STPS30170C
High voltage power Schottky rectifier
Datasheet - production data
K
A1
A2
TO-247
A1
A2
D 2 PAK
K
K
A1
K
A2
A1
A2
Features
High junction temperature capability
Good trade off between leakage current and forward voltage drop
Low leakage current
Avalanche capability specified
ECOPACK ® 2 compliant component for
D²PAK on demand
Description
Dual center tap Schottky rectifier designed for high frequency switch mode power supply.
Table 1: Device summary
Symbol Value
I
F(AV)
V
RRM
T j
(max)
V
F
(typ)
2 x 15 A
170 V
175 °C
0.69 V
May 2017 DocID11640 Rev 2
This is information on a product in full production.
1/13 www.st.com
Characteristics
1 Characteristics
STPS30170C
Table 2: Absolute ratings (limiting values, per diode, at 25 °C, unless otherwise specified)
Symbol Parameter Value Unit
V
RRM
Repetitive peak reverse voltage
I
F(RMS)
Forward rms current
I
I
F(AV)
P
FSM
T
ARM stg
T j
Average forward current
δ = 0.5, square wave
T
C
= 150 °C
Per diode
Per device
Surge non repetitive forward current
Repetitive peak avalanche power t tp = 10 ms sinusoidal p
= 10 µs, T j
= 125 °C
Storage temperature range
Maximum operating junction temperature (1)
170
30
15
30
220
750
-65 to +175
+175
Notes:
(1)
(dP tot
/dT j
) < (1/R th(j-a)
) condition to avoid thermal runaway for a diode on its own heatsink.
Symbol
Table 3: Thermal parameter
Parameter Max. value
D 2 PAK
Per diode
R th(j-c)
Junction to case
TO-247
D 2 PAK
Total
TO-247
D 2 PAK
R th(c)
Coupling Coupling
TO-247
When the diodes 1 and 2 are used simultaneously:
ΔT j (diode1)
= P
(diode1)
x R th(j-c)
(per diode) + P
(diode2)
x R th(c)
1.6
1.5
0.95
0.9
0.3
V
A
A
A
W
°C
°C
Unit
°C/W
°C/W
2/13 DocID11640 Rev 2
STPS30170C
Symbol
I
R
(1)
V
F
(2)
Characteristics
Table 4: Static electrical characteristics (per diode)
Parameter Test conditions Min. Typ. Max. Unit
Reverse leakage current
Forward voltage drop
T j
= 25 °C
T j
= 125 °C
T j
= 25 °C
T j
= 125 °C
T j
= 25 °C
T j
= 125 °C
V
R
= V
RRM
I
F
= 15 A
I
F
= 30 A
-
-
-
-
-
-
5
20
20
0.92
0.69 0.75
1
0.8 0.86
µA mA
V
Notes:
(1)
Pulse test: t p
= 5 ms, δ < 2%
(2)
Pulse test: t p
= 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.64 x I
F(AV)
+ 0.0073 I
F
2
(RMS)
DocID11640 Rev 2 3/13
Characteristics
1.1 Characteristics (curves)
STPS30170C
14
Figure 1: Average forward power dissipation versus average forward current (per diode)
P
F (AV )
(W )
=1
=0.1
=0.2
=0.5
12
=0.05
10
8
6
4
2
0
0 1 2 3 4 5 6
T
7
I
F( AV)
(A)
8 t p
9 10 11 12 13 14 15 16 17 18
Figure 2: Average forward current versus ambient temperature (δ = 0.5, per diode)
I
F (AV)
(A)
18
16
14
12
10
8
6
4
2
0
0
T
25
R th(j-a)
=15 °C/W t p
50 75
T amb
(°C)
100 125 150 175
Figure 3: Normalized avalanche power derating versus pulse duration (Tj = 125 °C)
1
P
ARM
(tp)
P
ARM
(10 µs)
0.1
0.01
0.001
1 10 100 1000
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Figure 4: Relative variation of thermal impedance junction to case versus pulse duration (D²PAK and
TO-247)
Z th(j-c)
/R th(j-c)
1.0
=0.5
=0.2
=0.1
Single pulse
T t
P
(s) t p
0.0
1.E-03 1.E-02 1.E-0 1.E+00
Figure 5: Reverse leakage current versus reverse voltage applied (typical values, per diode)
I
R
(µA)
1.E+06
1.E+05
T j
=175°C
1000
Figure 6: Junction capacitance versus reverse voltage applied (typical values, per diode)
C(pF)
F=1MHz
V
OSC
=30mV
RMS
T j
=25°C
1.E+04 T j
=150°C
T j
=125°C
1.E+03
100
1.E+02
T j
=75°C
1.E+01
T j
=25°C
1.E+00
V
R
(V)
1.E-01
0 10 20 30 40 50 60 70 80 90 10 0 11 0 12 0 13 0 14 0 15 0 16 0 170
10
1 1 0
V
R
(V)
1 0 0 1 0 0 0
4/13 DocID11640 Rev 2
STPS30170C
15.0
Figure 7: Forward voltage drop versus forward current (per diode, low level)
I
F
(A)
12.5
10.0
Characteristics
100
Figure 8: Forward voltage drop versus forward current (per diode, high level)
I
F
(A)
7.5
10 Tj=25°C
(Maximum values)
5.0
2.5
V
F
(V)
0.0
0.0
0.1
0.2
0.3
Tj=25°C
(Maximum values)
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1
0.0
0.2
0.4
0.6
0.8
1.0
V
F
(V)
1.2
Figure 9: Thermal resistance junction to ambient versus copper surface under tab for
D²PAK (typical values)
80
R th(j-a)
(°C/W)
70
60
50
40
30
20
10
0
0 5 10 15
Epoxy printed board FR4, eCU= 35 µm
S
Cu
(cm²)
20 25 30 35 40
1.4
1.6
DocID11640 Rev 2 5/13
Package information
2 Package information
STPS30170C
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK ® is an ST trademark.
Cooling method: by conduction (C)
Epoxy meets UL 94,V0
Recommended torque values: 0.55 N·m (for TO-247)
Maximum torque values: 1.0 N·m maximum (for TO-247)
6/13 DocID11640 Rev 2
STPS30170C
2.1 D²PAK package information
Figure 10: D²PAK package outline
Package information
This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed.
DocID11640 Rev 2 7/13
Package information
Ref. e e1
H
J1
D2
E
E1
E2
A
A1 b b2 c c2
D
D1
L
L1
L2
R
V2
4.88
15.00
2.49
1.90
1.27
1.30
Min.
4.36
0.00
0.70
1.14
0.38
1.19
8.60
6.90
1.10
10.00
8.10
6.85
Table 5: D²PAK package mechanical data
Dimensions
Millimeters
Max.
4.60
0.25
0.93
1.70
0.69
1.36
9.35
8.00
1.50
10.55
8.90
7.25
Min.
0.172
0.000
0.028
0.045
0.015
0.047
0.339
0.272
0.043
0.394
0.319
0.266
2.54 typ.
5.28
15.85
2.90
2.79
1.65
1.78
0.190
0.591
0.097
0.075
0.049
0.050
0.4 typ.
0° 8° 0°
Inches
0.100
0.015
STPS30170C
0.205
0.624
0.112
0.110
0.065
0.070
8°
Max.
0.181
0.010
0.037
0.067
0.027
0.053
0.368
0.311
0.060
0.415
0.346
0.282
8/13 DocID11640 Rev 2
STPS30170C Package information
Figure 11: D²PAK recommended footprint (dimensions in mm)
DocID11640 Rev 2 9/13
Package information
2.2 TO-247 package information
Figure 12: TO-247 package outline
STPS30170C
0075325_8
10/13 DocID11640 Rev 2
STPS30170C
Ref. e
L
L1
L2
ØP (2)
ØR
S
A
A1 b b1 b2 c
D (1)
E
Min.
4.85
2.20
1.00
2.00
3.00
0.40
19.85
15.45
5.30
14.20
3.70
3.55
4.50
5.30
Table 6: TO-247 package mechanical data
Dimensions
Millimeters
Typ.
5.45
Max.
5.15
2.60
1.40
2.40
3.40
0.80
20.15
15.75
5.60
14.80
4.30
Min.
0.191
0.086
0.039
0.078
0.118
0.015
0.781
0.608
0.209
0.559
0.145
18.50
5.50
3.65
5.50
5.70
Notes:
(1)
Dimension D plus gate protusion does not exceed 20.5 mm
(2)
Resin thickness around the mounting hole is not less than 0.9 mm.
0.139
0.177
0.209
Package information
Inches
Typ.
0.215
0.728
0.216
Max.
0.203
0.102
0.055
0.094
0.133
0.031
0.793
0.620
0.220
0.582
0.169
0.143
0.217
0.224
DocID11640 Rev 2 11/13
Ordering information
3 Ordering information
Order code
STPS30170CW
STPS30170CG-TR
STPS30170C
Table 7: Ordering information
Marking Package Weight Base qty Delivery mode
STPS30170CW
STPS30170CG
TO-247
D 2 PAK
4.40g
1.48g
30
1000
Tube
Tape and reel
4 Revision history
Date Revision
Table 8: Document revision history
Changes
16-Sep-2005
16-May-2017
1
2
First issue.
Updated features, package silhouette and Table 1: "Device summary" .
Updated Section 1: "Characteristics" ,
Section 1.1: "Characteristics
(curves)" ,
Section 2: "Package information"
and Table 7: "Ordering information" .
12/13 DocID11640 Rev 2
STPS30170C
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DocID11640 Rev 2 13/13
