Technical data
9.3
Thermal specifications
The board is specified for an ambient temperature range of 0 °C to +60 °C (extended temperature range on request). In addition, care must be taken that the temperature of the processor die does not exceed 110 °C.
To ensure this a suitable cooling concept must be implemented that is oriented to the maximum power consumption of the processor/chipset. It must also be ensured that any existing controllers are included in the cooling concept. The power consumption of these blocks may be of the same order of magnitude as the power consumption of the processor.
The board is prepared with suitable holes for the use of modern cooling solutions. We have a series of compatible cooling components in our range. Your distributor will be pleased to assist you in selecting suitable solutions.
NOTE
Prevent the maximum die temperature being exceeded!
It is the end customer's responsibility to ensure that the die temperature of the processor does not exceed
110 °C! Continuous overheating can destroy the board!
If the temperature exceeds 110 °C, the ambient temperature needs to be reduced. Ensure sufficient air circulation if necessary.
62 Version: 0.2
CB6263
