STMicroelectronics STEVAL-IPM05F User Manual
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UM1971 User manual 500 W motor control power board based on STGIF5CH60TS-L SLLIMM™ 2nd series IPM Introduction The STEVAL-IPM05F is a compact motor drive power board based on SLLIMM™ (small low-loss intelligent molded module) 2nd series (STGIF5CH60TS-L). It provides an affordable and easy-to-use solution for driving high power motors for a wide range of applications such as power white goods, air conditioning, compressors, power fans, high-end power tools and 3-phase inverters for motor drives in general. The IPM itself consists of short-circuit rugged IGBTs and a wide range of features like undervoltage lockout, smart shutdown, embedded temperature sensor and NTC, and overcurrent protection. The main characteristics of this evaluation board are small size, minimal BOM and high efficiency. It consists of an interface circuit (BUS and VCC connectors), bootstrap capacitors, snubber capacitor, hardware short-circuit protection, fault event and temperature monitoring. In order to increase the flexibility, it is designed to work in single- or three-shunt configuration and with double current sensing options such as using three dedicated onboard op-amps, or op-amps embedded in the MCU. The Hall/ Encoder part completes the circuit. Thanks to these advanced characteristics, the system has been specifically designed to achieve fast and accurate current feedback conditioning, satisfying the typical requirements for field-oriented control (FOC). The STEVAL-IPM05F is compatible with ST's STM32-based control board, enabling designers to build a complete platform for motor control. Figure 1. SLLIMM 2nd series motor control internal demo board (top view) UM1971 - Rev 4 - September 2019 For further information contact your local STMicroelectronics sales office. www.st.com UM1971 Key features 1 Key features • • • • • • • • • • • Input voltage: 125 - 400 VDC Nominal power: up to 700 W Nominal current: up to 3.0 A Input auxiliary voltage: up to 20 V DC Motor control connector (32 pins) interfacing with ST MCU boards Single- or three-shunt resistors for current sensing (with sensing network) Two options for current sensing: dedicated op-amps or through MCU Overcurrent hardware protection IPM temperature monitoring and protection Hall sensors (3.3 / 5 V)/encoder inputs (3.3 / 5 V) IGBT intelligent power module: • • – SLLIMM™ 2nd series IPM (STGIF5CH60TS-L - Full molded package) Universal conception for further evaluation with bread board and testing pins Very compact size Figure 2. SLLIMM 2nd series motor control internal demo board: (bottom view) UM1971 - Rev 4 page 2/35 UM1971 Circuit schematic 2 Circuit schematics The following figures show the schematics for the SLLIMM™ 2nd series card for STGIF5CH60TS-L IPM products. This card consists of an interface circuit (BUS and VCC connectors), bootstrap capacitors, snubber capacitor, short circuit protection, fault output circuit, temperature monitoring, single-/three-shunt resistors and filters for input signals. It also includes bypass capacitors for VCC and bootstrap capacitors. The capacitors are located very close to the drive IC, which is very helpful in preventing malfunction due to noise. Two current sensing options are provided: using three dedicated onboard op-amps or using op-amps embedded on the MCU; selection is managed via three jumpers. The Hall/Encoder part (powered at 5 V or 3.3 V) completes the circuit. 2.1 Schematic diagrams Figure 3. STEVAL-IPM05F circuit schematic (1 of 6) STEVAL-IPMnmx decoder N M X UM1971 - Rev 4 RC1 RC2 RC3 RC4 0 0 0 0 RC5 RC6 RC7 RC8 0 0 0 0 RC9 RC10 0 0 page 3/35 UM1971 Schematic diagrams Figure 4. STEVAL-IPM05F circuit schematic (2 of 6) E1 Current_A_amp EM_STOP PWM-A-H PWM-A-L PWM-B-H PWM-B-L PWM-C-H PWM-C-L 3 E2 NTC_bypass_relay SW2 +5V Current_B 2 1 PWM_Vref M_phase_A J2 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 TSO Bus_voltage 2 SW3 3.3V E3 M_phase_B 3 Current_B_amp 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 1 Current_A 1 2 3 3 Control Connector SW1 M_phase_C SW4 Current_C 1 2 NTC Current_C_amp J3 3 2 1 phase_C phase_B phase_A Motor Output UM1971 - Rev 4 page 4/35 UM1971 Schematic diagrams Figure 5. STEVAL-IPM05F circuit schematic (3 of 6) Input DC_bus_voltage +Bus R1 470K 3.3V INPUT-dc 2 1 C1 D1 BAT48JFILM R2 470K + J1 Bus_voltage R3 120R R4 7k5 C2 10n 3.3V 4 R5 1k0 12 + 14 47µ/35V UM1971 - Rev 4 R6 1k0 11 13 + C3 U1D TSV994 1.65V + C4 47µ/35V page 5/35 E3 E1 1.65V R42 R40 R32 R30 1.65V 1k0 C30 100p 1k0 C28 10n 1k0 C24 100p 1k0 C22 10n - 2 - 6 R43 2k1 + 5 R38 2k1 R33 2k1 + 3 R29 2k1 4 11 4 11 U1B TSV994 7 100n C23 3.3V TSV994 1 U1A 4.7u 50V + UM1971 - Rev 4 1k R41 1k R31 C31 330p TP26 C25 330p TP24 3.3V E2 Current_C_amp R37 R35 1.65V Current_A_amp 1k0 C27 100p 1k0 C26 10n R39 2k1 9 - 10 + R34 2k1 4 11 C21 TSV994 8 U1C 3.3V 1k R36 C29 330p TP25 Current_B_amp Schematic diagrams UM1971 Figure 6. STEVAL-IPM05F circuit schematic (4 of 6) page 6/35 UM1971 - Rev 4 R12 5k6 3.3V TP23 LINu 9 10 TP12 TP20 GNDa 8 + C12 4.7u 50V TP22 TP21 PWM-C-H PWM-C-L Phase C - input EM_STOP R22 3k3 R17 3k9 R16 3k3 R20 1k0 R19 1k0 R15 1k0 C20 330p R28 10k C17 10p C14 10p C18 10p R53 4.7k SD C19 1n 3.3V BAT48JFILM D6 TSO TP17 R23 C16 1nF 1k0 GNDb TSO 16 CIN 15 17 SD 14 VCCL TP14 HINw VCCH 7 HINv BAT48JFILM D5 BAT48JFILM D4 NW NV NU W V U 1k0 R21 1k0 R18 1k0 R24 STGIF5CH60TS-L P T2 T1 IPM module BAT48JFILM D3 HINu 5 6 VBOOTw 4 VBOOTv VBOOTu 2 3 13 TP15 C13 100n TP8 TP5 NC 1 U2 PWM-B-H TP7 TP6 TP4 2.2u C7 LINw C15 10p C11 10p TP3 2.2u LINv TP11 C10 10p TP2 C6 2.2u C5 12 R14 1k0 R9 1k0 R8 1k0 11 R13 3k9 R11 3k3 R7 3k9 PWM-B-L Phase B - input J4 2 1 15V D2 LED Red PWM-A-H PWM-A-L Phase A - input 18 19 20 21 22 23 24 25 26 TP1 R25 0.1 TP19 TP18 TP16 TP13 TP10 TP9 NTC C8 100n 3.3V SW7 12k R10 1_SHUNT SW5 R26 0.1 R27 0.1 1_SHUNT SW6 C9 0,1 uF - 400V SW8 phase_C phase_B phase_A +Bus E1 E2 E3 Schematic diagrams UM1971 Figure 7. STEVAL-IPM05F circuit schematic (5 of 6) 3_SHUNT 3_SHUNT page 7/35 3.3V +5V 3.3V J5 1 2 3 4 5 1 2 3 4 5 2 SW9 2 SW16 Encoder/Hall H1/A+ H2/B+ H3/Z+ + 3.3/5V GND C33 100n 3 1 3 UM1971 - Rev 4 1 +5V C32 100n C34 100n R49 SW12 R48 SW11 R47 SW10 2k4 2k4 2k4 C35 10p R44 4k7 Hall/Encoder C36 10p R45 4k7 C37 10p R46 4k7 R50 4k7 SW13 R51 4k7 SW14 R52 4k7 SW15 M_phase_C M_phase_B M_phase_A Schematic diagrams UM1971 Figure 8. STEVAL-IPM05F circuit schematic (6 of 6) page 8/35 UM1971 Main characteristics 3 Main characteristics The board is designed to be compatible with DC supply from 125 VDC up to 400 VDC voltage. A bulk capacitor according to the power level of the application must be mounted. The footprint is already provided on the board. The SLLIMM integrates six IGBT switches with freewheeling diodes together with high voltage gate drivers. Thanks to this integrated module, the system is specifically designed to achieve power inversion in a reliable and compact design. Such integration reduces the required PCB area and the simplicity of the design increases reliability. In order to increase the flexibility, it can operate in single- or three-shunt configuration by modifying solder bridge jumper settings (see Section 4.3.5 Single- or three-shunt selection). Figure 9. STEVAL-IPM05F architecture UM1971 - Rev 4 page 9/35 UM1971 Filters and key parameters 4 Filters and key parameters 4.1 Input signals The input signals (LINx and HINx), able to drive the internal IGBTs, are active high. A 100 kΩ (typ.) pull-down resistor is built-in for each input signal. In order to prevent input signal oscillation, an RC filter was added on each input and placed as close as possible to the IPM. The filter is designed using a time constant of 10 ns (1 kΩ and 10 pF). 4.2 Bootstrap capacitor In the 3-phase inverter, the emitters of the low side IGBTs are connected to the negative DC bus (VDC-) as common reference ground, which allows all low side gate drivers to share the same power supply, while the emitter of high side IGBTs is alternately connected to the positive (VDC+) and negative (VDC-) DC bus during running conditions. A bootstrap method is a simple and cheap solution to supply the high voltage section. This function is normally accomplished by a high voltage fast recovery diode. The SLLIMM 2nd series family includes a patented integrated structure that replaces the external diode. It is realized with a high voltage DMOS functioning as diode with series resistor. An internal charge pump provides the DMOS driving voltage. The value of the CBOOT capacitor should be calculated according to the application condition. Figure 10. CBOOT graph selection shows the behavior of CBOOT (calculated) versus switching frequency (fsw), with different values of ∆VCBOOT for a continuous sinusoidal modulation and a duty cycle δ = 50%. The boot capacitor must be two or three times larger than the CBOOT calculated in the graph. For this design, a value of 2.2 µF was selected. Note: This curve is taken from application note AN4768 (available on www.st.com); calculations are based on the STGIB15CH60 device, which represents the worst case scenario for this kind of calculation. Figure 10. CBOOT graph selection UM1971 - Rev 4 page 10/35 UM1971 Overcurrent protection 4.3 Overcurrent protection The SLLIMM 2nd series integrates a comparator for fault sensing purposes. The comparator has an internal voltage reference VREF (510 mV typ.) connected to the inverting input, while the non-inverting input available on the CIN pin can be connected to an external shunt resistor to implement the overcurrent protection function. When the comparator triggers, the device enters the shutdown state. The comparator output is connected to the SD pin in order to send the fault message to the MCU. 4.3.1 SD Pin The SD is an input/output pin (open drain type if used as output). Taking into account the voltage reference on SD (3.3 V), a pull up resistor of 10 kΩ (R28) is used to guarantee the right bias and consequently to keep the current on the open drain DMOS (Iod) lower than 3 mA. The filter on SD (R28 and C20) has to be sized to obtain the desired re-starting time after a fault event and placed as close as possible to the SD pin. A shutdown event can be managed by the MCU, in this case the SD functions as the input pin. Conversely, the SD functions as an output pin when an overcurrent or undervoltage condition is detected. 4.3.2 Fault management The SLLIMM 2nd series integrates a specific kind of fault management, useful when SD is functioning as output, able to identify the type of fault event. As previously described, as soon as a fault occurs, the open-drain (DMOS) is activated and LVGx outputs are forced low. Two types of fault can be signaled: • Overcurrent (OC) sensed by the internal comparator (CIN); • Undervoltage (UVLO) on supply voltage (VCC). Each fault enables the SD open drain for a different time (see the table below). The duration of a shutdown event therefore tells us the type of failure that has occurred. Table 1. Fault timing Symbol OC UVLO Parameter Over current event Undervoltage lockout event Event time SD open-drain enable time result ≤ 24 µs 24 µs > 24 µs OC time ≤ 70 µs 70 µs > 70 µs until VCC_LS exceeds the VCC_LS UVLO time UV turn on threshold 1. typical value (TJ = -40 °C to 125 °C) 2. without contribution of RC network on SD Figure 11. SD failure due to overcurrent shows a shutdown as the result of an overcurrent event. During the overcurrent, the voltage on the comparator (CIN) exceeds the threshold (0.51 V typ.) and the shutdown is able to stop the application. In this case, the SD event time is about 24 µs (for OC event less than 24 µs). UM1971 - Rev 4 page 11/35 UM1971 Overcurrent protection Figure 11. SD failure due to overcurrent Figure 12. SD failure due to undervoltage (UVLO below 70 µs) shows the shutdown event as the result of an undervoltage condition on the VCC supply. If VCC drops below the undervoltage threshold, the shutdown can stop the application. If the voltage on VCC rises above the VCC on threshold in less than 70 µs, the SD event time is about 70 µs. UM1971 - Rev 4 page 12/35 UM1971 Overcurrent protection Figure 12. SD failure due to undervoltage (UVLO below 70 µs) Figure 13. SD failure due to undervoltage (UVLO above 70 µs) shows the shutdown event as the result of an undervoltage condition on the VCC supply. In this case, the drop on VCC is greater than 70 µs. The SD event time is the same as the duration of drop. Figure 13. SD failure due to undervoltage (UVLO above 70 µs) UM1971 - Rev 4 page 13/35 UM1971 Overcurrent protection 4.3.3 Shunt resistor selection The value of the shunt resistor is calculated by the following equation: Vref RSH = IOC (1) Where Vref is the internal comparator (CIN) (0.51 V typ.) and IOC is the overcurrent threshold detection level. The maximum OC protection level should be set to less than the pulsed collector current in the datasheet. In this design, the overcurrent threshold level is fixed at IOC = 6.5 A in order to select a commercial shunt resistor value. RSH = Vref ⋅ R23 + R53 1000 + 4700 + VF 0.51 ⋅ + 0.18 R53 4700 = 0.123Ω = IOC 6.5 (2) Where VF is the voltage drop across diodes D6, D7 and D8. For the power rating of the shunt resistor, the following parameters must be considered: • Maximum load current of inverter (85% of Inom [Arms]): Iload(max) • • Shunt resistor value at TC = 25 °C Power derating ratio of shunt resistor at TSH =100 °C • Safety margin The power rating is calculated by the following equation: 2 1 Iload max ⋅ RSH ⋅ margin PSH = ⋅ 2 Derating gratio (3) The commercial value chosen was RSH = 0.1 Ω, which corresponds to an overcurrent level of 8 A. The power rating is: • • • Inom = 5A Inom rms Inom rms = = 3 Arms Inom 2 Iload max = 85 % (4) Power derating ratio of shunt resistor at TSH = 100 °C: 80% (from datasheetmanufacturer) Safety margin: 30% 1 3² ⋅ 0.1 ⋅ 1.3 = 0.73 W PSH = ⋅ 2 0.8 (5) Considering the commercial value, a 1 W shunt resistor was selected. Based on the previous equations and conditions, the minimum shunt resistance and power rating is summarized below. Table 2. Shunt selection Inom(peak) [A] Device STGIF5CH60TS-L 4.3.4 5 OCP(peak) [A] 8 Iload(max) [Arms] 3 RSHUNT [Ω] 0.1 Minimum shunt power rating PSH [W] 0.73 RC filter An RC filter network is required to prevent undesired short circuit operation due to the noise on the shunt resistor. In this design, the RC filter, composed of R23, R18, R21, R24 and C19, has a constant time of about 1.3 µs. Adding the turn-off propagation delay of the gate driver and the IGBT turn-off time (hundreds of nanoseconds in total), the total delay time is less than 5 µs of short circuit withstand IGBT time. 4.3.5 Single- or three-shunt selection Single- or three-shunt resistor circuits can be adopted by setting the solder bridges SW5, SW6, SW7 and SW8. The figures below illustrate how to set up the two configurations. UM1971 - Rev 4 page 14/35 UM1971 Overcurrent protection Figure 14. One-shunt configuration Figure 15. Three-shunt configuration UM1971 - Rev 4 page 15/35 UM1971 Current sensing amplifying network 5 Current sensing amplifying network The STEVAL-IPM05F motor control evaluation board can be configured to run in three-shunt or single-shunt configurations for field oriented control (FOC). The current can be sensed thanks to the shunt resistor and amplified by using the on board operational amplifiers or by the MCU (if equipped with op-amp). Once the shunt configuration is chosen by setting solder bridge on SW5, SW6, SW7 and SW8 (as described in Section 4.3.5 Single- or three-shunt selection), the user can choose to send the voltage shunt to the MCU amplified or not amplified. Single-shunt configuration requires a single op amp and three-shunt configuration requires three op amps; therefore, in single-shunt configuration, the only voltage which is sent to the MCU to control the sensing is connected to phase V through SW2. SW1, SW2, SW4 can select which signals are sent to micro, as described below: Table 3. Op-amp sensing configuration Symbol SW1 SW2 SW4 Configuration Bridge Sensing Single 1-2 open Shunt 2-3 open Three 1-2 On-board op-amp Shunt 2-3 MCU op-amp Single 1-2 On board op-amp Shunt 2-3 MCU op-amp Three 1-2 On-board op-amp Shunt 2-3 MCU op-amp Single 1-2 open Shunt 2-3 open Three 1-2 On-board op-amp Shunt 2-3 MCU op-amp The operational amplifier TSV994 used on amplifying networks has a 20 MHz gain bandwidth and operates with a single positive supply of 3.3 V. The amplification network must allow bidirectional current sensing, so that an output offset VO = +1.65 V represents zero current. Referencing the STGIF5CH60TS-L (IOCP = 8 A; RSHUNT = 0.1 Ω), the maximum measurable phase current, considering that the output swings from +1.65 V to +3.3 V (MCU supply voltage) for positive currents and from +1.65 V to 0 for negative currents is: Equation 5 ∆V =8A rm ∆V 1.65 rm = = = 0.206 Ω MaxMeasCurrent 8 MaxMeasCurrent = (6) (7) The overall trans-resistance of the two-port network is: rm = RSHUNT ∙ AMP = 0.06 ∙ AMP = 0.206 Ω rm 0.206 AMP = = 2.1 = RSHUNT 0.1 (8) (9) Finally choosing Ra=Rb and Rc=Rd, the differential gain of the circuit is: UM1971 - Rev 4 page 16/35 UM1971 Current sensing amplifying network AMP = Rc = 2.1 Ra (10) An amplification gain of 2.1 was chosen. The same amplification is obtained for all the other devices, taking into account the OCP current and the shunt resistance, as described in Table 1. The RC filter for output amplification is designed to have a time constant that matches noise parameters in the range of 1.5 µs: 4 ∙ τ = 4 ∙ Re ∙ Cc = 1.5 μs 1.5 µs Cc = = 375 pF 330 pF selected 4 ∙ 1000 (11) (12) Table 4. Amplifying networks Amplifying network Phase UM1971 - Rev 4 Ra Rb RC filter Rc Rd Re Cc Phase U R30 R32 R29 R33 R31 C25 Phase V R35 R37 R34 R39 R36 C29 Phase W R40 R42 R38 R43 R41 C31 page 17/35 UM1971 Temperature monitoring 6 Temperature monitoring The SLLIMM 2nd series family integrates a temperature sensor (VTSO) on the low side gate driver and an NTC thermistor placed close to the power stage. They can be selected via SW3. The board is designed to use both of them to monitor the internal IPM temperature through the MCU. 6.1 Thermal sensor (VTSO) A voltage proportional to the temperature is available on the TSO pin (17) and easily measurable on the TP20 test pin. To improve noise immunity, a 1 nF (C16) capacitor filter is placed on this pin. The thermal sensor does not need any pull down resistors. The following graph shows typical voltage variation as a function of temperature. Figure 16. Thermal sensor voltage vs temperature 6.2 NTC Thermistor The embedded thermistor (85 kΩ at 25 °C) in the IPM is connected between pins T1 and T2 (26, 25). A12 kΩ pull up resistor (R10) ensures that the voltage variation on the NTC as a function of temperature is almost linear. This voltage is easily monitored on TP1 test pin. The figure below shows the typical voltage on T2 as function of temperature. UM1971 - Rev 4 page 18/35 UM1971 NTC Thermistor Figure 17. NTC voltage vs temperature UM1971 - Rev 4 page 19/35 UM1971 Firmware configuration for STM32 PMSM FOC SDK 7 Firmware configuration for STM32 PMSM FOC SDK The following table summarizes the parameters which customize the latest version of the ST FW motor control library for permanent magnet synchronous motor (PMSM): STM32 PMSM FOC SDK for this STEVAL-IPM05F. Table 5. ST motor control workbench GUI parameters Block Parameter Value Comparator threshold Over current protection Bus voltage sensing Rated bus voltage info Current sensing Command stage UM1971 - Rev 4 Overcurrent network offset 0 Vref ∙ R23 + R53 + VF = 0.83V R53 Overcurrent network gain 0.1 V/A Bus voltage divider 1/125 Min rated voltage 125 V Max rated voltage 400 V Nominal voltage 325 V Current reading typology Single- or three-shunt Shunt resistor value 0.1 Ω Amplifying network gain 2.1 Phase U Driver HS and LS: Active high Phase V Driver HS and LS: Active high Phase W Driver HS and LS: Active high (13) page 20/35 UM1971 Connectors, jumpers and test pins 8 Connectors, jumpers and test pins Table 6. Connectors Connector Reference Description / pinout Motor control connector J2 1 - emergency stop 2 - GND 3 - PWM-1H 4 - GND 5 - PWM-1L 6 - GND 7 - PWM-2H 8 - GND 9 - PWM-2L 10 - GND 11 - PWM-3H 12 - GND 13 - PWM-3L 14 - HV bus voltage 15 - current phase A 16 - GND 17 - current phase B 18 - GND 19 - current phase C 20 - GND 21 - NTC bypass relay 22 - GND 23 - dissipative brake PWM 24 - GND 25 - +V power 26 - heat sink temperature 27- PFC sync. 28 - VDD_m 29 - PWM VREF 30 - GND 31 - measure phase A 32 - GND 33 - measure phase B 34 - measure phase C Motor connector J3 • phase A • phase B • phase C VCC supply (20 VDC max) J4 • positive • negative Supply connector (DC – 125V to 400 V) J7 1. + (positive terminal) 2. - (negative terminal) Hall sensors / encoder input connector J9 UM1971 - Rev 4 1. Hall sensors input 1 / encoder A+ 2. Hall sensors input 2 / encoder B+ 3. Hall sensors input 3 / encoder Z+ 4. 3.3 or 5 Vdc 5. GND page 21/35 UM1971 Connectors, jumpers and test pins Table 7. Jumpers Jumper Description TSO/NTC TSO: jumper on 1-2 SW3 NTC: jumper on 2-3 To choose current U to send to control board: Jumper on 1-2: from amplification SW1 Jumper on 2-3: directly from motor output To choose current V to send to control board Jumper on 1-2: from amplification SW2 Jumper on 2-3: directly from motor output To choose current W to send to control board: Jumper on 1-2: from amplification SW4 Jumper on 2-3: directly from motor output SW13 To modify phase A hall sensor network SW14 To modify phase B hall sensor network SW15 To modify phase C hall sensor network To choose input power for Hall/Encoder SW9, SW16 Jumper on 1-2: 5 V Jumper on 2-3: 3.3 V To choose one-shunt or three-shunt configuration. (Through solder bridge) SW5, SW6 SW5, SW6 closed SW7, SW8 SW7, SW8 open one shunt SW5, SW6 open three shunt SW7, SW8 closed Table 8. Test pins Test Pin UM1971 - Rev 4 Description TP1 NTC (T2 pin) TP2 VBOOTw TP3 VBOOTv TP4 VBOOTu TP5 HinU (high side U control signal input) TP6 HinV (high side V control signal input) TP7 HinW (high side W control signal input) TP8 VCCH TP9 phase A (U pin) TP10 phase B (V pin) TP11 Ground TP12 LinU (high side U control signal input) page 22/35 UM1971 Connectors, jumpers and test pins Test Pin UM1971 - Rev 4 Description TP13 phase C (W pin) TP14 LinV (high side V control signal input) TP15 LinW (high side W control signal input) TP16 Negative DC input for U phase TP17 CIN TP18 Negative DC input for V phase TP19 Negative DC input for W phase TP20 TSO (TSO pin) TP21 Ground TP22 Ground TP23 SD (shutdown pin) TP24 Current_A_amp TP25 Current_B_amp TP26 Current_C_amp page 23/35 UM1971 Bill of materials 9 Bill of material The components used to build the evaluation board are listed below. The majority of the active components used are available from STMicroelectronics. Table 9. Bill of materials Item Qty UM1971 - Rev 4 Reference Part/Value Description Manufacturer Order code 1 4 C2, C22, C26, C28 10 nF, SMD 1206 Capacitor AVX 12065C103KAT2A 2 9 C10, C11, C14, C15, 10 pF, SMD 1206 C17, C18, C35, C36, C37 Capacitor AVX 12061A100JAT2A 3 4 C20, C25, C29, C31 330 pF, SMD 1206 Capacitor AVX 12065A331JAT2A 4 3 C5, C6, C7 2.2 µF, SMD 1206 Capacitor Murata GCM31MR71E225KA57L 5 6 100 nF, SMD 1206 Capacitor AVX 12065C104KAZ2A 6 2 C12, C21 4.7 µF Electrolytic capacitor Any Any 7 2 C19, C16 1 nF, SMD 1206 Capacitor Kemet C1206C102K5RACTU 8 1 C9 0.1 µF, SMD 1812 Capacitor Murata GRM43DR72J104KW01L 9 3 C24, C27, C30 100 pF, SMD 1206 Capacitor Kemet C1206C101J1GACTU 10 2 C3, C4 47 µF Electrolytic capacitor Any 11 5 D1, D3, D4, D5, D6 Diode SOD323 Schottky diode ST BAT48J 12 1 D2 2 mA, 3 mm Red LED Ledtech L4RR3000G1EP4 13 1 J2 Connector Connector 34pins RS 625-7347 14 1 J3 7 mm - 3 pole Connector TE Connectivity AMP Connectors 282845-3 15 1 J4 5 mm - 2 pole Connector - Phoenix Contact 1935161 16 1 J1 7 mm - 2 pole Connector On Shore Technology Inc OSTVI024152 17 1 J5 Connector Five pins of pin header RS W81136T3825RC 18 2 R1, R2 470 kΩ, , SMD 1206 Resistor Any 19 1 R4 7.5 kΩ, SMD 1206 Capacitor Panasonic ERJP08F7501 20 1 R3 120 Ω, SMD 1206 Resistor Any Any 21 3 R7, R13, R17 3.9 kΩ, SMD 1206 Resistor Any Any 22 21 R5, R6, R8, R9, R14, R15, R19, R20, R23, R30, R32, R31, R18, R21, R24, R36, R35, R41, R42, R40, R37 Resistor, SMD 1206 Any Any 23 3 R11, R16, R22 3.3 kΩ Resistor Any Any 24 1 R28 10 kΩ, SMD 1206 Resistor Any Any 25 1 R10 12 kΩ, SMD 1206 Resistor Any Any C8, C13, C23, C32, C33, C34 page 24/35 UM1971 Bill of materials Item Qty Part/Value Description Manufacturer Order code 26 6 R29, R33, R34, R38, R39, R43 2.1 kΩ, SMD 1206 Resistor Any Any 27 1 R12 5.6 kΩ, SMD 1206 Resistor Any Any 28 3 R25, R26, R27 0.1 Ω, SMD 2512 Resistor Vishay WSL2512R1000FEK 29 7 R44, R45, R46, R50, R51, R52, R53 4.7 kΩ, SMD 1206 Resistor Any Any 30 3 R47, R48, R49 2.4 kΩ, SMD 1206 Resistor Any Any 31 6 SW1, SW2, SW3,S W4, SW9, SW16 Jumper 2.54 Three pins of pin header RS W81136T3825RC 32 6 SW10, SW11, SW12, SW13, SW14, SW15 Jumper 2.54 Two pins of pin header RS W81136T3825RC 33 12 - 2.54 mm, low profile, connector - RS 881545-2 34 2 SW7, SW8 Solder bridge Any Any 35 2 SW5, SW6 - Any Any 26 TP1, TP2, TP3, TP4, TP5, TP6, TP7, TP8, TP9, TP10, TP11, TP12, TP13, TP14, TP15, TP16, PCB terminal 1 mm Test pin TP17, TP18, TP19, TP20, TP21, TP22, TP23, TP24, TP25, TP26 KEYSTONE 5001 20 MHz GBP Rail-to-rail input/ output operational amplifiers, SO14 ST TSV994 ST STGIF5CH60TS-L 36 37 1 U1 open 38 1 U2 8 A, 600 V SLLIMM 2nd series IPM, 3phase inverter, short-circuit rugged IGBTs 39 3 RC1,RC6,RC9 0 Ω, SMD 0805 Resistor Any Any 40 7 RC2, RC3, RC4, RC5, RC7, RC8, RC10 Not mounted Not mounted Any Any 9 to close switch for: SW1, SW2, SW3, SW4, SW9, SW10, SW11, SW12, SW16 - - TE Connectivity 1-881545-1 41 UM1971 - Rev 4 Reference page 25/35 UM1971 PCB design guide 10 PCB design guide Optimization of PCB layout for high voltage, high current and high switching frequency applications is a critical point. PCB layout is a complex matter as it includes several aspects, such as length and width of track and circuit areas, but also the proper routing of the traces and the optimized reciprocal arrangement of the various system elements in the PCB area. A good layout can help the application to properly function and achieve expected performance. On the other hand, a PCB without a careful layout can generate EMI issues, provide overvoltage spikes due to parasitic inductance along the PCB traces and produce higher power loss and even malfunction in the control and sensing stages. In general, these conditions were applied during the design of the board: • PCB traces designed as short as possible and the area of the circuit (power or signal) minimized to avoid the sensitivity of such structures to surrounding noise. • Good distance between switching lines with high voltage transitions and the signal line sensitive to electrical noise. • The shunt resistors were placed as close as possible to the low side pins of the SLLIMM. To decrease the parasitic inductance, a low inductance type resistor (SMD) was used. • RC filters were placed as close as possible to the SLLIMM pins in order to increase their efficiency. 10.1 Layout of reference board All the components are inserted on the top of the board. Only the IPM module is inserted on the bottom to allow the insertion of a suitable heatsink for the application. Figure 18. Silk screen and etch - top side UM1971 - Rev 4 page 26/35 UM1971 Layout of reference board Figure 19. Silk screen and etch - bottom side UM1971 - Rev 4 page 27/35 UM1971 Recommendations and suggestions 11 Recommendations and suggestions • • • UM1971 - Rev 4 The BOM list is not provided with a bulk capacitor already inserted in the PCB. However, the necessary space has been included (C1). In order to obtain a stable bus supply voltage, it is advisable to use an adequate bulk capacity. For general motor control applications, an electrolytic capacitor of at least 100 µF is suggested. Similarly, the PCB does not come with a heat sink. In case of need, place an heat sink on top of the PCB with thermal conductive foil and screws. RTH is an important factor for good thermal performance and depends on certain factors such as current phase, switching frequency, power factor and ambient temperature. The board requires +5 V and +3.3 V to be supplied externally through the 34-pin motor control connector J2. Please refer to the relevant board manuals for information on key connections and supplies. page 28/35 UM1971 General safety instructions 12 General safety instructions Danger: The evaluation board works with high voltage which could be deadly for the users. Furthermore all circuits on the board are not isolated from the line input. Due to the high power density, the components on the board as well as the heat sink can be heated to a very high temperature, which can cause a burning risk when touched directly. This board is intended for use by experienced power electronics professionals who understand the precautions that must be taken to ensure that no danger or risk may occur while operating this board. Caution: After the operation of the evaluation board, the bulk capacitor C1 (if used) may still store a high energy for several minutes. So it must be first discharged before any direct touching of the board. Important: To protect the bulk capacitor C1, we strongly recommended using an external brake chopper after C1 (to discharge the high brake current back from the induction motor). UM1971 - Rev 4 page 29/35 UM1971 References 13 References All of the following reference material is freely available on www.st.com 1. STGIF5CH60TS-L datasheet 2. TSV994 datasheet 3. STTH15R06 datasheet 4. User manual UM1052 STM32F PMSM single/dual FOC SDK v4.3 5. Application note AN4076 Two or three shunt resistor based current sensing circuit design in 3-phase inverters UM1971 - Rev 4 page 30/35 UM1971 Revision history Table 10. Revision history Date Version Changes 23-Nov-2015 1 Initial release. 09-Mar-2016 2 Text and formatting changes throughout document Updated Introduction Updated Schematic diagrams Updated title 24-May-2018 3 Updated schematic diagrams Updated bill of material 18-Sep-2019 UM1971 - Rev 4 4 Updated Section 2.1 Schematic diagrams page 31/35 UM1971 Contents Contents 1 Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 2 Circuit schematics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.1 Schematic diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 Main characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 Filters and key parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 4.1 Input signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.2 Bootstrap capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.3 Overcurrent protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.3.1 SD Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.3.2 Fault management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.3.3 Shunt resistor selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.3.4 RC filter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.3.5 Single- or three-shunt selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5 Current sensing amplifying network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 6 Temperature monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 6.1 Thermal sensor (VTSO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 6.2 NTC Thermistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7 Firmware configuration for STM32 PMSM FOC SDK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 8 Connectors, jumpers and test pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 9 Bill of material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 10 PCB design guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 10.1 Layout of reference board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 11 Recommendations and suggestions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 12 General safety instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 13 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 UM1971 - Rev 4 page 32/35 UM1971 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Fault timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Shunt selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Op-amp sensing configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Amplifying networks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 ST motor control workbench GUI parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Jumpers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Test pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 UM1971 - Rev 4 page 33/35 UM1971 List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. UM1971 - Rev 4 SLLIMM 2nd series motor control internal demo board (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 SLLIMM 2nd series motor control internal demo board: (bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 STEVAL-IPM05F circuit schematic (1 of 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 STEVAL-IPM05F circuit schematic (2 of 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 STEVAL-IPM05F circuit schematic (3 of 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 STEVAL-IPM05F circuit schematic (4 of 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 STEVAL-IPM05F circuit schematic (5 of 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 STEVAL-IPM05F circuit schematic (6 of 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 STEVAL-IPM05F architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 CBOOT graph selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 SD failure due to overcurrent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 SD failure due to undervoltage (UVLO below 70 µs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 SD failure due to undervoltage (UVLO above 70 µs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 One-shunt configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Three-shunt configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Thermal sensor voltage vs temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 NTC voltage vs temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Silk screen and etch - top side . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Silk screen and etch - bottom side. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 page 34/35 UM1971 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved UM1971 - Rev 4 page 35/35 ">
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