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Master Product Selector Guide
PCI Peripheral Core
Features
• PCI V2.1 compliant
• 32-bit or 64-bit PCI Bus
• 32-bit or 64-bit Application Datapath
• 33 MHz and 66 MHz Speed Options
• Fast back-to-back Master Cycles Support
• Full Bandwidth Burst Support
• Read-only PCI Configuration Register can be optionally downloaded from an EEPROM at system start-up
• Memory Write and Invalidate Support
• Dual Address Cycles Support
Benefits
• Soft core that can be implemented in any technology
• Rigorous testing performed to ensure PCI compliance and functional correctness for a wide range of operations
• Synchronous or asynchronous application interfaces
• Internal scan and JTAG boundary scan can be inserted by customer before netlist handoff or by Fujitsu after handoff
Description
The PCI Synthesizable Core is a part of the Fujitsu IPWare™
Library. The Fujitsu PCI Cores are RTL synthesizable modules that provide an interface between an application and the PCI bus.
All PCI protocol and timing requirements are handled by the core, which is controlled through a simple application interface.
The Fujitsu PCI Cores are available in 32-bit or 64-bit bus paths on either the PCI bus or the application interface. The FIFO can be configured to different depths. Also, Fujitsu can provide these cores without any FIFOs.
The Fujitsu PCI Core family is architected for 33 MHz and 66
MHz performance, and verified through a combination of logic synthesis, floorplanning, place and route, and post layout timing verification with deep-submicron libraries.
The PCI Cores offer synchronous or asynchronous application interfaces. Asynchronous PCI Cores synchronize control and data signals between the PCI clock and an application clock, which may operate at a different frequency. The synchronous PCI Cores assume that all signals to and from the application are synchronized to the PCI clock.
The read-only register within the PCI configuration space can be optionally downloaded from an EEPROM at system startup. Information such as vendor ID, which is typically hard-coded into the chip incorporating the PCI core, can be loaded at system start.
This allows the same chip to be used in more than one system.
Deliverables
The Fujitsu family of application-optimized synthesizable PCI cores has become the de facto standard for designers who need high
PCI performance, off-the-shelf availability, and fast incorporation into ASIC designs.
Fujitsu’s application engineer works with customers and helps them select process technology that will suit the customer’s specific need. After the technology is selected, the following can be supplied to the customer:
• Encrypted RTL source codes written in Verilog and representing the entire hierarchical PCI core design
• A hierarchical gate level netlist of the PCI core
30
Fujitsu Microelectronics, Inc.
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Table of contents
- 9 Introduction
- 11 Application Specific ICs (ASICs)
- 13 CE81 Series Embedded Array (0.18µm CMOS Technology)
- 13 Features
- 13 Description
- 13 A-Series with 44µm Inline Pad Pitch and TAB
- 13 I-Series with 70µm Inline Pad Pitch
- 14 S-Series with 66µm Stagger Pad Pitch
- 14 ASIC Design Kit and EDA Support
- 15 Package Availability
- 16 CS81 Series Standard Cell (0.18µm CMOS Technology)
- 16 Features
- 16 Description
- 17 ASIC Design Kit and EDA Support
- 18 Package Availability
- 19 CE71 Series Embedded Array (0.25 µm CMOS Technology)
- 19 Features
- 19 Description
- 19 J-Series with 66µm Stagger Pad Pitch and Wire Bonding
- 20 K-Series with 88µm Inline Pad Pitch and Wire Bonding
- 20 m Inline Pad Pitch and Au Bump
- 20 T-Series with 88mm Inline Pad Pitch and Wire Bonding
- 21 ASIC Design Kit and EDA Support
- 22 Package Availability
- 23 CS71 Series Standard Cell (0.25 µm CMOS Technology)
- 23 Features
- 23 Description
- 24 ASIC Design Kit and EDA Support
- 25 Package Availability
- 26 CE66 Series Embedded Array (0.35 µm CMOS Technology)
- 26 Features
- 26 Description
- 26 m Inline Pad Pitch
- 27 ASIC Design Kit and EDA Support
- 27 Package Availability
- 28 CS66 Series Standard Cell (0.35 µm CMOS Technology)
- 28 Features
- 28 Description
- 29 Applications
- 29 ASIC Design Kit and EDA Support
- 30 Package Availability
- 31 Features
- 31 Description
- 31 E-Series, 70µm Staggered Pad Pitch, Optimized for Pad-Limited Designs
- 31 F-Series, Optimized for Core-Limited Designs
- 32 ASIC Design Kit and EDA Support
- 32 Package Availability
- 33 ARC Processor Core
- 34 Sonet STS-3c/SDH STM-1 Framer Core
- 35 ARM7TDMI™ Processor Core
- 36 UTOPIA Level II
- 38 PCI Peripheral Core
- 39 USB Function Core
- 40 USB Host Controller Core
- 41 ASIC Packaging
- 41 FC-BGA Packages
- 42 FBGA Packages
- 42 EBA Packages
- 43 FDH-BGA Packages
- 43 TAB-BGA Packages
- 44 PBGA Packages
- 44 QFP Packages
- 45 CPGA Packages
- 46 ASIC Mixed-Signal and Analog Macros
- 47 Design Support
- 49 Microcontrollers
- 50 8- and 16-bit Flexible Microcontrollers
- 50 F2MC-8L Series Features
- 50 MC-16L/16LX/16F Series Features
- 51 MC-8L/Low Power/Low Voltage Microcontrollers
- 53 MC-16L High Performance/Low Power/Low Voltage Microcontrollers
- 54 MC-16LX High Performance/Low Power Microcontrollers
- 55 MC-16F High Speed/High Performance Microcontrollers
- 56 FR Series
- 56 32-bit Flexible Microcontrollers
- 56 FR Features
- 58 Ethernet Products
- 59 Evaluation Kits
- 62 ATM Products
- 64 ADSL Products
- 64 Development Kits
- 65 Application Specific Controllers
- 66 IEEE 1394 Controller
- 68 SCSI Controllers
- 69 Wireless
- 70 SAW Filters
- 71 F5CM (B2) DMS Series (Balanced SAW Filters)
- 72 F5CE (D2) DMS Series (Dual Mode SAW Filters)
- 73 F5CH (L2) Series (Ladder SAW Filters)
- 74 F5CE/F6CE (K2) Series (Ladder SAW Filters)
- 75 F5CP/F6CP (D2) Series (Dual Mode SAW Filters)
- 76 F6CE (L2) Series (Ladder SAW Filters)
- 77 D5CC (D1) Series (Antenna Duplexer)
- 78 G5CH/G5CN/G6CH/G6CS (L2/D2) Series (Dual SAW Filters)
- 81 Single Super PLLs
- 81 The MB15C Series
- 82 The MB15S Series
- 83 Dual Super PLLs
- 83 The MB15E Series
- 84 The MB15U Series
- 85 The MB15F Series
- 86 Evaluation Kits
- 88 Prescalers
- 88 Bipolar Prescalers - 200 MHz to 2.7 GHz
- 89 High Performance CMOS Digital to Analog Converters
- 90 MB86060 Interpolating Filters
- 90 Development Kit Support
- 91 High Performance, Leading-Edge Memory
- 92 FCRAM
- 92 16 MEG SDR interface FCRAM
- 92 16 MEG SRAM interface FCRAM
- 92 16 MEG SRAM interface FCRAM with power down mode
- 93 Flash
- 93 Flash Memory Table
- 93 5V-only Flash Memory Devices – MBM29F series
- 93 3V-only Flash Memory – MBM29LV series
- 93 Dual-Operation 3V Flash Memory – MBM29DL Series
- 93 Dual-Operation 2.5V Flash Memory (2.3V to 2.7V) – MBM29DD Series
- 94 1.8V-only Flash Memory (1.8V to 2.2V) – MBM29SL series
- 94 Page Mode Devices – MBM29PL Series
- 94 NAND FLASH – MBM30 Series
- 94 3V stacked type MCP (Flash + RAM) Device – MB84VD series
- 94 2.5V stacked type MCP (Flash + RAM) Device – MB84LD series
- 95 Color Plasma Displays
- 96 Large Screen Color Plasma Components for System Integrators
- 96 42-inch Wide-VGA PDP Module
- 96 42-inch High Definition PDP Module
- 97 37-inch XGA PDP Module
- 97 Future PDP Modules
- 98 15-inch Active Matrix TFT-LCD
- 99 Advanced Packaging Technology
- 100 Chip Scale Package (CSP)
- 101 Bump Chip Carrier™ (BCC™, BCC++™)
- 101 Electrical Characteristics (Self-Inductance)
- 101 Reliability Criteria
- 101 BCC Package Family
- 102 Wafer Bumping
- 103 Single-Chip Solutions
- 103 BGA Package
- 103 FCBGA
- 105 Wafer Fab Services
- 106 CMOS Technology
- 106 Device Characteristics
- 106 Device Performance
- 106 Interconnect Characteristics
- 107 Test Capability
- 108 Representatives
- 110 Distributors