SIMCom SIM8950X Hardware Design

SIM8950x

Hardware Design

Smart Module

SIMCom Wireless Solutions Limited

Building B, SIM Technology Building, No.633, Jinzhong Road

Changning District, Shanghai P.R. China

Tel: 86-21-31575100 [email protected]

www.simcom.com

SIM8950X Hardware Design V1.08

Document Title:

Version:

Date:

Status:

SIM8950X Series Hardware Design

1.08

2020-11-25

Released

GENERAL NOTES

SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS, TO SUPPORT

APPLICATION AND ENGINEERING EFFORTS THAT USE THE PRODUCTS DESIGNED BY SIMCOM.

THE INFORMATION PROVIDED IS BASED UPON REQUIREMENTS SPECIFICALLY PROVIDED TO

SIMCOM BY THE CUSTOMERS. SIMCOM HAS NOT UNDERTAKEN ANY INDEPENDENT SEARCH

FOR ADDITIONAL RELEVANT INFORMATION, INCLUDING ANY INFORMATION THAT MAY BE IN THE

CUSTOMER’S POSSESSION. FURTHERMORE, SYSTEM VALIDATION OF THIS PRODUCT

DESIGNED BY SIMCOM WITHIN A LARGER ELECTRONIC SYSTEM REMAINS THE RESPONSIBILITY

OF THE CUSTOMER OR THE CUSTOMER’S SYSTEM INTEGRATOR. ALL SPECIFICATIONS

SUPPLIED HEREIN ARE SUBJECT TO CHANGE.

COPYRIGHT

THIS DOCUMENT CONTAINS PROPRIETARY TECHNICAL INFORMATION WHICH IS THE PROPERTY

OF SIMCOM WIRELESS SOLUTIONS LIMITED COPYING, TO OTHERS AND USING THIS DOCUMENT,

ARE FORBIDDEN WITHOUT EXPRESS AUTHORITY BY SIMCOM. OFFENDERS ARE LIABLE TO THE

PAYMENT OF INDEMNIFICATIONS. ALL RIGHTS RESERVED BY SIMCOM IN THE PROPRIETARY

TECHNICAL INFORMATION ， INCLUDING BUT NOT LIMITED TO REGISTRATION GRANTING OF A

PATENT , A UTILITY MODEL OR DESIGN. ALL SPECIFICATION SUPPLIED HEREIN ARE SUBJECT TO

CHANGE WITHOUT NOTICE AT ANY TIME.

SIMCom Wireless Solutions Limited

Building B, SIM Technology Building, No.633 Jinzhong Road, Changning District, Shanghai P.R.China

Tel: +86 21 31575100

Email: [email protected]

For more information, please visit:

https://www.simcom.com/download/list-863-en.html

For technical support, or to report documentation errors, please visit:

https://www.simcom.com/ask/ or email to: [email protected]

Copyright © 2020 SIMCom Wireless Solutions Limited All Rights Reserved.

www.simcom.com

2 / 89

SIM8950X Hardware Design V1.08

Version History

2018-06-27

2018-09-03

2018-11-07

2019-03-08

2019-03-28

2019-08-09

2020-03-05

2020-05-12

2020-11-25

Version Description of change

1.00

1.01

1.02

1.03

1.04

1.05

1.06

1.07

1.08

Initial release

Update Table 1, Table 25, Table 26, Table 27, Table

Delete SIM8950, SIM8050

Update the SIM card reference circuit and increase

Update Table 1

Author

Yan Zhang

Yan Zhang

Yan Zhang

Yan Zhang

Li Bing

Li Bing

Li Dingya Zhu Yu

Bai XiaoBo www.simcom.com

3 / 89

SIM8950X Hardware Design V1.08

Contents

Version History

.................................................................................................................................................

3

Contents

.................................................................................................................................................

4

Table Index

.............................................................................................................................................

6

Figure Index

...........................................................................................................................................

8

1. Introduction

..................................................................................................................................

10

1.1

SIM8950x Key Features ..........................................................................................................................

12

1.2

SIM8950x Functional Diagram ...............................................................................................................

15

2. Pin Definitions

.............................................................................................................................

16

2.1

Pin Assignment .........................................................................................................................................

16

2.2

Pin Description ..........................................................................................................................................

17

3. Interface Application

..................................................................................................................

30

3.1

Power Supply ............................................................................................................................................

30

3.1.1 Recommended power supply resolutions ....................................................................................

30

3.1.2 Enhance power stability ..................................................................................................................

31

3.2

Power On/off .............................................................................................................................................

32

3.2.1 Power on ...........................................................................................................................................

32

3.2.2 Power-on sequence .........................................................................................................................

33

3.2.3 Power off sequence .........................................................................................................................

34

3.3

VRTC ..........................................................................................................................................................

34

3.4

Output Power Management ....................................................................................................................

36

3.5

USB Type-C Interface ..............................................................................................................................

36

3.6

UART/SPI/I2C ...........................................................................................................................................

38

3.7

Secure Digital Interface ...........................................................................................................................

39

3.8

LCD Interface ............................................................................................................................................

40

3.9

Touch Screen Interface ...........................................................................................................................

42

3.10 Camera Interface ......................................................................................................................................

43

3.11 Audio ...........................................................................................................................................................

46

3.11.1 Microphone .....................................................................................................................................

47

3.11.2 Headset ............................................................................................................................................

47

3.11.3 Earpiece ...........................................................................................................................................

48

3.11.4 Speaker ............................................................................................................................................

49

3.11.5 LINEOUT .........................................................................................................................................

50

3.12 I2S Interface ..............................................................................................................................................

50

3.13 UIM Interface .............................................................................................................................................

51

3.14 ADC ............................................................................................................................................................

52

3.15 Antenna Interface .....................................................................................................................................

52

3.15.1 MAIN Antenna reference circuit ..................................................................................................

52

3.15.2 DRX Antenna reference circuit ....................................................................................................

53

3.15.3 GNSS Antenna reference circuit .................................................................................................

54

3.15.4 WiFi/BT Antenna reference circuit ..............................................................................................

55

3.16 RF traces layout guidelines ....................................................................................................................

55

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SIM8950X Hardware Design V1.08

3.17 Antenna Requirement ..............................................................................................................................

57

4. PCB Layout

...................................................................................................................................

59

4.1

Genneral Placement Guidelines ............................................................................................................

59

4.2

General Placement Guidelines ..............................................................................................................

59

4.3

PCB Layout Guideline Details ................................................................................................................

59

4.3.1 RF Trace ............................................................................................................................................

59

4.3.2 Power/GND .......................................................................................................................................

60

4.3.3 UIM Card ...........................................................................................................................................

60

4.3.4 MIPI_DSI/CSI ...................................................................................................................................

60

4.3.5 USB ....................................................................................................................................................

60

4.3.6 SDC ....................................................................................................................................................

61

4.3.7 Audio ..................................................................................................................................................

61

5. Electrical and Reliability

...........................................................................................................

62

5.1

Absolute Maximum Ratings ....................................................................................................................

62

5.2

Temperature Range .................................................................................................................................

62

5.3

Operating Voltage .....................................................................................................................................

62

5.4

Digital-logic Characteristics ....................................................................................................................

63

5.5

Current Consumption (VBAT=3.9V) ......................................................................................................

63

5.6

Electro-Static Discharge ..........................................................................................................................

65

5.7

Module Operating Frequencies .............................................................................................................

65

5.8

Module Output power ..............................................................................................................................

67

5.9

Module Receiving Sensitivity .................................................................................................................

68

5.10 WIFI main RF Characteristics ................................................................................................................

69

5.11 BT Main RF Characteristics ....................................................................................................................

70

5.12 GNSS Main RF Characteristics .............................................................................................................

70

6. Manufacturing

..............................................................................................................................

71

6.1

Top and Bottom View of SIM8950x .......................................................................................................

71

6.2

Physical Dimensions ................................................................................................................................

72

6.3

Recommended PCB footprint ................................................................................................................

73

6.4

Recommended SMT Stencil ...................................................................................................................

74

6.5

Typical SMT Reflow Profile .....................................................................................................................

76

6.6

Moisture Sensitivity Level (MSL) ...........................................................................................................

76

6.7

Baking Requirements ..............................................................................................................................

77

7. Packaging

.....................................................................................................................................

78

8. Recommend Peripheral Component list

..............................................................................

81

9. Appendix

.......................................................................................................................................

85

a) Related Documents ......................................................................................................................................

85

b) Terms and abbreviations ..............................................................................................................................

86

c) Safety Caution ...............................................................................................................................................

89

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SIM8950X Hardware Design V1.08

Table Index

TABLE 1: SIM8950X VARIANTS ................................................................................................................................

10

TABLE 2: SIM8950X KEY FEATURES .....................................................................................................................

12

TABLE 3: I/O PARAMETER DEFINITIONS ..............................................................................................................

17

TABLE 4: PIN DESCRIPTION ....................................................................................................................................

17

TABLE 5: PIN CHARACTERS ....................................................................................................................................

23

TABLE 6: RECOMMENDED COMPONENTS ..........................................................................................................

32

TABLE 7: PWRKEY CHARACTERISTICS ................................................................................................................

33

TABLE 8: VRTC CHARACTERISTIC .........................................................................................................................

35

TABLE 9: OUTPUT POWER MANAGEMENT SUMMARY ...................................................................................

36

TABLE 10: UART/SPI/I2C FUNCTIONAL ASSIGNMENTS ...................................................................................

38

TABLE 11: SD INTERFACE PIN DEFINITIONS ......................................................................................................

39

TABLE 12: DISPLAY INTERFACE PIN DEFINITIONS ...........................................................................................

41

TABLE 13: TOUCH SCREEN INTERFACE PIN DEFINITIONS ............................................................................

42

TABLE 14: CAMERA INTERFACE PIN DEFINITIONS ..........................................................................................

43

TABLE 15: AUDIO INTERFACE PIN DEFINITIONS ...............................................................................................

46

TABLE 16: I2S INTERFACE PIN DEFINITIONS .....................................................................................................

50

TABLE 17: UIM INTERFACE PIN DEFINITIONS ....................................................................................................

51

TABLE 18: ADC PERFORMANCE PARAMETERS ................................................................................................

52

TABLE 19: EXAMPLE OF IMPEDANCE CONTROL OF MICROSTRIP LINE STRUCTURE .........................

56

TABLE 20: EXAMPLE OF IMPEDANCE CONTROL OF COPLANAR WAVEGUIDE STRUCTURE .............

56

TABLE 21: ANTENNA REQUIREMENT ....................................................................................................................

57

TABLE 22: ABSOLUTE MAXIMUM RATINGS .........................................................................................................

62

TABLE 23: TEMPERATURE RANGE ........................................................................................................................

62

TABLE 24: OPERATING VOLTAGE ..........................................................................................................................

62

TABLE 25: 1.8 V DIGITAL I/O CHARACTERISTICS ...............................................................................................

63

TABLE 26: CURRENT CONSUMPTION ...................................................................................................................

63

TABLE 27: ESD PERFORMANCE PARAMETERS （ TEMPERATURE: 25 ℃ , HUMIDITY: 45% ） ................

65

TABLE 28: MODULE OPERATING FREQUENCIES .............................................................................................

65

TABLE 29: CONDUCTED TRANSMISSION POWER ............................................................................................

67

TABLE 30: CONDUCTED RECEIVING SENSITIVITY ...........................................................................................

68

TABLE 31: REFERENCE SENSITIVITY QPSK PREFSENS (LTE) ..................................................................

68

TABLE 32: 2.4G WIFI MAIN RF CHARACTERISTICS ...........................................................................................

69

TABLE 33: 5G WIFI MAIN RF CHARACTERISTICS ..............................................................................................

70

TABLE 34: BT MAIN RF CHARACTERISTICS ........................................................................................................

70

TABLE 35:GNSS MAIN RF CHARACTERISTICS ...................................................................................................

70

TABLE 36: MSL RATINGS SUMMARY .....................................................................................................................

76

TABLE 37: BAKING REQUIREMENTS .....................................................................................................................

77

TABLE 38: MODULE TRAY INFORMATION ...........................................................................................................

79

TABLE 39: SMALL CARTON INFORMATION .........................................................................................................

79

TABLE 40: BIG CARTON INFORMATION ................................................................................................................

80

TABLE 41: RECOMMENDED CAMERA SENSOR LIST .......................................................................................

81

TABLE 42: RECOMMENDED LCD DRIVER IC LIST .............................................................................................

82

TABLE 43: RECOMMENDED ACCELEROMETER & GYROSCOPE LIST ........................................................

82

TABLE 44: RECOMMENDED E-COMPASS LIST ..................................................................................................

83

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SIM8950X Hardware Design V1.08

TABLE 45: RECOMMENDED PROXIMITY & AMBIENT LIGHT LIST .................................................................

84

TABLE 46: RELATED DOCUMENTS .........................................................................................................................

85

TABLE 47: TERMS AND ABBREVIATIONS .............................................................................................................

86

TABLE 48: SAFETY CAUTION ...................................................................................................................................

89

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SIM8950X Hardware Design V1.08

Figure Index

FIGURE 1: SIM8950X FUNCTIONAL DIAGRAM ...................................................................................................

15

FIGURE 2: SIM8950X PIN ASSIGNMENT (TOP VIEW) .......................................................................................

16

FIGURE 3: LDO POWER SUPPLY REFERENCE CIRCUIT ................................................................................

30

FIGURE 4: DC-DC POWER SUPPLY REFERENCE CIRCUIT ...........................................................................

31

FIGURE 5: VBAT INPUT REFERENCE CIRCUIT ..................................................................................................

31

FIGURE 6: POWERED ON/OFF MODULE USING BUTTON ..............................................................................

32

FIGURE 7: POWERED ON/OFF MODULE USING TRANSISTOR .....................................................................

32

FIGURE 8: POWER-ON SEQUENCE ......................................................................................................................

33

FIGURE 9: POWER-OFF SEQUENCE ....................................................................................................................

34

FIGURE 10: KEEP-ALIVE CAPACITOR ...................................................................................................................

35

FIGURE 11: NON-RECHARGEABLE BATTERY ....................................................................................................

35

FIGURE 12: RECHARGEABLE BATTERY ..............................................................................................................

35

FIGURE 13: USB TYPE-C REFERENCE CIRCUIT ...............................................................................................

37

FIGURE 14: MICRO USB REFERENCE CIRCUIT ................................................................................................

37

FIGURE 15: SD CARD REFERENCE CIRCUIT .....................................................................................................

40

FIGURE 16: DISPLAY REFERENCE CIRCUIT ......................................................................................................

42

FIGURE 17: PRIMARY CAMERA REFERENCE CIRCUIT ...................................................................................

44

FIGURE 18: SECONDARY CAMERA REFERENCE CIRCUIT ...........................................................................

44

FIGURE 19: DUAL CAMERA REFERENCE CIRCUIT ..........................................................................................

45

FIGURE 20: ECM-TYPE MICROPHONE REFERENCE CIRCUIT ......................................................................

47

FIGURE 21: MEMS-TYPE MICROPHONE REFERENCE CIRCUIT ...................................................................

47

FIGURE 22: HEADSET REFERENCE CIRCUIT ....................................................................................................

48

FIGURE 23: EARPIECE REFERENCE CIRCUIT ...................................................................................................

49

FIGURE 24: SPEAKER REFERENCE CIRCUIT ....................................................................................................

49

FIGURE 25: LINEOUT REFERENCE CIRCUIT ......................................................................................................

50

FIGURE 26: UIM CARD REFERENCE CIRCUIT ...................................................................................................

51

FIGURE 27: MAIN ANTENNA RECOMMENDED CIRCUIT ..................................................................................

53

FIGURE 28: DRX ANTENNA RECOMMENDED CIRCUIT ...................................................................................

53

FIGURE 29: GNSS ANTENNA RECOMMENDED CIRCUIT ................................................................................

54

FIGURE 30: GNSS ACTIVE ANTENNA CIRCUIT ...................................................................................................

54

FIGURE 31: WIFI/BT ANTENNA RECOMMENDED CIRCUIT .............................................................................

55

FIGURE 32: TWO LAYER PCB MICROSTRIP STRUCTURE ..............................................................................

56

FIGURE 33: TWO LAYER PCB COPLANAR WAVEGUIDE STRUCTURE ........................................................

56

FIGURE 34: FOUR LAYER PCB COPLANAR WAVEGUIDE STRUCTURE 1# ................................................

57

FIGURE 35: FOUR LAYER PCB COPLANAR WAVEGUIDE STRUCTURE 2# ................................................

57

FIGURE 36: TOP AND BOTTOM VIEW OF SIM8950X .........................................................................................

71

FIGURE 37: OUTLINE DRAWING (UNIT: MM) .......................................................................................................

72

FIGURE 38: RECOMMENDED PCB FOOTPRINT ................................................................................................

73

FIGURE 39: OUTER PIN RECOMMENDED STENCIL ..........................................................................................

74

FIGURE 40: INNER FUNCTION PIN RECOMMENDED STENCIL .....................................................................

74

FIGURE 41: INNER GND PIN RECOMMENDED STENCIL .................................................................................

75

FIGURE 42: TYPICAL SMT REFLOW PROFILE ....................................................................................................

76

FIGURE 43: PACKAGING PROCESS ......................................................................................................................

78

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SIM8950X Hardware Design V1.08

FIGURE 44: MODULE TRAY DRAWING .................................................................................................................

78

FIGURE 45: SMALL CARTON DRAWING ...............................................................................................................

79

FIGURE 46: BIG CARTON DRAWING .....................................................................................................................

79

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SIM8950X Hardware Design V1.08

1. Introduction

This document describes electrical specifications, mechanical information, interfaces application and manufacturing information about SIM8950x module. With the help of this document and other application notes or user guide, users can understand SIM8950x well and develop various products quickly.

almost any space requirement in users’ applications, such as smart phone, PDA, industrial handhold, machine-to-machine and vehicle application, etc.

SIM8950x is a multi-mode and multi-band wireless smart module, which is based on Qualcomm SDM450 platform ：

 14nm FinFET ,64-bit ARM Cortex-A53 octa-core at 1.8GHz

 Non-PoP 2GB LPDDR3 SDRAM designed for 933Mhz clock.

 16GB eMMC Flash

 Qualcomm Adreno 506 GPU at 600MHz, with 64-bit addressing

 Rich multimedia features: Support Dual-LCM, two cameras and multi-path analog audio IO

 Support for USB3.0 and SD3.0

 Global location-based service, wireless connectivity, and air interface standards including GSM,

WCDMA, TD-SCDMA, CDMA2000, and LTE.

With higher integration to reduce PCB surface area, time-to-market, and BOM costs, SIM8950x will help drive wireless products adoption in more industry around the world.

The operating bands are different between SIM8950x variants, which are summarized in Table 1.

Table 1: SIM8950x Variants

Configuration

CPU

Memory

RAM （ standard ）

ROM （ standard ）

Standards & bands

GSM

GSM850

EGSM900

DCS1800

SIM8950LH

1.8GHz

2GB

16GB





SIM8950A

(AC)

1.8GHz

2GB

16GB





SIM8950E

(EC)

1.8GHz

2GB

16GB







SIM8050LH

1.8GHz

2GB

16GB www.simcom.com

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WCDMA

CDMA2000

1X/EVDO

TDSCDMA

FDD-LTE

TDD-LTE

WLAN

BT

GNSS

PCS1900

B1

B2

B4

B5

B8

BC0

B17

B20

B25

B26

B7

B8

B12

B13

B3

B4

B5

B34

B39

B1

B2

B34

B38

B39

B40

B41

2.4G/5GHz;

802.11a/b/g/n/ac

BT4.2 LE

GPS

GLONASS

BEIDOU

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SIM8950X Hardware Design V1.08

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 www.simcom.com

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SIM8950X Hardware Design V1.08

1.1 SIM8950x Key Features

Table 2: SIM8950x key features

Feature

Application processor

Memory

External memory via

SDC2

GPU

Operating system

Power supply

Charge management

Display

Camera

Video performance

Audio

USB www.simcom.com

Implementation

Octa ARM Cortex-A53 cores up to 1.8 GHz

64-bit processor

2GB LPDDR3 RAM up to 933Mhz

16GB eMMC NAND flash (MLC)

Customization: 3GB LPDDR3 + 32GB eMMC

4GB LPDDR3 + 64GB eMMC

SD3.0; Support SD flash devices up to 128GB

Qualcomm Adreno 506 GPU, 64bit addressing, designed for 600MHz

Android OS 7.x/8.x/9.x

3.4V ~4.4V

External charging IC needed

Provide Qualcomm PMI8952 interface for QC 3.0

Dual MIPI DSI four-lane

FHD (1920 × 1200) 60 fps; 16/18/24 bpp RGB

Primary camera: 4-lane MIPI_CSI, 21MP

Secondary camera: 2-lane MIPI_CSI, 8MP

Encode:

1080p60, H.264, H.265, and VP8

Decode:

1080p60, H.264, H.265, VP8, and VP9

One digital port I2S, support both master and slave mode

Three analog input ports:

MIC1 supports differential configuration

MIC2 supports single-ended configuration

MIC3 supports single-ended configuration

Supports dual-mic noise suppression

16, 32, and 48 KHz sample rate

Four analog output ports: earpiece, stereo headphones, class-D speaker driver ,and line out

16, 32, 48, 96 and 192 KHz sample rate

Audio codec support:

G711; QCELP; EVRC, EVRC-B, EVRC-WB; AMR-NB, AMR-WB;

GSM-EFR, GSM-FR, GSM-HR

One USB 3.0/2.0

Support Type-C

Support OTG (external 5V power supply is needed)

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UART

I2C

SPI

ADC

UIM card

Transmitting power

LTE features

UMTS features

TD-SCDMA features

CDMA2000 features

GSM features www.simcom.com

SIM8950X Hardware Design V1.08

4*UART: UART2 、 UART4 、 UART5 & UART6

 UART2 for debug ， 2-line

 UART4 、 UART5 & UART6 are 4-line that support RTS and CTS hardware flow control, the speed can up to 4Mbps.

8* I2C

5* SPI

1*ADC (16bit)

Detection range: 0.1V~1.7V or 0.3V~4.5V (software controlled)

Dual cards dual standby

Class 4 (33dBm±2dB) for EGSM850

Class 4 (33dBm±2dB) for EGSM900

Class 1 (30dBm±2dB) for DCS1800

Class 1 (30dBm±2dB) for PCS1900

Class E2 (27dBm±3dB) for EGSM850 8-PSK

Class E2 (27dBm±3dB) for EGSM900 8-PSK

Class E2 (26dBm±3dB) for DCS1800 8-PSK

Class E2 (26dBm±3dB) for PCS1900 8-PSK

Class 3 (24dBm+1/-3dB) for WCDMA bands

Class 3 (24dBm+3/-1dB) for CDMA BC0

Class 2 (24dBm+1/-3dB) for TD-SCDMA bands

Class 3 (23dBm±2dB) for LTE-FDD bands

Class 3 (23dBm±2dB) for LTE-TDD bands

Support 3GPP R8 Cat.4

Support 1.4 ~ 20MHz RF bandwidth

Support MIMO in DL direction

Cat.4 FDD: Max 150Mbps (DL)/Max 50Mbps (UL)

Cat.4 TDD: Max 130Mbps (DL)/Max 35Mbps (UL)

Support 3GPP R8 DC-HSDPA/ HSPA+/HSDPA/HSUPA/WCDMA

Support QPSK, 16-QAM and 64-QAM modulation

DC-HSDPA: Max 42Mbps (DL)

DC-HSUPA: Max 11.2Mbps (UL)

WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL)

Support CCSA Release 3 TD-SCDMA

Max 4.2Mbps (DL)/Max 2.2Mbps (UL)

Support 3GPP2 CDMA2000 1X Advanced, CDMA2000 1x EV-DO Rev.A

EVDO: Max 3.1Mbps (DL)/Max 1.8 Mbps (UL)

1X Advanced: Max 307.2Kbps (DL)/Max 307.2Kbps (UL)

R99:

CSD: 9.6kbps, 14.4kbps

GPRS:

Support GPRS multi-slot class 33 (default)

Coding scheme: CS-1, CS-2, CS-3 and CS-4

Max 85.6Kbps (UL), 107Kbps (DL)

EDGE:

Support EDGE multi-slot class 33 (default)

Support GMSK and 8-PSK for different MCS

13 / 89

WLAN features

Bluetooth features

GNSS

Temperature range

Physical features

SIM8950X Hardware Design V1.08

Downlink coding schemes: CS 1-4 and MCS 1-9

Uplink coding schemes: CS 1-4 and MCS 1-9

Max 236.8Kbps (UL), 296Kbps (DL)

2.4G/5GHz, 802.11a/b/g/n/ac, up to 433Mbps

Support AP mode

BT2.1+EDR /3.0 /4.2 BLE

GPS/GLONASS/BEIDOU

Operating temperature: -35 ℃ ~ +75 ℃ ［ 1 ］

Extreme operating temperature ： -40 ℃ ~ +85 ℃［ 2 ］

Storage temperature: -40 ℃ ~ +90 ℃

Dimension: 44.1(±0.2)*45.6(±0.2)*2.8(±0.2)mm

Weight: about 12.5g

NOTE

1. Module can operate in the -35 ℃ ~ +75 ℃ range, and the performance can be meet the 3GPP specifications.

2. Module is working when the temperature change to -40 ℃ ~ +85 ℃ ,Module is able to make and receive voice calls, data calls, SMS and make GPRS/UMTS/HSPA+/LTE traffic. The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the normal operating temperature range and still within the extreme operating temperature range.

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1.2 SIM8950x Functional Diagram

SIM8950X Hardware Design V1.08

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Figure 1: SIM8950x functional diagram

15 / 89

2. Pin Definitions

2.1 Pin Assignment

SIM8950X Hardware Design V1.08

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Figure 2: SIM8950x pin assignment (top view)

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SIM8950X Hardware Design V1.08

2.2 Pin Description

Table 3: I/O parameter definitions

Symbol Description

Pad attribute

PI

PO

AI

AO

DI

DO

Power input

Power input

Analog input

Analog output

Digital input

Digital output

Pad pull details for digital I/Os

NP

PU

PD

No internal pull

Internal pull up

Internal pull down

Table 4: Pin description

Pin Name

Power Supply

VBAT

VRTC

VREG_L22_2P8

VREG_L17_2P85

VREG_L10_2P8

VREG_L2_1P1

VREG_L6_1P8

VREG_L23_1P175

VREG_L5_1P8

Ground www.simcom.com

Pin No. I/O Description

10

11

6

8

12

4

5

83 ， 84 ，

85

79

PI

PI/PO

PO

PO

PO

PO

PO

PO

PO

Main power supply for the module

Coin cell or backup-battery charger supply and input

LDO 22 output for camera AVDD

LDO 17 output for display and camera

VCM

LDO 10 output for Sensors and touch screen

LDO 2 output for camera DVDD

LDO 6 output , could be turned off in sleep mode

LDO 23 output for camera DVDD

LDO 5 output, should not be changed and turned off

Note

17 / 89

SIM8950X Hardware Design V1.08

USB_CC1

USB_SS_RX_P

USB_SS_RX_M

USB_SS_TX_P

USB_SS_TX_M

UIM Interface

VREG_L15_UIM2

UIM2_DATA

UIM2_CLK

UIM2_RESET

UIM2_DET

UIM1_DET

UIM1_RESET

UIM1_CLK

UIM1_DATA

VREG_L14_UIM1

SDC Interface

GND

USB TYPE-C

1 3 15 18 27 29 32 40

42 48 50 59 61 70 81

82 86 88 96 103 114

123 134 145 148 157

160 162 164 166 168

170 171 173 175 177

179 181 184 189 192

195 198 199 201 204

206 209 212 213 214

215 216 217 218 219

220 221 222 223 224

225 226 227 228 229

230 231 232

VBUS_USB_IN

USB_DN

USB_DP

87

147

146

AI

AI/AO

AI/AO

Ground

USB_VCONN 165

USB_SS_SWITCH_S

EL

USB_CC2

188

190

191

193

194

196

197

172

174

176

178

180

205

207

208

210

211

AI

DO

AI/AO

AI/AO

AI

AI

AO

AO

VBUS monitor signal from Type-C connector

USB high-speed data

Power input pin (5 V, 210 mA from VBUS) to drive active cables during the DFP mode.

USB Type-C switch control, cannot be pull up externally

USB Type-C connector configuration channel 1

USB Type-C connector configuration channel 2

USB super-speed receive – plus

USB super-speed receive –minus

USB super-speed transmit – plus

USB super-speed transmit – minus

PO LDO 15 output for UIM2, 1.8V/2.95V

DI/DO UIM2 data

DO

DO

DI

DI

DO

DO

UIM2 clock

UIM2 reset

UIM2 presence detection

UIM1 presence detection

UIM1 reset

UIM1 clock

DI/DO UIM1 data

PO LDO 14 output for UIM1, 1.8V/2.95V

Cannot be used as GPIO

Cannot be used as GPIO www.simcom.com

18 / 89

VREG_L11_2P95

SDC2_CLK

SDC2_CMD

SDC2_DATA0

SDC2_DATA1

SDC2_DATA2

SDC2_DATA3

SD_DET

Touch Screen

TS_I2C3_SDA

TS_I2C3_SCL

TS_INT

TS_RST

LCD Interface

MIPI_DSI0_CLK_P 135

MIPI_DSI0_CLK_N 136

MIPI_DSI0_LANE0_P 137

MIPI_DSI0_LANE0_

N

138

MIPI_DSI0_LANE1_P 139

MIPI_DSI0_LANE1_

N

140

MIPI_DSI0_LANE2_P 141

MIPI_DSI0_LANE2_

N

142

MIPI_DSI0_LANE3_P 143

MIPI_DSI0_LANE3_

N

MIPI_DSI1_CLK_P

144

124

MIPI_DSI1_CLK_N 125

MIPI_DSI1_LANE0_P 126

MIPI_DSI1_LANE0_

N

127

MIPI_DSI1_LANE1_P 128

MIPI_DSI1_LANE1_

N

129

MIPI_DSI1_LANE2_P 130

MIPI_DSI1_LANE2_

N

131

MIPI_DSI1_LANE3_P 132

MIPI_DSI1_LANE3_

N

133

167

117

119

118

153

152

151

150

149

156

155

154 www.simcom.com

SIM8950X Hardware Design V1.08

PO

DO

LDO 11 output for SD card

Secure digital controller 2 clock

DI/DO Secure digital controller 2 command

DID/O Secure digital controller 2 data bit 0

DI/DO Secure digital controller 2 data bit 1

DI/DO Secure digital controller 2 data bit 2

DI/DO Secure digital controller 2 data bit 3

DI Secure digital card detection

DI/DO Touch screen I2C data

DO Touch screen I2C clock

DI

DO

Touch screen interrupt

Touch screen reset

AO

AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AO

AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

Primary display serial interface 0

Secondary display serial interface 1

19 / 89

LCD1_RST

LCD0_RST

LCD_BL_EN

PWM

Camera Interface

MIPI_CSI0_LANE3_

N

104

MIPI_CSI0_LANE3_P 105

MIPI_CSI0_LANE2_

N

106

MIPI_CSI0_LANE2_P 107

MIPI_CSI0_LANE1_

N

108

MIPI_CSI0_LANE1_P 109

MIPI_CSI0_LANE0_

N

110

MIPI_CSI0_LANE0_P 111

MIPI_CSI0_CLK_N 112

MIPI_CSI0_CLK_P

MIPI_CSI2_LANE1_

N

113

97

MIPI_CSI2_LANE1_P 98

MIPI_CSI2_LANE0_

N

99

MIPI_CSI2_LANE0_P 100

MIPI_CSI2_CLK_N 101

MIPI_CSI2_CLK_P 102

120

121

122

33

CAM2_PWD 90

CAM2_RST

CAM0_RST

CAM0_PWD

CAM_I2C_SDA

CAM_I2C_SCL

CAM_MCLK2

CAM_MCLK0

Keypad

KEY_VOL_UP

KEY_VOL_DOWN

PWRKEY

Sensors

SENSOR_I2C4_SCL 38

44

43

14

91

92

93

94

95

115

116 www.simcom.com

SIM8950X Hardware Design V1.08

DO

DO

DO

DO

LCD1 reset

LCD0 reset

LCD back light enable

PWM control for external WLED driver

DI

DI

DI

DO

AI/AO

AI/AO

AI/AO

AI

AI

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO Primary camera serial interface 0

AI/AO

AI/AO Secondary camera serial interface 2

AI/AO

AI

AI

DO

DO

DO

DO

Secondary Camera power down, cannot be pull up externally

Secondary Camera reset

Primary Camera reset

Primary Camera power down

DI/DO Dedicated Camera I2C data

DO

DO

DO

Dedicated Camera I2C clock

Secondary Camera master clock

Primary Camera master clock

Volume up keypad

Volume down keypad

Power on keypad

Sensors I2C clock

20 / 89

SENSOR_I2C4_SDA 39

ACCEL_INT 56

ALSP_INT 57

Antenna

MAIN_ANT

DRX_ANT

GNSS_ANT

WIFI/BT_ANT

UART

UART2_RX

UART2_TX

UART4_TX

UART4_RX

UART5_RX

UART5_TX

SPI

SPI6_CS

SPI6_CLK

SPI6_MOSI

SPI6_MISO

GPIO

GPIO_0

MAG_INT

GYRO_INT

Audio

SPK_P

SPK_N

EAR_P

EAR_N

HPH_L

HPH_REF

HPH_R

HS_DET

MIC2_P

MIC1_N

MIC1_P

MIC3_P

MIC_BIAS1

LINEOUT_P

LINEOUT_N www.simcom.com

58

66

45

60

41

49

2

62

63

64

65

36

37

182

183

25

26

28

30

31

9

7

202

203

20

21

22

23

24

16

17

19

SIM8950X Hardware Design V1.08

AI

AI

AI

AI

PO

AO

AO

AO

AO

AO

AO

AO

AI

AO

AI

DI/DO Sensors I2C data

DI

DI

DI

Accelerate sensor interrupt

Ambient light and proximity sensor interrupt

Magnetic sensor interrupt

DI Gyroscope sensor interrupt

Speaker driver output, positive

Speaker driver output, negative

Earpiece output, positive

Earpiece output, negative

Headphone output, left channel

Headphone ground reference

Headphone output, right channel

Headset detection

Microphone input 2, positive

Microphone input 1, negative

Microphone input 1, positive

Microphone input 3, positive

Microphone bias1

LINEOUT output, positive

LINEOUT output, negative

DI

DO

DO

DI

DI

DO

AI/AO 2G/3G/4G main antenna port

AI 4G diversity antenna port

AI GNSS antenna port

AI/AO WIFI/BT antenna port

UART2 data receive for debug

UART2 data transmit for debug

UART4 data transmit

UART4 data receive

UART5 data receive

UART5 data transmit

DO

DO

DO

DI

SPI6 chip select

SPI6 clock

SPI6 master out slave in

SPI6 master in slave out

DI/DO GPIO

21 / 89

SIM8950X Hardware Design V1.08

GPIO_1

GPIO_2

GPIO_3

GPIO_18

GPIO_19

GPIO_24

GPIO_31

GPIO_32

GPIO_48

GPIO_59

GPIO_63

GPIO_90

GPIO_91

GPIO_93

GPIO_99

GPIO_98

GPIO_105

GPIO_106

GPIO_135

GPIO_138

GPIO_140

Others

FORCED_USB_BOO

T

ADC

PMI8952 Interface

PON_1

13

34

72

73

77

78

67

68

69

71

52

53

54

55

46

89

47

51

186

187

74

75

76

35

PM8953_GPIO8

PM_PON_RESET

SPMI_CLK

SPMI_DATA

NC

NC

DI/DO GPIO

DI/DO GPIO

DI/DO GPIO

DI/DO GPIO

DI/DO GPIO

DI/DO GPIO

DI/DO GPIO

DI/DO GPIO

DI/DO GPIO

DI/DO GPIO

DI/DO GPIO

DI/DO GPIO

DI/DO GPIO

DI/DO GPIO

DI/DO GPIO

DI/DO GPIO

DI/DO GPIO, cannot be pull up externally

DI/DO GPIO, cannot be pull up externally

DI/DO GPIO

DI/DO GPIO

DI/DO

DI

AI

GPIO

Force boot from USB interface

ADC

158

159

161

163

80,169,

185 ， 200

DI

DO

DO

DO

LOW to HIGH from PMI8952 initiates power on

Disables and enables external regulator source for VCONN and also serves as the

USB_ID pin control for PMI8952

Power-on reset control for PMI8952

SPMI clock for PMI8952

DI/DO SPMI data for PMI8952

Do not connect www.simcom.com

22 / 89

SIM8950X Hardware Design V1.08

NOTE

1. Leave unused pins floating unless otherwise specified.

2. For SIM8050LH, MAIN_ANT /DRX_ANT /GNSS_ANT are NC pins.

For more information about SIM8950x pin characters, refer to the following table.

Table 5: Pin Characters

Pin# Pin Name Voltage

SDM450

Platform

Pin Name

Reset

Status

Wakeup

Interrupt

20

21

22

23

16

17

18

19

24

25

26

27

12

13

14

15

8

9

10

11

6

7

4

5

1

2

3 www.simcom.com

SPK _N

GND

EAR_P

EAR_N

HPH_L

HPH_REF

HPH_R

HS_DET

UART5_RX

UART5_TX

GND

GND

WIFI/BT_ANT

GND

VREG_L22_2P8

VREG_L17_2P85

VREG_L10_2P8

MIC_BIAS1

VREG_L2_1P1

2.8V

2.85V

2.8V

1.6~2.85V

1.1V

MIC3_P

VREG_L6_1P8

VREG_L23_1P175

VREG_L5_1P8

1.8V

1.15V

1.8V

FORCED_USB_BOOT 1.8V

PWRKEY 1.8V

GND

SPK _P

1.8V

1.8V

GPIO_37

GPIO_17

GPIO_16

I-PD

I-PD

I-PD

√

√

Note

23 / 89

SIM8950X Hardware Design V1.08

58

59

60

61

54

55

56

57

50

51

52

53

46

47

48

49

66

67

68

62

63

64

65

42

43

44

45

38

39

40

41

34

35

36

37

28

29

30

31

32

33 www.simcom.com

MIC2_P

GND

MIC1_N

MIC1_P

GND

PWM

ADC

PON_1

UART2_RX

UART2_TX

SENSOR_I2C4_SCL

SENSOR_I2C4_SDA

GND

DRX_ ANT

GND

KEY_VOL_DOWN

KEY_VOL_UP

GPIO_0

GPIO_1

GPIO_3

GND

GNSS_ANT

GND

GPIO_18

GPIO_19

GPIO_24

GPIO_31

GPIO_32

ACCEL_INT

ALSP_INT

MAG_INT

GND

MAIN_ANT

GND

SPI6_CS

SPI6_CLK

SPI6_MOSI

SPI6_MISO

GYRO_INT

GPIO_48

GPIO_59

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

GPIO_5

GPIO_4

GPIO_15

GPIO_14

I-PD

I-PD

I-PD

I-PD

√

GPIO_85

GPIO_0

GPIO_1

GPIO_3

GPIO_18

GPIO_19

GPIO_24

GPIO_31

GPIO_32

GPIO_42

GPIO_43

GPIO_44

GPIO_22

GPIO_23

GPIO_20

GPIO_21

GPIO_45

GPIO_48

GPIO_59

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

√

√

√

√

√

√

√

√

√

√

24 / 89

83

84

85

86

79

80

81

82

87

88

89

75

76

77

78

69

70

71

72

73

74

90 CAM2_PWD

91

92

93

94

95

96

97

98

CAM2_RST

CAM0_RST

CAM0_PWD

CAM_I2C_SDA

CAM_I2C_SCL

GND

MIPI_CSI2_LANE1_N

MIPI_CSI2_LANE1_P

99 MIPI_CSI2_LANE0_N

100 MIPI_CSI2_LANE0_P

101 MIPI_CSI2_CLK_N

102 MIPI_CSI2_CLK_P

103 GND

104 MIPI_CSI0_LANE3_N

105 MIPI_CSI0_LANE3_P

GPIO_63

GND

GPIO_90

GPIO_91

GPIO_93

GPIO_135

GPIO_138

GPIO_140

GPIO_99

GPIO_98

VRTC

NC

GND

GND

VBAT

VBAT

VBAT

GND

VBUS_USB_IN

GND

GPIO_2

1.8V

3.4~4.4V

3.4~4.4V

3.4~4.4V

5V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

3V www.simcom.com

GPIO_2

GPIO_130

GPIO_129

GPIO_40

GPIO_39

GPIO_29

GPIO_30

GPIO_63

GPIO_90

GPIO_91

GPIO_93

GPIO_135

GPIO_138

GPIO_140

GPIO_99

GPIO_98

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

SIM8950X Hardware Design V1.08

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

√

√

√

√

√

√

√

√

Cannot be pull externally up

25 / 89

SIM8950X Hardware Design V1.08

106 MIPI_CSI0_LANE2_N

107 MIPI_CSI0_LANE2_P

108 MIPI_CSI0_LANE1_N

109 MIPI_CSI0_LANE1_P

110 MIPI_CSI0_LANE0_N

111 MIPI_CSI0_LANE0_P

112 MIPI_CSI0_CLK_N

113 MIPI_CSI0_CLK_P

114 GND

115 CA M_MCLK2

116 CA M_MCLK0

117 TP_I2C3_SCL

118 TP_RST

119 TP_INT

120 LCD1_RST

121 LCD0_RST

122 LCD_BL_EN

123 GND

124 MIPI_DSI1_CLK_P

125 MIPI_DSI1_CLK_N

126 MIPI_DSI1_LANE0_P

127 MIPI_DSI1_LANE0_N

128 MIPI_DSI1_LANE1_P

129 MIPI_DSI1_LANE1_N

130 MIPI_DSI1_LANE2_P

131 MIPI_DSI1_LANE2_N

132 MIPI_DSI1_LANE3_P

133 MIPI_DSI1_LANE3_N

134 GND

135 MIPI_DSI0_CLK_P

136 MIPI_DSI0_CLK_N

137 MIPI_DSI0_LANE0_P

138 MIPI_DSI0_LANE0_N

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

www.simcom.com

GPIO_27

GPIO_26

GPIO_11

GPIO_64

GPIO_65

GPIO_136

GPIO_61

GPIO_137

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

√

√

√

26 / 89

SIM8950X Hardware Design V1.08

139 MIPI_DSI0_LANE1_P

140 MIPI_DSI0_LANE1_N

141 MIPI_DSI0_LANE2_P

142 MIPI_DSI0_LANE2_N

143 MIPI_DSI0_LANE3_P

144 MIPI_DSI0_LANE3_N

145 GND

146 USB_DP

147 USB_DN

148 GND

149 VREG_L11_2P95

150 SD_DET_N

151 SDC2_DATA3

152 SDC2_DATA2

153 SDC2_DATA1

154 SDC2_DATA0

155 SDC2_CMD

156 SDC2_CLK

157 GND

158 PM8953_GPIO8

159 PM_PON_RESET

160 GND

161 SPMI_CLK

162 GND

163 SPMI_DATA

164 GND

165 USB_VCONN

166 GND

167 TP_I2C3_SDA

168 GND

169 NC

170 GND

171 GND

172 VREG_L15_UIM2

173 GND www.simcom.com

1.8V

1.8V

1.8V

1.8/2.95 V

2.95V

1.8V

1.8/2.95

1.8/2.95 V

1.8/2.95 V

1.8/2.95 V

1.8/2.95 V

1.8/2.95 V

GPIO_133

GPIO_10 I-PD

I-PD

BH-P

BH-P D

BH-P D

BH-P D

BH-P D

BHNP

√

√

√

27 / 89

174 UIM2_DATA

175 GND

176 UIM2_CLK

177 GND

178 UIM2_RESET

179 GND

180 UIM2_DET

181 GND

182 UART4_TX

183 UART4_RX

184 GND

185 NC

186 GPIO_105

1.8/2.95 V

1.8/2.95 V

1.8V

1.8V

1.8V

GPIO_55

GPIO_56

1.8/2.95 V GPIO_57

1.8V

GPIO_58

GPIO_12

GPIO_13

GPIO_105

187 GPIO_106 1.8V

GPIO_106

188

USB_SS_SWITCH_SE

L

189 GND

190 USB_CC2

191 USB_CC1

192 GND

193 USB1_SS_RX_P

194 USB1_SS_RX_M

195 GND

196 USB1_SS_TX_P

197 USB1_SS_TX_M

198 GND

199 GND

200 NC

201 GND

202 LINEOUT_P

203 LINEOUT_N

204 GND

205 UIM1_DET

206 GND

207 UIM1_RESET

208 UIM1_CLK

209 GND

1.8V

1.8V

GPIO_139

GPIO_54

1.8 / 2.95 V GPIO_53

1.8 / 2.95 V GPIO_52 www.simcom.com

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

SIM8950X Hardware Design V1.08

I-PD

I-PD

I-PD

I-PD

I-PD

I-PD

√

√

Cannot be used as

GPIO

√

√ cannot be pull externally externally externally up cannot be pull up cannot be pull up

Cannot be used as

GPIO

28 / 89

210 UIM1_DATA

211 VREG_L14_UIM1

212 GND

213 GND

214 GND

215 GND

216 GND

217 GND

218 GND

219 GND

220 GND

221 GND

222 GND

223 GND

224 GND

225 GND

226 GND

227 GND

228 GND

229 GND

230 GND

231 GND

232 GND

1.8 / 2.95 V GPIO_51

1.8 / 2.95 V

SIM8950X Hardware Design V1.08

I-PD www.simcom.com

29 / 89

SIM8950X Hardware Design V1.08

3. Interface Application

3.1 Power Supply

The power supply of SIM8950x ranges from 3.4V to 4.4V, and 3.9V is recommended. It must be able to provide sufficient current up to 3A for the high-power transmitting.

3.1.1 Recommended power supply resolutions

For battery-powered applications, the external charging IC is needed.

For non-battery applications, if the DC input voltage is +5V and users do not care about the power efficiency, a high-current low-dropout regulator is recommended.

The reference design is shown in Figure 3.

Figure 3: LDO power supply reference circuit

NOTE

To ensure a proper behavior of the regulator under light load, an extra minimum load (R103 in Figure

3) is required, because the current SIM8950x consumed is very small in sleep mode and power off mode. For more details about minimum load, please refer to specification of MIC29302.

www.simcom.com

30 / 89

SIM8950X Hardware Design V1.08

To increase power efficiency, the switching mode DC-DC converter is preferable, especially when DC input voltage is quite high. The reference design is shown in Figure 4, and it is recommended to reserve a proper ferrite bead (FB101 in Figure 4) in series for EMI suppression.

Figure 4: DC-DC power supply reference circuit

3.1.2 Enhance power stability

To enhance power stability, it is recommended to add some bypass capacitors and zener diode closed to

VBAT pins. The reference design is shown in Figure 5, where C101 and C102 are two 110uF tantalum capacitors with low ESR, C103 could be a 1~10uF ceramic capacitor, 33pF and 10pF capacitors are used for eliminating the high frequency interference, D101 can protect the module against voltage surge.

www.simcom.com

Figure 5: VBAT input reference circuit

31 / 89

SIM8950X Hardware Design V1.08

Table 6: Recommended components

Posite

C101 C102

D101

Supplier Part number parameter

AVX

Prisemi

Prisemi

TAJY107M010RNJ ESR 0.9ohm@100KHz

PTVSHC3N4V8U

PTVSHC2EN5VU

POWER 3200W

POWER 1600W

package

7343-20

DFN2×2-3L

DFN1610-2L

3.2 Power On/off

3.2.1 Power on

Users can power on SIM8950x by pulling down the PWRKEY pin for more than 2 second then release. This pin is already pulled up to 1.8V internally, so external pull up is not necessary. The electrical characteristics are listed in Table 7, and reference circuits are shown in the following figures:

Figure 6: Powered on/off module using button www.simcom.com

Figure 7: Powered on/off module using transistor

32 / 89

SIM8950X Hardware Design V1.08

Table 7: PWRKEY characteristics

Parameters Description

V

IH

V

IL

High-level input voltage

Low-level input voltage

Min

1.4

-

Typ

-

-

Max

-

0.6

Unit

V

V

3.2.2 Power-on sequence

The power-on sequence is shown in Figure 8.

Figure 8: Power-on sequence

NOTE

1 ， Make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 50ms.

2 ， PWRKEY pin cannot be pulled down all the time.

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SIM8950X Hardware Design V1.08

3.2.3 Power off sequence

Users can turn off SIM8950x by pulling down the PWRKEY pin for more than 1 second. After the module detects that the PWRKEY is low level, a prompt window will pop up on the screen to confirm whether to execute the shutdown action.

Module can also be forced to shut down by pulling down PWRKEY for more than 8 seconds.

Figure 9: Power-off sequence

NOTE

1. The VBAT power supply circuit of the module can be cut off in the customer's hardware design.

2.

It is recommended to add a low-cost MCU, which can control the PWRKEY to power on and power off the module, as well as the hardware watchdog to protect the normal operation.

3. Do not directly cut off the power supply VBAT of the module when the module is working normally, otherwise the internal flash of the module will be damaged. It is strongly recommended to shut down the module through PWRKEY or AT command before disconnecting the power supply VBAT of the module.

3.3 VRTC

VRTC is the power supply for RTC circuit and charger output for coin cell or backup battery. If RTC support is needed when the battery is removed, a qualified coin cell or keep-alive capacitor is required on the VRTC pin. When VBAT is present and valid, coin cell charging is enabled through software control and powered from VBAT. Reference circuits are shown in the following figures: www.simcom.com

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SIM8950X Hardware Design V1.08

Keep-alive capacitor:

Non-rechargeable battery:

Figure 10: Keep-alive capacitor

Rechargeable battery:

Figure 11: Non-rechargeable battery

Figure 12: Rechargeable battery

VRTC typical voltage is 3.0V, and the current consumption is about 5uA when VBAT is absence. VRTC electrical characteristics are listed in the following table.

Table 8: VRTC characteristic

Parameter Description

VRTC

-IN

I

RTC-IN

VRTC

-OUT

I

RTC-OUT

VRTC input voltage

VRTC current consumption

VRTC output voltage

VRTC output current

Min

2.0

-

2.5

-

Typ

3.0

7.5

3.1

Max

3.25

-

3.2

2

Unit

V uA

V mA www.simcom.com

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SIM8950X Hardware Design V1.08

3.4 Output Power Management

Table 9: Output power management summary

Pin Name Pin#

VREG_L22_2P8 4

VREG_L17_2P85 5

VREG_L10_2P8 6

VREG_L2_1P1

VREG_L6_1P8

8

10

VREG_L23_1P175 11

VREG_L5_1P8 12

VREG_L11_2P95 149

VREG_L15_UIM2 172

VREG_L14_UIM1 211

Specified range (V)

Programmable

Range (V)

2.8

2.85

2.8

1.1

1.8

1.175

1.8

1.750–3.3375

1.750–3.3375

1.750–3.3375

0.375–1.5375

N/A

0.375–1.5375

N/A

2.95

N/A

1.8V/2.95V N/A

1.8V/2.95V N/A

150

1200

300

600

100

800

50

50

Rated current

(mA)

150

300

Expected use

camera AVDD display and camera VCM

Sensors and touch screen camera DVDD

Display, camera, sensors camera DVDD

Force USB boot, level shifter

SD/MMC card

UIM2

UIM1

3.5 USB Type-C Interface

SIM8950x module provides one USB 3.0/2.0 interface used for software upgrading, debugging, charging, etc. Moreover, SIM8950x has integrated Type-C interface to provide multiple Type-C features, including mode configuration, channel configuration, current advertisement, and active cable support.

In addition, SIM8950x supports OTG function, but external 5V power supply is required. USB_ID function could be configured via a GPIO (GPIO_140 is recommended), then connect it to PMI8953_GPIO_8 when using USB Type-C connector, or connect to USB_ID pin of connector when using micro USB connector.

www.simcom.com

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SIM8950X Hardware Design V1.08

Figure 13: USB Type-C reference circuit www.simcom.com

Figure 14: Micro USB reference circuit

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SIM8950X Hardware Design V1.08

3.6 UART/SPI/I2C

SIM8950x provides several sets of GPIOs which are available as BLSP (BAM-enabled low-speed peripheral) interfaces that can be configured to support various interface combinations, as shown in Table

10.

UART:

 Support 4*UART

 UART2 for debug ， 2-line port.

 UART4 、 UART5 & UART6 are 4-line port that support RTS and CTS hardware flow control, the speed can up to 4Mbps.

SPI:

 Supports 5*SPI; master-only mode; up to 52 MHz

I2C:

 Support 8*I2C; master-only mode; up to 3.4 MHz, 2.2Kohm pull-up resistors are needed externally;

NOTE

CAM_I2C is a dedicated camera control interface, which cannot be used as general-purpose I2C ports.

Table 10: UART/SPI/I2C functional assignments

Pin Name Pin#

GPIO_0

GPIO_1

GPIO_2

GPIO_3

UART2_TX

UART2_RX

TS_I2C3_SDA

TS_I2C3_SCL

UART4_TX

117

182

UART4_RX 183

SENSOR_I2C4_SDA 39

SENSOR_I2C4_SCL 38

UART5_TX 26

45

46

89

47

37

36

167 www.simcom.com

Alternative

Function 1

UART2_TX

UART2_RX

UART4_TX

UART4_RX

UART4_CTS

UART4_RTS

UART5_TX

Alternative

Function 2

SPI1_MOSI

SPI1_MISO

SPI1_CS

SPI1_CLK

SPI4_MOSI

SPI4_MISO

SPI4_CS

SPI4_CLK

SPI5_MOSI

Alternative

Function 3

I2C1_SDA

I2C1_SCL

I2C3_SDA

I2C3_SCL

I2C4_SDA

I2C4_SCL

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UART5_RX

GPIO_18

GPIO_19

SPI6_MOSI

SPI6_MISO

SPI6_CS

SPI6_CLK

LCD_BL_EN

GPIO_138

LCD1_RST_N

GPIO_135

GPIO_98

GPIO_99

CAM_I2C_SDA

CAM_I2C_SCL

77

94

95

63

122

75

120

74

78

25

51

52

64

65

62

UART5_RX

UART5_CTS

UART5_RTS

UART6_TX

UART6_RX

UART6_CTS

UART6_RTS

SIM8950X Hardware Design V1.08

SPI5_MISO

SPI5_CS

SPI5_CLK

SPI6_MOSI

SPI6_MISO

SPI6_CS

SPI6_CLK

SPI7_MOSI

SPI7_MISO

SPI7_CS

SPI7_CLK

I2C5_SDA

I2C5_SCL

I2C6_SDA

I2C6_SCL

I2C7_SDA

I2C7_SCL

I2C8_SDA

I2C8_SCL

CAM_I2C_SDA0

CAM_I2C_SCL0

3.7 Secure Digital Interface

SIM8950x provides one 4-bit secure digital interface, which supports SD 3.0 specifications.

Table 11: SD interface pin definitions

Pin Name

VREG_L11_2P95

SDC2_CLK

SDC2_CMD

SDC2_DATA0

SDC2_DATA1

SDC2_DATA2

SDC2_DATA3

SD_DET_N

Pin#

149

156

155

154

153

152

151

150

I/O

PO

DO

DI/DO

DI/DO

DI/DO

DI/DO

DI/DO

DI

Description

LDO 11 output for SD card

Secure digital controller 2 clock

Secure digital controller 2 command

Secure digital controller 2 data bit 0

Secure digital controller 2 data bit 1

Secure digital controller 2 data bit 2

Secure digital controller 2 data bit 3

Secure digital card detection www.simcom.com

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SIM8950X Hardware Design V1.08

Figure 15: SD card reference circuit

NOTE

SDC signal cannot be pulled up to VREG_L11_2P95.

3.8 LCD Interface

SIM8950x provides two 4-lane MIPI_DSI, with 2.1 Gbps per lane high-speed mode bandwidth, to support dual LCDs with FHD (1920 × 1200 @ 60 fps) resolution.

NOTE

MIPI_DSI0 must used for primary display.

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SIM8950X Hardware Design V1.08

Table 12: Display interface pin definitions

Pin Name

MIPI_DSI0_CLK_P

MIPI_DSI0_CLK_N

MIPI_DSI0_LANE0_P

MIPI_DSI0_LANE0_N

MIPI_DSI0_LANE1_P

MIPI_DSI0_LANE1_N

MIPI_DSI0_LANE2_P

MIPI_DSI0_LANE2_N

MIPI_DSI0_LANE3_P

MIPI_DSI0_LANE3_N

MIPI_DSI1_CLK_P

MIPI_DSI1_CLK_N

MIPI_DSI1_LANE0_P

MIPI_DSI1_LANE0_N

MIPI_DSI1_LANE1_P

MIPI_DSI1_LANE1_N

MIPI_DSI1_LANE2_P

MIPI_DSI1_LANE2_N

MIPI_DSI1_LANE3_P

MIPI_DSI1_LANE3_N

LCD1_RST_N

LCD0_RST_N

LCD_BL_EN

PWM

Pin#

135

136

137

138

139

128

129

130

131

124

125

126

127

140

141

142

143

144

132

133

120

121

122

33

I/O

AO

AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AO

AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

AI/AO

DO

DO

DO

DO

Description

Primary display serial interface 0

Secondary display serial interface 1

LCD1 reset

LCD0 reset

LCD back light enable

PWM control for external WLED driver

If only 2-lane MIPI_DSI is needed, just leave LANE2 and LANE3 floating. The reference circuit is shown in

Figure 15.

Common mode filters is recommended for EMI issue, and it may be omitted if best EMI practices are followed.

www.simcom.com

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SIM8950X Hardware Design V1.08

Figure 16: Display reference circuit

3.9 Touch Screen Interface

Table 13: Touch screen interface pin definitions

Pin Name

TS_I2C3_SDA

TS_I2C3_SCL

TS_INT_N

TS_RST_N

Pin#

167

117

119

118

I/O

DI/DO

DO

DI

DO

Description

Touch screen I2C data

Touch screen I2C clock

Touch screen interrupt

Touch screen reset www.simcom.com

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SIM8950X Hardware Design V1.08

3.10 Camera Interface

SIM8950x supports two cameras:

4-lane MIPI_CSI primary camera up to 21MP resolution

2-lane MIPI_CSI secondary camera up to 8MP resolution.

Table 14: Camera interface pin definitions

Pin Name Pin# I/O Description

MIPI_CSI0_LANE3_N 104 AI/AO

MIPI_CSI0_LANE3_P 105 AI/AO

MIPI_CSI0_LANE2_N 106 AI/AO

MIPI_CSI0_LANE2_P 107 AI/AO

MIPI_CSI0_LANE1_N 108 AI/AO

MIPI_CSI0_LANE1_P 109 AI/AO

MIPI_CSI0_LANE0_N 110

MIPI_CSI0_LANE0_P 111

MIPI_CSI0_CLK_N

MIPI_CSI0_CLK_P

112

113

AI/AO

AI/AO

AI

AI

Primary camera serial interface 0

MIPI_CSI2_LANE1_N 97

MIPI_CSI2_LANE1_P 98

AI/AO

AI/AO

MIPI_CSI2_LANE0_N 99 AI/AO

MIPI_CSI2_LANE0_P 100 AI/AO

MIPI_CSI2_CLK_N

MIPI_CSI2_CLK_P

CAM2_PWD_N

CAM2_RST_N

101 AI

102 AI

90

91

DO

DO

CAM0_RST_N

CAM0_PWD_N

CAM_I2C_SDA

CAM_I2C_SCL

CAM_MCLK2

CAM_MCLK0

92

93

94

95

115

116

Secondary camera serial interface 2

Secondary Camera power down, cannot be pull up externally

Secondary Camera reset

DO

DO

Primary Camera reset

Primary Camera power down

DI/DO Dedicated Camera I2C data

DO Dedicated Camera I2C clock

DO

DO

Secondary Camera master clock

Primary Camera master clock www.simcom.com

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The reference circuit is shown in the following figures.

SIM8950X Hardware Design V1.08

Figure 17: Primary camera reference circuit www.simcom.com

Figure 18: Secondary camera reference circuit

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SIM8950X Hardware Design V1.08

The sim8950x module has built-in dual ISPs, which can support two cameras working at the same time.

The primary camera and secondary camera need independent I2C control. The reference circuit is shown as follows: www.simcom.com

Figure 19: Dual camera reference circuit

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SIM8950X Hardware Design V1.08

3.11 Audio

SIM8950x provides three microphone inputs and four outputs including earpiece, stereo headphones, and mono class-D speaker driver.

Table 15: Audio interface pin definitions

Pin Name

SPK_P

SPK_N

EAR_P

EAR_N

HPH_L

HPH_REF

HPH_R

HS_DET

MIC2_P

MIC1_N

MIC1 _P

MIC3_P

MIC_BIAS1

LINEOUT_P

LINEOUT_N

Pin#

23

24

28

30

16

17

19

20

21

22

31

9

7

202

203

I/O

AO

AI

AI

AI

AO

AO

AO

AO

AO

AI

AI

AI

PO

AO

AO

Description

Speaker driver output, positive

Speaker driver output, negative

Earpiece output, positive

Earpiece output, negative

Headphone output, left channel

Headphone ground reference

Headphone output, right channel

Headset detection

Microphone input 2, positive

Microphone input 1, negative

Microphone input 1, positive

Microphone input 3, positive

Microphone bias1

LINEOUT output, positive

LINEOUT output, negative www.simcom.com

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SIM8950X Hardware Design V1.08

3.11.1 Microphone

Figure 20: ECM-type microphone reference circuit

Figure 21: MEMS-type microphone reference circuit

3.11.2 Headset

Stereo class-AB headphone supports 16 Ω, 32 Ω, and up to 50 KΩ loads. Its typical output power at 1.02

KHz and THD + N ≤ 1% is: www.simcom.com

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SIM8950X Hardware Design V1.08

62 mW with 16 Ω loads, 0 dBFS and 0 dB gain

30 mW with 32 Ω loads, 0 dBFS and 0 dB gain

A 100KΩ pull-down resistor is integrated at HPH_L pin, which could be used for mechanical insertion or removal detection through HS_DET pin. Figure 20 shows the reference circuit for normally-closed (NC) type headset jack.

Figure 22: Headset reference circuit

NOTE

1. SIM8950x also supports NO/NC type headset jack with detect pin on HPH_L or GND.

2. HPH has a negative swing and requires a bi-directional TVS diode.

3.11.3 Earpiece

Class AB earpiece driver supports 10.67 Ω, 16 Ω, 32 Ω, and up to 50 KΩ loads. The typical output power at

1.02 KHz, 6 dB gain, and THD + N ≤ 1% is:

126 mW with 32 Ω loads and 0 dBFS input

243 mW with 16 Ω loads and -1.5 dBFS input

320 mW with 10.67 Ω loads and -3.5 dBFS input www.simcom.com

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SIM8950X Hardware Design V1.08

Figure 23: Earpiece reference circuit

3.11.4 Speaker

Class-D mono differential loud speaker driver supports 4 Ω and 8 Ω loads. The driver is powered from internal 5 V Boost (VDD_SPKR). Its typical output power at 1.02 KHz, 12 dB gain, and THD + N ≤ 1% is:

1500 mW with 4 Ω loads and VDD_SPKR = 5V

2000 mW with 8 Ω loads and VDD_SPKR = 5.5V

www.simcom.com

Figure 24: Speaker reference circuit

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SIM8950X Hardware Design V1.08

NOTE the maximum breakdown voltage of TVS for SPKR should not be less than 6 V.

3.11.5 LINEOUT

LINEOUT is a differential class-AB output to drive external speaker amplifier for loudspeaker.

Figure 25: LINEOUT reference circuit

3.12 I2S Interface

SIM8950x supports one I2S port, the pin definitions are shown in Table 16.

Table 16: I2S interface pin definitions

Pin Name

GPIO_135

LCD1_RST_N

LCD0_BL_EN

GPIO_138

Pin#

74

120

122

75

Alternative

Function ( I2S )

I2S_SCK

I2S_WS

I2S_D0

I2S_D1

Type

DI/DO

DI/DO

DI/DO

DI/DO

Description

I2S bit clock

I2S word select

I2S data0

I2S data1 www.simcom.com

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SIM8950X Hardware Design V1.08

3.13 UIM Interface

SIM8950x supports dual cards dual standby, and card presence detection.

NOTE

The standard software provided by SIMCom only supports single UIM card configuration.

Table 17: UIM interface pin definitions

Pin Name

VREG_L15_UIM2

UIM2_DATA

UIM2_CLK

UIM2_RESET

UIM2_DET

UIM1_DET

UIM1_RESET

UIM1_CLK

UIM1_DATA

VREG_L14_UIM1

Pin#

172

174

176

178

180

205

207

208

210

211

Type Description

PO LDO 15 output for UIM2, 1.8V/2.95V

DI/DO UIM2 data , Need 10K external Pull-up resistor

DO

DO

DI

UIM2 clock

UIM2 reset

UIM2 presence detection

DI

DO

DO

UIM1 presence detection

UIM1 reset

UIM1 clock

DI/DO UIM1 data , Need 10K external Pull-up resistor

PO LDO 14 output for UIM1, 1.8V/2.95V

www.simcom.com

Figure 26: UIM card reference circuit

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SIM8950X Hardware Design V1.08

3.14 ADC

SIM8950x provides one 16bits ADC. Its performance parameters are shown as Table 18.

Table 18: ADC performance parameters

Parameter

Input voltage range

Resolution

Analog input bandwidth

Sample rate

INL

DNL

Offset error

Gain error

Comments

Programmable

XO/8

15-bit output

15-bit output

Relative to full-scale

Relative to full-scale

-

-

-

-

-

-

Min

-

0.1

0.3

-

-

-

-

100

2.4

Typ

-

-

16

-

-

±8

±4

±1

±1

Max

-

1.7

4.5

Unit

V bits kHz

MHz

LSB

LSB

%

%

3.15 Antenna Interface

SIM8950x provides four antenna interfaces including MAIN antenna, DRX antenna, GNSS antenna, and

WiFi/BT antenna. To ensure good RF performance, users should meet the following requirements:

●

●

Keep the RF traces at 50Ω.

Maintain a complete and continuous reference ground plane from antenna pin to the RF connector.

●

●

The RF traces should be away from any other noisy traces.

Keep the RF traces as short as possible.

3.15.1 MAIN Antenna reference circuit

The recommended circuit is shown in the following figures: www.simcom.com

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SIM8950X Hardware Design V1.08

Figure 27: MAIN antenna recommended circuit

R1, C1 and C2 are antenna matching components in Figure 27, the value of these components are determined according to the antenna tuning results. By default, R1 is 0Ω, C1 and C2 are reserved. The RF connector in Figure 27 is used to ensure the accuracy and convenience of the conduction testing, so

SIMCOM suggest keeping it. If considering Low-Cost BOM, user can cancel the connector.

3.15.2 DRX Antenna reference circuit

The recommended circuit is shown in the following figures:

Figure 28: DRX antenna recommended circuit

R1, C1 and C2 are antenna matching components in Figure 28, the value of these components are determined according to the antenna tuning results. By default, R1 is 0Ω, C1 and C2 are reserved. The RF connector in Figure 28 is used to ensure the accuracy and convenience of the conduction testing, so

SIMCOM suggest keeping it. If considering Low-Cost BOM, user can cancel the connector.

www.simcom.com

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3.15.3 GNSS Antenna reference circuit

The recommended circuit is shown in the following figures:

SIM8950X Hardware Design V1.08

Figure 29: GNSS antenna recommended circuit

Figure 30: GNSS active antenna circuit

The attenuator in Figure 30 must be added as required and attenuation value is determined according to the active antenna gain. Normally, the relationship between the attenuation value and the gain satisfies the following formula:

Antenna gain = Attenuation value + Cable Losses

In Figure 30, the VDD is used to provide voltage to the external active antenna and its value should be www.simcom.com

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SIM8950X Hardware Design V1.08

taken according to antenna characteristic; C1 is used for DC blocking and its value is 33pF by default.; the

RF connector is used to ensure the accuracy and convenience of the conduction testing, if considering

LOW-Cost BOM, users can cancel it.

3.15.4 WiFi/BT Antenna reference circuit

The recommended circuit is shown in the following figures:

Figure 31: WIFI/BT antenna recommended circuit

R1, C1 and C2 are antenna matching components in Figure 31, the value of these components are determined according to the antenna tuning results. By default, R1 is 0Ω, C1 and C2 are reserved. The RF connector in Figure 31 is used to ensure the accuracy and convenience of the conduction testing, so

SIMCOM suggest keeping it. If considering Low-Cost BOM, user can cancel the connector.

3.16 RF traces layout guidelines

The characteristic impedance of RF signals should be controlled at 50 ohm. In general, the impedance of

RF signal is determined by the Permittivity (ER) of PCB material, line width (W), ground clearance (S), height of reference ground plane (H) and other factors.

Microstrip line and coplanar waveguide are usually used to control the characteristic impedance of RF wiring. The following illustrations show the structure design of microstrip line and coplanar waveguide.

 Microstrip line structure www.simcom.com

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SIM8950X Hardware Design V1.08

Figure 32: Two layer PCB microstrip structure

Table 19: Example of impedance control of microstrip line structure

PCB thickness

1mm

1.6mm

Permittiv ity (ER)

4.2

4.2

Line thickness Layer

0.035mm

0.035mm

Reference plane

Layer1 Layer2

Layer1 Layer2

Target impedance

50 ohm

50 ohm

Expected linewidth W

1.7mm (67 mil)

3mm (118 mil)

 Coplanar waveguide (CPW) structure (recommended)

Figure 33: Two layer PCB coplanar waveguide structure

Table 20: Example of impedance control of coplanar waveguide structure

PCB thickness

1mm

1.6mm

Permittiv ity (ER)

4.2

4.2

Line thickness

0.035mm

0.035mm

Layer

Layer1

Referenc e plane

Layer1 Layer2

Layer2

Target impedance

50 ohm

50 ohm

Expected gap to ground S

0.65mm

(25.6 mil)

0.65mm

(25.6 mil)

Expected linewidth

W

0.2mm

(7.8 mil)

0.15mm

(5.9 mil)

Four layer PCB coplanar waveguide structure 1# is shown in following figure. The third layer is reference layer.

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SIM8950X Hardware Design V1.08

Figure 34: Four layer PCB coplanar waveguide structure 1#

Four layer PCB coplanar waveguide structure 2# is shown in following figure. The fourth layer is reference layer.

Figure 35: Four layer PCB coplanar waveguide structure 2#

3.17 Antenna Requirement

The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna.

Table 21: Antenna Requirement

Antenna

GSM/WCDMA/TD-SCDMA/LTE

Requirements

VSWR: ≤ 2

Gain (dBi): >1

Max Input Power (W): 50

Input Impedance (ohm): 50

Polarization Type: Vertical www.simcom.com

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Wi-Fi/BT

GNSS

SIM8950X Hardware Design V1.08

VSWR: ≤ 2

Gain (dBi): >1

Max Input Power (W): 50

Input Impedance (ohm): 50

Polarization Type: Vertical

Frequency range:1565-1607MHz

Polarization: RHCP or linear

VSWR: < 2 (Typ.)

Passive antenna gain:>0dBi

Active antenna noise figure: < 1.5dB

Active antenna gain: > 0dBi

Active antenna embedded LNA gain: <17dB www.simcom.com

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SIM8950X Hardware Design V1.08

4. PCB Layout

This section provides PCB layout guidelines for SIM8950x users to ensure their production against lots of issues, and achieve the optimum performance.

4.1 General Placement Guidelines

At least, 4-layer through-hole PCB should be chosen for good impedance control and signal shielding.

4.2 General Placement Guidelines

 Digital devices and traces should not be placed near sensitive signals like RF and clock.

 Keep SPKR and MIC away from sensitive RF lines.

4.3 PCB Layout Guideline Details

4.3.1 RF Trace

 RF connector should be placed close to the module’s antenna pin.

 Antenna matching circuit should be placed close to the antenna.

 Keep the RF traces at 50Ω.

 Maintain a complete and continuous reference ground plane from antenna pin to the RF connector.

 The RF traces should be far away from any other noisy traces.

 Keep the RF traces as short as possible.

 If using a coaxial RF cable to connect the antenna, please avoid spanning on UIM cards, power circuits and high-speed digital circuits to minimize the impact of each other.

www.simcom.com

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SIM8950X Hardware Design V1.08

4.3.2 Power/GND

 Both VBAT and return path should be as short and wide as possible to minimize the IR drop

 The VBAT current should go through Zener diode, capacitors, then VBAT pins

 Must have a solid ground plane throughout the board as the primary reference plane for most signals

4.3.3 UIM Card

 Ensure UIM card holder is far way from antenna or RF signal

 ESD component and bypass caps should be placed closed to UIM Card

 UIM card signals should be far away from other high-speed signal

4.3.4 MIPI_DSI/CSI

 Protect MIPI_DSI/CSI signals from noisy signals (clocks, SMPS, etc.)

 Differential pairs, 100 Ω nominal, ±10%

 Total routing length < 305 mm

 Intra-pair length matching < 5 ps (0.67 mm)

 Inter-pair length matching < 10 ps (1.3 mm)

 Lane-to-lane trace spacing = 3x line width

 Spacing to all other signals = 4x line width

 Maintain a solid ground reference for clocks to provide a low-impedance path for return currents

 Each trace needs to be next to a ground plane

 Minimize the number of via on the trace

4.3.5 USB

 90 Ω differential, ± 10% trace impedance

 Differential data pair matching < 6.6 mm (50 ps)

 External components should be located near the USB connector.

 Should be routed away from sensitive circuits and signals.

 If there are test points, place them on the trace to keep branches as short as possible

 If USB connector is used as the charger input, USB_VBUS node must be routed to the module using extremely wide traces or sub planes.

www.simcom.com

60 / 89

SIM8950X Hardware Design V1.08

4.3.6 SDC

 Protect other sensitive signals/circuits from SDC corruption.

 Protect SDC signals from noisy signals (clocks, SMPS, etc.).

 Up to 200 MHz clock rate

 50 Ω nominal, ±10% trace impedance

 CLK to DATA/CMD length matching < 1 mm

 30–35 Ω termination resistor on clock lines near the module

 Total routing length < 50 mm recommended

 Spacing to all other signals = 2x line width

 Bus capacitance < 15 pF

4.3.7 Audio

Analog input

 4 to 5 mil trace widths; 4 to 5 mil spacing between traces

 Differential route for MIC1P with MIC1N and MIC2P with GND_MIC;

 Isolate from noise sources, such as antenna, RF signals, SMPS, clocks, and other digital signals with fast transients

Analog output

 Coplanar ground fill on both sides (of traces or pair as appropriate); in between ground planes – grounds above and below

 Isolate from noise sources such as antenna, RF signals, SMPS, clocks, and other digital signals with fast transients.

 EAR output signal – route as differential pair with 10 mil trace widths.

 SPKR output signals – route as differential pair with 20 mil trace widths with 8 Ω load and 25 mil trace widths with 4 Ω load

 HPH output signals – not a differential pair; 10 mil trace widths for HPH_L and HPH_R; 15 mil trace widths for HPH_REF

 Connect HPH_REF to the ground pin of the jack connector and route HPH_REF in between HPH_L and HPH_R for best crosstalk minimization www.simcom.com

61 / 89

SIM8950X Hardware Design V1.08

5. Electrical and Reliability

5.1 Absolute Maximum Ratings

Absolute maximum ratings reflect the stress levels that, if exceeded, may cause permanent damage to the device. Functionality and reliability are only guaranteed within the operating conditions.

Table 22: Absolute maximum ratings

Parameter

VBAT

VBUS

VRTC

Min

-

-0.3

-0.3

Max

5

28

3.5

Unit

V

V

V

5.2 Temperature Range

Table 23: Temperature range

Parameter

Operating temperature

Storage temperature

Min

-25

-45

Typ

25

Max

+75

+90

Unit

℃

℃

5.3 Operating Voltage

Table 24: Operating voltage

Parameter

VBAT

VBUS

VRTC

Min

3.4

4.35

2.0

Typ

3.9

5

3.0

Max

4.4

10

3.25

Unit

V

V

V www.simcom.com

62 / 89

SIM8950X Hardware Design V1.08

5.4 Digital-logic Characteristics

Table 25: 1.8 V digital I/O characteristics

Parameter Description

V

IH

V

IL

V

OH

V

OL

High-level input voltage

Low-level input voltage

High-level output voltage

Low-level output voltage

Min

1.17

-

1.35

-

Typ

-

-

-

-

Max

-

0.63

-

0.45

V

V

V

V

Unit

5.5 Current Consumption (VBAT=3.9V)

Table 26: Current consumption

Parameter

Leakage current

Standby current

GSM Voice call

WCDMA Voice call

FDD-LTE call voice

Conditions

Off mode

Flight mode

GSM@BS-PA-MFRMS=2

WCDMA @DRX=8

CDMA 1X @max slot=1~7

EVDO @max slot=1~7

TD-SCDMA @DRX=7

LTE-FDD @standby 1.28s

LTE-TDD @standby 1.28s

GSM850 @PCL5

EGSM900 @PCL5

DCS1800 @PCL0

PCS1900 @PCL0

Band 1 @max power

Band 2 @max power

Band 4 @max power

Band 5 @max power

Band 8 @max power

Band 1 @max power

Band 2 @max power

Band 3 @max power

Band 4 @max power www.simcom.com

Typ.

195

588

562

540

4.0

259

269

224

31

2.6

3.5

3.47

3.53

3.17

3.14

3.95

504

504

583

650

680

690

Max Unit

mA mA mA mA mA mA mA mA mA mA mA mA uA mA mA mA mA mA mA mA mA mA

63 / 89

TDD-LTE call

GPRS data

EDGE data

LTE data voice

Band 5 @max power

Band 8 @max power

Band 12 @max power

Band 13 @max power

Band 17 @max power

Band 20 @max power

Band 25 @max power

Band 26 @max power

Band 34 @max power

Band 38 @max power

Band 39 @max power

Band 40 @max power

Band 41 @max power

GSM850 (1UL/4DL) @PCL5

GSM850 (2UL/3DL) @PCL5

GSM850 (4UL/1DL) @PCL5

GSM900 (1UL/4DL) @PCL5

GSM900 (2UL/3DL) @PCL5

GSM900 (4UL/1DL) @PCL5

DCS1800 (1UL/4DL) @PCL5

DCS1800 (2UL/3DL) @PCL5

DCS1800 (4UL/1DL) @PCL5

DCS1900 (1UL/4DL) @PCL5

DCS1900 (2UL/3DL) @PCL5

DCS1900 (4UL/1DL) @PCL5

GSM850 (1UL/4DL) @PCL8

GSM850 (2UL/3DL) @PCL8

GSM850 (4UL/1DL) @PCL8

GSM900 (1UL/4DL) @PCL8

GSM900 (2UL/3DL) @PCL8

GSM900 (4UL/1DL) @PCL8

DCS1800 (1UL/4DL) @PCL2

DCS1800 (2UL/3DL) @PCL2

DCS1800 (4UL/1DL) @PCL2

DCS1900 (1UL/4DL) @PCL2

DCS1900 (2UL/3DL) @PCL2

DCS1900 (4UL/1DL) @PCL2

FDD Band1 @0dBm

FDD Band2 @0dBm

FDD Band3 @0dBm

FDD Band4 @0dBm www.simcom.com

SIM8950X Hardware Design V1.08

533

178

315

500

461

616

196

344

251

446

577

253

326

330

428

413

600

558

620

580

350

520

510

550

570

294

/

296

/

420

137

235

399

268

381

157

248

145

245

365

165 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA

64 / 89

Peak current

FDD Band5 @0dBm

FDD Band7 @0dBm

FDD Band8 @0dBm

FDD Band12 @0dBm

FDD Band13 @0dBm

FDD Band17 @0dBm

FDD Band25 @0dBm

FDD Band26 @0dBm

TDD Band34 @0dBm

TDD Band38 @0dBm

TDD Band39 @0dBm

TDD Band40 @0dBm

TDD Band41 @0dBm

Max power

SIM8950X Hardware Design V1.08

/

/

/

/

314

231

/

234

/

209

231

297

210

3 mA mA mA mA mA mA mA mA mA mA mA mA mA

A

5.6 Electro-Static Discharge

Electrostatic discharge (ESD) occurs naturally in laboratory and factory environments. An established high-voltage potential is always at risk of discharging to a lower potential. If this discharge path is through a semiconductor device, it may result in destructive damage.

SIM8950x must be handled according to the ESD Association standard: ANSI/ESD S20.20-1999,

Protection of Electrical and Electronic Parts, Assemblies, and Equipment.

Table 27: ESD performance parameters （ Temperature: 25 ℃ , Humidity: 45% ）

Pin

VBAT

GND

Antenna

Contact discharge

±5KV

±6KV

±5KV

Air discharge

±10KV

±12KV

±10KV

5.7 Module Operating Frequencies

Table 28: Module operating frequencies

Frequency

GSM850

EGSM900

DCS1800

Receive

869-894MHz

925-960MHz

1805-1880MHz www.simcom.com

Transmit

824-849MHz

880-915MHz

1710-1785MHz

Physical channel

128-251

0-124, 975-1023

512-885

65 / 89

LTE B3

LTE B4

LTE B5

LTE B7

LTE B8

LTE B12

LTE B13

LTE B17

LTE B20

LTE B25

LTE B26

LTE B34

LTE B38

LTE B39

LTE B40

LTE B41

PCS1900

WCDMA B1

WCDMA B2

WCDMA B4

WCDMA B5

WCDMA B8

CDMA BC0

TDSCDMA 1.9G

TDSCDMA 2G

LTE B1

LTE B2 www.simcom.com

1930-1990MHz

2110-2170 MHz

1930-1990MHz

2110-2155MHz

869-894MHz

925-960MHz

869-894MHz

1880-1920 MHz

2010-2025 MHz

2110-2170 MHz

1930-1990MHz

1805-1880 MHz

2110-2155MHz

869-894 MHz

2620-2690MHz

925-960 MHz

729-746MHz

746-756MHz

734-746MHz

791-821MHz

1850-1915MHz

859-894MHz

2010-2025 MHz

2570-2620 MHz

1880-1920 MHz

2300-2400 MHz

2555-2655 MHz

1850-1910MHz

1920-1980 MHz

1850-1910MHz

1710-1755MHz

824-849MHz

880-915 MHz

824-849MHz

1880-1920MHz

2010-2025MHz

1920-1980 MHz

1850-1910MHz

1710-1785 MHz

1710-1755MHz

824-849MHz

2500-2570MHz

880-915 MHz

699-716MHz

777-787MHz

704-716MHz

832-862MHz

1930-1995MHz

814-849MHz

2010-2025 MHz

2570-2620 MHz

1880-1920 MHz

2300-2400 MHz

2555-2655MHz

SIM8950X Hardware Design V1.08

512-810

TX: 9612-9888

RX: 10562-10838

TX: 9262-9538

RX: 9662-9938

TX: 1312-1862

RX: 1537-2087

TX: 4132-4233

RX: 4357-4458

TX: 2712-2863

RX: 2937-3088

1-799 ;991-1023

9400-9600

10054-10121

TX: 18000-18599

RX: 0-599

TX: 18600-19199

RX: 600-1199

TX: 19200-19949

RX: 1200-1949

TX: 19950-20399

RX: 1950-2399

TX: 20400-20649

RX: 2400-2649

TX: 20750-21449

RX: 2750-3449

TX: 21450-21799

RX: 3450-3799

TX: 23010-23179

RX: 5010-5179

TX: 23180-23279

RX: 5180-5279

TX: 23730-23849

RX: 5730-5849

TX: 24150-24449

RX: 6150-6449

TX: 26040-26689

RX:8040-8689

TX: 26690-27039

RX: 8690-9039

36200-36349

37750-38249

38250-38649

38650-39649

40240-41240

66 / 89

SIM8950X Hardware Design V1.08

5.8 Module Output power

Frequency

GSM850

LTE-FDD B2

LTE-FDD B3

LTE-FDD B4

LTE-FDD B5

LTE-FDD B7

LTE-FDD B8

LTE-FDD B12

LTE-FDD B13

LTE-FDD B17

LTE-FDD B20

LTE-FDD B25

LTE-FDD B26

LTE-TDD B34

LTE-TDD B38

LTE-TDD B39

LTE-TDD B40

LTE-TDD B41

E-GSM900

DCS1800

PCS1900

GSM850(8-PSK)

E-GSM900 (8-PSK)

DCS1800 (8-PSK)

PCS1900(8-PSK)

WCDMA B1

WCDMA B2

WCDMA B4

WCDMA B5

WCDMA B8

CDMABC0

TDSCDMA B34

TDSCDMA B39

LTE-FDD B1 www.simcom.com

Table 29: Conducted transmission power

Power

33dBm ±2dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

23dBm +/-2.7dB

33dBm ±2dB

30dBm ±2dB

30dBm ±2dB

27dBm ±3dB

27dBm ±3dB

26dBm +3/-4dB

26dBm +3/-4dB

24dBm +1/-3dB

24dBm +1/-3dB

24dBm +1/-3dB

24dBm +1/-3dB

24dBm +1/-3dB

24dBm +1/-1dB

24dBm +1/-3dB

24dBm +1/-3dB

23dBm +/-2.7dB

Min.

5dBm ± 5dB

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

<-40dBm

5dBm ± 5dB

0dBm ± 5dB

0dBm ± 5dB

5dBm ± 5dB

5dBm ± 5dB

0dBm ±5dB

0dBm ±5dB

<-50dBm

<-50dBm

<-50dBm

<-50dBm

<-50dBm

<-50dBm

<-50dBm

<-50dBm

<-40dBm

67 / 89

SIM8950X Hardware Design V1.08

5.9 Module Receiving Sensitivity

Table 30: Conducted receiving sensitivity

Band

GSM850

EGSM900

DCS1800

PCS1900

WCDMA B1

WCDMA B2

WCDMA B4

WCDMA B5

WCDMA B8

CDMA BC0

TDSCDMA B34

TDSCDMA B39

LTE FDD/TDD

Receiving sensitivity

（

Typ

）

Receiving sensitivity

（

Max

）

< -108dBm

< -108dBm

< -108dBm

< -108dBm

<-109dBm

<-109dBm

<-109dBm

<-109dBm

<-109dBm

<-109dBm

<-110dBm

<-110dBm

See Table 31

3GPP standard

3GPP standard

3GPP standard

3GPP standard

3GPP standard

3GPP standard

3GPP standard

3GPP standard

3GPP standard

3GPP standard

3GPP standard

3GPP standard

3GPP standard

Table 31: Reference sensitivity QPSK PREFSENS (LTE)

E-UTRA

Band number

1

8

9

6

7

10

11

4

5

2

3

12

13

14

17

1.4 MHz

-

-102.7

-101.7

-104.7

-103.2

-

-

-102.2

-

-

-

-101.7

-

3 MHz

-

-99.7

-98.7

-101.7

-100.2

-

-

-99.2

-

-

-

-98.7

-

-

5 MHz 10 MHz 15 MHz 20 MHz

-94

-94

-94

-94

-94

-96

-97

-97

-97

-95

-94

-97

-95

-97

-95

-97

-97

-97

-97

-97

-99

-100

-100

-100

-98

-97

-100

-98

-100

-98

-95.2

-93.2

-92.2

-95.2

-93.2

-94.2

-95.2

-94

-92

-91

-94

-92

-93

-94

Duplex mode

FDD

FDD

FDD

FDD

FDD

FDD

FDD

FDD

FDD

FDD

FDD

FDD

FDD

FDD

FDD www.simcom.com

68 / 89

36

37

38

39

26

33

34

35

40

41

42

43

22

23

24

25

18

19

20

21

-

-

-

-

-104.7

-101.2

-102.7

-

-

-106.2

-

-

-

-

-106.2

-

-

-

-101.7

-98.2

-99.7

-

-

-102.2

-

-

-

-

-102.2

-

-

-

-97.5

-100

-100

-100

-100

-100

-100

-100

-100

-100

-97

-100

-97

-100

-100

-96.5

-100

-99

-99

-99

-97

-96

-96

-96

-97

-97

-97

-97

-94.5

-97

-97

-97

-97

-97

-94

-97

-94

-97

-97

-93.5

-95.2

-95.2

-91.2

-95.2

-92.2

-95.2

-95.2

-95.2

-95.2

-95.2

-94.2

-94.2

-94.2

-91.7

-92.7

-95.2

-95.2

-95.2

SIM8950X Hardware Design V1.08

-

-

-90

-91

-90.5

-94

-

-94

-94

-94

-94

-94

-94

-93

-93

-93

FDD

TDD

TDD

TDD

TDD

TDD

TDD

TDD

FDD

FDD

FDD

FDD

FDD

FDD

FDD

FDD

TDD

TDD

TDD

TDD

5.10 WIFI main RF Characteristics

Table 32: 2.4G WIFI main RF Characteristics

Transmission performance

Output power

EVM

Receiving performance

802.11B

11M ） 802.11G

（ 54M ） 802.11N (MCS7)

17dBm±1dB

<35%

13dBm±1dB

<-25dB

12dBm±1dB

<-27dB

Receiving sensitivity

802.11B

11M ） 802.11G

（ 54M ） 802.11N (MCS7)

<-88 <-73 <-71 dBm www.simcom.com

69 / 89

SIM8950X Hardware Design V1.08

Table 33: 5G WIFI main RF Characteristics

Transmission performance

Output power

EVM

Receiving performance

802.11A

（ 54M ） 802.11N (MCS7) 802.11AC (MCS9)

17dBm±1dB 16dBm±1dB 14dBm±1dB

<-25 <-27 <-30

Receiving sensitivity dB

802.11A

（ 54M ） 802.11N (MCS7) 802.11AC (MCS9)

<-71 <-70 <-64 dBm

5.11 BT Main RF Characteristics

Table 34: BT Main RF Characteristics

Transmission performance

Output power

Receiving performance

Receiving sensitivity

DH5 2DH5 3DH5

9dBm±1dB 7dBm±1dB 7dBm±1dB

DH5

<-90

2DH5

<-80

3DH5

<-80 dBm

5.12 GNSS Main RF Characteristics

Table 35: GNSS Main RF Characteristics

Receiver type

CN0

Accuracy (Open Sky)

Sensitivity

TTFF(Open Sky)

GPS,GLONASS,BEIDOU

Tracking & Navigation

Reacquisition

40dB/Hz@-130dBm

2.5m (CEP50)

Cold start

Cold start

Warm start

Hot start

-159dBm

-156dBm

-148dBm

<35s

<15s

<5s www.simcom.com

70 / 89

6. Manufacturing

6.1 Top and Bottom View of SIM8950x

SIM8950X Hardware Design V1.08

www.simcom.com

Figure 36: Top and bottom view of SIM8950x

71 / 89

6.2 Physical Dimensions

SIM8950X Hardware Design V1.08

www.simcom.com

Figure 37: Outline drawing (unit: mm)

72 / 89

6.3 Recommended PCB footprint

SIM8950X Hardware Design V1.08

www.simcom.com

Figure 38: Recommended PCB footprint

73 / 89

SIM8950X Hardware Design V1.08

6.4 Recommended SMT Stencil

Stencil thickness requirement ：

 The stencil thickness of outer circle’ s pin need 0.18mm

 The stencil thickness of inner pin need reduce, recommend 0.15mm.

Recommended SMT stencil ：

1, Outer pin (units ： mm) ：

Figure

39

:

Outer PIN recommended stencil

2, Inner function pin (units ： mm) ： www.simcom.com

Figure 40: Inner function PIN recommended stencil

74 / 89

SIM8950X Hardware Design V1.08

3, Inner GND pin (units ： mm) ：

Figure 41: Inner GND PIN recommended stencil

NOTE

The SMT stencil of Inner PIN need cross design.

www.simcom.com

75 / 89

6.5 Typical SMT Reflow Profile

SIM8950X Hardware Design V1.08

Figure 42: Typical SMT reflow profile

NOTE

Refer to “Module secondary-SMT-UGD” for more information about the module shipping and manufacturing.

6.6 Moisture Sensitivity Level (MSL)

SIM8950x is susceptible to damage induced by absorbed moisture and high temperature. A package’s moisture-sensitivity level (MSL) indicates its ability to withstand exposure after it is removed from its shipment bag, while it is on the factory floor awaiting PCB installation. A low MSL rating is better than a high rating; a low MSL device can be exposed on the factory floor longer than a high MSL device. All pertinent

MSL ratings are summarized in Table 36.

Table 36: MSL ratings summary

MSL

1

Out-of-bag floor life

Unlimited www.simcom.com

Comments

≤+30 ℃ /85% RH

76 / 89

SIM8950X Hardware Design V1.08

3

4

2

2a

5

5a

6

1 year

4 weeks

168 hours

72 hours

48 hours

24 hours

Mandatory bake before use. After bake, it must be reflowed within the time limit specified on the label.

≤+30 ℃ /60% RH

≤+30 ℃ /60% RH

≤+30 ℃ /60% RH

≤+30 ℃ /60% RH; SIM8950x rating

≤+30 ℃ /60% RH

≤+30 ℃ /60% RH

≤+30 ℃ /60% RH

The MSM8909 device samples are currently classified as MSL4 at 255 (+5, -0)°C, following the latest

IPC/JEDEC J-STD-020 standard revision for moisture-sensitivity qualification This qualification temperature

(255°C) should not be confused with the peak temperature within the recommended solder reflow profile.

6.7 Baking Requirements

It is necessary to bake modules if the prescribed time limit has been exceeded. The baking conditions are specified in Table 37. Note that if baking is required, the devices must be transferred into trays that can be baked to at least 125°C.

Table 37: Baking requirements

Baking conditions options

40°C±5°C, <5% RH

120°C±5°C, <5% RH

Duration

192 hours

4 hours www.simcom.com

77 / 89

SIM8950X Hardware Design V1.08

7. Packaging

SIM8950x module supports tray packaging. The packaging process is shown in the following figures.

Module tray drawing ：

Figure 43: Packaging process

www.simcom.com

Figure 44: Module tray drawing

78 / 89

SIM8950X Hardware Design V1.08

Table 38: Module tray information

Length （ ±3mm ）

242.0

Width （ ±3mm ）

161.0

Small carton drawing ：

Units per tray

8

Figure 45: Small carton drawing

Table 39: Small carton information

Length （ ±10mm ）

270

Width

180

（ ±10mm ） Height

120

（ ±10mm ）

Big carton drawing ：

Units per carton

8*19-2=150 www.simcom.com

Figure 46: Big carton drawing

79 / 89

SIM8950X Hardware Design V1.08

Table 40: Big carton information

Length （ ±10mm ）

380

Width （ ±10mm ）

280

Height （ ±10mm ）

280

Units per carton

150*4=600 www.simcom.com

80 / 89

SIM8950X Hardware Design V1.08

8. Recommend Peripheral Component list

Table 41:

Recommended

Camera Sensor List

Primary camera/

Secondary camera

Primary camera

Resolution Sensor Part Nmuber

2M

5M

8M

12M

13M

16M

20M

OV2680

OV5675

OV5695

S5K5E8

OV8856

OV8858

OV8865

S5K4H8

OV12890

S5K2L7

IMX362

AR1337

OV13853(PDAF)

OV13855

OV13870

MN34153

S5K2M8

S5K3M2XM(PDAF)

IMX258(PDAF)

OV16860

OV16880

S5K2P7

S5K3P3

S5K3P8

IMX298 (PDAF)

IMX230

Sensor Vendor

Panasonic

SAMSUNG

SAMSUNG

SONY

OmniVision

OmniVision

SAMSUNG

SAMSUNG

SAMSUNG

SONY

SONY

OmniVision

OmniVision

OmniVision

SAMSUNG

OmniVision

OmniVision

OmniVision

SAMSUNG

OmniVision

SAMSUNG

SONY

ON Semiconductor

OmniVision

OmniVision

OmniVision www.simcom.com

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SIM8950X Hardware Design V1.08

Table 42: Recommended LCD Driver IC List

LCD Driver IC

OTM1902A

OTM1906C

HX8399-C

ILI7807E

ILI9885

NT35532

NT35596

NT35695

R63417

Vendor

FocalTech

FocalTech

Himax

Ilitek

Ilitek

Novatek

Novatek

Novatek

SYNAPTICS

Resolution

FHD

FHD

FHD

FHD

FHD

FHD

FHD

FHD

FHD

No.

12

13

14

15

8

9

10

11

6

7

4

5

1

2

3

20

21

22

16

17

18

19 www.simcom.com

Part Number

BMA222E

BMA250E

BMA253

BMA255

BMA421

BMA422

BMA424

BMG160

BMI120

BMI160

BMI260

ICM-20600

ICM-20602

ICM-20607

ICM-20608-D

ICM-20608-G

ICM-20609

ICM-20621

ICM-20622

ICM-20690

ICM-40602

ICM-40604

Table 43: Recommended Accelerometer & Gyroscope List

Vendor

Bosch

Bosch

Bosch

Bosch

Bosch

Bosch

Bosch

Bosch

Bosch

Bosch

Bosch

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

Accelerometer Gyroscope

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

82 / 89

ICM-40605

ICM-42602

ICM-42605

ICM-42605-M

ICM-42608

MPU-6500

MPU-6881

KX022-1020

KX023-1025

KX122-1037

KXTJ2-1009

KXTJ2-1029

KXTJ3

MC3413-P

MC3416-P

MXC4005XC

STK8BA53

LIS2DH12TR

LIS2DS12TR

LIS2HH12

LIS3DH

LIS3DHTR

LSM6DS3TR

LSM6DS3TR-C

LSM6DSLTR

LSM6DSMTR

42

43

44

45

38

39

40

41

46

47

48

34

35

36

37

30

31

32

33

23

24

25

26

27

28

29

Table 44: Recommended E-Compass List

No.

3

4

5

1

2

8

9

6

7

10

Part Number

AK09911C

AK09915C

AK09915D

AK09916C

AK09918C

HSCDTD008A

BMM150

GMC306

IST8305

IST8306 www.simcom.com

ST

ST

ST

ST

ST

ST

ST

MEMSIC

Sensortek

ST

ST

Kionix

Kionix

Kionix

Kionix

Kionix

Kionix mCube mCube

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

InvenSense

Vendor

AKM

AKM

AKM

AKM

AKM

Alps

Bosch

Globalmems iSentek iSentek

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

SIM8950X Hardware Design V1.08

√

√

√

√

√

√

√

√

√

√

√

83 / 89

22

23

24

25

18

19

20

21

11

12

13

14

15

16

17

IST8307

IST8310

MXG4300

MMC3530

MMC3630

MMC3630KJ

MMC5603NJ

STM350MC

STM480MW

LIS2MDL

AF6133

AF6133E

AF8133J

AF9133

YAS539 iSentek iSentek

MagnaChip

MEMSIC

MEMSIC

MEMSIC

MEMSIC

Senodia

Senodia

ST

Voltafield

Voltafield

Voltafield

Voltafield

Yamaha

SIM8950X Hardware Design V1.08

Table 45: Recommended Proximity & Ambient Light List

No.

13

14

15

9

10

11

12

5

6

7

8

3

4

1

2

Part Number

TMD26203

CM36686

AP3426

EPL2590KTWJP

MN66213

LTR-578ALS

BH1745NUC

RPR-0521RS

RPR-0531

RPR-0531RS

STK3321

PA12200001

PA22401001

PA22A00001

TMD26203

Vendor

ams

Capella

Dyna Image

Elan

Elan

Lite-On

ROHM

ROHM

ROHM

ROHM

Sensortek

TXC

TXC

TXC ams

√

√

√

√

√

√

√

√

Proximity

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

Ambient

Light

√ www.simcom.com

84 / 89

SIM8950X Hardware Design V1.08

9. Appendix a) Related Documents

Table 46: Related Documents

No. Document name

[1]

[2]

GSM 07.07

：

GSM 07.10

：

[3] GSM 07.05

：

[4] GSM 11.14

：

[5] GSM 11.11

：

[6] GSM 03.38

：

[7] GSM 11.10

[8] 3GPP TS 51.010-1

[9] 3GPP TS 34.124

[10] 3GPP TS 34.121

[11] 3GPP TS 34.123-1

[12] 3GPP TS 34.123-3

[13] EN 301 908-02 V2.2.1

www.simcom.com

Remark

Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME)

Support GSM 07.10 multiplexing protocol

Digital cellular telecommunications (Phase 2+); Use of Data

Terminal Equipment – Data Circuit terminating Equipment (DTE –

DCE) interface for Short Message Service (SMS) and Cell

Broadcast Service (CBS)

Digital cellular telecommunications system (Phase 2+);

Specification of the SIM Application Toolkit for the Subscriber

Identity Module – Mobile Equipment (SIM – ME) interface

Digital cellular telecommunications system (Phase 2+);

Specification of the Subscriber Identity Module – Mobile Equipment

(SIM – ME) interface

Digital cellular telecommunications system (Phase 2+); Alphabets and language-specific information

Digital cellular telecommunications system (Phase 2); Mobile

Station (MS) conformance specification; Part 1: Conformance specification

Digital cellular telecommunications system (Release 5); Mobile

Station (MS) conformance specification

Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment.

Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment.

Technical Specification Group Radio Access Network; Terminal conformance specification; Radio transmission and reception

(FDD)

User Equipment (UE) conformance specification; Part 3: Abstract

Test Suites.

Electromagnetic compatibility and Radio spectrum Matters (ERM);

Base Stations (BS) and User Equipment (UE) for IMT-2000. Third

Generation cellular networks; Part 2: Harmonized EN for IMT-2000,

CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive

85 / 89

SIM8950X Hardware Design V1.08

[14] EN 301 489-24 V1.2.1

[15]

[16]

[17]

IEC/EN60950-1(2001)

GCF-CC V3.23.1

2002/95/EC

Electromagnetic compatibility and Radio Spectrum Matters (ERM);

Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA

Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment

Safety of information technology equipment (2000)

Global Certification Forum - Certification Criteria

Directive of the European Parliament and of the Council of 27

January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)

b) Terms and abbreviations

Table 47: Terms and abbreviations

Abbreviation

DAC

DDR

DSDA

DSDS

DSP

DTE

DTR

DTX

ADC

AMR

BOM bps

BT

CDMA

CS

CSD

CSI

CTS

EFR

EGSM

ESD

ESR

ETS

EVDO

Description

Analog-to-Digital Converter

Adaptive Multi-Rate

Bill of materials

Bits per second

Bluetooth

Code division multiple access

Coding Scheme

Circuit Switched Data

Camera serial interface

Clear to Send

Digital-to-analog converter

Double data rate

Dual SIM dual active

Dual SIM dual standby

Digital signal processor

Data Terminal Equipment (typically computer, terminal, printer)

Data Terminal Ready

Discontinuous Transmission

Enhanced Full Rate

Enhanced GSM

Electrostatic Discharge

Effective series resistance

European Telecommunication Standard

Evolution data optimized www.simcom.com

86 / 89

PDU

RF

PM

RoHS

PPP

PWM

RMS

RTC

LPDDR

MIC

MIPI

PA

PBCCH

PCB

PCL

PCS

RX

SD

SDC

SIM

SMS

SMT

SPI

TDD

TE

TX

HR

HSPA

I2C

IMEI

ISP

Kbps

LCD

LDO

FDD

FR

GNSS

GPIO

GPRS

GPU

GSM www.simcom.com

SIM8950X Hardware Design V1.08

Frequency division duplex

Full Rate

Global navigation satellite system

General-purpose input/output

General Packet Radio Service

Graphics processing unit

Global Standard for Mobile Communications

Half Rate

High-speed packet access

Inter-integrated circuit

International Mobile Equipment Identity

Image signal processing kilobits per second

Liquid crystal display

Low dropout (linear regulator)

Low-power DDR

Microphone

Mobile industry processor interface

Power amplifier

Packet Broadcast Control Channel

Printed Circuit Board

Power Control Level

Personal Communication System, also referred to as GSM 1900

Protocol Data Unit

Radio Frequency

Power management

Restriction of hazardous substances

Point-to-point protocol

Pulse-width modulator

Root Mean Square (value)

Real-time clock

Receive Direction

Secure digital

Secure digital controller

Subscriber Identification Module

Short Message Service

Surface mount technology

Serial peripheral interface

Time Division Distortion

Terminal Equipment, also referred to as DTE

Transmit Direction

87 / 89

SIM8950X Hardware Design V1.08

UART

UIM

URC

USB

USSD

WCDMA

WCN

WLAN

Universal Asynchronous Receiver & Transmitter

User identity module

Unsolicited Result Code

Universal serial bus

Unstructured Supplementary Service Data

Wideband code division multiple access

Wireless connectivity network

Wireless local area network

Pay attention to the following safety precautions when using or maintaining any terminal or mobile phone that contains the module. Inform the users of the following security information on the terminal device.

Otherwise SIMCom will not bear any consequences resulting from the users’ not operating according to these warnings.

www.simcom.com

88 / 89

SIM8950X Hardware Design V1.08

c) Safety Caution

Pay attention to the following safety precautions when using or maintaining any terminal or mobile phone that contains the module. Inform the users of the following security information on the terminal device.

Otherwise SIMCom will not bear any consequences resulting from the users’ not operating according to these warnings.

Table 48: Safety Caution

Marks Requirements

When in a hospital or other health care facility, observe the restrictions about the use of mobiles. Switch the cellular terminal or mobile off, medical equipment may not operate normally because of RF energy interference.

Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Ignoring of these instructions may lead to flight accident or offend against local legal, or both.

Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard.

The cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment.

Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for hands free operation. Before making a call with a hand-held terminal or mobile, park the vehicle.

GSM cellular terminals or mobiles operate over radio frequency signals and cellular networks and cannot be guaranteed to connect in all conditions, for example, no mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember using emergency calls. In order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing, etc.). You may have to deactivate those features before you can make an emergency call. Also, some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile.

www.simcom.com

89 / 89