A1 A2
G
DPAK
A2
Product status link
X0405MB
Product summary
I
T(RMS)
V
DSM
/V
RSM
I
GT
T j
max.
4 A
750 V
50 µA
125 °C
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Datasheet
4 A Sensitive gate SCR in DPAK package
Features
• 4 A SCR
• Sensitive SCR: I
GT
= 50 µA
• V
DRM
/ V
RRM
= 600 V and V
DSM
/ V
RSM
= 750 V
• 125 °C maximum junction temperature T j
• DPAK SMD package
• Halogen-free molding, lead-free plating
• ECOPACK2 compliant
Application
• Actuators
• Ignitors
• Inrush current limiting circuits
Description
The X04 series is 4 A SCR housed in compact SMD DPAK package. This highly sensitive device is suited to home appliances or power tools and industrial systems and drives loads up to 4 A.
DS14025 - Rev 1 - September 2022
For further information contact your local STMicroelectronics sales office.
www.st.com
1
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Characteristics
Characteristics
Symbol
I
T(RMS)
I
T AV
I
TSM
I 2 t dl/dt
V
DRM
/V
RRM
V
DSM
/V
RSM
I
GM
P
GM
T stg
T j
T
L
Table 1. Absolute maximum ratings (limiting values)
Parameter
RMS on-state current (full sine wave)
RMS on-state average current (full sine wave)
Non repetitive surge peak on-state current (full cycle,
T j
initial = 25 °C)
T c
= 114 °C
T c
= 114 °C t = 8.3 ms t = 10 ms t p
= 10 ms I 2 t value for fusing
Critical rate of rise of on-state current, I
G
= 2 x I
≤ 100 ns, f = 60 Hz
GT
, tr
Repetitive peak off-state voltage
Non Repetitive peak off-state voltage, 10 ms
Maximum peak gate current
Maximum gate power dissipation
Storage temperature range
Operating junction temperature range
Maximum lead temperature for soldering during 10 s
T j
= 125 °C
T j
= 125 °C t p
= 20 µs, T j
= 125 °C
Value
4
2.5
33
30
9
50
600
750
1.2
0.5
-40 to +125
-40 to +125
260
Symbol
Table 2. Electrical characteristics (T j
= 25 °C, unless otherwise specified)
Test conditions
I
GT
(1)
V
D
= 12 V, R
L
= 140 Ω
I
V
GT
V
GD
V
RGM
I
L
H
(2)
dV/dt
(2)
V
D
= V
DRM
, R
L
= 3.3 kΩ
I
RG
= 10 µA
I
G
= 1.2 x I
GT
I
T
= 500 mA, gate open
V
D
= 67 % V
DRM
, R
GK
= 1 kΩ
1. For both polarities of OUT pin referenced to COM pin.
2. For both polarities of A2 referenced to A1.
T j
= 125 °C
T j
= 110 °C
Min.
Max.
Max.
Min.
Max.
Max.
Max.
Min.
0.1
8
6
5
Value
20
50
0.8
15
Symbol
V
TM
(1)
V
TO
(1)
R
D
(1)
I
DRM
/I
RRM
Table 3. Static characteristics
Test conditions
I
TM
= 8 A, t p
= 380 µs
Threshold voltage
Dynamic resistance
V
D
= V
DRM
; V
R
= V
RRM
; R
GK
= 1 kΩ
T j
25 °C
125 °C
125 °C
25 °C
125°C
1. For both polarities of A2 referenced to A1.
Max.
Max.
Max.
Max.
Value
1.8
0.85
100
5
1
Unit
µA
V
V
V mA mA
V/µs
Unit
A
A
A
A 2 s
A/µs
A
W
°C
°C
°C
V
V
Unit
V
V mΩ
µA mA
DS14025 - Rev 1 page 2/11
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Characteristics
Symbol
R th(j-c)
R th(j-a)
Table 4. Thermal resistance
Parameter
Junction to case
Junction to ambient: S
CU
= 0.5 cm²
Max.
Typ.
Value
3
70
Unit
°C/W
°C/W
DS14025 - Rev 1 page 3/11
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Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Maximum average power dissipation versus onstate RMS current
Figure 2. Average and DC on-state current versus case temperature
Figure 3. On-state RMS current versus ambient temperature (full cycle)
Figure 4. Relative variation of thermal impedance versus pulse duration
Figure 5. Relative variation of gate triggering current and voltage versus junction temperature (typical values)
Figure 6. Surge peak on-state current versus number of cycles
DS14025 - Rev 1 page 4/11
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Characteristics (curves)
Figure 7. Non repetitive surge peak on-state current for a sinusoidal pulse with width t p
< 10 ms and corresponding value of I²t
Figure 8. On-state characteristics (maximum values)
Figure 9. Relative variation of static dV/dt immunity versus gate-to-cathode resistance (typical values)
Figure 10. Relative variation of static dV/dt immunity versus gate-to-cathode capacitance (typical values)
Figure 11. Relative variation of static dV/dt immunity versus junction temperature
Figure 12. Thermal resistance junction to ambient versus copper surface under tab (typical values)
100
90
80
70
60
50
40
30
20
10
0
0
R th(j-a)
(°C/W)
5 10
DPAK
15 20 25 30
S
Cu
(cm²)
35 40
DS14025 - Rev 1 page 5/11
2
2.1
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Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com
. ECOPACK is an ST trademark.
•
•
DPAK package information
Molding compouned resin is halogen free and meets UL94 flammability standard, level V0
Lead-free package leads plating
Figure 13. DPAK package outline
DS14025 - Rev 1 page 6/11
Note:
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DPAK package information
Table 5. DPAK package mechanical data
Dimensions
Ref.
L
L1
L2
L3
L4
L6
ϴ1
ϴ2
V2 c2
D
D1
E
E1 e
H
A
A1
A2 b b4 c
Min.
2.20
0.90
0.00
0.72
5.13
0.47
0.47
6.00
5.15
6.50
4.70
2.186
9.80
1.40
0.90
Millimeters
Typ.
2.30
1.01
5.33
6.10
5.40
6.60
4.85
2.286
10.10
1.50
2.90 REF
0.60
5°
5°
0°
0.51 BSC
0.80
1.80 BSC
7°
7°
1. Dimensions in inches are given for reference only
0.85
5.46
0.60
0.60
6.20
Max.
2.38
1.10
0.10
5.65
6.70
5.00
2.386
10.40
1.70
1.25
1.00
9°
9°
8°
0.0354
0.0236
5°
5°
0°
Min.
0.0866
0.0354
0.0000
0.0283
0.2020
0.0185
0.0185
0.2362
0.2028
0.2550
0.1850
0.0860
0.3858
0.0551
Inches (1)
Typ.
0.0906
0.0398
0.2098
0.2402
0.2126
0.2598
0.1909
0.0900
0.3976
0.0591
0.1142 REF
0.201 BSC
0.0315
0.0709 BSC
7°
7°
0.0492
0.0394
9°
9°
8°
This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed.
Max.
0.0937
0.0433
0.0039
0.335
0.2150
0.0236
0.0236
0.2441
0.2224
0.2638
0.1969
0.0940
0.4094
0.0669
DS14025 - Rev 1 page 7/11
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DPAK package information
Figure 14. DPAK recommended footprint (dimensions are in mm)
DS14025 - Rev 1 page 8/11
3
Ordering information
Figure 15. Ordering information scheme
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Ordering information
Order code
X0405MB
Marking
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Table 6. Ordering information
Package
DPAK
Weight
0.3 g
Base qty.
2500
Delivery mode
Tape and reel
DS14025 - Rev 1 page 9/11
Revision history
Date
06-Sep-2022
Revision
1
Table 7. Document revision history
Changes
Initial release.
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DS14025 - Rev 1 page 10/11
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DS14025 - Rev 1 page 11/11
