4.3. Bill of Materials. Silicon Laboratories Si2493, Si2404, Si2415, Si2434, Si2494, Si2439, Si2457, Si2443
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AN93
4.3. Bill of Materials
Component
C1, C2
C3
C4
C5, C6, C50, C52
C7
C8, C9
Value
33 pF, Y2, X7R, ±20%
10 nF, 250 V, X7R, ±20%
1.0 µF, 50 V, Elec/Tant, ±20%
0.1 µF, 16 V, X7R, ±20%
2.7 nF, 50 V, X7R, ±20%
680 pF, Y2, X7R, ±10%
Supplier(s)
Panasonic, Murata, Vishay,
Holy Stone
Venkel, SMEC
Panasonic
Venkel, SMEC
Venkel, SMEC
Panasonic, Murata, Vishay,
Holy Stone
Venkel, SMEC C10
C40
C41
C51, C53
FB1, FB2
0.01 µF, 16 V, X7R, ±20%
32.768 kHz, 18 pF, 16 V, NPO, ±5%
4.9152 MHz, 27 MHz, 33 pF, 16 V, NPO, ±5%
0.22 µF, 16 V, X7R, ±20%
Dual Diode, 225 mA, 300 V, MMBT3004S
Ferrite Bead, BLM18AG601SN1
Venkel, SMEC
Venkel, SMEC
Diodes Inc.
Murata
Q1, Q3
Q2
Q4, Q5
RV1
R1
R2
R3
R4
R5, R6
R7, R8
R9
R10
R11
R12, R13
R15, R16
NPN, 300 V, MMBTA42
PNP, 300 V, MMBTA92
NPN, 80 V, 330 mW, MMBTA06
Sidactor, 275 V, 100 A
1.07 k
, 1/2 W, 1%
150
, 1/16 W, 5%
3.65 k
, 1/2 W, 1%
2.49 k
, 1/2 W, 1%
100 k
, 1/16 W, 5%
20 M
, 1/16 W, 5%
1 M
, 1/16 W, 1%
536
, 1/4 W, 1%
73.2
, 1/2 W, 1%
56
, 1/16 W, 1%
0
, 1/16 W
Diodes Inc., Fairchild
Diodes Inc., Fairchild
Diodes Inc., Fairchild
Teccor, Protek, ST Micro
Venkel, SMEC, Panasonic
Venkel, SMEC, Panasonic
Venkel, SMEC, Panasonic
Venkel, SMEC, Panasonic
Venkel, SMEC, Panasonic
Venkel, SMEC, Panasonic
Venkel, SMEC, Panasonic
Venkel, SMEC, Panasonic
Venkel, SMEC, Panasonic
Venkel, SMEC, Panasonic
Venkel, SMEC, Panasonic
U1
U2
Y1
Si24xx ISOmodem
Si3018
32.768 kHz, 12 pF, 100 ppm, 35 k
max ESR
4.9152 MHz, 20 pF, 100 ppm, 150
ESR
27 MHz (from external clock)
Silicon Labs
Silicon Labs
ECS Inc., Siward, Abracon
Z1 Zener Diode, 43 V, 1/2 W, BZT84C43 On Semi
Notes:
1. C52 and C53 should not be populated with the Si2493 16-pin package option.
2. Several diode bridge configurations are acceptable. For example, a single DF04S or four 1N4004 diodes may be used.
3. Murata BLM18AG601SN1 may be substituted for R15–R16 (0
) to decrease emissions.
4. To ensure compliance with ITU specifications, frequency tolerance must be less than 100 ppm including initial accuracy, 5-year aging, 0 to 70 °C, and capacitive loading. For optimal V.92 PCM upstream performance, the recommended crystal accuracy is ±25 ppm.
Rev. 1.41
51
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Table of contents
- 1 1. Introduction
- 9 1.1. Selection Guide
- 11 2. Modem (System-Side) Device
- 11 2.1. Resetting the Device
- 11 2.1.1. Reset Sequence
- 12 2.1.2. Reset Strapping: General Considerations
- 13 2.1.3. Reset-Strap Options for 16-Pin SOIC Package
- 13 2.1.4. Reset-Strap Options for 24-Pin TSSOP Package
- 14 2.1.4.1. Reset Strapping Options for TSSOP-24 with UART-Interface
- 14 2.1.4.2. Reset Strapping Options for TSSOP-24 with Parallel-Interface
- 15 2.1.4.3. Reset Strapping Options for TSSOP with SPI-Interface
- 15 2.1.5. Reset Strapping Options for QFN Parts
- 15 2.1.5.1. Reset Strapping Options for QFN Parts with UART Operation
- 16 2.1.5.2. Reset Strapping Options for QFN Parts with SPI Operation
- 16 2.1.5.3. Reset Strapping Options for QFN Parts with Parallel Operation
- 17 2.2. System Interface
- 17 2.2.1. Interface Selection
- 19 2.2.2. Interface Signal Description
- 19 2.2.3. UART Interface Operation
- 19 2.2.3.1. UART Options
- 20 2.2.3.2. Autobaud
- 21 2.2.3.3. Flow Control
- 23 2.2.4. Parallel and SPI Interface Operation
- 25 2.2.4.1. Hardware Interface Register
- 25 2.2.4.2. Hardware Interface Register
- 26 2.2.4.3. Parallel Interface Operation
- 28 2.2.4.4. SPI Interface Operation
- 28 2.2.4.5. Interface Communication Modes
- 29 2.3. Isolation Capacitor Interface
- 29 2.4. Low-Power Modes
- 29 2.4.1. Power-Down Mode
- 29 2.4.2. Wake-on-Ring Mode
- 29 2.4.3. Sleep Mode
- 30 2.5. Controlling GPIOs (38-Pin QFN Only)
- 33 2.6. SSI/Voice Mode (24-Pin TSSOP and 38-Pin QFN Only)
- 34 2.7. EEPROM Interface (24-Pin TSSOP and 38-Pin QFN Only)
- 34 2.7.1. Supported EEPROM Types
- 36 2.7.2. Three-Wire SPI Interface to EEPROM
- 36 2.7.3. Detailed EEPROM Examples
- 36 2.7.4. Boot Commands (Custom Defaults)
- 37 2.7.5. AT Command Macros (Customized AT Commands)
- 37 2.7.6. Firmware Upgrades
- 37 2.7.6.1. Boot Command Example
- 38 2.7.6.2. AT Command Macro Example
- 38 2.7.6.3. Autoloading Firmware Upgrade Example
- 39 2.7.6.4. Combination Example
- 41 3. DAA (Line-Side) Device
- 41 3.1. Hookswitch and DC Termination
- 42 3.2. AC Termination
- 42 3.3. Ringer Impedance and Threshold
- 42 3.4. Pulse Dialing and Spark Quenching
- 42 3.5. Line Voltage and Loop Current Sensing
- 45 3.6. Legacy-Mode Line Voltage and Loop Current Measurement
- 45 3.7. Billing Tone Detection
- 46 4. Hardware Design Reference
- 46 4.1. Component Functions
- 46 4.1.1. Power Supply and Bias Circuitry
- 46 4.1.2. Hookswitch and DC Termination
- 46 4.1.3. Clocks
- 47 4.1.4. Ringer Network
- 47 4.1.5. Optional Billing-Tone Filter
- 50 4.2. Schematic
- 51 4.3. Bill of Materials
- 52 4.4. Layout Guidelines
- 54 4.4.1. ISOmodem Layout Check List
- 57 4.4.2. Module Design and Application Considerations
- 57 4.4.2.1. Module Design
- 57 4.4.2.2. Motherboard Design
- 58 4.5. Analog Output
- 58 Required Modem Reset Time
- 59 4.5.2. Audio Quality
- 59 4.5.3. Power Dissipation in the Si3018 DAA
- 61 5. Modem Reference Guide
- 61 5.1. Controller
- 62 5.2. DSP
- 62 5.3. Memory
- 62 5.4. AT Command Set
- 83 5.5. Extended AT Commands
- 95 5.6. S Registers
- 98 5.7. U Registers
- 103 5.7.1. U-Register Summary
- 104 5.7.2. U00–U16 (Dial Tone Detect Filter Registers)
- 105 5.7.3. U17–U30 (Busy Tone Detect Filter Registers)
- 108 5.7.4. U31–U33 (Ringback Cadence Registers)
- 108 5.7.5. U34–U35 (Dial Tone Timing Register)
- 108 5.7.6. U37–U45 (Pulse Dial Registers)
- 109 5.7.7. U46–U48 (DTMF Dial Registers)
- 110 5.7.8. U49–U4C (Ring Detect Registers)
- 110 5.7.9. U4D (Modem Control Register 1—MOD1)
- 112 5.7.10. U4E (Pre-Dial Delay Time Register)
- 112 5.7.11. U4F (Flash Hook Time Register)
- 112 5.7.12. U50–U51 (Loop Current Debouncing Registers)
- 112 5.7.13. U52 (Transmit Level Register)
- 113 5.7.14. U53 (Modem Control Register 2)
- 113 5.7.15. U54 (Calibration Timing Register)
- 113 5.7.16. U62–U66 (DAA Control Registers)
- 115 5.7.17. U67–U6A (International Configuration Registers)
- 119 5.7.18. U6C (Line-Voltage Status Register)
- 119 5.7.19. U6E–U7D (Modem Control and Interface Registers)
- 129 5.7.20. U80 (Transmit Delay for V.22 Fast Connect)
- 130 5.7.21. U87 (Synchronous Access Mode Configuration Register)
- 131 5.7.22. UAA (V.29 Mode Register)
- 133 5.8. Firmware Upgrades
- 133 5.8.1. Method 1 (Fastest)
- 133 5.8.2. Method
- 133 5.8.3. Method
- 134 5.9. Escape Methods
- 134 5.9.1. +++ Escape
- 135 5.9.2. “9th Bit” Escape
- 135 5.9.3. “Escape Pin” Escape
- 136 5.10. Data Compression
- 136 5.11. Error Correction
- 136 5.12. Wire Mode
- 137 5.13. EPOS (Electronic Point of Sale) Applications
- 137 5.13.1. EPOS Fast Connect
- 137 5.13.2. EPOS V.29 Fast Connect
- 137 5.14. Legacy Synchronous DCE Mode/V.80 Synchronous Access Mode
- 138 5.15. V.80 Mode
- 144 6. Programming Examples
- 144 6.1. Quick Reference
- 145 6.2. Country-Dependent Setup
- 145 6.2.1. DC Termination
- 146 6.2.2. Country Configuration
- 146 6.2.2.1. Country Initialization Table
- 157 6.2.2.2. Country-Setting Register Tables
- 158 6.2.2.3. Special Requirements for Serbia and Montenegro
- 159 6.2.3. Blacklisting
- 159 6.3. Caller ID
- 160 6.3.1. Force Caller ID Monitor (Always On)
- 160 6.3.2. Caller ID After Ring Only
- 160 6.3.3. UK Caller ID with Wetting Pulse
- 160 6.3.4. Japan Caller ID
- 160 6.3.5. DTMF Caller ID
- 161 6.4. SMS Support
- 163 6.5. Type II Caller ID/SAS Detection
- 173 6.6. Intrusion/Parallel Phone Detection
- 173 6.6.1. On-Hook Condition
- 173 6.6.1.1. Line Not Present/In Use Indication (Method 1—Fixed)
- 174 6.6.1.2. Line Not Present/In Use Indication (Method 2—Adaptive)
- 174 6.6.2. Intrusion Explanation
- 176 6.7. Modem-On-Hold
- 176 6.7.1. Initiating Modem-On-Hold
- 177 6.7.2. Receiving Modem-On-Hold Requests
- 177 6.8. HDLC: Bit Errors on a Noisy Line
- 181 6.9. Overcurrent Detection
- 181 6.10. Pulse/Tone Dial Decision
- 182 6.10.3. Method 3: Adaptive Dialing
- 182 6.10.4. Automatic Phone-Line Configuration Detection
- 182 6.10.5. Line Type Determination
- 183 6.11. Telephone Voting Mode
- 183 6.12. V.92 Quick Connect
- 184 6.13. Abort the Dialing Operation in Voice Mode
- 185 7. Handset, TAM, and Speakerphone Operation
- 185 7.1. Software Reference
- 185 7.1.1. AT Command Set
- 185 7.1.2. AT+ Extended Commands
-
190
7.1.3.
Commands (DTE-to-DCE) -
191
7.1.4.
Events (DCE-to-DTE) - 191 7.1.4.1. Simple Event Reporting
- 193 7.1.4.2. Complex Event Reporting
- 193 7.1.5. U Registers
- 199 7.2. Voice Reference—Overview
- 199 7.2.1. Abort the Dialing Operation in Voice Mode
- 204 7.3. Si3000 Configuration
- 204 7.3.1. Microphone and Speaker Ports
- 204 7.3.2. Register Settings
- 204 7.3.3. System Voice Modes
- 204 7.3.3.1. TAM Hands-Free
- 204 7.3.3.2. TAM Handset
- 204 7.3.3.3. Speakerphone
- 204 7.3.3.4. Handset
- 204 7.3.3.5. Si3000 Control Register Overview
- 206 7.3.3.6. TAM PSTN
- 207 7.4. Initialization
- 209 7.5. Handset
- 209 7.5.1. Overview
- 209 7.5.2. Handset Configuration
- 211 7.5.3. Call – Automatic Tone Dial
- 211 7.5.4. Call – Manual Off-Hook Tone Dial
- 211 7.5.5. Call – Automatic Pulse Dial
- 211 7.5.6. Answer
- 212 7.5.7. Terminate
- 213 7.5.8. Speakerphone Transition
- 214 7.6. Telephone Answering Machine
- 214 7.6.1. Overview
- 214 7.6.2. TAM Hands-Free—Idle
- 215 7.6.2.1. Record OGM
- 216 7.6.2.2. Review OGM
- 216 7.6.2.3. Record Local ICM
- 216 7.6.2.4. Review ICM
- 216 7.6.2.5. Speakerphone Transition
- 216 7.6.2.6. Handset Transition
- 216 7.6.3. TAM Handset
- 216 7.6.3.1. Record OGM
- 219 7.6.3.2. Review OGM
- 221 7.6.3.3. Record Local ICM
- 221 7.6.3.4. Review ICM
- 221 7.6.4. TAM PSTN
- 221 7.6.4.1. Normal Answer – OGM Playback with ICM Record
- 223 7.6.4.2. Interrupted Answer – OGM Playback with DTMF Menu Entry
- 225 7.6.4.3. Speakerphone Transition
- 225 7.6.4.4. Handset Transition
- 225 7.7. Speakerphone
- 225 7.7.1. Overview
- 225 7.7.2. External Microphone/Speaker Calibration
- 225 7.7.2.1. Transmit Gain Calibration—Speakerphone Disabled
- 228 7.7.2.2. Receive Gain Calibration—Speakerphone Disabled
- 229 7.7.2.3. Speakerphone Calibration—AEC Gain Calibration
- 231 7.7.3. Speakerphone Configuration
- 232 7.7.4. Simplex Speakerphone Configuration
- 233 7.7.5. Call—Automatic Tone Dial
- 233 7.7.6. Call—Manual Off-Hook Tone Dial
- 234 7.7.7. Call—Automatic Pulse Dial
- 234 7.7.8. Answer
- 234 7.7.9. Handset Transition
- 235 7.7.10. Termination
- 235 7.8. Glossary
- 235 7.9. References
- 236 8. Security Protocols
- 236 8.1. Implementing the SIA Protocol
- 236 8.1.1. Modem-Specific Implementation Details
- 236 8.1.1.1. Listen-In and V-channel Periods (Voice Pass-Through)
- 236 8.1.1.2. Inserting a V.32bis period (e.g., SIA Level-3 Video Block Support)
- 237 8.1.1.3. Considerations when Disconnecting the Session
- 240 8.2. Implementing the Ademco® Contact ID Protocol
- 241 8.2.1. Modem Specific Implementation Details
- 242 8.2.1.1. Handshake Tone Detection
- 242 8.2.1.2. Session Example
- 244 9. Chinese ePOS SMS
- 244 9.1. Introduction
- 245 9.2. SMS AT Command Set
- 248 9.2.1. SMS User Registers
- 249 9.2.2. Procedure
- 250 9.2.2.1. Example
- 251 9.2.2.2. Response
- 251 9.2.2.3. Response
- 251 9.2.2.4. Response
- 252 9.3. Example Session
- 255 10. Testing and Diagnostics
- 255 10.1. Prototype Bring-Up (Si3018/10)
- 255 10.1.1. Introduction
- 255 10.1.2. Visual Inspection
- 255 10.1.3. Basic Troubleshooting Steps
- 257 10.1.4. Host Interface Troubleshooting
- 257 10.1.5. Isolation Capacitor Troubleshooting
- 257 10.1.6. Si3018/10 Troubleshooting
- 257 10.1.7. Component Troubleshooting
- 262 10.2. Self Test
- 263 10.3. Board Test
- 265 10.4. Compliance Testing
- 266 10.4.1. EMI
- 267 10.4.2. Safety
- 267 10.4.3. Surges
- 268 10.5. AM-Band Interference
- 269 10.6. Debugging the DTE interface
- 270 Appendix A—EPOS Applications
- 270 VISA II (7E1)
- 271 Recommendation V
- 273 The ISOmodem in EPOS Applications
- 274 A V.29 FastPOS Sample Program
- 286 Appendix B—Line Audio Recording
- 286 When to Use Audio Recording
- 286 Times When Audio Recording May Not Help
- 286 Hardware Setup
- 288 Audio Playback and Analysis
- 297 Examples of Line Impairments
- 302 Appendix C—Parallel/SPI Interface Software Implementation
- 303 Software Description
- 306 Document Change List