STMicroelectronics STEVAL-IPM07F User Manual
Mainos
Mainos
UM2015
User manual
700 W motor control power board based on STGIF7CH60TS-L SLLIMM™ 2nd series IPM
Introduction
The STEVAL-IPM07F is a compact motor drive power board based on SLLIMM™ (small low-loss intelligent molded module)
2nd series (STGIF7CH60TS-L). It provides an affordable and easy-to-use solution for driving high power motors for a wide range of applications such as power white goods, air conditioning, compressors, power fans, high-end power tools and 3-phase inverters for motor drives in general. The IPM itself consists of short-circuit rugged IGBTs and a wide range of features like undervoltage lockout, smart shutdown, embedded temperature sensor and NTC, and overcurrent protection.
The main characteristics of this evaluation board are small size, minimal BOM and high efficiency. It consists of an interface circuit (BUS and V
CC
connectors), bootstrap capacitors, snubber capacitor, hardware short-circuit protection, fault event and temperature monitoring. In order to increase the flexibility, it is designed to work in single- or three-shunt configuration and with double current sensing options such as using three dedicated onboard op-amps, or op-amps embedded in the MCU. The Hall/
Encoder part completes the circuit.
Thanks to these advanced characteristics, the system has been specifically designed to achieve fast and accurate current feedback conditioning, satisfying the typical requirements for field-oriented control (FOC).
The STEVAL-IPM07F is compatible with ST's STM32-based control board, enabling designers to build a complete platform for motor control.
Figure 1. SLLIMM 2nd series motor control internal demo board (top view)
UM2015 - Rev 3 - September 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
1
Key features
•
•
•
•
•
•
•
•
•
•
•
•
•
Input voltage: 125 - 400 VDC
Nominal power: up to 700 W
Nominal current: up to 4.2 A
Input auxiliary voltage: up to 20 V DC
Motor control connector (32 pins) interfacing with ST MCU boards
Single- or three-shunt resistors for current sensing (with sensing network)
Two options for current sensing: dedicated op-amps or through MCU
Overcurrent hardware protection
IPM temperature monitoring and protection
Hall sensors (3.3 / 5 V)/encoder inputs (3.3 / 5 V)
IGBT intelligent power module:
– SLLIMM™ 2 nd series IPM (STGIF7CH60TS-L - Full molded package)
Universal conception for further evaluation with bread board and testing pins
Very compact size
Figure 2. SLLIMM 2nd series motor control internal demo board: (bottom view)
UM2015
Key features
UM2015 - Rev 3 page 2/35
2
2.1
UM2015
Circuit schematic
Circuit schematic
Following figures show the whole schematic of the SLLIMM™ 2nd series card for STGIF7CH60TS-L IPM products. This card consists of an interface circuit (BUS and V
CC
connectors), bootstrap capacitors, snubber capacitor, short-circuit protection, fault output circuit, temperature monitoring, single-/three-shunt resistors and filters for input signals. It also includes bypass capacitors for V
CC
and bootstrap capacitors. The capacitors are located very close to the drive IC, which is very helpful in preventing malfunction due to noise.
Two current sensing options are provided: three dedicated onboard op-amps or using opamps embedded on the
MCU. Selection is performed through three jumpers.
The Hall/Encoder part (powered at 5 V or 3.3 V) completes the circuit.
Schematic diagram
Figure 3. STEVAL-IPM07F circuit schematic (1 of 6)
N
RC1
0
STEVAL-IPMnmx decoder
RC2
0
RC3
0
RC4
0
M
RC5
0
RC6
0
RC7
0
RC8
0
X
RC9
0
RC10
0
UM2015 - Rev 3 page 3/35
UM2015 - Rev 3
UM2015
Schematic diagram
Figure 4. STEVAL-IPM07F circuit schematic (2 of 6)
E1
Current_A_amp
E2
SW2
2 Current_B
SW1
2 Current_A
EM_STOP
PWM-A-H
PWM-A-L
PWM-B-H
PWM-B-L
PWM-C-H
PWM-C-L
NTC_bypass_relay
+5V
PWM_Vref
M_phase_A
E3
Current_B_amp
M_phase_B
SW4
2 Current_C
Control Connector
11
13
15
17
19
21
5
7
1
3
9
23
25
27
29
31
33
J2
12
14
16
18
20
22
6
8
2
4
10
24
26
28
30
32
34
Bus_voltage
3.3V
M_phase_C
TSO
2
SW3
NTC
Current_C_amp
J3
3
2
1
Motor Output phase_C phase_B phase_A page 4/35
DC_bus_voltage
INPUT-dc
2
1
J1
+
C1
Figure 5. STEVAL-IPM07F circuit schematic (3 of 6)
Input
+Bus
R1
470K
R2
470K
3.3V
D1
BAT48JFILM
Bus_voltage
R3 120R
R4
7k5
C2
10n
R5
1k0
+ C3
47µ/35V
R6
1k0
12
+
13
-
3.3V
U1D
14
TSV994
+ C4
47µ/35V
1.65V
UM2015
Schematic diagram
UM2015 - Rev 3 page 5/35
UM2015 - Rev 3
Figure 6. STEVAL-IPM07F circuit schematic (4 of 6)
UM2015
Schematic diagram
4 11
+
4 11 4 11 page 6/35
Figure 7. STEVAL-IPM07F circuit schematic (5 of 6)
3_SHUNT
UM2015
Schematic diagram
3_SHUNT
UM2015 - Rev 3 page 7/35
Figure 8. STEVAL-IPM07F circuit schematic (6 of 6)
UM2015
Schematic diagram
UM2015 - Rev 3
3 1 3 1 page 8/35
3
UM2015
Main characteristics
Main characteristics
The board is designed to be compatible with DC supply from 125 VDC up to 400 VDC voltage.
A bulk capacitor according to the power level of the application must be mounted. The footprint is already provided on the board.
The SLLIMM integrates six IGBT switches with freewheeling diodes together with high voltage gate drivers.
Thanks to this integrated module, the system is specifically designed to achieve power inversion in a reliable and compact design. Such integration reduces the required PCB area and the simplicity of the design increases reliability.
In order to increase the flexibility, it can operate in single- or three-shunt configuration by modifying solder bridge
jumper settings (see Section 4.3.5 Single- or three-shunt selection
).
Figure 9. STEVAL-IPM05F architecture
UM2015 - Rev 3 page 9/35
UM2015
Filters and key parameters
4
4.1
4.2
Note:
Filters and key parameters
Input signals
The input signals (LINx and HINx), able to drive the internal IGBTs, are active high. A 100 kΩ (typ.) pull-down resistor is built-in for each input signal. In order to prevent input signal oscillation, an RC filter was added on each input and placed as close as possible to the IPM. The filter is designed using a time constant of 10 ns (1 kΩ and
10 pF).
Bootstrap capacitor
In the 3-phase inverter, the emitters of the low side IGBTs are connected to the negative DC bus (V
DC-
) as common reference ground, which allows all low side gate drivers to share the same power supply, while the emitter of high side IGBTs is alternately connected to the positive (V
DC+
) and negative (V
DC-
) DC bus during running conditions.
A bootstrap method is a simple and cheap solution to supply the high voltage section. This function is normally accomplished by a high voltage fast recovery diode. The SLLIMM 2 nd series family includes a patented integrated structure that replaces the external diode. It is realized with a high voltage DMOS functioning as diode with series resistor. An internal charge pump provides the DMOS driving voltage. The value of the C
BOOT
capacitor should be calculated according to the application condition.
This curve is taken from application note AN4768 (available on www.st.com); calculations are based on the
STGIB15CH60 device, which represents the worst case scenario for this kind of calculation.
shows the behavior of C
BOOT
(calculated) versus switching frequency (f sw
), with different values of ∆V
CBOOT
for a continuous sinusoidal modulation and a duty cycle δ = 50%.
The boot capacitor must be two or three times larger than the C
BOOT
calculated in the graph. For this design, a value of 2.2 µF was selected.
Figure 10. C
BOOT
graph selection
UM2015 - Rev 3 page 10/35
UM2015
Overcurrent protection
4.3
4.3.1
4.3.2
Overcurrent protection
The SLLIMM 2 nd series integrates a comparator for fault sensing purposes. The comparator has an internal voltage reference V
REF
(510 mV typ.) connected to the inverting input, while the non-inverting input available on the CIN pin can be connected to an external shunt resistor to implement the overcurrent protection function.
When the comparator triggers, the device enters the shutdown state.
The comparator output is connected to the SD pin in order to send the fault message to the MCU.
SD Pin
The SD is an input/output pin (open drain type if used as output). Taking into account the voltage reference on SD
(3.3 V), a pull up resistor of 10 kΩ (R28) is used to guarantee the right bias and consequently to keep the current on the open drain DMOS (I od
) lower than 3 mA.
The filter on SD (R28 and C20) has to be sized to obtain the desired re-starting time after a fault event and placed as close as possible to the SD pin.
A shutdown event can be managed by the MCU, in this case the SD functions as the input pin.
Conversely, the SD functions as an output pin when an overcurrent or undervoltage condition is detected.
•
•
Fault management
The SLLIMM 2nd series integrates a specific kind of fault management, useful when SD is functioning as output, able to identify the type of fault event.
As previously described, as soon as a fault occurs, the open-drain (DMOS) is activated and LVGx outputs are forced low.
Two types of fault can be signaled:
Overcurrent (OC) sensed by the internal comparator (CIN);
Undervoltage (UVLO) on supply voltage (VCC).
Each fault enables the SD open drain for a different time (see the table below).
The duration of a shutdown event therefore tells us the type of failure that has occurred.
Symbol
OC
UVLO
Parameter
Over current event
Undervoltage lockout event
Table 1. Fault timing
Event time
≤ 24 µs
> 24 µs
≤ 70 µs
> 70 µs until VCC_LS exceeds the VCC_LS
UV turn on threshold
24 µs
SD open-drain enable time result
OC time
70 µs
UVLO time
1. typical value (T
J
= -40 °C to 125 °C)
2. without contribution of RC network on SD
overcurrent, the voltage on the comparator (CIN) exceeds the threshold (0.51 V typ.) and the shutdown is able to stop the application. In this case, the SD event time is about 24 µs (for OC event less than 24 µs).
UM2015 - Rev 3 page 11/35
UM2015 - Rev 3
Figure 11. SD failure due to overcurrent
UM2015
Overcurrent protection
Figure 12. SD failure due to undervoltage (UVLO below 70 µs)
shows the shutdown event as the result of an undervoltage condition on the V
CC
supply. If V
CC
drops below the undervoltage threshold, the shutdown can stop the application. If the voltage on V
CC about 70 µs.
rises above the V
CC
on threshold in less than 70 µs, the SD event time is page 12/35
UM2015 - Rev 3
Figure 12. SD failure due to undervoltage (UVLO below 70 µs)
UM2015
Overcurrent protection
undervoltage condition on the V
CC
supply. In this case, the drop on V
CC
is greater than 70 µs. The SD event time is the same as the duration of drop.
Figure 13. SD failure due to undervoltage (UVLO above 70 µs) page 13/35
UM2015
Overcurrent protection
4.3.3
4.3.4
4.3.5
Shunt resistor selection
The value of the shunt resistor is calculated by the following equation:
RSH =
Vref
IOC
Where V ref
is the internal comparator (CIN) (0.54 V typ.) and I
OC
is the overcurrent threshold detection level.
(1)
The maximum OC protection level should be set to less than the pulsed collector current in the datasheet. In this design, the overcurrent threshold level was fixed at I
OC
= 9.1 A in order to select a commercial shunt resistor value.
RSH =
Vref ⋅
R23 + R53
R53
IOC
+ VF
=
4700
9.1
+ 0.18
= 0.088 Ω (2)
Where V
F
is the voltage drop across diodes D3, D4 and D5.
•
•
For the power rating of the shunt resistor, the following parameters must be considered:
• Maximum load current of inverter (85% of I nom [Arms]
): I load(max)
•
Shunt resistor value at TC = 25 °C
Power derating ratio of shunt resistor at T
SH
=100 °C
Safety margin
The power rating is calculated by the following equation:
•
•
The commercial value chosen was R
SH
= 0.08 Ω, which corresponds an overcurrent level of 10 A.
The power rating is:
•
PSH =
1
2 ⋅
Iload max ⋅ RSH ⋅ margin
Derating gratio
Inom = 7A Inom rms =
Inom
2
Iload max = 85 %
Inom rms = 4.2 Arms
Power derating ratio of shunt resistor at TSH = 100 °C: 80% (from datasheetmanufacturer)
Safety margin: 30%
(3)
(4)
PSH =
1
2 ⋅
4.2² ⋅ 0.08 ⋅ 1.3
0.8
= 1.14 W
Considering the commercial value, a 5 W shunt resistor was selected.
Based on the previous equations and conditions, the minimum shunt resistance and power rating is summarized below.
(5)
Table 2. Shunt selection
Device
STGIF7CH60TS-L 7
I nom(peak)
[A]
10
OCP
(peak)
[A] I load(max)
[Arms]
4.2
0.08
R
SHUNT
[Ω]
Minimum shunt power rating P
SH
[W]
1.14
RC filter
An RC filter network is required to prevent undesired short circuit operation due to the noise on the shunt resistor.
In this design, the RC filter, composed of R23, R18, R21, R24 and C19, has a constant time of about 1.3 µs.
Adding the turn-off propagation delay of the gate driver and the IGBT turn-off time (hundreds of nanoseconds in total), the total delay time is less than 5 µs of short circuit withstand IGBT time.
Single- or three-shunt selection
Single- or three-shunt resistor circuits can be adopted by setting the solder bridges SW5, SW6, SW7 and SW8.
The figures below illustrate how to set up the two configurations.
UM2015 - Rev 3 page 14/35
Figure 14. One-shunt configuration
UM2015
Overcurrent protection
Figure 15. Three-shunt configuration
UM2015 - Rev 3 page 15/35
5
UM2015 - Rev 3
UM2015
Current sensing amplifying network
Current sensing amplifying network
The motor control demonstration board can be configured to run in three-shunt or single-shunt configurations for field oriented control (FOC).
The current can be sensed thanks to the shunt resistor and amplified by using the on board operational amplifiers or by the MCU (if equipped with op-amp).
Once the shunt configuration is chosen by setting solder bridge on SW5, SW6, SW7 and SW8 (as described in
amplified or unamplified.
Single-shunt configuration requires a single op amp and three-shunt configuration requires three op amps; therefore, in single-shunt configuration, the only voltage which is sent to the MCU to control the sensing is connected to phase V through SW2.
SW1, SW2, SW4 can select which signals are sent to micro, as described below:
SW1
SW2
SW4
Symbol
Single
Shunt
Three
Shunt
Single
Shunt
Three
Shunt
Single
Shunt
Three
Shunt
Table 3. Op-amp sensing configuration
Configuration
1-2
2-3
1-2
2-3
1-2
2-3
1-2
2-3
1-2
2-3
1-2
2-3
Bridge open open
On-board op-amp
MCU op-amp
On board op-amp
MCU op-amp
On-board op-amp
MCU op-amp open open
On-board op-amp
MCU op-amp
Sensing
The operational amplifier TSV994 used on amplifying networks has a 20 MHz gain bandwidth and operates with a single positive supply of 3.3 V.
The amplification network must allow bidirectional current sensing, so that an output offset V
O
= +1.65 V represents zero current.
Referencing the STGIF7CH60TS-L (I
OCP
= 10 A; R
SHUNT
= 0.08 Ω), the maximum measurable phase current, considering that the output swings from +1.65 V to +3.3 V (MCU supply voltage) for positive currents and from
+1.65 V to 0 for negative currents is:
Equation 5
= 10 A rm =
∆ V
MaxMeasCurrent =
The overall trans-resistance of the two-port network is:
1.65
10 = 0.165 Ω rm = RSHUNT ∙ AMP = 0.08 ∙ AMP = 0.165 Ω
AMP = rm
RSHUNT
Finally choosing R a
=R b
and R c
=R d
, the differential gain of the circuit is:
(6)
(7)
(8)
(9) page 16/35
UM2015
Current sensing amplifying network
AMP =
Rc
Ra
= 2.1
(10)
An amplification gain of 2.1 was chosen. The same amplification is obtained for all the other devices, taking into account the OCP current and the shunt resistance, as described in Table 1.
The RC filter for output amplification is designed to have a time constant that matches noise parameters in the range of 1.5 µs:
Cc =
4 ∙ τ = 4 ∙ Re ∙ Cc = 1.5 μs
1.5 µs
4 ∙ 1000 = 375 pF 330 pF selected
(11)
(12)
Phase
Phase U
Phase V
Phase W
R30
R35
R40
Ra
R32
R37
R42
Table 4. Amplifying networks
Rb
Amplifying network
Rc
R29
R34
R38
R33
R39
R43
Rd
R31
R36
R41
Re
RC filter
C25
Cc
C29
C31
UM2015 - Rev 3 page 17/35
6
6.1
UM2015
Temperature monitoring
Temperature monitoring
The SLLIMM 2 nd series family integrates a temperature sensor (VTSO) on the low side gate driver and an NTC thermistor placed close to the power stage.
They can be selected via SW3.
The board is designed to use both of them to monitor the internal IPM temperature through the MCU.
Thermal sensor (VTSO)
A voltage proportional to the temperature is available on the TSO pin (17) and easily measurable on the TP20 test pin.
To improve noise immunity, a 1 nF (C16) capacitor filter is placed on this pin.
The thermal sensor does not need any pull down resistors.
The following graph shows typical voltage variation as a function of temperature.
Figure 16. Thermal sensor voltage vs temperature
6.2
NTC Thermistor
The embedded thermistor (85 kΩ at 25 °C) in the IPM is connected between pins T1 and T2 (26, 25).
A12 kΩ pull up resistor (R10) ensures that the voltage variation on the NTC as a function of temperature is almost linear. This voltage is easily monitored on TP1 test pin.
The figure below shows the typical voltage on T2 as function of temperature.
UM2015 - Rev 3 page 18/35
Figure 17. NTC voltage vs temperature
UM2015
NTC Thermistor
UM2015 - Rev 3 page 19/35
7
UM2015
Firmware configuration for STM32 PMSM FOC SDK
Firmware configuration for STM32 PMSM FOC SDK
The following table summarizes the parameters which customize the latest version of the ST FW motor control library for permanent magnet synchronous motor (PMSM): STM32 PMSM FOC SDK for this STEVAL-IPM07F.
Table 5. ST motor control workbench GUI parameters
Block Parameter Value
Comparator threshold
Over current protection
Overcurrent network offset 0
Bus voltage sensing
Overcurrent network gain 0.1 V/A
Bus voltage divider 1/125
Rated bus voltage info
Current sensing
Command stage
Amplifying network gain
Phase U Driver
Phase V Driver
Phase W Driver
Vref ∙
Min rated voltage
Max rated voltage
Nominal voltage
125 V
400 V
325 V
Current reading typology Single- or three-shunt
Shunt resistor value 0.08 Ω
R23 + R53
2.1
HS and LS: Active high
HS and LS: Active high
HS and LS: Active high
R53
+ VF = 0.83V
(13)
UM2015 - Rev 3 page 20/35
8
UM2015
Connectors, jumpers and test pins
Connectors, jumpers and test pins
Connector
J2
J3
Reference
Table 6. Connectors
Description / pinout
Motor control connector
1 - emergency stop
3 - PWM-1H
5 - PWM-1L
7 - PWM-2H
9 - PWM-2L
11 - PWM-3H
13 - PWM-3L
15 - current phase A
17 - current phase B
19 - current phase C
21 - NTC bypass relay
23 - dissipative brake PWM
25 - +V power
27- PFC sync.
29 - PWM VREF
31 - measure phase A
33 - measure phase B
2 - GND
4 - GND
6 - GND
8 - GND
10 - GND
12 - GND
14 - HV bus voltage
16 - GND
18 - GND
20 - GND
22 - GND
24 - GND
26 - heat sink temperature
28 - VDD_m
30 - GND
32 - GND
34 - measure phase C
•
•
•
Motor connector phase A phase B phase C
J4
•
•
VCC supply (20 VDC max) positive negative
J7
J9
Supply connector (DC – 125V to 400 V)
1.
+ (positive terminal)
2.
- (negative terminal)
Hall sensors / encoder input connector
1.
Hall sensors input 1 / encoder A+
2.
Hall sensors input 2 / encoder B+
3.
Hall sensors input 3 / encoder Z+
4.
3.3 or 5 Vdc
5.
GND
UM2015 - Rev 3 page 21/35
UM2015 - Rev 3
SW3
SW1
SW2
Jumper
SW4
SW13
SW14
SW15
SW9, SW16
SW5, SW6
SW7, SW8
TP7
TP8
TP9
TP10
TP11
TP12
TP1
TP2
TP3
TP4
TP5
TP6
Test Pin
Table 7. Jumpers
Description
TSO/NTC
TSO: jumper on 1-2
NTC: jumper on 2-3
To choose current U to send to control board:
Jumper on 1-2: from amplification
Jumper on 2-3: directly from motor output
To choose current V to send to control board
Jumper on 1-2: from amplification
Jumper on 2-3: directly from motor output
To choose current W to send to control board:
Jumper on 1-2: from amplification
Jumper on 2-3: directly from motor output
To modify phase A hall sensor network
To modify phase B hall sensor network
To modify phase C hall sensor network
To choose input power for Hall/Encoder
Jumper on 1-2: 5 V
Jumper on 2-3: 3.3 V
To choose one-shunt or three-shunt configuration.
(Through solder bridge)
SW5, SW6 closed
SW7, SW8 open
SW5, SW6 open
SW7, SW8 closed
Table 8. Test pins
Description
NTC (T2 pin)
VBOOTw
VBOOTv
VBOOTu
HinU (high side U control signal input)
HinV (high side V control signal input)
HinW (high side W control signal input)
VCCH phase A (U pin) phase B (V pin)
Ground
LinU (high side U control signal input)
UM2015
Connectors, jumpers and test pins one shunt three shunt page 22/35
TP20
TP21
TP22
TP23
TP24
TP25
TP26
TP13
TP14
TP15
TP16
TP17
TP18
TP19
Test Pin phase C (W pin)
LinV (high side V control signal input)
LinW (high side W control signal input)
Negative DC input for U phase
CIN
Negative DC input for V phase
Negative DC input for W phase
TSO (TSO pin)
Ground
Ground
SD (shutdown pin)
Current_A_amp
Current_B_amp
Current_C_amp
Description
UM2015
Connectors, jumpers and test pins
UM2015 - Rev 3 page 23/35
9
UM2015
Bill of materials
Bill of material
The components used to build the evaluation board are listed below. The majority of the active components used are available from STMicroelectronics.
Table 9. Bill of materials
6
7
8
9
3
4
Item Qty
1 4
Reference
C2, C22, C26, C28
2
5
9
4
3
6
C10, C11, C14, C15,
C17, C18, C35, C36, C37
10 pF, SMD 1206 Capacitor
C20, C25, C29, C31
C5, C6, C7
C8, C13, C23, C32,
C33, C34
Part/Value Description
10 nF, SMD 1206 Capacitor
330 pF, SMD 1206 Capacitor
2.2 µF, SMD 1206 Capacitor
100 nF, SMD 1206 Capacitor
2
2
1
C12, C21
C19, C16
C9
3 C24, C27, C30
4.7 µF
Electrolytic capacitor
1 nF, SMD 1206 Capacitor
0.1 µF, SMD 1812 Capacitor
10 2 C3, C4
100 pF, SMD 1206 Capacitor
47 µF
Electrolytic capacitor
11 5 D1, D3, D4, D5, D6
12 1 D2
13 1 J2
Diode SOD323
2 mA, 3 mm
Connector
Schottky diode
Red LED
Connector 34pins
AVX
14 1 J3
15 1 J4
16 1 J1
17 1 J5
18 2 R1, R2
19 1 R4
20 1 R3
21 3 R7, R13, R17
22 21
R5, R6, R8, R9, R14,
R15, R19, R20, R23,
R30, R32, R31, R18,
R21, R24, R36, R35,
R41, R42, R40, R37
23 3 R11, R16, R22
24 1 R28
25 1 R10
7 mm - 3 pole
5 mm - 2 pole
Connector
Connector -
7 mm - 2 pole Connector
Connector
Five pins of pin header
470 kΩ, , SMD
1206
Resistor
7.5 kΩ, SMD 1206 Capacitor
120 Ω, SMD 1206 Resistor
3.9 kΩ, SMD 1206 Resistor
Resistor, SMD
1206
3.3 kΩ Resistor
10 kΩ, SMD 1206 Resistor
12 kΩ, SMD 1206 Resistor
Manufacturer
AVX
AVX
AVX
Murata
Order code
12065C103KAT2A
12061A100JAT2A
12065A331JAT2A
GCM31MR71E225KA57L
12065C104KAZ2A
Any
Kemet
Murata
Kemet
Any
ST
Ledtech
RS
Any
C1206C102K5RACTU
GRM43DR72J104KW01L
C1206C101J1GACTU
BAT48J
L4RR3000G1EP4
625-7347
TE Connectivity
AMP Connectors
282845-3
Phoenix Contact 1935161
On Shore
Technology Inc
OSTVI024152
RS W81136T3825RC
Any
Panasonic
Any
Any
Any
Any
Any
Any
ERJP08F7501
Any
Any
Any
Any
Any
Any
UM2015 - Rev 3 page 24/35
UM2015 - Rev 3
UM2015
Bill of materials
Item Qty Reference
26 6
R29, R33, R34, R38,
R39, R43
27 1 R12
28 3 R25, R26, R27
29 7
R44, R45, R46, R50,
R51, R52, R53
30 3 R47, R48, R49
31
32
33
6
6
12 -
SW1, SW2, SW3,S W4,
SW9, SW16
SW10, SW11, SW12,
SW13, SW14, SW15
Part/Value
2.1 kΩ, SMD 1206
5.6 kΩ, SMD 1206
0.08 Ω, SMD 2512
4.7 kΩ, SMD 1206
Description
Resistor
Resistor
Resistor
Resistor
2.4 kΩ, SMD 1206 Resistor
Jumper 2.54
Three pins of pin header
Jumper 2.54
Two pins of pin header
2.54 mm, low profile, connector
-
34 2 SW7, SW8
35 2 SW5, SW6 open -
Solder bridge
36
37
38
26
1
1
TP1, TP2, TP3, TP4,
TP5, TP6, TP7, TP8,
TP9, TP10, TP11, TP12,
TP13, TP14, TP15, TP16,
TP17, TP18, TP19, TP20,
TP21, TP22, TP23, TP24,
TP25, TP26
PCB terminal 1 mm Test pin
U1
U2
20 MHz GBP
8 A, 600 V
Rail-to-rail input/ output operational amplifiers, SO14
SLLIMM 2nd series IPM, 3phase inverter, short-circuit rugged IGBTs
0 Ω, SMD 0805 Resistor 39 3 RC1,RC6,RC9
40 7
RC2, RC3, RC4, RC5,
RC7, RC8, RC10
Not mounted Not mounted
41 9 to close switch for: SW1,
SW2, SW3, SW4, SW9,
SW10, SW11, SW12,
SW16
-
Manufacturer
Any
Any
Vishay
Any
Any
RS
RS
RS
Any
Any
KEYSTONE
ST
ST
Any
Any
Any
Any
WSL2512R1000FEK
Any
Any
Any
Any
Any
Any
Order code
W81136T3825RC
W81136T3825RC
881545-2
5001
TSV994
STGIF5CH60TS-L
TE Connectivity 1-881545-1 page 25/35
UM2015
PCB design guide
10
10.1
PCB design guide
Optimization of PCB layout for high voltage, high current and high switching frequency applications is a critical point. PCB layout is a complex matter as it includes several aspects, such as length and width of track and circuit areas, but also the proper routing of the traces and the optimized reciprocal arrangement of the various system elements in the PCB area.
A good layout can help the application to properly function and achieve expected performance. On the other hand, a PCB without a careful layout can generate EMI issues, provide overvoltage spikes due to parasitic inductance along the PCB traces and produce higher power loss and even malfunction in the control and sensing stages.
In general, these conditions were applied during the design of the board:
• PCB traces designed as short as possible and the area of the circuit (power or signal) minimized to avoid the sensitivity of such structures to surrounding noise.
•
•
•
Good distance between switching lines with high voltage transitions and the signal line sensitive to electrical noise.
The shunt resistors were placed as close as possible to the low side pins of the SLLIMM. To decrease the parasitic inductance, a low inductance type resistor (SMD) was used.
RC filters were placed as close as possible to the SLLIMM pins in order to increase their efficiency.
Layout of reference board
All the components are inserted on the top of the board. Only the IPM module is inserted on the bottom to allow the insertion of a suitable heatsink for the application.
Figure 18. Silk screen and etch - top side
UM2015 - Rev 3 page 26/35
Figure 19. Silk screen and etch - bottom side
UM2015
Layout of reference board
UM2015 - Rev 3 page 27/35
11
UM2015
Recommendations and suggestions
Recommendations and suggestions
•
•
•
The BOM list is not provided with a bulk capacitor already inserted in the PCB. However, the necessary space has been included (C1). In order to obtain a stable bus supply voltage, it is advisable to use an adequate bulk capacity. For general motor control applications, an electrolytic capacitor of at least 100 µF is suggested.
Similarly, the PCB does not come with a heat sink. In case of need, place an heat sink on top of the PCB with thermal conductive foil and screws. R
TH
is an important factor for good thermal performance and depends on certain factors such as current phase, switching frequency, power factor and ambient temperature.
The board requires +5 V and +3.3 V to be supplied externally through the 34-pin motor control connector J2.
Please refer to the relevant board manuals for information on key connections and supplies.
UM2015 - Rev 3 page 28/35
UM2015
General safety instructions
12
General safety instructions
Danger:
The evaluation board works with high voltage which could be deadly for the users. Furthermore all circuits on the board are not isolated from the line input. Due to the high power density, the components on the board as well as the heat sink can be heated to a very high temperature, which can cause a burning risk when touched directly. This board is intended for use by experienced power electronics professionals who understand the precautions that must be taken to ensure that no danger or risk may occur while operating this board.
Caution: After the operation of the evaluation board, the bulk capacitor C1 (if used) may still store a high energy for several minutes. So it must be first discharged before any direct touching of the board.
Important:
To protect the bulk capacitor C1, we strongly recommended using an external brake chopper after C1 (to discharge the high brake current back from the induction motor).
UM2015 - Rev 3 page 29/35
13
UM2015
References
References
All of the following reference material is freely available on www.st.com
1.
STGIF7CH60TS-L datasheet
2.
TSV994 datasheet
3.
STTH15R06 datasheet
4.
User manual UM1052 STM32F PMSM single/dual FOC SDK v4.3
5.
Application note AN4076 Two or three shunt resistor based current sensing circuit design in 3-phase inverters
UM2015 - Rev 3 page 30/35
UM2015
Revision history
Table 10. Document revision history
Date
01-Mar-2016
Version Changes
1 Initial release.
24-May-2018 2
18-Sep-2019 3
Updated title.
Updates Figure 5. STEVAL-IPM07F circuit schematic (3 of 6)
and Figure 6. STEVAL-IPM07F circuit schematic (4 of 6)
UM2015 - Rev 3 page 31/35
UM2015
Contents
Contents
UM2015 - Rev 3 page 32/35
UM2015
List of tables
List of tables
UM2015 - Rev 3 page 33/35
UM2015
List of figures
List of figures
UM2015 - Rev 3 page 34/35
UM2015
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks . All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2019 STMicroelectronics – All rights reserved
UM2015 - Rev 3 page 35/35
Lataa
Julkinen linkki päivitetty
Chattisi julkinen linkki on päivitetty. You may view and manage your chat links after registration here.
Dokumentin julkinen linkki
Mainos