trademark.
DPAK package information
Epoxy meets UL 94,V0
Cooling method: by conduction (C)
Figure 9. DPAK package outline
E b4 c2
A
Thermal pad
E1
L2
D
D1
H
L4
R e e1 b
A1
A2
L1
L
0.25
V2
Gauge plane c
R
Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed.
DS2653 - Rev 6 page 6/10
DS2653 - Rev 6
Ref.
E1 e e1
H
L
L2
L4
V2 c c2
D
D1
E
A
A1
A2 b b4
6.7
STPS15L45C
DPAK package information
Min.
0.46
0.46
5.97
4.95
6.35
4.32
2.18
0.90
0.03
0.64
4.95
4.40
9.35
1.0
0.60
-8°
Table 4. DPAK package mechanical data
Dimensions
Millimeters
2.286 typ.
Max.
0.61
0.60
6.22
5.60
6.73
5.50
2.40
1.10
0.23
0.90
5.46
4.70
10.40
1.78
1.27
1.02
+8°
Inches (for reference only)
Min.
Max.
0.018
0.018
0.235
0.194
0.250
0.170
0.085
0.035
0.001
0.025
0.194
0.024
0.023
0.244
0.220
0.265
0.216
0.094
0.043
0.009
0.035
0.215
0.090 typ.
0.173
0.368
0.039
0.023
-8°
0.185
0.409
0.070
0.050
0.040
+8°
Figure 10. DPAK recommended footprint (dimensions in mm)
12.7
6.7
3.0
3.0
4.572
A
B
The device must be positioned within 0.05 AB
1.6
page 7/10
3
STPS15L45C
Ordering Information
Ordering Information
Order code
STPS15L45CB
STPS15L45CB-TR
Marking
Table 5. Ordering information
Package Weight
S15L45C DPAK 0.35 g
Base qty.
75
2500
Delivery mode
Tube
Tape and reel
DS2653 - Rev 6 page 8/10
STPS15L45C
Revision history
Date
10-Mar-2011
07-Jul-2015
29-Nov-2018
09-Aug-2019
02-Apr-2020
3
4
5
6
Table 6. Document revision history
Version
2
Changes
Automatic revalidation date workflow started.
Updated DPAK package information and reformatted to current standard.
Removed IPAK.
Updated DPAK package information and reformatted to current standard.
Added
Section Applications
. Updated Table 3
,
Figure 4 and
Table 5
.
Updated Figure 5
.
DS2653 - Rev 6 page 9/10
STPS15L45C
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DS2653 - Rev 6 page 10/10
