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Master Product Selector Guide
The Fujitsu MB86626 (KeyWaveAFE device) is a complete analog front end for ADSL modems. The device integrates high resolution analog to digital converters (ADC) and digital to analog converters (DAC), and combined with active filtering significantly reduces the requirements placed on external components. The architecture supports both analog and digital echo cancellation (EC). The
MB86626 KeyWaveAFE is ideal for cost sensitive Customer
Premise Equipment (CPE) and power sensitive Central Office (CO) equipment.
ADSL Products
Part No.
MB86670
Device Name
KeyWave
MB86626 KeyWave AFE
Description
Single-chip ADSL device for Remote Terminal (RT) and Central Office (CO) applications
15-bit Analog Front End (ADC & DAC )
Typical Applications
RT/ CPE and CO / DSLAM equipment.
RT/ CPE and CO / DSLAM equipment.
Development Kits
Part No.
DK86670-C
For
KeyWave – (CO application)
DK86670-R
DK86626-2
KeyWave – (CPE applications)
KeyWave AFE
Includes
ADSL modem board, supporting software, user guide, schematics, data sheet and applications notes.
ADSL modem board, supporting software, user guide, schematics, data sheet and applications notes.
AFE, transmit Amplifier, Hybrid and DSP interface, supporting software, user guide, schematics, data sheet and application notes.
Package
240-pin HQFP
80-pin LQFP
Available
Y
Y
Y
56
Fujitsu Microelectronics, Inc.
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Table of contents
- 9 Introduction
- 11 Application Specific ICs (ASICs)
- 13 CE81 Series Embedded Array (0.18µm CMOS Technology)
- 13 Features
- 13 Description
- 13 A-Series with 44µm Inline Pad Pitch and TAB
- 13 I-Series with 70µm Inline Pad Pitch
- 14 S-Series with 66µm Stagger Pad Pitch
- 14 ASIC Design Kit and EDA Support
- 15 Package Availability
- 16 CS81 Series Standard Cell (0.18µm CMOS Technology)
- 16 Features
- 16 Description
- 17 ASIC Design Kit and EDA Support
- 18 Package Availability
- 19 CE71 Series Embedded Array (0.25 µm CMOS Technology)
- 19 Features
- 19 Description
- 19 J-Series with 66µm Stagger Pad Pitch and Wire Bonding
- 20 K-Series with 88µm Inline Pad Pitch and Wire Bonding
- 20 m Inline Pad Pitch and Au Bump
- 20 T-Series with 88mm Inline Pad Pitch and Wire Bonding
- 21 ASIC Design Kit and EDA Support
- 22 Package Availability
- 23 CS71 Series Standard Cell (0.25 µm CMOS Technology)
- 23 Features
- 23 Description
- 24 ASIC Design Kit and EDA Support
- 25 Package Availability
- 26 CE66 Series Embedded Array (0.35 µm CMOS Technology)
- 26 Features
- 26 Description
- 26 m Inline Pad Pitch
- 27 ASIC Design Kit and EDA Support
- 27 Package Availability
- 28 CS66 Series Standard Cell (0.35 µm CMOS Technology)
- 28 Features
- 28 Description
- 29 Applications
- 29 ASIC Design Kit and EDA Support
- 30 Package Availability
- 31 Features
- 31 Description
- 31 E-Series, 70µm Staggered Pad Pitch, Optimized for Pad-Limited Designs
- 31 F-Series, Optimized for Core-Limited Designs
- 32 ASIC Design Kit and EDA Support
- 32 Package Availability
- 33 ARC Processor Core
- 34 Sonet STS-3c/SDH STM-1 Framer Core
- 35 ARM7TDMI™ Processor Core
- 36 UTOPIA Level II
- 38 PCI Peripheral Core
- 39 USB Function Core
- 40 USB Host Controller Core
- 41 ASIC Packaging
- 41 FC-BGA Packages
- 42 FBGA Packages
- 42 EBA Packages
- 43 FDH-BGA Packages
- 43 TAB-BGA Packages
- 44 PBGA Packages
- 44 QFP Packages
- 45 CPGA Packages
- 46 ASIC Mixed-Signal and Analog Macros
- 47 Design Support
- 49 Microcontrollers
- 50 8- and 16-bit Flexible Microcontrollers
- 50 F2MC-8L Series Features
- 50 MC-16L/16LX/16F Series Features
- 51 MC-8L/Low Power/Low Voltage Microcontrollers
- 53 MC-16L High Performance/Low Power/Low Voltage Microcontrollers
- 54 MC-16LX High Performance/Low Power Microcontrollers
- 55 MC-16F High Speed/High Performance Microcontrollers
- 56 FR Series
- 56 32-bit Flexible Microcontrollers
- 56 FR Features
- 58 Ethernet Products
- 59 Evaluation Kits
- 62 ATM Products
- 64 ADSL Products
- 64 Development Kits
- 65 Application Specific Controllers
- 66 IEEE 1394 Controller
- 68 SCSI Controllers
- 69 Wireless
- 70 SAW Filters
- 71 F5CM (B2) DMS Series (Balanced SAW Filters)
- 72 F5CE (D2) DMS Series (Dual Mode SAW Filters)
- 73 F5CH (L2) Series (Ladder SAW Filters)
- 74 F5CE/F6CE (K2) Series (Ladder SAW Filters)
- 75 F5CP/F6CP (D2) Series (Dual Mode SAW Filters)
- 76 F6CE (L2) Series (Ladder SAW Filters)
- 77 D5CC (D1) Series (Antenna Duplexer)
- 78 G5CH/G5CN/G6CH/G6CS (L2/D2) Series (Dual SAW Filters)
- 81 Single Super PLLs
- 81 The MB15C Series
- 82 The MB15S Series
- 83 Dual Super PLLs
- 83 The MB15E Series
- 84 The MB15U Series
- 85 The MB15F Series
- 86 Evaluation Kits
- 88 Prescalers
- 88 Bipolar Prescalers - 200 MHz to 2.7 GHz
- 89 High Performance CMOS Digital to Analog Converters
- 90 MB86060 Interpolating Filters
- 90 Development Kit Support
- 91 High Performance, Leading-Edge Memory
- 92 FCRAM
- 92 16 MEG SDR interface FCRAM
- 92 16 MEG SRAM interface FCRAM
- 92 16 MEG SRAM interface FCRAM with power down mode
- 93 Flash
- 93 Flash Memory Table
- 93 5V-only Flash Memory Devices – MBM29F series
- 93 3V-only Flash Memory – MBM29LV series
- 93 Dual-Operation 3V Flash Memory – MBM29DL Series
- 93 Dual-Operation 2.5V Flash Memory (2.3V to 2.7V) – MBM29DD Series
- 94 1.8V-only Flash Memory (1.8V to 2.2V) – MBM29SL series
- 94 Page Mode Devices – MBM29PL Series
- 94 NAND FLASH – MBM30 Series
- 94 3V stacked type MCP (Flash + RAM) Device – MB84VD series
- 94 2.5V stacked type MCP (Flash + RAM) Device – MB84LD series
- 95 Color Plasma Displays
- 96 Large Screen Color Plasma Components for System Integrators
- 96 42-inch Wide-VGA PDP Module
- 96 42-inch High Definition PDP Module
- 97 37-inch XGA PDP Module
- 97 Future PDP Modules
- 98 15-inch Active Matrix TFT-LCD
- 99 Advanced Packaging Technology
- 100 Chip Scale Package (CSP)
- 101 Bump Chip Carrier™ (BCC™, BCC++™)
- 101 Electrical Characteristics (Self-Inductance)
- 101 Reliability Criteria
- 101 BCC Package Family
- 102 Wafer Bumping
- 103 Single-Chip Solutions
- 103 BGA Package
- 103 FCBGA
- 105 Wafer Fab Services
- 106 CMOS Technology
- 106 Device Characteristics
- 106 Device Performance
- 106 Interconnect Characteristics
- 107 Test Capability
- 108 Representatives
- 110 Distributors