SIMCom SIM8960X Hardware Design

SIM8960 Series

Hardware Design

Smart Module

SIMCom Wireless Solutions Limited

SIMCom Headquarters Building, Building 3, No. 289 Linhong

Road, Changning District, Shanghai P.R. China

Tel: 86-21-31575100 [email protected]

www.simcom.com

SIM8960 Series Hardware Design V1.03

Document Title:

Version:

Date:

Status:

SIM8960 Series Hardware Design

1.03

2021-06-08

Released

GENERAL NOTES

SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS, TO SUPPORT

APPLICATION AND ENGINEERING EFFORTS THAT USE THE PRODUCTS DESIGNED BY SIMCOM.

THE INFORMATION PROVIDED IS BASED UPON REQUIREMENTS SPECIFICALLY PROVIDED TO

SIMCOM BY THE CUSTOMERS. SIMCOM HAS NOT UNDERTAKEN ANY INDEPENDENT SEARCH

FOR ADDITIONAL RELEVANT INFORMATION, INCLUDING ANY INFORMATION THAT MAY BE IN THE

CUSTOMER’S POSSESSION. FURTHERMORE, SYSTEM VALIDATION OF THIS PRODUCT

DESIGNED BY SIMCOM WITHIN A LARGER ELECTRONIC SYSTEM REMAINS THE RESPONSIBILITY

OF THE CUSTOMER OR THE CUSTOMER’S SYSTEM INTEGRATOR. ALL SPECIFICATIONS

SUPPLIED HEREIN ARE SUBJECT TO CHANGE.

COPYRIGHT

THIS DOCUMENT CONTAINS PROPRIETARY TECHNICAL INFORMATION WHICH IS THE PROPERTY

OF SIMCOM WIRELESS SOLUTIONS LIMITED COPYING, TO OTHERS AND USING THIS DOCUMENT,

ARE FORBIDDEN WITHOUT EXPRESS AUTHORITY BY SIMCOM. OFFENDERS ARE LIABLE TO THE

PAYMENT OF INDEMNIFICATIONS. ALL RIGHTS RESERVED BY SIMCOM IN THE PROPRIETARY

TECHNICAL INFORMATION ， INCLUDING BUT NOT LIMITED TO REGISTRATION GRANTING OF A

PATENT , A UTILITY MODEL OR DESIGN. ALL SPECIFICATION SUPPLIED HEREIN ARE SUBJECT TO

CHANGE WITHOUT NOTICE AT ANY TIME.

SIMCom Wireless Solutions Limited

SIMCom Headquarters Building, Building 3, No. 289 Linhong Road, Changning District, Shanghai P.R.

China

Tel: +86 21 31575100

Email: [email protected]

For more information, please visit: https://www.simcom.com/download/list-863-en.html

For technical support, or to report documentation errors, please visit: https://www.simcom.com/ask/ or email to: [email protected]

Copyright © 2020 SIMCom Wireless Solutions Limited All Rights Reserved.

www.simcom.com

2 / 104

SIM8960 Series Hardware Design V1.03

Version History

Date

2020-03-03

2020-05-18

Version

V1.01

V1.02

2020-06-08 V1.03

Description of change

Initial release

Modify document template format

Add current consumption and modify document format

Author

Bing Li

Bing Li

Daofu yang www.simcom.com

3 / 104

SIM8960 Series Hardware Design V1.03

Contents

1 Introduction

................................................................................................................................................

10

1.1

Product Outline .........................................................................................................................................

10

1.2

Hardware Interface Overview .................................................................................................................

12

1.3

Hardware Block Diagram ........................................................................................................................

12

1.4

Functional Overview ................................................................................................................................

13

1.5

Evaluation board .......................................................................................................................................

17

2 Package Information

................................................................................................................................

18

2.1

Pin Assignment Overview .......................................................................................................................

18

2.2

Pin Description ..........................................................................................................................................

19

2.3

Pin Description ..........................................................................................................................................

27

3 Interface Application

..............................................................................................................................

37

3.1

Power Supply ............................................................................................................................................

37

3.1.1 Recommended power supply resolutions ....................................................................................

37

3.1.2 Enhance power stability ..................................................................................................................

38

3.2

Power On/off .............................................................................................................................................

39

3.2.1 Power on ...........................................................................................................................................

39

3.2.2 Power-on sequence .........................................................................................................................

40

3.2.3 Power off ............................................................................................................................................

40

3.3

VRTC ..........................................................................................................................................................

41

3.4

Output Power Management ....................................................................................................................

42

3.5

USB Type-C Interface ..............................................................................................................................

43

3.6

UART/SPI/I2C ...........................................................................................................................................

45

3.7

Secure Digital Interface ...........................................................................................................................

47

3.8

LCD Interface ............................................................................................................................................

48

3.9

Touch Screen Interface ...........................................................................................................................

52

3.10 Camera Interface ......................................................................................................................................

53

3.11 Audio ...........................................................................................................................................................

58

3.11.1 Microphone .....................................................................................................................................

59

3.11.2 Headset ............................................................................................................................................

59

3.11.3 Earpiece ...........................................................................................................................................

61

3.11.4 Speaker ............................................................................................................................................

62

3.11.5 LINEOUT .........................................................................................................................................

63

3.11.6 Microphone bias .............................................................................................................................

63

3.12 I2S Interface ..............................................................................................................................................

64

3.13 UIM Interface .............................................................................................................................................

64

3.14 ADC ............................................................................................................................................................

66

3.15 Forced USB BOOT Interface ..................................................................................................................

66

3.16 Antenna Interface .....................................................................................................................................

67

3.16.1 MAIN Antenna reference circuit ..................................................................................................

67

3.16.2 DRX Antenna reference circuit ....................................................................................................

68

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SIM8960 Series Hardware Design V1.03

3.16.3 GNSS Antenna reference circuit .................................................................................................

68

3.16.4 WiFi/BT Antenna reference circuit ..............................................................................................

70

3.16.5 RF traces layout guidance ...........................................................................................................

70

3.16.6 Antenna Requirement ...................................................................................................................

73

3.16.7 Install the Antenna with RF Connector ......................................................................................

73

4 PCB Layout

...............................................................................................................................................

75

4.1

Stack-up Options ......................................................................................................................................

75

4.2

General Placement Guidelines ..............................................................................................................

75

4.3

PCB Layout Guideline Details ................................................................................................................

75

4.3.1 RF Trace ............................................................................................................................................

75

4.3.2 Power/GND .......................................................................................................................................

75

4.3.3 UIM Card ...........................................................................................................................................

76

4.3.4 MIPI_DSI/CSI ...................................................................................................................................

76

4.3.5 USB ....................................................................................................................................................

76

4.3.6 SDC ....................................................................................................................................................

76

4.3.7 Audio ..................................................................................................................................................

76

5 Electrical and Reliability

..........................................................................................................................

78

5.1

Absolute Maximum Ratings ....................................................................................................................

78

5.2

Temperature Range .................................................................................................................................

78

5.3

Operating Voltage .....................................................................................................................................

78

5.4

Digital-logic Characteristics ....................................................................................................................

79

5.5

Current Consumption (VBAT=3.9V) ......................................................................................................

80

5.6

Electro-Static Discharge ..........................................................................................................................

80

5.7

Module Operating Frequencies .............................................................................................................

82

5.8

Module Output power ..............................................................................................................................

83

5.9

Module Receiving Sensitivity .................................................................................................................

84

5.10 WIFI Main RF Characteristics ................................................................................................................

85

5.11 BT Main RF Characteristics ....................................................................................................................

86

5.12 GNSS Main RF Characteristics .............................................................................................................

86

6 Manufacturing

............................................................................................................................................

87

6.1

Top and Bottom View of SIM8960x .......................................................................................................

87

6.2

Physical Dimensions ................................................................................................................................

88

6.3

Recommended PCB footprint ................................................................................................................

89

6.4

Recommended SMT Stencil ...................................................................................................................

90

6.5

Typical SMT Reflow Profile .....................................................................................................................

91

6.6

Moisture Sensitivity Level (MSL) ...........................................................................................................

92

6.7

Baking Requirements ..............................................................................................................................

92

7 Packing System

.........................................................................................................................................

93

8 List of Recommended Devices

..............................................................................................................

96

9 Appendix

...................................................................................................................................................

100

9.1

Related Documents ...............................................................................................................................

100

9.2

Terms and Abbreviations ......................................................................................................................

101

9.3

Safety Caution ........................................................................................................................................

103

www.simcom.com

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SIM8960 Series Hardware Design V1.03

Table Index

Table 1: Module frequency bands ..............................................................................................................................

10

Table 2: General features ............................................................................................................................................

13

Table 3: Pin Characters ................................................................................................................................................

19

Table 4: I/O parameter definitions ..............................................................................................................................

27

Table 5: Pin description ................................................................................................................................................

28

Table 6: Recommended TVS diode ...........................................................................................................................

38

Table 7: PWRKEY characteristics ..............................................................................................................................

39

Table 8: VRTC characteristic .......................................................................................................................................

42

Table 9: Output power management summary ........................................................................................................

42

Table 10: USB interface Pin definition .......................................................................................................................

43

Table 11: Length of USB traces inside the module .................................................................................................

45

Table 12: UART/SPI/I2Cfunctional assignments .....................................................................................................

46

Table 13: SD interface pin definitions ........................................................................................................................

47

Table 14: Length of SD traces inside the module ....................................................................................................

48

Table 15: Display interface pin definitions ................................................................................................................

49

Table 16: Length of MIPI_DSI traces inside the module ........................................................................................

51

Table 17: Touch screen interface pin definitions ......................................................................................................

52

Table 18: Camera interface pin definitions ...............................................................................................................

53

Table 19: Length of MIPI_CSI traces inside the module ........................................................................................

57

Table 20: Audio interface pin definitions ....................................................................................................................

58

Table 21: Headphone output performance specifications ......................................................................................

60

Table 22: Earpiece output performance specifications ...........................................................................................

61

Table 23: speaker driver output performance specifications .................................................................................

62

Table 24: LINEOUT output performance specifications .........................................................................................

63

Table 25: Microphone bias output performance specifications .............................................................................

64

Table 26: I2S interface pin definitions ........................................................................................................................

64

Table 27: UIM interface pin definitions ......................................................................................................................

65

Table 28: ADC performance parameters ...................................................................................................................

66

Table 29: ADC interface pin definitions .....................................................................................................................

66

Table 30: FORCED USB BOOT definitions ..............................................................................................................

66

Table 31: Example of impedance control of microstrip line structure ..................................................................

71

Table 32: Example of impedance control of coplanar waveguide structure .......................................................

71

Table 33: Antenna Requirement .................................................................................................................................

73

Table 34: Absolute maximum ratings .........................................................................................................................

78

Table 35: Temperature range ......................................................................................................................................

78

Table 36: Operating voltage ........................................................................................................................................

78

Table 37: 1.8 V digital I/O characteristics ..................................................................................................................

79

Table 38: USIM interface characteristics (USIM_VDD=1.8V/2.95V) ...................................................................

79

Table 39: SD interface characteristics (SD_LDO11 =1.8V) ...................................................................................

79

Table 40: SD interface characteristics (SD_LDO11 =2.95V) .................................................................................

79

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SIM8960 Series Hardware Design V1.03

Table 41: Current consumption(TBD) ........................................................................................................................

80

Table 42: ESD performance parameters （ Temperature: 25 ℃ , Humidity: 45% ） .............................................

81

Table 43: Module operating frequencies ...................................................................................................................

82

Table 44: Conducted transmission power .................................................................................................................

83

Table 45: Conducted receiving sensitivity .................................................................................................................

84

Table 46: Reference sensitivity QPSk PREFSENS(LTE) .......................................................................................

84

Table 47: 2.4GWIFI main RF Characteristics ...........................................................................................................

85

Table 48: 5G WIFI main RF Characteristics .............................................................................................................

86

Table 49: BT Main RF Characteristics .......................................................................................................................

86

Table 50: GNSS Main RF Characteristics ................................................................................................................

86

Table 51: MSL ratings summary .................................................................................................................................

92

Table 52: Baking requirements ...................................................................................................................................

92

Table 53: Module tray information ..............................................................................................................................

94

Table 54: Small carton information .............................................................................................................................

95

Table 55: Big carton information .................................................................................................................................

95

Table 56: Recommended Camera Sensor List ........................................................................................................

96

Table 57: Recommended LCD Driver IC List ...........................................................................................................

97

Table 58: Recommended Accelerometer & Gyroscope List ..................................................................................

97

Table 59: Recommended E-Compass List ...............................................................................................................

98

Table 60: Recommended Proximity&Ambient Light List ........................................................................................

99

Table 61: Related Documents ..................................................................................................................................

100

Table 62: Terms and abbreviations ..........................................................................................................................

101

Table 63: Safety Caution ...........................................................................................................................................

103

www.simcom.com

7 / 104

SIM8960 Series Hardware Design V1.03

Figure Index

Figure 1: SIM8960x functional diagram ....................................................................................................................

13

Figure 2: Pin assignment overview ............................................................................................................................

18

Figure 3: LDO power supply reference circuit ..........................................................................................................

37

Figure 4: DC-DC power supply reference circuit .....................................................................................................

38

Figure 5: VBAT input reference circuit .......................................................................................................................

38

Figure 6: Powered on/off module using button ........................................................................................................

39

Figure 7: Powered on/off module using transistor ...................................................................................................

39

Figure 8: Power-on sequence .....................................................................................................................................

40

Figure 9: Power-o ff sequence .....................................................................................................................................

40

Figure 10: Keep-alive capacitor ..................................................................................................................................

41

Figure 11: Non-rechargeable battery .........................................................................................................................

41

Figure 12: Rechargeable battery ................................................................................................................................

42

Figure 13: USB Type-C reference circuit ..................................................................................................................

44

Figure 14: Micro USB reference circuit .....................................................................................................................

44

Figure 15: SD card reference circuit ..........................................................................................................................

47

Figure 16: LCM0 Display reference circuit (external backlight drive) ..................................................................

50

Figure 17: LCM1 Display reference circuit ...............................................................................................................

51

Figure 18: Primary camera reference circuit ............................................................................................................

55

Figure 19: Secondary camera reference circuit .......................................................................................................

56

Figure 20: Depth camera reference circuit ...............................................................................................................

56

Figure 21: ECM-type microphonereference circuit .................................................................................................

59

Figure 22: MEMS-type microphone reference circuit .............................................................................................

59

Figure 23: Headset reference circuit .........................................................................................................................

60

Figure 24: Earpiece reference circuit .........................................................................................................................

61

Figure 25: Speaker reference circuit .........................................................................................................................

62

Figure 26: LINEOUT reference circuit .......................................................................................................................

63

Figure 27: UIM card reference circuit ........................................................................................................................

65

Figure 28: Emergency download reference circuit ..................................................................................................

67

Figure 29: MAIN antenna recommended circuit ......................................................................................................

67

Figure 30: DRX antenna recommended circuit ........................................................................................................

68

Figure 31: GNSS antenna recommended circuit .....................................................................................................

69

Figure 32: GNSS active antenna circuit ....................................................................................................................

69

Figure 33: WIFI/BT antenna recommended circuit .................................................................................................

70

Figure 34: Two layer PCB microstrip structure ........................................................................................................

71

Figure 35: Two layer PCB coplanar waveguide structure ......................................................................................

71

Figure 36: Four layer PCB coplanar waveguide structure 1# ...............................................................................

72

Figure 37: Four layer PCB coplanar waveguide structure 2# ...............................................................................

72

Figure 38: Dimensions of the UF.L-R-SMT Connector (Unit: mm) .......................................................................

74

Figure 39: Top and bottom view of SIM8960x ..........................................................................................................

87

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SIM8960 Series Hardware Design V1.03

Figure 40: Outline drawing (unit: mm) .......................................................................................................................

88

Figure 41: Recommended PCB footprint ..................................................................................................................

89

Figure 42: Recommended SMT stencil .....................................................................................................................

90

Figure 43: Typical SMT reflow profile ........................................................................................................................

91

Figure 44: Packaging process ....................................................................................................................................

93

Figure 45: Module tray drawing ..................................................................................................................................

94

Figure 46: Small carton drawing .................................................................................................................................

94

Figure 47: Big carton drawing .....................................................................................................................................

95

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SIM8960 Series Hardware Design V1.03

1

Introduction

This document describes the electronic specifications, RF specifications, interfaces, mechanical characteristics and testing results of the SIMCom module. With the help of this document and other software application notes/user guides, users can understand and use module to design and develop applications quickly.

1.1

Product Outline

SIM8960x is a multi-mode and multi-band wireless smart module, which is based on Qualcomm SDM450 platform.

 14nm FinFET ,64-bit ARM Cortex-A53 octa-core at 1.8GHz

 Non-PoP 2GB LPDDR3 SDRAM designed for 933Mhz clock.

 16GB eMMC Flash

 Qualcomm Adreno 506 GPU at 600MHz, with 64-bit addressing

 Rich multimedia features: Support Dual-LCM, two cameras and multi-path analog audio IO

 Support for USB3.0 and SD3.0

 Global location-based service, wireless connectivity, and air interface standards including GSM,

WCDMA, TD-SCDMA, and LTE.

With higher integration to reduce PCB surface area, time-to-market, and BOM costs, SIM8960x will help drive wireless products adoption in more industry around the world.

The operating bands are different between SIM8960x variants, which are summarized in Table 1.

Table 1: Module frequency bands

Module

CPU clock speed

Memory

RAM

ROM

Standard & Frequency

GSM

GSM850

EGSM900 www.simcom.com

SIM8960CE

1.8GHz

2GB

16GB



SIM8960E

1.8GHz

2GB

16GB



SIM8060

1.8GHz

2GB

16GB

10 / 104

WCDMA

TDSCDMA

FDD-LTE

B18

B19

B20

B25

B12

B13

B14

B17

B26

B28A

B28B

B66

B71

B34

B38

B39 TDD-LTE

B40

B41

WLAN 2.4G

802.11b/g/n/ac

WLAN 5G 802.11a/n/ac

BT BT4.2 LE

GPS

GNSS GLONASS

BEIDOU

B4

B5

B7

B8

B39

B1

B2

B3

B4

B5

B8

B34

DCS1800

PCS1900

B1

B2 www.simcom.com









































SIM8960 Series Hardware Design V1.03













































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SIM8960 Series Hardware Design V1.03

With a small physical dimension of 43×44×2.85mm and with the functions integrated, the module can meet almost any space requirement in users’ applications, such as smart phone, PDA, industrial handhold, machine-to-machine and vehicle application, etc.

1.2

Hardware Interface Overview

The interfaces are described in detail in the next chapters include:

 Power Supply

 USB2.0/3.0 Interface

 SDIO /SD Interface

 LCM Interface(MIPI DSI)

 Camera Interface(MIPI CSI0/CSI1/CSI2)

 USIM Interface

 GPIO

 ADC

 LDO Power Output

 AUDIO Interface (Three inputs and Four outputs)

 UART Interface

 SPI Interface

 I2C Interface

1.3

Hardware Block Diagram

The block diagram of the module is shown in the figure below.

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SIM8960 Series Hardware Design V1.03

Figure 1: SIM8960x functional diagram

1.4

Functional Overview

Table 2: General features

Feature

Power supply

Power saving

Application processor

Memory

Operating system

Display

Camera www.simcom.com

Implementation

3.4V ~4.4V

Current in sleep mode : <5mA

Octa ARM Cortex-A53 cores up to 1.8 GHz

LPDDR3 up to 933Mhz eMMC NAND flash

Please refer to the table 1

Customization: 3GB eMMC + 32GB LPDDR3

4GB eMMC + 64GB LPDDR3

Android OS 7.x/8.x/9.x

Dual MIPI DSI four-lane

FHD (1920 × 1200) 60 fps; 16/18/24 bpp RGB

Three mipi_csi interfaces with a maximum speed of 2.1gbps/lane

Support Three cameras (4-lane + 4-lane + 4-lane) or Four cameras (4-lane

+ 4-lane + 2-lane + 1-lane)

13 / 104

Video performance

Audio

Radio frequency bands

Transmitting power

LTE features

UMTS features

TD-SCDMA features

GSM features www.simcom.com

SIM8960 Series Hardware Design V1.03

4-lane Mipi_CSI: up to 21mp pixels

2-lane Mipi_CSI: up to 8mp

Encode:

1080p60, H.264, H.265, and VP8

Decode:

1080p60, H.264, H.265, VP8, and VP9

One digital port I2S, support both master and slave mode

Three analog input ports:

MIC1 supports differential configuration

MIC2 supports single-ended configuration

MIC3 supports single-ended configuration

Supports dual-mic noise suppression

16, 32, and 48 KHzsample rate

Four analog output ports: earpiece, stereo headphones, class-D speaker driver ,and line out

16, 32, 48, 96 and 192 KHz sample rate

Audio codec support:

G711; QCELP; EVRC, EVRC-B, EVRC-WB; AMR-NB, AMR-WB;

GSM-EFR, GSM-FR, GSM-HR

Please refer to the table 1

Class 4 (33dBm±2dB) for EGSM900

Class 1 (30dBm±2dB) for DCS1800

Class E2 (27dBm±3dB) for EGSM900 8-PSK

Class E2 (26dBm±3dB) for DCS1800 8-PSK

Class 3 (24dBm+1/-3dB) for WCDMA bands

Class 2 (24dBm+1/-3dB) for TD-SCDMA bands

Class 3 (23dBm±2dB) for LTE-FDD bands

Class 3 (23dBm±2dB) for LTE-TDD bands

 Support 3GPP R8 Cat.4

 Support 1.4 ~ 20MHz RF bandwidth

 Support MIMO in DL direction

 Cat.4 FDD: Max 150Mbps (DL)/Max 50Mbps (UL)

 Cat.4 TDD: Max 130Mbps (DL)/Max 35Mbps (UL)

 Support 3GPP R9 DC-HSDPA/HSPA+/HSDPA/HSUPA/WCDMA

 Support QPSK, 16-QAM and 64-QAM modulation

 DC-HSDPA: Max 42Mbps (DL)

 DC-HSUPA: Max 11.2Mbps (UL)

 WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL)

 Support CCSA Release 3 TD-SCDMA

 Max 4.2Mbps (DL)/Max 2.2Mbps (UL)

 R99:

 CSD: 9.6kbps, 14.4kbps

 GPRS:

 Support GPRS multi-slot class 33 (default)

 Coding scheme: CS-1, CS-2, CS-3 and CS-4

14 / 104

Bluetooth features

WLAN features

GNSS

Antenna

USIM interface

UART

I2C

SPI eMMC/SD/SDIO

ADC

USB

Physical features

Temperature range

SIM8960 Series Hardware Design V1.03

 Max 85.6Kbps (UL), 107Kbps (DL)

 EDGE:

 Support EDGE multi-slot class 33 (default)

 Support GMSK and 8-PSK for different MCS

 Downlink coding schemes: CS 1-4 and MCS 1-9

 Uplink coding schemes: CS 1-4 and MCS 1-9

 Max 236.8Kbps (UL), 296Kbps (DL)

BT2.1+EDR /3.0 /4.2 LE

2.4G/5GHz, 802.11a/b/g/n/ac, up to 433Mbps

Support AP mode

GPS /GLONASS /BEIDOU

GSM/UMTS/LTE main antenna.

UMTS/LTE auxiliary antenna

GNSS antenna

WIFI/BT antenna

Support identity card: 1.8V/ 2.95V

Dual cards dual standby

4*UART

UART2: for debug ， 2-line

UART4: 2-line

UART5 & UART6 are 4-line that support RTS and CTS hardware flow control, the speed can up to 4Mbps.

10* I2C

7* SPI

SD3.0; Support SD flash devices up to 128GB

1*ADC (15bit)

Detection range: 0.1V~1.7V or 0.3V~4.5V (software controlled)

One USB 3.0/2.0

Support Type-C

Support OTG (external 5V power supply is needed)

Dimension: 43.0(±0.2)×44.0(±0.2) ×2.85(±0.2)mm

Weight: about 12.5g

Operating temperature: -35 ℃ ~ +75 ℃［ 1 ］

Extreme operating temperature ： -40 ℃ ~ +85 ℃［ 2 ］

Storage temperature: -40 ℃ ~ +90 ℃

NOTE

1. Module can operate in the -35 ℃ ~ +75 ℃ range, and the performance can be meet the 3GPP specifications.

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SIM8960 Series Hardware Design V1.03

2. Module is working when the temperature change to -40 ℃ ~ +85 ℃ ,Module is able to make and receive voice calls, data calls, SMS and make GPRS/UMTS/HSPA+/LTE traffic. The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the normal operating temperature range and still within the extreme operating temperature range.

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SIM8960 Series Hardware Design V1.03

1.5

Evaluation board

SIMCom provides a complete set of evaluation boards to facilitate the test and use of SIM8960x module.

The evaluation board tool comprises an EVB board, a SIM8960-TE core board, a USB data cable, a headset, an antenna, an adapter and other peripherals.

www.simcom.com

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SIM8960 Series Hardware Design V1.03

2

Package Information

2.1

Pin Assignment Overview

All functions of the module will be provided through 327 pads that will be connected to the customers’ platform. The following Figure is a high-level view of the pin assignment of the module.

www.simcom.com

Figure 2: Pin assignment overview

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SIM8960 Series Hardware Design V1.03

2.2

Pin Description

Table 3: Pin Characters

Pin#

26

27

28

29

22

23

24

25

18

19

20

21

14

15

16

17

30

31

32

33

34

35

10

11

12

13

8

9

6

7

3

4

5

1

2 www.simcom.com

Pin Name

VDD_RF

VDD_RF

GND

GND

UART2_TX

UART2_RX

UART4_TX

UART4_RX

VREG_L5_1P8

VREG_L6_1P8

VREG_L10_2P8

VREG_L17_2P85

VREG_L2_1P1

VREG_L22_2P8

VREG_L23_1P2

VRTC

RESERVED

GND

MAIN_ANT

GND

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

USB_ID

GND

USB_DP

USB_DN

GND

GND

Voltage

SDM450

Platform

Pin#

Pin

Name

Note

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

2.8V

2.85V

1.1V

2.8V

1.2V

3V

GPIO_4

GPIO_5

GPIO_12

GPIO_13

I-PD

I-PD

I-PD

I-PD √

19 / 104

SIM8960 Series Hardware Design V1.03

67

68

64

65

66

60

61

62

63

56

57

58

59

52

53

54

55

48

49

50

51

44

45

46

47

40

41

42

43

36

37

38

39

69 SD_CMD

70

71

72

73

SD_CLK

SCAM_PWD_N

SCAM_RST_N

MCAM_PWD_N www.simcom.com

RESERVED

VBAT

VBAT

PWRKEY

GND

USB_VBUS

USB_VBUS

GND

MIC1_P

MIC1_N

MIC2_P

GND

HS_DET

HPH_L

HPH_REF

HPH_R

EAR_N

EAR_P

SPK_N

SPK_P

GND

FORCED_USB_BOOT

SPI6_CS

SPI6_CLK

SPI6_MOSI

SPI6_MISO

GND

SD_LDO11_2P95

SD_DET_N

SD_DATA3

SD_DATA2

SD_DATA1

SD_DATA0

3.4~4.4V

3.4~4.4V

1.8V

5V

5V

1.8V

1.8V

1.8V

1.8V

1.8V

GPIO_37

GPIO_22

GPIO_23

GPIO_20

GPIO_21

2.95V

1.8V

1.8/2.95

1.8/2.95 V

GPIO_133

1.8/2.95 V

1.8/2.95 V

1.8/2.95 V

1.8/2.95 V

1.8V

1.8V

1.8V

GPIO_130

GPIO_129

GPIO_39

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

BH-P

BH-P

D

BH-P

D

BH-P

D

BH-P

D

BHNP

I-PD

I-PD

I-PD

√

√

√

√

√

20 / 104

102

103

104

105

98

99

100

101

94

95

96

97

90

91

92

93

110

111

112

113

114

106

107

108

109

86

87

88

89

82

83

84

85

78

79

80

81

74

75

76

77 www.simcom.com

MCAM_RST_N

CAM_I2C_SCL0

CAM_I2C_SDA0

MIPI_CSI2_CLK_P

MIPI_CSI2_CLK_N

MIPI_CSI2_LANE0_P

MIPI_CSI2_LANE0_N

MIPI_CSI2_LANE1_P

MIPI_CSI2_LANE1_N

MIPI_CSI2_LANE2_P

MIPI_CSI2_LANE2_N

MIPI_CSI2_LANE3_P

MIPI_CSI2_LANE3_N

GND

MIPI_CSI0_CLK_P

MIPI_CSI0_CLK_N

MIPI_CSI0_LANE0_P

MIPI_CSI0_LANE0_N

MIPI_CSI0_LANE1_P

MIPI_CSI0_LANE1_N

MIPI_CSI0_LANE2_P

MIPI_CSI0_LANE2_N

MIPI_CSI0_LANE3_P

MIPI_CSI0_LANE3_N

GND

MCAM_MCLK

SCAM_MCLK

GND

MIPI_DSI1_CLK_P

MIPI_DSI1_CLK_N

MIPI_DSI1_LANE0_P

MIPI_DSI1_LANE0_N

MIPI_DSI1_LANE1_P

MIPI_DSI1_LANE1_N

MIPI_DSI1_LANE2_P

MIPI_DSI1_LANE2_N

MIPI_DSI1_LANE3_P

MIPI_DSI1_LANE3_N

GND

LCD1_RST

LCD1_TE

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

SIM8960 Series Hardware Design V1.03

GPIO_40

GPIO_30

GPIO_29

I-PD

I-PD

I-PD

GPIO_26

GPIO_27

GPIO_87

GPIO_25

I-PD

I-PD

I-PD

I-PD

√

√

21 / 104

143

144

145

146

135

136

137

138

131

132

133

134

139

140

141

127

128

129

130

123

124

125

126

119

120

121

122

115

116

117

118

142

SIM8960 Series Hardware Design V1.03

MIPI_DSI0_CLK_P

MIPI_DSI0_CLK_N

MIPI_DSI0_LANE0_P

MIPI_DSI0_LANE0_N

MIPI_DSI0_LANE1_P

MIPI_DSI0_LANE1_N

MIPI_DSI0_LANE2_P

MIPI_DSI0_LANE2_N

MIPI_DSI0_LANE3_P

MIPI_DSI0_LANE3_N

GND

LCD0_TE

LCD0_RST

GND

WIFI/BT_ANT

GND

SENSOR_I2C_SCL

SENSOR_I2C_SDA

GND

GNSS_ANT

GND

TP1_RST_N

TP1_INT_N

TP0_RST_N

TP0_INT_N

TP0_I2C_SCL

USIM1_VDD

USIM1_DATA

USIM1_CLK

USIM1_RST

USIM1_DET

KEY_VOL_UP_N

1.8V

1.8V

1.8V

1.8V

GPIO_24

GPIO_61

GPIO_15

GPIO_14

1.8V

1.8V

1.8V

1.8V

1.8V

1.8 / 2.95

V

1.8 / 2.95

V

1.8 / 2.95

V

1.8 / 2.95

V

1.8V

1.8V

GPIO_8

GPIO_9

GPIO_64

GPIO_65

GPIO_11

GPIO_51

GPIO_52

GPIO_53

GPIO_54

GPIO_85

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

√

√

√

√

√

Can not be used as GPIO

Cannot be pull down externally

147

148

149

150

KEY_VOL_DOWN_N

GND

DRX_ANT

GND www.simcom.com

1.8V

22 / 104

171

172

173

174

167

168

169

170

175

176

177

178

179

163

164

165

166

159

160

161

162

155

156

157

158

151

152

153

154

ADC

PWM

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

GND

RESERVED

RESERVED

RESERVED

GND

RESERVED

RESERVED

RESERVED

MIC_BIAS

MIC_GND

MIC3_P

GND

USB_SS_RX_P

USB_SS_RX_M

GND

USB_SS_TX_P

USB_SS_TX_M

GND

GPIO_98

GPIO_99

SD_LDO12

186

187

188

189

190

180

181

182

183

184

185 www.simcom.com

DCAM_RST_N

DCAM_PWD_N

GND

MIPI_CSI1_CLK_P

MIPI_CSI1_CLK_N

MIPI_CSI1_LANE0_P

MIPI_CSI1_LANE0_N

MIPI_CSI1_LANE1_P

MIPI_CSI1_LANE1_N

MIPI_CSI1_LANE2_P

MIPI_CSI1_LANE2_N

1.6~2.85V

SIM8960 Series Hardware Design V1.03

PM8953_MPP2

PM8953_MPP4

1.8V

1.8V

1.8 / 2.95

V

1.8V

1.8V

GPIO_98

GPIO_99

GPIO_131

GPIO_132

I-PD

I-PD

I-PD

I-PD

√

√

23 / 104

SIM8960 Series Hardware Design V1.03

203

204

205

206

207

199

200

201

202

195

196

197

198

191

192

193

194

208

209

USIM2_CLK

USIM2_DATA

210 USIM2_VDD

225

226

227

228

221

222

223

224

217

218

219

220

211

212

213

214

215

216 www.simcom.com

TP_A

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

GND

RESERVED

RESERVED

USB_VCONN

USBC_CC2

USBC_CC1

GND

USB_SS_SEL

LINEOUT_P

LINEOUT_N

MIPI_CSI1_LANE3_P

MIPI_CSI1_LANE3_N

GND

DCAM_MCLK

GND

DCAM_I2C_SCL

DCAM_I2C_SDA

UART5_RX

UART5_TX

GPIO_3

GPIO_2

GNSS_LNA_EN

FP_SPI_CS

TP1_I2C_SDA

TP1_I2C_SCL

TP0_I2C_SDA

USIM2_RST

1.8V

1.8V

GPIO_28

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8 / 2.95

V

1.8 / 2.95

V

1.8 / 2.95

V

1.8 / 2.95

V

GPIO_56

GPIO_55

GPIO_32

GPIO_31

GPIO_17

GPIO_16

GPIO_3

GPIO_2

GPIO_116

GPIO_136

GPIO_6

GPIO_7

GPIO_10

GPIO_57

GPIO_139

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

√

√

√

√

Can be used not as GPIO

24 / 104

237

238

239

240

241

242

233

234

235

236

229

230

231

232

GPIO_97

GPIO_96

GPIO_90

GPIO_89

TP_B

GPIO_66

RESERVED

CAM4_MCLK

GPIO_36

GPIO_33

RESERVED

RESERVED

GPIO_107

GPIO_105

1.8V

1.8V

255

256

257

258

251

252

253

254

247

248

249

250

243

244

245

246

263

265

264

266

267

259

260

261

262

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

RESERVED

UART5_RTS

UART5_CTS

GPIO_1

GPIO_0

FP_SPI_MOSI

FP_SPI_CLK

GPIO_45

USIM2_DET

GND

GND

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

FP_SPI_MISO 1.8V

GPIO_42/ACCL_INT_N 1.8V

GPIO_43/ALSP_INT_N 1.8V

GPIO_44/MAG_INT_N 1.8V

1.8V

1.8V

www.simcom.com

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

GPIO_19

GPIO_18

GPIO_1

GPIO_0

GPIO_137

GPIO_135

GPIO_138

GPIO_42

GPIO_43

GPIO_44

GPIO_45

GPIO_58

SIM8960 Series Hardware Design V1.03

GPIO_97

GPIO_96

GPIO_90

GPIO_89

GPIO_66

GPIO_128

GPIO_36

GPIO_33

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

√

√

√

GPIO_107

GPIO_105

I-PD

I-PD Cannot be pull up externally

√

√

√

√

√

√

√

√

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

25 / 104

296

297

298

299

292

293

294

295

288

289

290

291

284

285

286

287

304

305

306

307

308

300

301

302

303

280

281

282

283

276

277

278

279

272

273

274

275

268

269

270

271 www.simcom.com

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

SIM8960 Series Hardware Design V1.03

26 / 104

SIM8960 Series Hardware Design V1.03

321

322

323

324

317

318

319

320

313

314

315

316

309

310

311

312

325

326

327

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

NOTE

1. NP = no-pull, PD = pull down, PU = pull up, KP = keeper

2. PM8953_XX means that it is a pin of PM8953

2.3

Pin Description

Table 4: I/O parameter definitions

Symbol

Pad attribute

PI

PO

AI

AO

DI

DO

Description

Power input

Power input

Analog input

Analog output

Digital input

Digital output www.simcom.com

27 / 104

SIM8960 Series Hardware Design V1.03

OD Open drain

Pad pull details for digital I/Os

NP No internal pull

PU

PD

Internal pullup

Internal pulldown

Table 5: Pin description

Pin Name

Power Supply

Pin No.

I/O

VBAT 37 ， 38 PI

VDD_RF

VREG_L5_1P8

VREG_L6_1P8

VREG_L10_2P8

VREG_L17_2P85 12

VREG_L2_1P1 www.simcom.com

1 ， 2

9

10

11

13

PO

PO

PO

PO

PO

PO

Description Note

Main power supply for the module

Main power supply for the

RF. External filter capacitor shall be reserved.

LDO 5 output, should not be changed and turned off.

LDO 6 output , could be turned off in sleep mode

LDO 10 output for Sensors and touchscreen

LDO 17 output for display and camera VCM

LDO 2 output for camera

DVDD

TVS is recommended for surge protection .

TVS is recommended for surge protection .

Cannot be used for other peripheral

Power supply for external GPIO’s pull up and level shift circuits.

If unused, keep it open.

Power supply for external circuit. A parallel 2.2uF~4.7uf

capacitance is required.

If unused, keep it open.

Power supply for external circuit. A parallel 2.2uF~4.7uf

capacitance is required.

If unused, keep it open.

Power supply for external circuit. A parallel 2.2uF~4.7uf

capacitance is required.

If unused, keep it open.

Power supply for external circuit. A parallel 2.2uF~4.7uf

capacitance is

28 / 104

VREG_L22_2P8

VREG_L23_1P2

VRTC

GND

USB TYPE-C

USB_VBUS

USB_DN

USB_DP

USB_ID

USB_VCONN

USB_SS_SEL www.simcom.com

14

15

16 PI/PO

3 ， 4 ， 18 ，

20 ， 31 ，

34 ， ， 40 ，

43 ， 47 ，

56 ， ， 87 ，

98 ， 101 ，

112 ， 125 ，

128 ， 130 ，

133 ， 135 ，

148 ， 150 ，

159 ， 163 ，

170 ， 173 ，

176 ， 182 ，

193 ， 195 ，

219 ， 225 ，

243 ，

257~327

P

41 ， 42

33

32

30

222

PI/PO

AI/AO

AI/AO

AI

AI

226

PO

PO

DO

SIM8960 Series Hardware Design V1.03

LDO 22 output for camera

AVDD

LDO 23 output for camera

DVDD

Coin cell or backup-battery charger supply and input required.

If unused, keep it open.

Power supply for external circuit. A parallel 2.2uF~4.7uf

capacitance is required.

If unused, keep it open.

Power supply for external circuit. A parallel 2.2uF~4.7uf

capacitance is required.

If unused, keep it open.

If unused, keep it open.

Ground

USB high-speed data

USB_ID interrupt detection

Power input pin (5 V, 210 mA from VBUS) to drive active cables during the DFP mode.

USB Type-C switch control,

USB insertion interrupt detection

Require differential impedance of 90ohm.

Default high-level

29 / 104

USBC_CC2

USBC_CC1

USB_SS_RX_P

USB_SS_RX_M

USB_SS_TX_P

USB_SS_TX_M

UIM Interface

USIM2_VDD

223

224

171

172

174

175

210

USIM2_DATA

USIM2_CLK

USIM2_RST

USIM2_DET

USIM1_DET

USIM1_RST

USIM1_CLK

USIM1_DATA

USIM1_VDD

SDIO/SD Interface

SD_CLK

SD_CMD

SD_DATA0

70

69

68 www.simcom.com

209

208

207

256

145

144

143

142

141

SIM8960 Series Hardware Design V1.03

AI

AI

AI/AO

AI/AO

AO

AO

PO

DI/DO

DO

DO

DI

DI

DO

DO

DI/DO

PO

DO

DI/DO

DID/O cannot be pull up externally

USB Type-C connector configuration channel 1

USB Type-C connector configuration channel 2

USB super-speed receive – plus

USB super-speed receive

–minus

USB super-speed transmit – plus

USB super-speed transmit – minus

LDO 15 output for UIM2

UIM2 data

UIM2 clock

UIM2 reset

UIM2 presence detection

The 1.8V or 2.95v

USIM identified card automatically is

Cannot be used as

GPIO

UIM1 presence detection

UIM1 reset

UIM1 clock

UIM1 data

LDO 14 output for UIM1

1.8V power domain.

External pull-up resistor is required.

If unused, keep it open.

1.8V power domain.

External pull-up resistor is required.

If unused, keep it open.

Cannot be used as

GPIO

The 1.8V or 2.95v

USIM card is automatically identified

Secure digital controller clock

Secure digital controller command

Secure digital controller data bit 0

30 / 104

SD_DATA1

SD_DATA2

SD_DATA3

SD_DET_N

SD_LDO11_2P95

SD_LDO12

Touch Screen

TP0_I2C_SDA

TP0_I2C_SCL

TP0_RST_N

TP0_INT_N

TP1_I2C_SDA

TP1_I2C_SCL

TP1_INT_N

TP1_RST_N

LCD Interface

PWM 152

LCD0_RST

LCD0_TE

LCD1_RST

LCD1_TE

MIPI_DSI0_CLK_P

MIPI_DSI0_CLK_N

MIPI_DSI0_LANE0_P 117

MIPI_DSI0_LANE0_N 118

MIPI_DSI0_LANE1_P 119

MIPI_DSI0_LANE1_N 120

MIPI_DSI0_LANE2_P 121

MIPI_DSI0_LANE2_N 122

MIPI_DSI0_LANE3_P 123

MIPI_DSI0_LANE3_N 124

MIPI_DSI1_CLK_P

MIPI_DSI1_CLK_N

102

103

MIPI_DSI1_LANE0_P 104

MIPI_DSI1_LANE0_N 105

127

126

113

114

115

116 www.simcom.com

206

140

138

139

204

205

137

136

67

66

65

64

63

179

SIM8960 Series Hardware Design V1.03

OD

OD

DO

DI

OD

OD

DI

DO

DI/DO

DI/DO

DI/DO

DI

PO

PO

Secure digital controller data bit 1

Secure digital controller data bit 2

Secure digital controller data bit 3

Secure digital card detection

LDO 11 output for SD card

SD card pull-up power supply;1.8v/2.95v

SD card pull-up only

Touch0 screen I2C data

Touch0 screen I2C clock

Touch0 screen reset

Touch0 screen interrupt

Touch1 screen I2C data

Touch1 screen I2C clock

Touch1 screen interrupt

Touch1screen reset

1.8V power domain.

External pull-up resistors are required.

1.8V

1.8V

1.8V power domain.

External pull-up resistors are required.

1.8V

1.8V

DO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AO

AO

AI/AO

AI/AO

DO

DI

DO

DI

AO

AO

PWM control for external

WLED driver

LCD0 reset

LCD0 tearing effect

LCD1 reset

LCD1 tearing effect

1.8V

1.8V

1.8V

1.8V

1.8V

Primary interface 0 display serial

Secondary display serial interface 1

31 / 104

MIPI_DSI1_LANE1_P 106

MIPI_DSI1_LANE1_N 107

MIPI_DSI1_LANE2_P 108

MIPI_DSI1_LANE2_N 109

MIPI_DSI1_LANE3_P 110

MIPI_DSI1_LANE3_N 111

Camera Interface

MIPI_CSI0_CLK_P

MIPI_CSI0_CLK_N

88

89

MIPI_CSI0_LANE0_P 90

MIPI_CSI0_LANE0_N 91

MIPI_CSI0_LANE1_P 92

MIPI_CSI0_LANE1_N 93

MIPI_CSI0_LANE2_P 94

MIPI_CSI0_LANE2_N 95

MIPI_CSI0_LANE3_P 96

MIPI_CSI0_LANE3_N 97

MIPI_CSI1_CLK_P

MIPI_CSI1_CLK_N

183

184

MIPI_CSI1_LANE0_P 185

MIPI_CSI1_LANE0_N 186

MIPI_CSI1_LANE1_P 187

MIPI_CSI1_LANE1_N 188

MIPI_CSI1_LANE2_P 189

MIPI_CSI1_LANE2_N 190

MIPI_CSI1_LANE3_P 191

MIPI_CSI1_LANE3_N 192

MIPI_CSI2_CLK_P 77

MIPI_CSI2_CLK_N 78

MIPI_CSI2_LANE0_P 79

MIPI_CSI2_LANE0_N 80

MIPI_CSI2_LANE1_P 81

MIPI_CSI2_LANE1_N 82

MIPI_CSI2_LANE2_P 83

MIPI_CSI2_LANE2_N 84

MIPI_CSI2_LANE3_P 85

MIPI_CSI2_LANE3_N 86 www.simcom.com

SIM8960 Series Hardware Design V1.03

AI/AO

AI/AO

AI

AI

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI

AI

AI/AO

AI/AO

AI/AO

AI/AO

AI

AI

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

Primary camera interface 0 serial

Camera serial interface 1

Secondary camera serial interface 2

Camera 4 MIPI lane0

– positive

Camera 4 MIPI lane0

–negative

Camera 4 MIPI clock

– positive

Camera 4 MIPI clock

– negative

32 / 104

MCAM_RST_N

MCAM_PWD_N

SCAM_RST_N

SCAM_PWD_N

CAM_I2C_SDA0

CAM_I2C_SCL0

SCAM_MCLK

MCAM_MCLK 99

DCAM_MCLK

CAM4_MCLK

DCAM_RST_N

DCAM_PWD_N

DCAM_I2C_SDA

DCAM_I2C_SCL

Keypad

KEY_VOL_UP_N 146

KEY_VOL_DOWN_N 147

194

236

180

181

197

196

76

75

100

39 PWRKEY

Sensors

SENSOR_I2C_SCL

SENSOR_I2C_SDA

GPIO_42/

ACCL_INT_N

GPIO_43/

ALSP_INT_N

GPIO_44/

MAG_INT_N

GPIO_45

Audio

SPK_P

SPK_N

55

54

131

132

252

253

254

255

74

73

72

71 www.simcom.com

DO

DO

DO

DO

DO

OD

OD

OD

OD

DO

DO

DO

DO

DO

DI

DI

OD

OD

DI

DI

DI

DI

DI

AO

AO

SIM8960 Series Hardware Design V1.03

Primary Camera reset 1.8V

Primary Camera power down

Secondary Camera reset

1.8V

1.8V

Secondary Camera power down, cannot be pull up externally

1.8V

DedicatedCamera I2C data 1.8V power domain.

Dedicated Camera I2C clock

Secondary Camera master clock

External pull-up resistors are required.

1.8V

Primary Camera master clock

1.8V

Depth Camera master clock 1.8V

Camera 4 master clock

Depth Camera reset

1.8V

1.8V

Depth Camera power down 1.8V

Depth Camera I2C data

Depth Camera I2C clock

1.8V power domain.

External pull-up resistors are required.

Volume up keypad

Volume down keypad

Power on keypad

If unused, keep it open.

If unused, keep it open.

Sensors I2C clock

Sensors I2C data

Accelerate sensor interrupt

Ambient light and proximity sensor interrupt

Magnetic sensor interrupt

Gyroscope sensor interrupt

1.8V power domain.

External pull-up resistors are required.

Speaker driver output, positive

Speaker driver output, negative

33 / 104

EAR_P

EAR_N

HPH_L

HPH_REF

HPH_R

HS_DET

MIC2_P

MIC1_N

MIC1_P

MIC_GND

MIC3_P

MIC_BIAS

LINEOUT_P

LINEOUT_N

Antenna

MAIN_ANT

DRX_ANT

GNSS_ANT

WIFI/BT_ANT

UART

UART2_TX

UART2_RX

UART4_TX

UART4_RX

UART5_TX

UART5_RX

UART5_RTS

UART5_CTS

SPI

SPI6_CS

SPI6_CLK

SPI6_MOSI

SPI6_MISO www.simcom.com

227

228

19

149

134

129

5

6

7

8

199

198

245

246

58

59

60

61

51

48

46

45

44

168

169

167

53

52

49

50

SIM8960 Series Hardware Design V1.03

DO

DO

DO

DI

AO

AI

AI

AI

AI

AO

AO

AO

AI

AI

PO

AO

AO

AI/AO

AI

AI

AI/AO

DO

DI

DO

DI

DO

DI

DO

DI

Earpiece output, positive

Earpiece output, negative

Headphone output, left channel

Headphone reference ground

Headphone output, right channel

Headset detection

Microphone input 2, positive

Microphone input 1, negative

Microphone input 1, positive

MIC ground

Microphone input 3, positive

Microphone bias1 Bias for external

MEMS Microphone ；

ECM:

MIC_BIAS open keep

LINEOUT output, positive

LINEOUT output, negative

2G/3G/4G main antenna port

4G diversity antenna port

GNSS antenna port

WIFI/BT antenna port

UART2 data transmit for debug

UART2 data receive for debug

UART4 data transmit

UART4 data receive

UART5 data transmit

UART5 data receive

UART5 Ready-for-receive

UART5 Clear-to-send

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

SPI6 chip select

SPI6 clock

SPI6 master out slave in

SPI6 master in slave out

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SIM8960 Series Hardware Design V1.03

FP_SPI_CS

FP_SPI_CLK

FP_SPI_MOSI

FP_SPI_MISO

GPIO

GPIO_0

GPIO_1

GPIO_2

GPIO_3

GPIO_33

GPIO_36

GPIO_66

GPIO_89

GPIO_90

GPIO_96

GPIO_97

GPIO_98

GPIO_99

203

250

249

251

232

231

230

229

177

178

248

247

201

200

238

237

234

GPIO_105 242

GPIO_107 241

Emergency Download Interface

FORCED_USB_BOO

T

57

ADC Interface

ADC 151

Others

GNSS_LNA_EN

TP_A

TP_B

NC

202

211

233

NC

17 ， 21~29 ，

36 ，

153~158 ，

160~162 ，

164~166 ，

212~218 ，

220 ， 221 ，

235 ， 239 ， www.simcom.com

DO

DO

DO

DI

DI/DO

DI/DO

DI/DO

DI/DO

DI/DO

DI/DO

DI/DO

DI/DO

DI/DO

DI/DO

DI/DO

DI/DO

DI/DO

DI/DO

DI/DO

DI

AI

DO

SPI chip select

SPI clock

SPI master out slave in

SPI master in slave out

Do not connect

Reusable as I2S_WS

Reusable

I2S_SCK as

Reusable as I2S_D0

Reusable as I2S_D1

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

Cannot be pull up externally

Force boot from USB interface

ADC Maximum voltage is 1.7V.

input

GPS LNA enable control

Only for testing.

Please keep open only used for module testing TP_A and TP_B are only used for module testing directly connected inside the module

35 / 104

240 ， 244

NOTE

1. Leave unused pins floating unless otherwise specified.

SIM8960 Series Hardware Design V1.03

www.simcom.com

36 / 104

SIM8960 Series Hardware Design V1.03

3

Interface Application

3.1

Power Supply

The power supply of SIM8960x ranges from 3.4V to 4.4V, and 3.9V is recommended. It must be able to provide sufficient current up to 3A for the high-power transmitting.

3.1.1

Recommended power supply resolutions

For battery-powered applications, the external charging IC is needed.

For non-battery applications, if the DC input voltage is +5V and users do not care about the power efficiency, a high-current low-dropout regulator is recommended. The reference design is shown in Figure 3.

Figure 3: LDO power supply reference circuit

NOTE

1. To ensure a proper behavior of the regulator under light load, an extra minimum load (R103 in

Figure 3) is required, because the current SIM8960x consumed is very small in sleep mode and power off mode. For more details about minimum load, please refer to specification of MIC29302.

To increase power efficiency, the switching mode DC-DC converter is preferable, especially when DC input www.simcom.com

37 / 104

SIM8960 Series Hardware Design V1.03

voltage is quite high. The reference design is shown in Figure 4, and it is recommended to reserve a proper ferrite bead (FB101 in Figure 4) in series for EMI suppression.

Figure 4: DC-DC power supply reference circuit

3.1.2

Enhance power stability

To enhance power stability, it is recommended to add some bypass capacitors and TVS closed to VBAT pins. The reference design is shown in Figure 5, where C101 and C102 are two110uF tantalum capacitors with low ESR, C103 could be a 1~10uF ceramic capacitor, 33pFand 10pF capacitors are used for eliminating the high frequency interference, 5V/1600W TVS can protect the module against voltage surge.

Figure 5: VBAT input reference circuit

Table 6: Recommended TVS diode

1

2

No.

Vendor

Prisemi

Prisemi

Part number

PTVSHC3N4V8U

PTVSHC2EN5VU

Power(watts)

3200W

1600W www.simcom.com

Packages

DFN2×2-3L

DFN1610-2L

38 / 104

SIM8960 Series Hardware Design V1.03

3.2

Power On/off

3.2.1

Power on

Users can power on SIM8960x by pulling down the PWRKEY pin for more than 2 second then release. This pin is already pulled up to 1.8V internally, so external pull up is not necessary. The electrical characteristics are listed in Table 7, and reference circuits are shown in the following figures:

Figure 6: Powered on/off module using button

Figure 7: Powered on/off module using transistor

Table 7: PWRKEY characteristics

Parameters

V

IH

V

IL

Description

High-level input voltage

Low-level input voltage -

1.4

Min

-

-

Typ

-

0.6

Max

V

V

Unit www.simcom.com

39 / 104

3.2.2

Power-on sequence

The power-on sequence is shown in Figure 8.

SIM8960 Series Hardware Design V1.03

Figure 8: Power-on sequence

NOTE

1. Make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 50ms.

2. PWRKEY pin cannot be pulled down all the time.

3.2.3

Power off

Users can turn off SIM8960x by pulling down the PWRKEY pin for more than 1 second. After the module detects that the PWRKEY is low level, a prompt window will pop up on the screen to confirm whether to execute the shutdown action.

Module can also be forced to shut down by pulling down PWRKEY for more than 8 seconds.

www.simcom.com

Figure 9: Power-o ff sequence

40 / 104

SIM8960 Series Hardware Design V1.03

NOTE

1. The VBAT power supply circuit of the module can be cut off in the customer's hardware design.

2. It is recommended to add a low-cost MCU, which can control the PWRKEY to power on and power off the module, as well as the hardware watchdog to protect the normal operation.

3. Do not directly cut off the power supply VBAT of the module when the module is working normally, otherwise the internal flash of the module will be damaged. It is strongly recommended to shut down the module through PWRKEY or AT command before disconnecting the power supply VBAT of the module.

3.3

VRTC

VRTC is the power supply for RTC circuit and charger output for coin cell or backup battery. If RTC support is needed when the battery is removed, a qualified coin cell or keep-alive capacitor is required on the VRTC pin. When VBAT is present and valid, coin cell charging is enabled through software control and powered from VBAT.

Reference circuits are shown in the following figures:

Keep-alive capacitor:

Non-rechargeable battery:

Figure 10: Keep-alive capacitor www.simcom.com

Figure 11: Non-rechargeable battery

41 / 104

SIM8960 Series Hardware Design V1.03

Rechargeable battery:

Figure 12: Rechargeable battery

VRTC typical voltage is 3.0V, and the current consumption is about 18uA when VBAT is absence. VRTC electrical characteristics are listed in the following table.

Table 8: VRTC characteristic

Parameter Description

VRTC

-IN

I

RTC-IN

VRTC

-OUT

I

RTC-OUT

VRTC input voltage

VRTC current consumption -

2.0

VRTC output voltage

VRTC output current -

2.5

Min

3.0

18

3.1

Typ

3.25

20

3.2

2

Max

V uA

V mA

Unit

3.4

Output Power Management

Table 9: Output power management summary

Pin Name

VREG_L5_1P8 9

Pin# Specified

1.8

VREG_L6_1P8 10

VREG_L10_2P8 11

1.8

2.8

Pin Name

N/A 50

Pin#

N/A 300

1.750–3.3375

150

VREG_L17_2P85 12

VREG_L2_1P1 13

VREG_L22_2P8 14

VREG_L23_1P2 15

SD_LDO11_2P95 63

SD_LDO12 179

2.85

1.1

2.8

1.2

1.8V/2.95V

1.8V/2.95V

1.750–3.3375

300

0.375–1.5375

1200

1.750–3.3375

150

0.375–1.5375

600

800

N/A 50 www.simcom.com

Specified

Force USB boot, level shifter

Display, camera, sensors

Sensors and touch screen display and camera VCM camera DVDD camera AVDD camera DVDD

SD/MMC card

SD card pull-up power supply;

42 / 104

USIM1_VDD

USIM2_VDD

141

210

1.8V/2.95V

1.8V/2.95V

N/A

N/A

SIM8960 Series Hardware Design V1.03

50

50

UIM1

UIM2

3.5

USB Type-C Interface

SIM8960x module provides one USB 3.0/2.0 interface used for software upgrading, debugging, etc.

Moreover, SIM8960x has integrated Type-C interface to provide multiple Type-C features, including mode configuration, channel configuration, current advertisement, and active cable support.

Table 10: USB interface Pin definition

PIN name Pin# I/O

USB_VBUS 41, 42 PI/PO

USB_DP

USB_DN

USB_ID

USB_VCONN

32

33

30

222

AI/AO

AI/AO

AI

AI

USB_SS_SEL

USBC_CC2

USBC_CC1

USB_SS_RX_P

USB_SS_RX_M

USB_SS_TX_P

USB_SS_TX_M

226

223

224

171

172

174

175

DO

AI/AO

AI/AO

AI

AI

AO

AO

Description

VBUS insertion detection

USB high-speed data

Note

Vmin=4.35V

Vnorm=5.0V

Vmax=10V

Require differential impedance

90ohm.

of

Default high-level USB_ID interrupt detection

Power input pin (5 V, 210 mA from

VBUS) to drive active cables during the DFP mode.

USB Type-C switch control, cannot be pull up externally

USB Type-C connector configuration channel 2

USB Type-C connector configuration channel 1

USB super-speed receive – plus

USB super-speed receive –minus

USB super-speed transmit – plus

USB super-speed transmit – minus

Vmin=4.75V

Vmax=5.25V

Require differential impedance of

90ohm.

Require differential impedance

90ohm.

of www.simcom.com

43 / 104

SIM8960 Series Hardware Design V1.03

Figure 13: USB Type-C reference circuit

Figure 14: Micro USB reference circuit

In order to ensure the performance of USB, it is recommended to follow the following design principles:

 90 Ω differential, ± 10% trace impedance

 Differential data pair matching <6.6 mm (50 ps)

 USB data traces layout requires GND protection. It need keep away from crystals, power, www.simcom.com

44 / 104

SIM8960 Series Hardware Design V1.03

magnetic devices, and RF-sensitive signals.

 Reserve ESD protection devices close to the USB interface. External components should be located near the USB connector.

 The parasitic capacitance requirements of USB 2.0 ESD protection devices are not more than

2pF;

 The parasitic capacitance requirements of the USB 3.0 ESD protection device do not exceed

0.5pF.

 USB 2.0 differential signal lines, USB 3.0 TX difference signals, and USB 3.0RX differential signal lines require equal length processing.

 If there are test points, place them on the trace to keep branches as short as possible

Table 11: Length of USB traces inside the module

Pin#

32

33

171

172

174

175

USB_DP

USB_DN

USB_SS_RX_P

USB_SS_RX_M

USB_SS_TX_P

USB_SS_TX_M

Net Name Length (mm)

42.13

42.08

26.85

26.87

23.99

24.14

Difference(mm)

0.05

-0.02

-0.15

3.6

UART/SPI/I2C

SIM8960x provides several sets of GPIOs which are available as BLSP (BAM-enabled low-speed peripheral) interfaces that can be configured to support various interface combinations, as shown in Table

12.

UART: Support 4*UART; up to 4 Mbps

SPI: Supports 7*SPI; master-only mode; up to 52 MHz

I2C: Support 10*I2C; master-only mode; up to 3.4 MHz, 2.2Kohm pull-up resistors are needed externally;

NOTE

1. CAM_I2C is a dedicated camera control interface, which cannot be used as general-purpose I2C ports.

2. I2C: 2.2Kohm pull-up resistors are needed externally.

www.simcom.com

45 / 104

SIM8960 Series Hardware Design V1.03

Pin Name

UART5_TX

UART5_RX

UART5_CTS

UART5_RTS

SPI6_MOSI

SPI6_MISO

SPI6_CS

SPI6_CLK

GPIO_96

GPIO_97

GPIO_98

GPIO_99

FP_SPI_CLK

FP_SPI_CS

FP_SPI_MOSI

FP_SPI_MISO

CAM_I2C_SDA0

CAM_I2C_SCL0

DCAM_I2C_SDA

GPIO_0

GPIO_1

GPIO_2

GPIO_3

UART2_TX

UART2_RX

TP1_I2C_SDA

TP1_I2C_SCL

TP1_RST_N

TP1_INT_N

TP0_I2C_SDA

TP0_I2C_SCL

UART4_TX

UART4_RX

7

8

SENSOR_I2C_SDA 132

SENSOR_I2C_SCL 131

205

136

137

206

140

248

247

201

200

5

6

204

230

229

177

177

250

203

249

251

76

75

197

199

198

246

245

60

61

58

59

Pin#

Table 12: UART/SPI/I2Cfunctional assignments

GPIO

GPIO_0

GPIO_1

GPIO_2

GPIO_3

GPIO_4

GPIO_5

GPIO_6

GPIO_7

GPIO_8

GPIO_9

GPIO_10

GPIO_11

GPIO_12

GPIO_13

GPIO_14

GPIO_15

Alternative

Function 1

Alternative

Function 2

SPI1_MOSI

SPI1_MISO

SPI1_CS

SPI1_CLK

GPIO_16

GPIO_17

GPIO_18

GPIO_19

GPIO_20

GPIO_21

GPIO_22

GPIO_23

UART2_TX

UART2_RX

UART2_CTS

UART2_RTS

SPI3_MOSI

SPI3_MISO

SPI3_CS

SPI3_CLK

UART4_TX

UART4_RX

SPI4_MOSI

SPI4_MISO

UART4_CTS SPI4_CS

UART4_RTS SPI4_CLK

UART5_TX

UART5_RX

SPI5_MOSI

SPI5_MISO

UART5_CTS SPI5_CS

UART5_RTS SPI5_CLK

UART6_TX SPI6_MOSI

UART6_RX SPI6_MISO

UART6_CTS SPI6_CS

UART6_RTS SPI6_CLK

GPIO_96

GPIO_97

GPIO_98

GPIO_99

SPI8_MOSI

SPI8_MISO

SPI8_CS

SPI8_CLK

GPIO_135 MI2S_2_SCK SPI7_CLK

GPIO_136 MI2S_2_WS SPI7_CS

GPIO_137 MI2S_2_D0 SPI7_MOSI

SPI7_MISO GPIO_138 MI2S_2_D1

GPIO_29

GPIO_30

GPIO_31

Alternative

Function 3

I2C1_SDA

I2C1_SCL

I2C2_SDA

I2C2_SCL

I2C3_SDA

I2C3_SCL

I2C4_SDA

I2C4_SCL

I2C5_SDA

I2C5_SCL

I2C6_SDA

I2C6_SCL

I2C8_SDA

I2C8_SCL

I2C7_SCL

I2C7_SDA

CAM_I2C_SDA0

CAM_I2C_SCL0

DCAM_I2C_SDA www.simcom.com

46 / 104

DCAM_I2C_SCL 196 GPIO_32

SIM8960 Series Hardware Design V1.03

DCAM_I2C_SCL

3.7

Secure Digital Interface

SIM8960x provides one 4-bit secure digital interface, which supports SD 3.0 specifications.

Table 13: SD interface pin definitions

Pin Name

SD_LDO11_2P95 63

SD_LDO12

SD_CLK

SD_CMD

SD_DATA0

SD_DATA1

SD_DATA2

SD_DATA3

SD_DET_N

Pin#

179

67

66

65

64

70

69

68

I/O

PO

Description

LDO 11 output for SD card

PO

DO

DI/DO

DID/O

DI/DO

DI/DO

DI/DO

DI

SD card pull-up power supply

Secure digital controller clock

Secure digital controller command

Secure digital controller data bit 0

Secure digital controller data bit 1

Secure digital controller data bit 2

Secure digital controller data bit 3

Secure digital card detection

Note

Vnorm=2.95V

Maximum current:

800mA

Maximum current:

50mA

Require impedance

50ohm.

of www.simcom.com

Figure 15: SD card reference circuit

47 / 104

SIM8960 Series Hardware Design V1.03

NOTE

1. SDC signal cannot be pulled up to SD_LDO11_2P95.

In order to ensure the performance of SD, it is recommended to follow the following design principles:

 Protect other sensitive signals/circuits from SDC corruption.

 Protect SDC signals from noisy signals (clocks, SMPS, etc.).

 Up to 200 MHz clock rate

 50 Ω nominal, ±10% trace impedance

 CLK to DATA/CMD length matching <1 mm

 30–35 Ω termination resistor on clock lines near the module

 Total routing length <50 mm recommended

 Spacing to all other signals = 2x line width

 Bus capacitance < 15 pF

Table 14: Length of SD traces inside the module

67

66

65

Pin#

70

69

68

Net Name

SD_CLK

SD_CMD

SD_DATA0

SD_DATA1

SD_DATA2

SD_DATA3

Length (mm)

25.30

25.41

25.40

25.19

25.16

25.56

3.8

LCD Interface

SIM8960x provides two 4-lane MIPI_DSI, with 2.1 Gbps per lane high-speed mode bandwidth, to support dual LCDs with FHD (1920 × 1200 @ 60 fps) resolution.

NOTE

1. MIPI_DSI0 must be used for primary display.

www.simcom.com

48 / 104

SIM8960 Series Hardware Design V1.03

Table 15: Display interface pin definitions

Pin Name Pin#

MIPI_DSI0_CLK_P

MIPI_DSI0_CLK_N

115

116

MIPI_DSI0_LANE0_P 117

MIPI_DSI0_LANE0_N 118

MIPI_DSI0_LANE1_P 119

MIPI_DSI0_LANE1_N 120

MIPI_DSI0_LANE2_P 121

MIPI_DSI0_LANE2_N 122

MIPI_DSI0_LANE3_P 123

MIPI_DSI0_LANE3_N 124

MIPI_DSI1_CLK_P

MIPI_DSI1_CLK_N

102

103

MIPI_DSI1_LANE0_P 104

MIPI_DSI1_LANE0_N 105

MIPI_DSI1_LANE1_P 106

MIPI_DSI1_LANE1_N 107

MIPI_DSI1_LANE2_P 108

MIPI_DSI1_LANE2_N 109

MIPI_DSI1_LANE3_P 110

MIPI_DSI1_LANE3_N 111

VREG_L6_1P8

VREG_L17_2P85

PWM

LCD0_RST

LCD0_TE

LCD1_RST

LCD1_TE

10

12

152

127

126

113

114

I/O

AO

AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AO

AO

PO

PO

DO

DO

DI

DO

DI

Description

Primary display serial interface 0

Secondary display serial interface 1

LDO 6 output for LCM IO

LDO 17 output for display

PWM control for external WLED driver

LCD0 reset

LCD0 tearing effect

LCD1 reset

LCD1 tearing effect

If only 2-lane MIPI_DSI is needed, just leave LANE2 and LANE3 floating.Common mode filters is recommended for EMI issue, and it may be omitted if best EMI practices are followed.

LCM0 can adopt external backlight drive also. The PWM pin of module is used to adjust backlight brightness. The reference circuit is shown as follows.

www.simcom.com

49 / 104

SIM8960 Series Hardware Design V1.03

Figure 16: LCM0 Display reference circuit (external backlight drive)

LCM1 can adopt external backlight drive also. The reference circuit is shown as follows.

www.simcom.com

50 / 104

SIM8960 Series Hardware Design V1.03

Figure 17: LCM1 Display reference circuit

In order to ensure the performance of MIPI_DSI, it is recommended to follow the following design principles:

 Protect MIPI_DSI signals from noisy signals (clocks, SMPS, etc.)

 Differential pairs, 100 Ω nominal, ±10%

 Total routing length <305 mm

 Intra-pair length matching < 5 ps (0.67 mm)

 Inter-pair length matching < 10 ps (1.3 mm)

 Lane-to-lane trace spacing = 3x line width

 Spacing to all other signals = 4x line width

 Maintain a solid ground reference for clocks to provide a low-impedance path for return currents

 Each trace needs to be next to a ground plane

 Minimize the number of via on the trace

Table 16: Length of MIPI_DSI traces inside the module

Pin#

115

116

117

Net Name

MIPI_DSI0_CLK_P

MIPI_DSI0_CLK_N

MIPI_DSI0_LANE0_P www.simcom.com

Length (mm)

21.26

21.62

21.12

Difference(mm)

-0.36

-0.26

51 / 104

104

105

106

107

123

124

102

103

108

109

110

111

118

119

120

121

122

MIPI_DSI0_LANE0_N

MIPI_DSI0_LANE1_P

MIPI_DSI0_LANE1_N

MIPI_DSI0_LANE2_P

MIPI_DSI0_LANE2_N

MIPI_DSI0_LANE3_P

MIPI_DSI0_LANE3_N

MIPI_DSI1_CLK_P

MIPI_DSI1_CLK_N

MIPI_DSI1_LANE0_P

MIPI_DSI1_LANE0_N

MIPI_DSI1_LANE1_P

MIPI_DSI1_LANE1_N

MIPI_DSI1_LANE2_P

MIPI_DSI1_LANE2_N

MIPI_DSI1_LANE3_P

MIPI_DSI1_LANE3_N

SIM8960 Series Hardware Design V1.03

21.38

21.62

21.60

23.75

23.61

23.87

23.71

15.46

15.54

15.44

15.58

15.56

15.43

15.59

15.70

15.47

15.46

0.02

0.14

0.16

-0.08

-0.14

0.13

-0.11

0.01

3.9

Touch Screen Interface

The module provides two I2C interfaces for connecting the touch screen, as well as the interrupt and reset pins of the touch panel. The interface pins are defined as follows:

Table 17: Touch screen interface pin definitions

Pin Name

TP0_I2C_SDA

TP0_I2C_SCL

TP0_RST_N

TP0_INT_N

TP1_I2C_SDA

TP1_I2C_SCL

TP1_INT_N

TP1_RST_N

VREG_L6_1P8

VREG_L10_2P8

139

204

205

137

136

Pin#

206

140

138

10

11

I/O

OD

OD

DO

DI

OD

OD

DI

DO

PO

PO

Description

Touch screen I2C data

Touch screen I2C clock

Touch screen reset

Touch screen interrupt

Touch screen I2C data

Touch screen I2C clock

Touch screen interrupt

Touch screen reset

LDO 6 output for Touch screen

LDO 10 output for Touch screen

Note

Maximum current:

300mA

Maximum current:

150mA www.simcom.com

52 / 104

SIM8960 Series Hardware Design V1.03

NOTE

1. I2C requires external pull-up to 1.8V, pull-up resistor 2.2Kohm

3.10

Camera Interface

The SIM8960x module video input interface is based on the MIPI_CSI standard.

■Three 4-lane CSI (4 + 4 + 4 or 4 + 4 + 2 + 1), 2.1 Gbps per lane.

■Three 4-lane CSI interfaces support three (4-lane+4-lane+4-lane) or four (4-lane+4-lane+2-lane+1-lane) cameras.

■ Support dual ISP (image signal processing), up to 21M pixels (dual ISP).

■Hardware support for up to four MCLKs, two CCI I2C for camera control.

Table 18: Camera interface pin definitions

Pin Name

VREG_L2_1P1

Pin#

13

I/O

PO

Description

LDO 2 output for camera DVDD

VREG_L6_1P8 10 PO LDO 6 output for camera IO VDD

VREG_L17_2P85

VREG_L22_2P8

VREG_L23_1P2 15

MIPI_CSI0_CLK_P

MIPI_CSI0_CLK_N

88

89

MIPI_CSI0_LANE0_P 90

MIPI_CSI0_LANE0_N 91

MIPI_CSI0_LANE1_P 92

MIPI_CSI0_LANE1_N 93

MIPI_CSI0_LANE2_P 94

MIPI_CSI0_LANE2_N 95

MIPI_CSI0_LANE3_P 96

MIPI_CSI0_LANE3_N 97

12

14

PO

PO

LDO 17 output for camera VCM

LDO 22 output for camera AVDD

PO

AI

AI

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

LDO 23 output for camera DVDD

Primary camera serial interface 0

Note

The maximum output current is 1200mA

The maximum output current is 300mA

The maximum output current is 300mA

The maximum output current is 150mA

The maximum output current is 600mA www.simcom.com

53 / 104

MIPI_CSI1_CLK_P 183

MIPI_CSI1_CLK_N 184

MIPI_CSI1_LANE0_P 185

MIPI_CSI1_LANE0_N 186

MIPI_CSI1_LANE1_P 187

MIPI_CSI1_LANE1_N 188

MIPI_CSI1_LANE2_P 189

MIPI_CSI1_LANE2_N 190

MIPI_CSI1_LANE3_P 191

MIPI_CSI1_LANE3_N 192

MIPI_CSI2_CLK_P

MIPI_CSI2_CLK_N

77

78

MIPI_CSI2_LANE0_P 79

MIPI_CSI2_LANE0_N 80

MIPI_CSI2_LANE1_P 81

MIPI_CSI2_LANE1_N 82

MIPI_CSI2_LANE2_P 83

MIPI_CSI2_LANE2_N 84

MIPI_CSI2_LANE3_P 85

MIPI_CSI2_LANE3_N 86

MCAM_RST_N

MCAM_PWD_N

SCAM_RST_N

74

73

72

SCAM_PWD_N 71

CAM_I2C_SDA0

CAM_I2C_SCL0

SCAM_MCLK

MCAM_MCLK

DCAM_MCLK

CAM4_MCLK

DCAM_RST_N

DCAM_PWD_N

DCAM_I2C_SDA

DCAM_I2C_SCL

76

75

100

99

194

236

180

181

197

196

SIM8960 Series Hardware Design V1.03

AI

AI

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

Camera serial interface 1

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

DO

DO

DO

AI

AI

AI/AO

AI/AO

AI/AO

AI/AO

DO

OD

OD

DO

DO

DO

DO

DO

DO

OD

OD

Secondary camera serial interface

2

Primary Camera reset

Primary Camera power down

Secondary Camera reset

Secondary Camera power down, cannot be pull up externally

Dedicated Camera I2C data

Dedicated Camera I2C clock

Secondary Camera master clock

Primary Camera master clock

Depth Camera master clock

Camera 4 master clock

Depth Camera reset

Depth Camera power down

Depth Camera I2C data

Depth Camera I2C clock

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

Camera 4 MIPI lane0 – positive

Camera 4 MIPI lane0 –negative

Camera 4 MIPI clock

– positive

Camera 4 MIPI clock

– negative www.simcom.com

54 / 104

The reference circuit is shown in the following figures.

SIM8960 Series Hardware Design V1.03

www.simcom.com

Figure 18: Primary camera reference circuit

55 / 104

SIM8960 Series Hardware Design V1.03

Figure 19: Secondary camera reference circuit www.simcom.com

Figure 20: Depth camera reference circuit

56 / 104

SIM8960 Series Hardware Design V1.03

NOTE

1. CSI0 is used for the rear camera, CSI1 for the depth camera and CSI2 for the front camera.

2. MIPI_CSI1_LANE2_P 、 MIPI_CSI1_LANE2_N 、 MIPI_CSI1_LANE3_P and MIPI_CSI1_LANE3_N can be reused as MIPI signal lines of camera 4.

3. I2C requires external pull-up to 1.8V, pull-up resistor 2.2Kohm

In order to ensure the performance of MIPI_CSI, it is recommended to follow the following design principles:

 Protect MIPI_DSI signals from noisy signals (clocks, SMPS, etc.)

 Differential pairs, 100 Ω nominal, ±10%

 Total routing length <305 mm

 Intra-pair length matching < 5 ps (0.67 mm)

 Inter-pair length matching < 10 ps (1.3 mm)

 Lane-to-lane trace spacing = 3x line width

 Spacing to all other signals = 4x line width

 Maintain a solid ground reference for clocks to provide a low-impedance path for return currents

 Each trace needs to be next to a ground plane

 Minimize the number of via on the trace

Table 19: Length of MIPI_CSI traces inside the module

94

95

96

97

91

92

93

183

184

185

186

187

Pin#

88

89

90 www.simcom.com

Net Name

MIPI_CSI0_CLK_P

MIPI_CSI0_CLK_N

MIPI_CSI0_LANE0_P

MIPI_CSI0_LANE0_N

MIPI_CSI0_LANE1_P

MIPI_CSI0_LANE1_N

MIPI_CSI0_LANE2_P

MIPI_CSI0_LANE2_N

MIPI_CSI0_LANE3_P

MIPI_CSI0_LANE3_N

MIPI_CSI1_CLK_P

MIPI_CSI1_CLK_N

MIPI_CSI1_LANE0_P

MIPI_CSI1_LANE0_N

MIPI_CSI1_LANE1_P

Length (mm)

16.10

15.93

15.83

15.52

15.50

15.72

15.52

15.56

15.54

15.27

15.23

15.26

11.88

11.51

6.29

Difference(mm)

0.17

0.31

-0.22

-0.04

0.27

-0.03

0.37

-0.32

57 / 104

84

85

86

79

80

81

82

83

188

189

190

191

192

77

78

MIPI_CSI1_LANE1_N

MIPI_CSI1_LANE2_P

MIPI_CSI1_LANE2_N

MIPI_CSI1_LANE3_P

MIPI_CSI1_LANE3_N

MIPI_CSI2_CLK_P

MIPI_CSI2_CLK_N

MIPI_CSI2_LANE0_P

MIPI_CSI2_LANE0_N

MIPI_CSI2_LANE1_P

MIPI_CSI2_LANE1_N

MIPI_CSI2_LANE2_P

MIPI_CSI2_LANE2_N

MIPI_CSI2_LANE3_P

MIPI_CSI2_LANE3_N

SIM8960 Series Hardware Design V1.03

22.72

22.60

22.67

22.58

22.43

22.60

22.53

22.70

6.61

4.89

4.56

7.69

7.72

23.24

22.78

0.33

-0.03

0.46

0.12

0.09

-0.17

-0.17

3.11

Audio

SIM8960x provides three microphone inputs and four outputs including earpiece, stereo headphones, mono class-D speaker driver and LINEOUT.

Pin Name

SPK_P

SPK_N

EAR_P

EAR_N

HPH_L

HPH_REF

HPH_R

HS_DET

MIC2_P

MIC1_N

MIC1_P

MIC_GND

MIC3_P

MIC_BIAS

Table 20: Audio interface pin definitions

Pin#

55

54

51

48

46

45

44

53

52

49

50

168

169

167

AO

AI

AI

AI

AI

AO

AO

AO

AI

I/O

AO

AO

AI

PO www.simcom.com

Description

Speaker driver output, positive

Speaker driver output, negative

Earpiece output, positive

Earpiece output, negative

Headphone output, left channel

Headphone ground reference

Headphone output, right channel

Headset detection

Microphone input 2, positive

Microphone input 1, negative

Microphone input 1, positive

MIC ground.

Microphone input 3, positive

Microphone bias

58 / 104

LINEOUT_P

LINEOUT_N

3.11.1

Microphone

227

228

AO

AO

SIM8960 Series Hardware Design V1.03

LINEOUT output, positive

LINEOUT output, negative

Figure 21: ECM-type microphonereference circuit

Figure 22: MEMS-type microphone reference circuit

3.11.2

Headset

Stereo class-AB headphone supports 16 Ω, 32 Ω, and up to 50 KΩ loads. Its typical output power at 1.02

www.simcom.com

59 / 104

SIM8960 Series Hardware Design V1.03

KHz and THD + N ≤ 1% is:

 62 mW with 16 Ω loads, 0 dBFS and 0 dB gain

 30 mW with 32 Ω loads, 0 dBFS and 0 dB gain

A 100KΩ pull-down resistor is integrated at HPH_L pin, which could be used for mechanical insertion or removal detection through HS_DET pin. Figure 23 shows the reference circuit for normally-closed (NC) type headset jack.

Figure 23: Headset reference circuit

Table 21: Headphone output performance specifications

Parameter

Output power

Test conditions

16 Ω load f = 1.02 kHz, 0 dB FS;

Full-scale output Voltage

32 Ω load f = 1.02 kHz, 0 dB FS;

16 Ω load f = 1.02 kHz, 0 dB FS;

32 Ω load f = 1.02 kHz, 0 dB FS;

Output load

Disabled output impedance Measured externally, with amplifier disabled

Min Typ Max Units

54 62 mW

-

0.9

30

1.0

0.9

1.0

13.0

16/32 -

-

-

1.0

mW

Vrms

Vrms

Ω

MΩ

NOTE

1. SIM8960x also supports NO/NC type headset jack with detect pin on HPH_L or GND.

2. HPH has a negative swing and requires a bi-directional TVS diode.

www.simcom.com

60 / 104

SIM8960 Series Hardware Design V1.03

3.11.3

Earpiece

Class AB earpiece driver supports 10.67 Ω, 16 Ω, 32 Ω, and up to 50 KΩ loads. The typical output power at

1.02 KHz,6 dB gain, and THD + N ≤ 1% is:

 126 mW with 32 Ω loads and 0 dBFS input

 243 mW with 16 Ω loads and -1.5 dBFS input

 320 mW with 10.67 Ω loads and -3.5 dBFS input

Figure 24: Earpiece reference circuit

Table 22: Earpiece output performance specifications

Parameter Test conditions

Output power

Min Typ Max Units

32 Ω load f = 1.02 kHz, 6 dB gain THD+N < 1% 115.0

126.0

-

16 Ω load f = 1.02 kHz, 6 dB gain THD+N < 1% 235.0

243.0

mW mW

Full-scale output

Voltage

Output load

Disabled output impedance

6 dB gain mode f = 1.02 kHz

1.5 dB gain mode f = 1.02 kHz

1.94

1.14

10

1.0

1.98

1.16

-

32

-

-

-

Vrms

Vrms

Ω

MΩ www.simcom.com

61 / 104

SIM8960 Series Hardware Design V1.03

3.11.4

Speaker

Class-D mono differential loud speaker driver supports 4 Ω and 8 Ω loads. The driver is powered from internal 5 V Boost (VDD_SPKR). Its typical output power at 1.02 KHz,12 dB gain, and THD + N ≤ 1% is:

 1500 mW with 4 Ω loads and VDD_SPKR= 5V

 2000 mW with 8 Ω loads and VDD_SPKR= 5.5V

Figure 25: Speaker reference circuit

Table 23: speaker driver output performance specifications

Parameter

Output power (Pout)

(f = 1 kHz, THD+N≤

1%)

THD+N

(1 kHz)

Efficiency

（ Vdd = 3.7 V ） output impedance

Shutdown

Turn on time

Test conditions

15 μH + 4Ω + 15 μH, Vdd = 5V

15 μH + 8 Ω + 15 μH, Vdd = 5.5 V

1.5 W Pout, VDD_SPKR = 5.5 V

1.2 W Pout, VDD_SPKR = 5 V

1 W Pout, 15 μH + 8 Ω + 15 μH

1 W Pout, 15 μH + 4 Ω + 15 μH

Min

1200

1500

-

-

-

-

73.0

60.0

25

Typ

1500

2000

-85.0

-86.0

81.0

-

72.0

2

0.2

-

-

Max Units mW mW

-

-

-

-

-

16.0

10.0

dB dB

%

% kΩ

µA ms

NOTE

1. The maximum breakdown voltage of TVS for SPKR should not be less than 6 V.

www.simcom.com

62 / 104

SIM8960 Series Hardware Design V1.03

3.11.5

LINEOUT

LINEOUT is a differential class-AB output to drive external speaker amplifier for loudspeaker.

Figure 26: LINEOUT reference circuit

Table 24: LINEOUT output performance specifications

Parameter Test conditions Min

Maximum output voltage f = 1.02 kHz, 0 dBFS 0.9

Output common mode voltage 6 dB gain mode f = 1.02 kHz 1.52

Output load 1

Disabled output impedance 37.5

Typ

1.0

-

1.6

10

Max

-

-

-

1.68

Unit s

Vrms

Vrms

KΩ

KΩ

3.11.6

Microphone bias

SIM8960x provides one microphone bias outputs: MIC_BIAS. The microphone bias cannot be used for

ECM-type microphone. MIC_BIAS could be used for External MEMS microphone as power supply.

The microphone bias output performance specifications are shown in the following table: www.simcom.com

63 / 104

SIM8960 Series Hardware Design V1.03

Table 25: Microphone bias output performance specifications

Parameter

Output voltage

Output voltage error

Output current

Output switch to ground

Output noise

PSRR-Power rejection ratio supply

Test conditions

No load

Min Typ Max Units

1.60

2.85

V

No load -3.00 0.00

3.00

%

2 microphone loads of 1.0 to 1.5 mA each 2.0

3.0

mA

On resistance

Sink current

0.1 µF bypass

-

2.0

0.0

-

-

2.0

-

20

4.0

Ω mA

µVrms at 20 Hz at 200 Hz to 1 kHz at 5 kHz at 10 kHz at 20 kHz

80

80

80

80

75

-

-

-

-

-

-

-

-

-

dB dB dB dB dB

Output capacitor value

［ 2 ］

External bypass mode ［ 1 ］ 0.1

0.1

0.5

µF

3.12

I2S Interface

SIM8960x supports one I2S port, the pin definitions are shown in the following table:

Table 26: I2S interface pin definitions

Pin Name

LCD1_TE

GPIO_66

FP_SPI_CS

FP_SPI_CLK

FP_SPI_MOSI

FP_SPI_MISO

Pin#

114

234

203

250

249

251

Alternative

Function

( I2S )

I2S_MCLK_A

I2S_MCLK_B

I2S_WS

I2S_SCK

I2S_D0

I2S_D1

I/O

DI

DO

DI/DO

DI/DO

DI/DO

DI/DO

Description

I2S main clock A

I2S main clock B

I2S bit clock

I2S word select

I2S data0

I2S data1

3.13

UIM Interface

SIM8960x supports dual cards dual standby, and card presence detection.

www.simcom.com

64 / 104

SIM8960 Series Hardware Design V1.03

NOTE

1. The standard software provided by SIMCom only supports single UIM card configuration.

Table 27: UIM interface pin definitions

Pin Name

USIM2_VDD

USIM2_DATA

USIM2_CLK

USIM2_RST

USIM2_DET

USIM1_DET

USIM1_RST

USIM1_CLK

USIM1_DATA

USIM1_VDD

Pin# I/O Description

210 PO LDO 15 output for UIM2, 1.8V/2.95V

UIM2 data

209

DI/D

O

208

207

DO

DO

UIM2 clock

UIM2 reset

UIM2 presence detection

256 DI

145 DI

UIM1 presence detection

Note

Pull up USIM2_DATA to

USIM2_VDD by the external 10K resistor

1.8V power domain.

External pull-up resistor is required.

If unused, keep it open.

1.8V power domain.

External pull-up resistor is required.

If unused, keep it open.

144

143

142

141

DO

DO

DI/D

O

PO

UIM1 reset

UIM1 clock

UIM1 data

LDO 14 output for UIM1, 1.8V/2.95V

Pull up USIM1_DATA to

USIM1_VDD by the external 10K resistor www.simcom.com

Figure 27: UIM card reference circuit

65 / 104

SIM8960 Series Hardware Design V1.03

3.14

ADC

SIM8960x provides one 15bits ADC. Its performance parameters are shown in the following table:

Table 28: ADC performance parameters

Parameter

Input voltage range

Test conditions

Programmable

Resolution

Analog input bandwidth

Sample rate

INL

DNL

Offset error

Gain error

XO/8

15-bit output

15-bit output

Relative to full-scale

Relative to full-scale

-

-

-

-

-

-

Min

-

0.1

0.3

-

-

-

-

2.4

Typ

-

-

15

100

-

±8

±4

±1

±1

-

Max

-

1.7

4.5

Units

V

%

% bits kHz

MHz

LSB

LSB

Table 29: ADC interface pin definitions

Pin Name

ADC

Pin#

151

I/O

AI

Description

ADC

Note

Maximum input voltage is 1.7V.

3.15

Forced USB BOOT Interface

FORCED_USB_BOOT is the emergency download interface. FORCED_USB_BOOT is pulled up to

VREG_L5_1P8, and the module can enter the emergency download mode. Used when the product does not start properly. To facilitate subsequent software upgrades and debugging, please reserve test points.

Table 30: FORCED USB BOOT definitions

Pin Name Pin#

FORCED_USB_BOOT 57

I/O

DI

VREG_L5_1P8 www.simcom.com

9 PO

Description

USB forced download signal, short-circuit to VREG_L5_1P8 at power-on to enter forced download mode.

1.8V power supply of GPIO port, normally open, voltage is not adjustable

Note

Reserved test point

66 / 104

SIM8960 Series Hardware Design V1.03

Figure 28: Emergency download reference circuit

3.16

Antenna Interface

SIM8960x provides four antenna interfaces including MAIN antenna, DRX antenna, GNSS antenna, and

WiFi/BT antenna. To ensure good RF performance, users should meet the following requirements:

 Keep the RF traces at 50Ω.

 Maintain a complete and continuous reference ground plane from antenna pin to the RF connector.

 The RF traces should be away from any other noisy traces.

 Keep the RF traces as short as possible.

3.16.1

MAIN Antenna reference circuit

The recommended circuit is shown in the following figures: www.simcom.com

Figure 29: MAIN antenna recommended circuit

67 / 104

SIM8960 Series Hardware Design V1.03

R1, C1 and C2 are antenna matching components in Figure 29, the value of these components are determined according to the antenna tuning results. By default, R1 is 0Ω, C1 and C2 are reserved. The RF connector in Figure 29 is used to ensure the accuracy and convenience of the conduction testing, so

SIMCOM suggest keeping it. If considering Low-Cost BOM, user can cancel the connector.

3.16.2

DRX Antenna reference circuit

The recommended circuit is shown in the following figures:

Figure 30: DRX antenna recommended circuit

R1, C1 and C2 are antenna matching components in Figure 30, the value of these components are determined according to the antenna tuning results. By default, R1 is 0Ω, C1 and C2 are reserved.The RF connector in Figure 30 is used to ensure the accuracy and convenience of the conduction testing, so

SIMCOM suggest keeping it. If considering Low-Cost BOM, user can cancel the connector.

3.16.3

GNSS Antenna reference circuit

The recommended circuit is shown in the following figures: www.simcom.com

68 / 104

SIM8960 Series Hardware Design V1.03

Figure 31: GNSS antenna recommended circuit

R1, C1 and C2 are antenna matching components in Figure 31, the value of these components are determined according to the antenna tuning results. By default, R1 is 0Ω, C1 and C2 are reserved. The RF connector in Figure 31 is used to ensure the accuracy and convenience of the conduction testing, so

SIMCOM suggest keeping it. If considering Low-Cost BOM, user can cancel the connector.

The module has internal LAN, so there is no need for external active antenna. But if the antenna is far away the module and need a long cable to connect, users can use external active antenna, the recommended circuit is shown as Figure 32:

Figure 32: GNSS active antenna circuit

The attenuator in Figure 32 must be added as required and attenuation value is determined according to the active antenna gain. Normally, the relationship between the attenuation value and the gain satisfies the following formula:

Antenna gain=Attenuation value + Cable Losses

In Figure 32, the VDD is used to provide voltage to the external active antenna and its value should be taken according to antenna characteristic; C1 is used for DC blocking and its value is 33pF by default. The

RF connectors used to ensure the accuracy and convenience of the conduction testing, if considering www.simcom.com

69 / 104

LOW-Cost BOM, users can cancel it.

3.16.4

WiFi/BT Antenna reference circuit

The recommended circuit is shown in the following figures:

SIM8960 Series Hardware Design V1.03

Figure 33: WIFI/BT antenna recommended circuit

R1, C1 and C2 are antenna matching components in Figure 33, the value of these components are determined according to the antenna tuning results. By default, R1 is 0Ω, C1 and C2 are reserved. The RF connector in Figure 33 is used to ensure the accuracy and convenience of the conduction testing, so

SIMCOM suggest keeping it. If considering Low-Cost BOM, user can cancel the connector.

3.16.5

RF traces layout guidance

The characteristic impedance of RF signals should be controlled at 50 ohm. In general, the impedance of

RF signal is determined by the Permittivity (ER) of PCB material, line width (W), ground clearance (S), height of reference ground plane (H) and other factors.

Microstrip line and coplanar waveguide are usually used to control the characteristic impedance of RF wiring. The following illustrations show the structure design of microstrip line and coplanar waveguide.

 Microstrip line structure www.simcom.com

70 / 104

SIM8960 Series Hardware Design V1.03

Figure 34: Two layer PCB microstrip structure

Table 31: Example of impedance control of microstrip line structure

PCB thickness

1mm

1.6mm

Permittivity

(ER)

4.2

4.2

Line thickness

Layer

Reference plane

0.035mm

Layer1 Layer2

0.035mm

Layer1 Layer2

Target impedance

50 ohm

50 ohm

Expected linewidth

W

1.7mm (67 mil)

3mm (118 mil)

 Coplanar waveguide (CPW) structure (recommended)

Figure 35: Two layer PCB coplanar waveguide structure

Table 32: Example of impedance control of coplanar waveguide structure

PCB thickness

1mm

Permittivity

(ER)

4.2

www.simcom.com

Line thickness

0.035mm

Layer

Layer

1

Reference plane

Layer2

Target impedance

50 ohm

Expected gap to ground S

0.65mm

(25.6 mil)

Expected linewidth W

0.2mm

(7.8 mil)

71 / 104

1.6mm

4.2

0.035mm

Layer

1

Layer2

SIM8960 Series Hardware Design V1.03

50 ohm

0.65mm

(25.6 mil)

0.15mm

(5.9 mil)

Four layer PCB coplanar waveguide structure 1# is shown in following figure. The third layer is reference layer.

Figure 36: Four layer PCB coplanar waveguide structure 1#

Four layer PCB coplanar waveguide structure 2# is shown in following figure. The fourth layer is reference layer.

www.simcom.com

Figure 37: Four layer PCB coplanar waveguide structure 2#

72 / 104

SIM8960 Series Hardware Design V1.03

3.16.6

Antenna Requirement

The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna.

Table 33: Antenna Requirement

Antenna

GSM/WCDMA/TD-SCDMA/LTE

Wi-Fi/BT

GNSS

Requirements

VSWR: ≤ 2

Gain (dBi): >1

Max Input Power (W): 50

Input Impedance (ohm): 50

Polarization Type: Vertical

VSWR: ≤ 2

Gain (dBi): 1

Max Input Power (W): 50

Input Impedance (ohm): 50

Polarization Type: Vertical

Frequency range: 1565 - 1607MHz

Polarization: RHCP or linear

VSWR: < 2 (Typ.)

Passive antenna gain: > 0dBi

Active antenna noise figure: < 1.5dB

Active antenna gain: > 0dBi

Active antenna embedded LNA gain: <17dB

3.16.7

Install the Antenna with RF Connector

The recommended RF connector is HIROSE UF.L-R-SMT. The antenna installation with RF connector is shown in following figure.

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SIM8960 Series Hardware Design V1.03

Figure 38: Dimensions of the UF.L-R-SMT Connector (Unit: mm) www.simcom.com

74 / 104

SIM8960 Series Hardware Design V1.03

4

PCB Layout

This section provides PCB layout guidelines for SIM8960x users to ensure their production against lots of issues, and achieve the optimum performance.

4.1

Stack-up Options

At least, 4-layer through-hole PCB should be chosen for good impedance control and signal shielding.

4.2

General Placement Guidelines

 Digital devices and traces should not be placed near sensitive signals like RF and clock.

 Keep SPKR and MIC away from sensitive RF lines.

4.3

PCB Layout Guideline Details

4.3.1

RF Trace

 RF connector should be placed close to the module’s antenna pin.

 Antenna matching circuit should be placed close to the antenna.

 Keep the RF traces at 50Ω.

 Maintain a complete and continuous reference ground plane from antenna pin to the RF connector.

 The RF traces should be far away from any other noisy traces.

 Keep the RF traces as short as possible.

 If using a coaxial RF cable to connect the antenna, please avoid spanning on UIM cards, power circuits and high-speed digital circuits to minimize the impact of each other.

4.3.2

Power/GND

 Both VBAT and return path should be as short and wide as possible to minimize the IR drop

 The VBAT current should go through Zener diode, capacitors, then VBAT pins

 Must have a solid ground plane throughout the board as the primary reference plane for most signals www.simcom.com

75 / 104

SIM8960 Series Hardware Design V1.03

4.3.3

UIM Card

 Ensure UIM card holder is far way from antenna or RF signal

 ESD component and bypass caps should be placed closed to UIM Card

 UIM card signals should be far away from other high-speed signal

4.3.4

MIPI_DSI/CSI

 Protect MIPI_DSI/CSI signals from noisy signals (clocks, SMPS, etc.)

 Differential pairs, 100 Ω nominal, ±10%

 Total routing length <305 mm

 Intra-pair length matching < 5 ps (0.67 mm)

 Inter-pair length matching < 10 ps (1.3 mm)

 Lane-to-lane trace spacing = 3x line width

 Spacing to all other signals = 4x line width

 Maintain a solid ground reference for clocks to provide a low-impedance path for return currents

 Each trace needs to be next to a ground plane

 Minimize the number of via on the trace

4.3.5

USB

 90 Ω differential, ± 10% trace impedance

 Differential data pair matching <6.6 mm (50 ps)

 External components should be located near the USB connector.

 Should be routed away from sensitive circuits and signals.

 If there are test points, place them on the trace to keep branches as short as possible

4.3.6

SDC

 Protect other sensitive signals/circuits from SDC corruption.

 Protect SDC signals from noisy signals (clocks, SMPS, etc.).

 Up to 200 MHz clock rate

 50 Ω nominal, ±10% trace impedance

 CLK to DATA/CMD length matching <1 mm

 30–35 Ω termination resistor on clock lines near the module

 Total routing length <50 mm recommended

 Spacing to all other signals = 2x line width

 Bus capacitance < 15 pF

4.3.7

Audio

Analog input

 4 to 5 mil trace widths; 4 to 5 mil spacing between traces www.simcom.com

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SIM8960 Series Hardware Design V1.03

 Differential route for MIC1P with MIC1N and MIC2P with GND_MIC;

 Isolate from noise sources, such as antenna, RF signals, SMPS, clocks, and other digital signals with fast transients

Analog output

 Coplanar ground fill on both sides (of traces or pair as appropriate); in between ground planes – grounds above and below

 Isolate from noise sources such as antenna, RF signals, SMPS, clocks, and other digital signals with fast transients.

 EAR output signal – route as differential pair with 10 mil trace widths.

 SPKR output signals – route as differential pair with 20 mil trace widths with 8 Ω load and 25 mil trace widths with 4 Ω load

 HPH output signals – not a differential pair; 10 mil trace widths for HPH_L and HPH_R; 15 mil trace widths for HPH_REF

 Connect HPH_REF to the ground pin of the jack connector and route HPH_REF in between HPH_L and HPH_R for best crosstalk minimization www.simcom.com

77 / 104

SIM8960 Series Hardware Design V1.03

5

Electrical and Reliability

5.1

Absolute Maximum Ratings

Absolute maximum ratings reflect the stress levels that, if exceeded, may cause permanent damage to the device. Functionality and reliability are only guaranteed within the operating conditions.

Table 34: Absolute maximum ratings

Parameter

VBAT

VBUS

VRTC

Min

-0.3

-

-0.3

Max

5

16

3.5

Unit

V

V

V

5.2

Temperature Range

Table 35: Temperature range

Parameter

Operating temperature

Storage temperature

Min

-35

-40

5.3

Operating Voltage

Table 36: Operating voltage

Parameter

VBAT

VBUS

VRTC www.simcom.com

Typ

25

Max

+75

+90

Unit

℃

℃

Min

3.4

4.35

2.0

Typ

3.9

5

3.0

Max

4.4

10

3.25

Unit

V

V

V

78 / 104

SIM8960 Series Hardware Design V1.03

5.4

Digital-logic Characteristics

Table 37: 1.8 V digital I/O characteristics

Parameter

V

IH

V

IL

V

OH

V

OL

Description

High-level input voltage

Low-level input voltage

High-level output voltage

Low-level output voltage

Min

1.17

-

-

1.35

-

-

-

-

Typ

Table 38: USIM interface characteristics (USIM_VDD=1.8V/2.95V)

Parameter Description

V

IH

High-level input voltage

V

IL

V

OH

V

OL

Min

0.7* USIM_VDD -

Typ

Low-level input voltage -0.3

High-level output voltage 0.8*USIM_VDD

Low-level output voltage 0

-

-

-

-

Max

-

0.63

0.45

V

V

V

Unit

V

Table 39: SD interface characteristics (SD_LDO11 =1.8V)

Parameter

V

IH

V

IL

V

OH

V

OL

Description

High-level input voltage

Low-level input voltage

High-level output voltage

Low-level output voltage

Min

1.27

-0.3

1.4

0 -

-

-

-

Typ

Table 40: SD interface characteristics (SD_LDO11 =2.95V)

Parameter Description

V

IH

Min

High-level input voltage 1.84

V

IL

V

OH

V

OL

Low-level input voltage -0.3

High-level output voltage 2.21

Low-level output voltage 0

-

-

-

-

Typ Max

3.25

0.74

2.95

0.37

Max

2

0.58

-

0.45

Max Unit

USIM_VDD+0.3

V

0.2* USIM_VDD V

USIM_VDD V

0.4

V

V

V

Unit

V

V

V

V

V

Unit

V www.simcom.com

79 / 104

SIM8960 Series Hardware Design V1.03

5.5

Current Consumption (VBAT=3.9V)

Table 41: Current consumption(TBD)

Parameter Conditions

Leakage current

Off mode

Flight mode

GSM@BS-PA-MFRMS=2

Standby current

GSM Voice call

WCDMA

Voice call

WCDMA @DRX=8

TD-SCDMA @DRX=7

LTE-FDD @standby 1.28s

LTE-TDD @standby 1.28s

GSM850 @PCL5 32.4dBm Ch=189

DCS1800 @PCL0 29.3dBm Ch=698

Band 1 @max power 22.8dBm Ch=10700

Band 5 @max power 23dBm Ch=4408

Band 8 @max power 22.4dBm Ch=3012

B1 power@ 23dBm BW = 20MHZ Ch = 18300

B3 power @ 22.3dBm

BW = 20MHZ Ch = 19575

FDD-LTE

TDD-LTE

B5 power@ 22.5dBm

BW = 10MHZ Ch = 20525

B7 power@ 22.2dBm

BW=10MHZ Ch=21100

B8 power@ 22.8dBm

BW=20MHZ Ch=21625

B20 power@ 22.1dBm

BW=20MHZ Ch=24300

B34 power@ 22.8dBm

BW=15MHZ Ch=36275

B38 power@ 23dBm BW=20MHZ Ch=38000

B39 power@ 22.3dBm

BW=20MHZ Ch=38450

B40 power@ 23dBm BW=20MHZ Ch=39150

B41 power@ 23dBm BW=20MHZ Ch=40740

Peak current

664

486

600

547

526

290

300

297

340

307

Typ.

29

3.95

4.0

256

191

585

560

500

3.5

2.53

3.29

3.14

690

700

600

700

600

600

600

600

600

600

600

3

Max

80

5

5

300

250

600

570

570

3.7

5

5

5

700 mA mA mA mA mA mA mA mA mA mA

A

Unit uA mA mA mA mA mA mA mA mA mA mA mA mA

5.6

Electro-Static Discharge

Electrostatic discharge (ESD) occurs naturally in laboratory and factory environments. An established high-voltage potential is always at risk of discharging to a lower potential. If this discharge path is through a semiconductor device, it may result in destructive damage.

www.simcom.com

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SIM8960 Series Hardware Design V1.03

SIM8960x must be handled according to the ESD Association standard: ANSI/ESD S20.20-1999,

Protection of Electrical and Electronic Parts, Assemblies, and Equipment.

Table 42: ESD performance parameters （ Temperature: 25 ℃ , Humidity: 45% ）

Pin

VBAT

GND

Antenna

PWRKEY

Contact discharge

±5KV

±6KV

±5KV

±4KV

Air discharge

±10 KV

±12KV

±10KV

±6KV www.simcom.com

81 / 104

5.7

Module Operating Frequencies

Table 43: Module operating frequencies

Frequency

GSM850

EGSM900

DCS1800

PCS1900

WCDMA B1

Receive

869-894MHz

925-960MHz

1805-1880MHz

1930-1990MHz

2110-2170 MHz

LTE B2

LTE B3

LTE B4

LTE B5

LTE B7

LTE B8

LTE B12

LTE B13

WCDMA B2

WCDMA B4

1930-1990MHz

2110-2155MHz

WCDMA B5 869-894MHz

WCDMA B8 925-960MHz

TDSCDMA B39 1880-1920 MHz

TDSCDMA B34 2010-2025 MHz

LTE B1 2110-2170 MHz

1930-1990MHz

1805-1880 MHz

2110-2155MHz

869-894 MHz

2620-2690 MHz

925-960 MHz

729-746MHz

746-756MHz

LTE B17

LTE B20

734-746MHz

791-821MHz

LTE B25 1850-1915MHz

LTE B26

LTE B34

LTE B38

LTE B39 www.simcom.com

859-894MHz

2010-2025 MHz

2570-2620 MHz

1880-1920 MHz

Transmit

824-849MHz

880-915MHz

1710-1785MHz

1850-1910MHz

1920-1980 MHz

1850-1910MHz

1710-1755MHz

824-849MHz

880-915 MHz

1880-1920MHz

2010-2025MHz

1920-1980 MHz

1850-1910MHz

1710-1785 MHz

1710-1755MHz

824-849MHz

2500-2570 MHz

880-915 MHz

699-716MHz

777-787MHz

704-716MHz

832-862MHz

1930-1995MHz

814-849MHz

2010-2025 MHz

2570-2620 MHz

1880-1920 MHz

SIM8960 Series Hardware Design V1.03

Physical channel

128-251

0-124, 975-1023

512-885

512-810

TX: 9612-9888

RX: 10562-10838

TX: 9262-9538

RX: 9662-9938

TX: 1312-1862

RX: 1537-2087

TX: 4132-4233

RX: 4357-4458

TX: 2712-2863

RX: 2937-3088

9400-9600

10054-10121

TX: 18000-18599

RX: 0-599

TX: 18600-19199

RX: 600-1199

TX: 19200-19949

RX: 1200-1949

TX: 19950-20399

RX: 1950-2399

TX: 20400-20649

RX: 2400-2649

TX: 20750-21449

RX: 2750-3449

TX: 21450-21799

RX: 3450-3799

TX: 23010-23179

RX: 5010-5179

TX: 23180-23279

RX: 5180-5279

TX: 23730-23849

RX: 5730-5849

TX: 24150-24449

RX: 6150-6449

TX: 26040-26689

RX:8040-8689

TX: 26690-27039

RX: 8690-9039

36200-36349

37750-38249

38250-38649

82 / 104

LTE B40

LTE B41

2300-2400 MHz

2555-2655 MHz

2300-2400 MHz

2555-2655MHz

SIM8960 Series Hardware Design V1.03

38650-39649

40240-41240

5.8

Module Output power

Table 44: Conducted transmission power

Frequency

GSM850

E-GSM900

DCS1800

PCS1900

Power

33dBm ±2dB

33dBm ±2dB

30dBm ±2dB

30dBm ±2dB

GSM850(8-PSK) 27dBm ±3dB

E-GSM900 (8-PSK) 27dBm ±3dB

DCS1800 (8-PSK) 26dBm +3/-4dB

PCS1900(8-PSK) 26dBm +3/-4dB

WCDMA B1

WCDMA B2

WCDMA B4

WCDMA B5

24dBm +1/-3dB

24dBm +1/-3dB

24dBm +1/-3dB

24dBm +1/-3dB

WCDMA B8

TDSCDMA B34

TDSCDMA B39

LTE-FDD B1

LTE-FDD B2

LTE-FDD B3

LTE-FDD B4

LTE-FDD B5

24dBm +1/-3dB

24dBm +1/-3dB

24dBm +1/-3dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

LTE-FDD B7

LTE-FDD B8

LTE-FDD B12

LTE-FDD B13

LTE-FDD B17

LTE-FDD B20

LTE-FDD B25

LTE-FDD B26

LTE-TDD B34

LTE-TDD B38

LTE-TDD B39

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

www.simcom.com

83 / 104

Min.

5dBm ± 5dB

5dBm ± 5dB

0dBm ± 5dB

0dBm ± 5dB

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

5dBm ± 5dB

5dBm ± 5dB

0dBm ±5dB

0dBm ±5dB

<-50dBm

<-50dBm

<-50dBm

<-50dBm

<-50dBm

<-50dBm

<-50dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

LTE-TDD B40

LTE-TDD B41

23dBm +/-2.7dB

23dBm +/-2.7dB

SIM8960 Series Hardware Design V1.03

<-40dBm

<-40dBm

5.9

Module Receiving Sensitivity

Table 45: Conducted receiving sensitivity

Band

GSM850

Receiving sensitivity （ Typ ）

< -108dBm

EGSM900

DCS1800

PCS1900

WCDMA B1

WCDMA B2

WCDMA B4

WCDMA B5

< -108dBm

< -108dBm

< -108dBm

<-109dBm

<-109dBm

<-109dBm

<-109dBm

WCDMA B8 <-109dBm

TDSCDMA B34 <-110dBm

TDSCDMA B39 <-110dBm

LTE FDD/TDD Table 46

Receiving sensitivity （ Max ）

3GPP standard

3GPP standard

3GPP standard

3GPP standard

3GPP standard

3GPP standard

3GPP standard

3GPP standard

3GPP standard

3GPP standard

3GPP standard

3GPP standard

Table 46: Reference sensitivity QPSk PREFSENS(LTE)

8

9

6

7

4

5

2

3

10

11

12

E-UTRA

Band number 1.4 MHz 3 MHz 5 MHz

1 -100

-102.7

-101.7

-104.7

-103.2

-

-

-

-102.2

-

-

-101.7

-99.7

-98.7

-98

-97

-101.7

-100

-100.2

-98

-

-

-

-99.2

-100

-98

-97

-99

-

-

-98.7

-100

-100

-97

-97

-95

-94

-96

-97

-97

-94

-97

-95

-94

-97

-95

10 MHz 15 MHz 20 MHz

-95.2

-93.2

-92.2

-95.2

-94

-92

-91

-94

-93.2

-94.2

-95.2

-92

-93

-94 www.simcom.com

Duplex mode

FDD

FDD

FDD

FDD

FDD

FDD

FDD

FDD

FDD

FDD

FDD

FDD

84 / 104

24

25

33

34

20

21

22

23

13

14

17

18

19

39

40

41

42

35

36

37

38

43

-

-

-

-104.7

-

-

-

-

-

-

-

-101.2

-

-

-106.2

-106.2

-

-

-

-

-

-

-

-

-

-97

-100

-97

-101.7

-100

-97

-97

-97

-100

-100

-

-

-98.2

-100

-96.5

-100

-100

-

-

-102.2

-100

-102.2

-100

-100

-100

-100

-100

-99

-99

-99

-94

-97

-94

-97

-97

-93.5

-97

-97

-94

-94

-94

-97

-97

-97

-97

-96

-96

-97

-97

-97

-97

-96

SIM8960 Series Hardware Design V1.03

-95.2

-95.2

-91.2

-95.2

-92.2

-95.2

-95.2

-94.2

-94.2

-94.2

-91.7

-95.2

-95.2

-95.2

-95.2

-95.2

-95.2

-

-

-

-90

-91

-90.5

-94

-94

-94

-94

-94

-94

-94

-93

-93

-93

FDD

FDD

FDD

FDD

FDD

FDD

TDD

TDD

FDD

FDD

FDD

FDD

FDD

TDD

TDD

TDD

TDD

TDD

TDD

TDD

TDD

TDD

5.10

WIFI Main RF Characteristics

Table 47: 2.4GWIFI main RF Characteristics

Transmission performance

Output power

EVM

Receiving performance

802.11B

（ 11M ）

17dBm±2dB

<35%

Receiving sensitivity

802.11B

（ 11M ）

≤-88dBm

802.11G

（ 54M ） 802.11N (MCS7)

15dBm±2dB 13dBm±2dB

<-25dB <-27dB

802.11G

（ 54M ） 802.11N (MCS7)

≤-73dBm ≤-72dBm www.simcom.com

85 / 104

SIM8960 Series Hardware Design V1.03

Table 48: 5G WIFI main RF Characteristics

Transmission performance

Output power

EVM

Receiving performance

802.11A

（ 54M ） 802.11N (MCS7)

15dBm±2dB 14dBm±2dB

<-25dB <-27dB

Receiving sensitivity

802.11A

（ 54M ） 802.11N (MCS7)

≤-71dBm ≤-70dBm

802.11AC (MCS8)

13dBm±2dB

<-30dB

802.11AC (MCS8)

≤-65dBm

5.11

BT Main RF Characteristics

Table 49: BT Main RF Characteristics

Transmission performance

Output power

Receiving performance

DH5

11dBm ± 2dB

Receiving sensitivity

DH5

≤ -90dBm

2DH5

10dBm ± 2dB

2DH5

≤ -80dBm

3DH5

9dBm ± 2dB

3DH5

≤ -80dBm

5.12

GNSS Main RF Characteristics

Table 50: GNSS Main RF Characteristics

Receiver type

CNo

Sensitivity

TTFF

GPS,GLANOSS,BEIDOU

40dB/Hz@-130dBm

Tracking & Navigation

Reacquisition

Cold start

Cold start

Warm start

Hot start

-160dBm

-156dBm

-148dBm

<35s

<15s

<5s www.simcom.com

86 / 104

6

Manufacturing

6.1

Top and Bottom View of SIM8960x

SIM8960 Series Hardware Design V1.03

Figure 39: Top and bottom view of SIM8960x www.simcom.com

87 / 104

6.2

Physical Dimensions

SIM8960 Series Hardware Design V1.03

www.simcom.com

Figure 40: Outline drawing (unit: mm)

88 / 104

6.3

Recommended PCB footprint

SIM8960 Series Hardware Design V1.03

www.simcom.com

Figure 41: Recommended PCB footprint

89 / 104

6.4

Recommended SMT Stencil

Stencil thickness requirement ：

 The stencil thickness of outer circle’ s pin need 0.18mm

SIM8960 Series Hardware Design V1.03

www.simcom.com

Figure 42: Recommended SMT stencil

90 / 104

6.5

Typical SMT Reflow Profile

SIM8960 Series Hardware Design V1.03

Figure 43: Typical SMT reflow profile

NOTE

1. Refer to “Module secondary-SMT-UGD” for more information about the module shipping and manufacturing.

www.simcom.com

91 / 104

SIM8960 Series Hardware Design V1.03

6.6

Moisture Sensitivity Level (MSL)

SIM8960x is susceptible to damage induced by absorbed moisture and high temperature. A package’s moisture-sensitivity level (MSL) indicates its ability to withstand exposure after it is removed from its shipment bag, while it is on the factory floor awaiting PCB installation. A low MSL rating is better than a high rating; a low MSL device can be exposed on the factory floor longer than a high MSL device. All pertinent

MSL ratings are summarized in Table 51.

Table 51: MSL ratings summary

3

4

5

5a

6

MSL

1

2

2a

Out-of-bag floor life

Unlimited

1 year

4 weeks

168 hours

72 hours

48 hours

24 hours

Mandatory bake before use. After bake, it must be reflowed within the time limit specified on the label.

Comments

≤+30 ℃ /85% RH

≤+30 ℃ /60% RH

≤+30 ℃ /60% RH

≤+30 ℃ /60% RH

≤+30 ℃ /60% RH

≤+30 ℃ /60% RH

≤+30 ℃ /60% RH

≤+30 ℃ /60% RH

The SDM450 device samples are currently classified as MSL4 at 255 (+5, -0)°C, following the latest

IPC/JEDEC J-STD-020 standard revision for moisture-sensitivity qualification This qualification temperature

(255°C) should not be confused with the peak temperature within the recommended solder reflow profile.

6.7

Baking Requirements

It is necessary to bake modules if the prescribed time limit has been exceeded. The baking conditions are specified in Table 55. Note that if baking is required, the devices must be transferred into trays that can be baked to at least 125°C.

Table 52: Baking requirements

Baking conditions options

40°C±5°C, <5% RH

120°C±5°C, <5% RH

Duration

192 hours

4 hours www.simcom.com

92 / 104

SIM8960 Series Hardware Design V1.03

7

Packing System

SIM8960x module supports tray packaging. The packaging process is shown in the following figures.

Module tray drawing ：

Figure 44: Packaging process www.simcom.com

93 / 104

SIM8960 Series Hardware Design V1.03

Figure 45: Module tray drawing

Table 53: Module tray information

Length （ ±3mm ）

242.0

Width （ ±3mm ）

161.0

Small carton drawing ：

Units per tray

8 www.simcom.com

Figure 46: Small carton drawing

94 / 104

SIM8960 Series Hardware Design V1.03

Table 54: Small carton information

Length （ ±10mm ） Width （ ±10mm ）

270 180

Big carton drawing ：

Height （ ±10mm ） Units per carton

120 8*19-2=150

Figure 47: Big carton drawing

Table 55: Big carton information

Length （ ±10mm ） Width （ ±10mm ） Height （ ±10mm ） Count of small carton

380 280 280 150*4=600 www.simcom.com

95 / 104

SIM8960 Series Hardware Design V1.03

8

List of Recommended Devices

Table 56: Recommended Camera Sensor List

Primary camera/

Secondary camera

Primary camera

Resolution Part Number

2M OV2680

5M

OV5675

OV5695

S5K5E8

8M

OV8856

OV8858

OV8865

S5K4H8

12M

13M

16M

20M

23M

OV12890

S5K2L7

IMX362

AR1337

OV13853(PDAF)

OV13855

OV13870

MN34153

S5K2M8

)

S5K3M2XM(PDAF

IMX258(PDAF)

OV16860

OV16880

S5K2P7

S5K3P3

S5K3P8

IMX298 (PDAF)

IMX230

IMX318

Sensor Vendor

OmniVision

OmniVision

OmniVision

SAMSUNG

OmniVision

OmniVision

OmniVision

SAMSUNG

OmniVision

SAMSUNG

SONY

ON Semiconductor

OmniVision

OmniVision

OmniVision

Panasonic

SAMSUNG

SAMSUNG

SONY

OmniVision

OmniVision

SAMSUNG

SAMSUNG

SAMSUNG

SONY

SONY

OmniVision www.simcom.com

96 / 104

SIM8960 Series Hardware Design V1.03

Table 57: Recommended LCD Driver IC List

LCD Driver IC

OTM1902A

OTM1906C

HX8399-C

ILI7807E

ILI9885

NT35532

NT35596

NT35695

R63417

Vendor

FocalTech

FocalTech

Himax

Ilitek

Ilitek

Novatek

Novatek

Novatek

SYNAPTICS

Resolution

FHD

FHD

FHD

FHD

FHD

FHD

FHD

FHD

FHD

Table 58: Recommended Accelerometer & Gyroscope List

No.

1

Part Number Vendor

BMA222E Bosch

14

15

16

17

9

10

11

12

13

6

7

8

4

5

2

3

18

19

20

ICM-20621

ICM-20622

ICM-20690

21 ICM-40602 www.simcom.com

BMA250E

BMA253

BMA255

BMA421

BMA422

BMA424

BMG160

BMI120

BMI160

BMI260

ICM-20600

ICM-20602

ICM-20607

ICM-20608-D

ICM-20608-G

ICM-20609

Bosch

Bosch

Bosch

Bosch

Bosch

Bosch

Bosch

Bosch

Bosch

Bosch

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

Accelerometer Gyroscope

√ √

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

97 / 104

41

42

43

44

45

37

38

39

40

46

47

48

34

35

36

29

30

31

32

33

25

26

27

28

22

23

24

ICM-40604

ICM-40605

ICM-42602

ICM-42605

ICM-42605-M

ICM-42608

MPU-6500

MPU-6881

KX022-1020

KX023-1025

KX122-1037

KXTJ2-1009

KXTJ2-1029

KXTJ3

MC3413-P

MC3416-P

MXC4005XC

STK8BA53

LIS2DH12TR

LIS2DS12TR

LIS2HH12

LIS3DH

LIS3DHTR

LSM6DS3TR

LSM6DS3TR-C ST

LSM6DSLTR ST

LSM6DSMTR ST

ST

ST

ST

ST

ST mCube

MEMSIC

Sensortek

ST

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

Kionix

Kionix

Kionix

Kionix

Kionix

Kionix mCube

4

5

2

3

6

7

8

No.

1

Table 59: Recommended E-Compass List

Part Number

AK09911C

AK09915C

AK09915D

AK09916C

AK09918C

HSCDTD008A

BMM150

GMC306 www.simcom.com

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

SIM8960 Series Hardware Design V1.03

√

√

√

√

√

√

√

√

√

√

√

√

Vendor

AKM

AKM

AKM

AKM

AKM

Alps

Bosch

Globalmems

98 / 104

21

22

23

24

25

17

18

19

20

13

14

15

16

9

10

11

12

IST8305

IST8306

IST8307

IST8310

MXG4300

MMC3530

MMC3630

MMC3630KJ

MMC5603NJ

STM350MC

STM480MW

LIS2MDL

AF6133

AF6133E

AF8133J

AF9133

YAS539

SIM8960 Series Hardware Design V1.03

iSentek iSentek iSentek iSentek

MagnaChip

MEMSIC

MEMSIC

MEMSIC

MEMSIC

Senodia

Senodia

ST

Voltafield

Voltafield

Voltafield

Voltafield

Yamaha

Table 60: Recommended Proximity&Ambient Light List

No.

13

14

15

9

10

11

12

7

8

5

6

1

2

3

4

Part Number Vendor

TMD26203

CM36686 ams

Capella

AP3426 Dyna Image

EPL2590KTWJP Elan

MN66213

LTR-578ALS

BH1745NUC

RPR-0521RS

Elan

Lite-On

ROHM

ROHM

RPR-0531

RPR-0531RS

STK3321

PA12200001

PA22401001

PA22A00001

TMD26203

ROHM

ROHM

Sensortek

TXC

TXC

TXC ams

√

√

√

√

√

√

√

√

Proximity

√

√

√

√

√

√

Ambient Light

√

√

√

√

√

√

√

√

√

√

√

√ www.simcom.com

99 / 104

SIM8960 Series Hardware Design V1.03

9

Appendix

9.1

Related Documents

Table 61: Related Documents

No.

[1]

[2]

[3]

[4]

[5]

[6]

[7]

[8]

[9]

[10]

[11]

[12]

[13]

Document name Remark

GSM 07.07

：

GSM 07.10

：

Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME)

Support GSM 07.10 multiplexing protocol

GSM 07.05

：

GSM 11.14

：

GSM 11.11

：

GSM 03.38

：

GSM 11.10

3GPP TS 51.010-1

3GPP TS 34.124

3GPP TS 34.121

3GPP TS 34.123-1

3GPP TS 34.123-3

EN 301 908-02 V2.2.1

Digital cellular telecommunications (Phase 2+); Use of Data

Terminal Equipment – Data Circuit terminating Equipment (DTE –

DCE) interface for Short Message Service (SMS) and Cell

Broadcast Service (CBS)

Digital cellular telecommunications system (Phase 2+);

Specification of the SIM Application Toolkit for the Subscriber

Identity Module – Mobile Equipment (SIM – ME) interface

Digital cellular telecommunications system (Phase 2+);

Specification of the Subscriber Identity Module – Mobile

Equipment (SIM – ME) interface

Digital cellular telecommunications system (Phase 2+); Alphabets and language-specific information

Digital cellular telecommunications system (Phase 2); Mobile

Station (MS) conformance specification; Part 1: Conformance specification

Digital cellular telecommunications system (Release 5); Mobile

Station (MS) conformance specification

Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment.

Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment.

Technical Specification Group Radio Access Network; Terminal conformance specification; Radio transmission and reception

(FDD)

User Equipment (UE) conformance specification; Part 3: Abstract

Test Suites.

Electromagnetic compatibility and Radio spectrum Matters (ERM);

Base Stations (BS) and User Equipment (UE) for IMT-2000. Third

Generation cellular networks; Part 2: Harmonized EN for

IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive www.simcom.com

100 / 104

[14]

[15]

[16]

[17]

SIM8960 Series Hardware Design V1.03

EN 301 489-24 V1.2.1

Electromagnetic compatibility and Radio Spectrum Matters

(ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for IMT-2000

CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment

IEC/EN60950-1(2001) Safety of information technology equipment (2000)

GCF-CC V3.23.1

2002/95/EC

Global Certification Forum - Certification Criteria

Directive of the European Parliament and of the Council of 27

January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)

9.2

Terms and Abbreviations

Table 62: Terms and abbreviations

Abbreviation

ADC

CSD

CSI

CTS

DAC

DDR

DSDA

DSDS

DSP

AMR

BOM bps

BT

CDMA

CS

DTE

DTR

DTX

EFR

EGSM

ESD

Description

Analog-to-Digital Converter

Adaptive Multi-Rate

Bill of materials

Bits per second

Bluetooth

Code division multiple access

Coding Scheme

Circuit Switched Data

Camera serial interface

Clear to Send

Digital-to-analog converter

Double data rate

Dual SIM dual active

Dual SIM dual standby

Digital signal processor

Data Terminal Equipment (typically computer, terminal, printer)

Data Terminal Ready

Discontinuous Transmission

Enhanced Full Rate

Enhanced GSM

Electrostatic Discharge www.simcom.com

101 / 104

PWM

RMS

RTC

RX

SD

PCB

PCL

PCS

PDU

RF

PM

RoHS

PPP

Kbps

LCD

LDO

LPDDR

MIC

MIPI

PA

PBCCH

GPRS

GPU

GSM

HR

HSPA

I2C

IMEI

ISP

ESR

ETS

EVDO

FDD

FR

GNSS

GPIO www.simcom.com

SIM8960 Series Hardware Design V1.03

Effective series resistance

European Telecommunication Standard

Evolution data optimized

Frequency division duplex

Full Rate

Global navigation satellite system

General-purpose input/output

General Packet Radio Service

Graphics processing unit

Global Standard for Mobile Communications

Half Rate

High-speed packet access

Inter-integrated circuit

International Mobile Equipment Identity

Image signal processing kilobits per second

Liquid crystal display

Low dropout (linear regulator)

Low-power DDR

Microphone

Mobile industry processor interface

Power amplifier

Packet Broadcast Control Channel

Printed Circuit Board

Power Control Level

Personal Communication System, also referred to as GSM 1900

Protocol Data Unit

Radio Frequency

Power management

Restriction of hazardous substances

Point-to-point protocol

Pulse-width modulator

Root Mean Square (value)

Real-time clock

Receive Direction

Secure digital

102 / 104

SDC

SIM

SMS

SMT

SPI

TDD

TE

TX

UART

UIM

URC

USB

USSD

WCDMA

WCN

WLAN

SIM8960 Series Hardware Design V1.03

Secure digital controller

Subscriber Identification Module

Short Message Service

Surface mount technology

Serial peripheral interface

Time Division Distortion

Terminal Equipment, also referred to as DTE

Transmit Direction

Universal Asynchronous Receiver & Transmitter

User identity module

Unsolicited Result Code

Universal serial bus

Unstructured Supplementary Service Data

Wideband code division multiple access

Wireless connectivity network

Wireless local area network

9.3

Safety Caution

Table 63: Safety Caution

Marks www.simcom.com

Requirements

When in a hospital or other health care facility, observe the restrictions about the use of mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive and not operate normally due to RF energy interference.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forgetting to think much of these instructions may impact the flight safety, or offend local legal action, or both.

Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard.

103 / 104

SIM8960 Series Hardware Design V1.03

Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment.

Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for hands free operation.

Before making a call with a hand-held terminal or mobile, park the vehicle.

GSM cellular terminals or mobiles operate over radio frequency signals and cellular networks and cannot be guaranteed to connect in all conditions, especially with a mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember to use emergency calls. In order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength.

Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call.

Also, some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile.

www.simcom.com

104 / 104