STMicroelectronics VN750-E Datasheet

VN750-E
High-side driver
Datasheet − production data
Features
Type
VN750-E
VN750PT-E
VN750B5-E
VN750-12-E
RDS(on)
IOUT
VCC
60 mΩ
6A
36 V
3(17$: $77
*$3*5,
3(17$:$77
LQOLQH
*$3*5,
■
ECOPACK®: lead free and RoHS compliant
■
Automotive Grade: compliance with AEC
guidelines
3 3$.
33$ .
■
CMOS compatible input
■
On-state open-load detection
■
Off-state open-load detection
■
Shorted load protection
Description
■
Undervoltage and overvoltage shutdown
■
Protection against loss of ground
■
Very low standby current
■
Reverse battery protection
The VN750-E is a monolithic device designed in
STMicroelectronics® VIPower® M0-3 technology
intended for driving any kind of load with one side
connected to ground.
*$3*5,
*$3*5,
Active VCC pin voltage clamp protects the device
against low energy spikes (see ISO7637 transient
compatibility table). Active current limitation
combined with thermal shutdown and automatic
restart help protect the device against overload.
The device detects open load condition in
on-state and off-state. Output shorted to VCC is
detected in the off-state. Device automatically
turns off in case of ground pin disconnection.
Table 1.
Device summary
Order codes
Package
Tube
Tape and reel
PENTAWATT
VN750-E
-
P2PAK
VN750B5-E
VN750B5TR-E
PPAK
VN750PT-E
VN750PTTR-E
PENTAWATT in-line
VN750-12-E
-
September 2013
This is information on a product in full production.
Doc ID 10891 Rev 7
1/38
www.st.com
1
Contents
VN750-E
Contents
1
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3
4
2.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.4
Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.5
GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 16
2.5.1
Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 16
2.5.2
Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 17
2.6
Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.7
Microcontroller I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.8
Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.9
PPAK/P2PAK maximum demagnetization energy (VCC=13.5V) . . . . . . . 19
Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.1
P2PAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.2
PPAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.1
ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.2
PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.2.1
5
2/38
PENTAWATT (in-line) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . 27
2
4.3
P PAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.4
PPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.5
PENTAWATT packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.6
P2PAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.7
PPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Doc ID 10891 Rev 7
VN750-E
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Electrical transient requirements on VCC pin (part 1/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Electrical transient requirements on VCC pin (part 2/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Electrical transient requirements on VCC pin (part 3/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
P2PAK thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
PPAK thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
PENTAWATT (in-line) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
P2PAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
PPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Doc ID 10891 Rev 7
3/38
List of figures
VN750-E
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
Figure 37.
Figure 38.
Figure 39.
Figure 40.
Figure 41.
Figure 42.
Figure 43.
Figure 44.
4/38
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
On-state resistance Vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
On-state resistance Vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Open-load on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Open-load off-state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Ilim Vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
PPAK /P2PAK maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . 19
P2PAK PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
P2PAK Rthj-amb Vs. PCB copper area in open box free air condition . . . . . . . . . . . . . . . 20
P2PAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 21
P2PAK thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
PPAK PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
PPAK Rthj-amb Vs. PCB copper area in open box free air condition . . . . . . . . . . . . . . . . 23
PPAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 23
PPAK thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
PENTAWATT package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
PENTAWATT (in-line) package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
P2PAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
PPAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
PENTAWATT tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
P2PAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
P2PAK tape and reel (suffix “13TR”). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
PPAK suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
PPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
PPAK tape and reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Doc ID 10891 Rev 7
VN750-E
1
Block diagram and pin description
Block diagram and pin description
Figure 1.
Block diagram
9 &&
29(592/7$*(
'(7(&7,21
9 &&
&ODPS
81'(592/7$*(
'(7(&7,21
*1'
3RZHU &/$03
'5,9(5 ,1387
287387
/2*,&
&855(17
/,0,7(5
21 67$7( 23(1/2$'
'(7(&7,21
67$786 29(57(03(5$785(
'(7(&7,21
2)) 67$7( 23(1/2$'
$1' 287387 6+257(' 72 9 &&
'(7(&7,21
*$3*5,
Figure 2.
Configuration diagram (top view)
287387
67$786
9&&
,1387
*1'
33$.33$.
3(17$:$77
*$3*5,
*$3*5,
Table 2.
Suggested connections for unused and not connected pins
Connection/pin
Status
N.C.
Output
Input
Floating
X
X
X
X
To ground
X
Doc ID 10891 Rev 7
Through 10 KΩ resistor
5/38
Electrical specifications
2
VN750-E
Electrical specifications
Figure 3.
Current and voltage conventions
,6
9)
,,1
,1387
9&&
,67$7
,287
67$786
9&&
287387
*1'
9,1
967$7
9287
,*1'
*$3*5,
2.1
Absolute maximum ratings
Stress values that exceed those listed in the “Absolute maximum ratings” table can cause
permanent damage to the device. These are stress ratings only, and operation of the device
at these, or any other conditions greater than those, indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics sure
program and other relevant quality documents.
Table 3.
Absolute maximum ratings
Value
Symbol
Parameter
P2PAK
PENTAWATT
VCC
41
V
- VCC
Reverse DC supply voltage
- 0.3
V
- Ignd
DC reverse ground pin current
- 200
mA
IOUT
DC output current
Internally limited
A
-6
A
- IOUT
6/38
DC supply voltage
Unit
PPAK
Reverse DC output current
IIN
DC input current
+/- 10
mA
ISTAT
DC status current
+/- 10
mA
VESD
Electrostatic discharge
(human body model: R=1.5 KΩ;
C=100pF)
- Input
- Status
- Output
- VCC
4000
4000
5000
5000
V
V
V
V
Doc ID 10891 Rev 7
VN750-E
Electrical specifications
Table 3.
Absolute maximum ratings (continued)
Value
Symbol
Parameter
PENTAWATT
EMAX
Ptot
138
138
mJ
60
W
Internally limited
°C
Tj
Junction operating temperature
Tc
Case operating temperature
- 40 to 150
°C
Storage temperature
- 55 to 150
°C
Tstg
2.2
PPAK
Maximum switching energy
(L=2.46 mH; RL=0 Ω; Vbat=13.5 V;
Tjstart=150 °C; IL=9 A)
Power dissipation TC=25°C
Unit
P2PAK
Thermal data
Table 4.
Thermal data
Max. value
Symbol
Parameter
Unit
PENTAWATT
P2PAK
PPAK
Rthj-case
Thermal resistance junction-case
2.1
2.1
2.1
°C/W
Rthj-lead
Thermal resistance junction-lead
-
-
-
°C/W
62.1
52.1(1)
77.1(1)
°C/W
62.1
37(2)
44(2)
°C/W
Rthj-amb
Thermal resistance junction-ambient
1. When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35µm thick). Horizontal
mounting and no artificial air flow.
2. When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35µm thick). Horizontal
mounting and no artificial air flow.
2.3
Electrical characteristics
Values specified in this section are for 8 V<VCC<36 V; -40 °C< Tj <150 °C, unless otherwise
stated.
Table 5.
Symbol
Electrical characteristics
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Power
VCC
Operating supply voltage
5.5
13
36
V
VUSD
Undervoltage shutdown
3
4
5.5
V
VUSDhyst
Undervoltage shutdown
hysteresis
VOV
Overvoltage shutdown
RON
On-state resistance
0.5
V
36
IOUT=2 A; Tj=25 °C; VCC> 8 V
IOUT=2 A; VCC>8 V
Doc ID 10891 Rev 7
V
60
120
mΩ
mΩ
7/38
Electrical specifications
Table 5.
Electrical characteristics (continued)
Symbol
IS
VN750-E
Parameter
Supply current
Test conditions
Min.
Typ.
Max.
Unit
10
10
25
20
µA
µA
2
3.5
mA
0
50
µA
-75
0
µA
Off-state; VCC=13 V; VIN=VOUT=0 V
Off-state; VCC=13 V; VIN=VOUT=0 V;
Tj=25 °C
On-state; VCC=13 V; VIN=5 V;
IOUT=0 A
IL(off1)
Off-state output current
VIN=VOUT=0 V
IL(off2)
Off-state output current
VIN=0V; VOUT=3.5 V
IL(off3)
Off-state output current
VIN=VOUT=0 V; Vcc=13 V; Tj =125 °C
5
µA
IL(off4)
Off-state output current
VIN=VOUT=0 V; Vcc=13 V; Tj =25 °C
3
µA
Switching (VCC=13 V)
td(on)
Turn-on delay time
RL=6.5 Ω from VIN rising edge to
VOUT=1.3 V
40
µs
td(off)
Turn-off delay time
RL=6.5 Ω from VIN falling edge to
VOUT=11.7 V
30
µs
dVOUT/dt(on) Turn-on voltage slope
RL=6.5 Ω from VOUT=1.3 V to
VOUT=10.4 V
See Figure 21.
V/µs
dVOUT/dt(off) Turn-off voltage slope
RL=6.5 Ω from VOUT=11.7 V to
VOUT=1.3 V
See Figure 22.
V/µs
Input pin
VIL
Input low level
IIL
Low level input current
VIH
Input high level
IIH
High level input current
Vhyst
Input hysteresis voltage
VICL
Input clamp voltage
1.25
VIN=1.25 V
1
µA
3.25
V
VIN=3.25 V
10
0.5
IIN=1 mA
IIN=-1 mA
V
6
µA
V
6.8
-0.7
8
V
V
0.6
V
VCC output diode
VF
Forward on voltage
-IOUT=1.3 A; Tj=150 °C
Status pin
VSTAT
Status low output voltage ISTAT=1.6 mA
0.5
V
ILSTAT
Status leakage current
Normal operation; VSTAT=5 V
10
µA
CSTAT
Status pin input
capacitance
Normal operation; VSTAT=5 V
100
pF
VSCL
Status clamp voltage
ISTAT=1mA
ISTAT=-1mA
6
6.8
-0.7
8
V
V
150
175
200
°C
Protections(1)
TTSD
8/38
Shutdown temperature
Doc ID 10891 Rev 7
VN750-E
Table 5.
Electrical specifications
Electrical characteristics (continued)
Symbol
Parameter
Test conditions
Min.
TR
Reset temperature
135
Thyst
Thermal hysteresis
7
tSDL
Status delay in overload
condition
Tj>Tjsh
Ilim
Current limitation
9 V<VCC<36 V
5 V<VCC<36 V
Turn-off output clamp
voltage
IOUT=2 A; VIN=0 V; L=6 mH
Vdemag
Typ.
Max.
Unit
°C
15
6
°C
9
20
ms
15
15
A
A
VCC-41 VCC-48 VCC-55
V
Open-load detection
IOL
Open-load on state
detection threshold
VIN= 5 V
tDOL(on)
Open-load on state
detection delay
IOUT= 0 A
VOL
Open-load off state
voltage detection
threshold
VIN= 0 V
tDOL(off)
Open-load detection
delay at turn-off
50
200
mA
200
µs
3.5
V
1000
µs
1.5
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals
must be used together with a proper software strategy. If the device operates under abnormal conditions this software must
limit the duration and number of activation cycles.
Figure 4.
Status timings
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Doc ID 10891 Rev 7
9/38
Electrical specifications
Figure 5.
VN750-E
Switching time waveforms
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Table 6.
Truth table
Conditions
Input
Output
Status
Normal operation
L
H
L
H
H
H
Current limitation
L
H
H
L
X
X
H
(Tj < TTSD) H
(Tj > TTSD) L
Over temperature
L
H
L
L
H
L
Undervoltage
L
H
L
L
X
X
Overvoltage
L
H
L
L
H
H
Output voltage > VOL
L
H
H
H
L
H
Output current < IOL
L
H
L
H
H
L
Table 7.
Electrical transient requirements on VCC pin (part 1/3)
Test levels
ISO T/R 7637/1
10/38
test pulse
I
II
III
IV
Delays and
impedance
1
-25 V
-50 V
-75 V
-100 V
2 ms 10 Ω
2
+25 V
+50 V
+75 V
+100 V
0.2 ms 10 Ω
3a
-25 V
-50 V
-100 V
-150 V
0.1 µs 50 Ω
Doc ID 10891 Rev 7
VN750-E
Electrical specifications
Table 7.
Electrical transient requirements on VCC pin (part 1/3) (continued)
Test levels
ISO T/R 7637/1
test pulse
I
II
III
IV
Delays and
impedance
3b
+25 V
+50 V
+75 V
+100 V
0.1 µs 50 Ω
4
-4 V
-5 V
-6 V
-7 V
100 ms, 0.01 Ω
5
+26.5 V
+46.5 V
+66.5 V
+86.5 V
400 ms, 2 Ω
Table 8.
Electrical transient requirements on VCC pin (part 2/3)
Test levels results
ISO T/R 7637/1
test pulse
I
II
III
IV
1
C
C
C
C
2
C
C
C
C
3a
C
C
C
C
3b
C
C
C
C
4
C
C
C
C
5
C
E
E
E
Table 9.
Class
Electrical transient requirements on VCC pin (part 3/3)
Contents
C
All functions of the device are performed as designed after exposure to disturbance.
E
One or more functions of the device is not performed as designed after exposure to
disturbance and cannot be returned to proper operation without replacing the device.
Doc ID 10891 Rev 7
11/38
Electrical specifications
Figure 6.
VN750-E
Waveforms
NORMAL OPERATION
INPUT
LOAD VOLTAGE
STATUS
UNDERVOLTAGE
VUSDhyst
VCC
VUSD
INPUT
LOAD VOLTAGE
STATUS
undefined
OVERVOLTAGE
VCC<VOV
VCC>VOV
VCC
INPUT
LOAD VOLTAGE
STATUS
OPEN LOAD with external pull-up
INPUT
VOUT>VOL
LOAD VOLTAGE
VOL
STATUS
OPEN LOAD without external pull-up
INPUT
LOAD VOLTAGE
STATUS
Tj
TTSD
TR
OVERTEMPERATURE
INPUT
LOAD CURRENT
STATUS
12/38
Doc ID 10891 Rev 7
VN750-E
2.4
Electrical specifications
Electrical characteristics curves
Figure 7.
Off-state output current
Figure 8.
High level input current
Iih (uA)
IL(off1) (uA)
7
3
2.5
6
Off state
Vcc=36V
Vin=Vout=0V
2
Vin=3.25V
5
1.5
4
1
3
0.5
2
0
1
-0.5
-1
0
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
Tc (ºC)
Figure 9.
50
75
100
125
150
175
Tc (ºC)
Input clamp voltage
Figure 10. Status leakage current
Ilstat (uA)
Vicl (V)
8
0.05
7.8
Iin=1mA
0.04
7.6
Vstat=5V
7.4
0.03
7.2
7
0.02
6.8
6.6
0.01
6.4
6.2
0
6
-50
-25
0
25
50
75
100
125
150
-50
175
-25
0
25
Figure 11.
50
75
100
125
150
175
Tc (°C)
Tc (°C)
Status low output voltage
Figure 12. Status clamp voltage
Vstat (V)
Vscl (V)
0.6
8
7.8
Istat=1mA
0.5
7.6
Istat=1.6mA
7.4
0.4
7.2
7
0.3
6.8
0.2
6.6
6.4
0.1
6.2
0
6
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
Tc (ºC)
Doc ID 10891 Rev 7
13/38
Electrical specifications
VN750-E
Figure 13. On-state resistance Vs Tcase
Figure 14. On-state resistance Vs VCC
Ron (mOhm)
Ron (mOhm)
140
120
110
120
Iout=2A
Iout=2A
Vcc=8V; 13V; 36V
100
100
Tc= 150°C
90
80
80
Tc= 125°C
70
60
60
50
40
Tc= 25°C
40
Tc= - 40°C
20
30
0
20
-50
-25
0
25
50
75
100
125
150
175
5
10
15
20
Tc (ºC)
25
30
35
40
Vcc (V)
Figure 15. Open-load on-state detection Figure 16. Input high level
threshold
Iol (mA)
Vih (V)
220
3.6
200
3.4
Vcc=13V
Vin=5V
180
3.2
160
140
3
120
2.8
100
2.6
80
60
2.4
40
2.2
20
0
2
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
Tc (ºC)
50
75
100
125
150
175
Tc (ºC)
Figure 17. Input low level
Figure 18. Input hysteresis voltage
Vil (V)
Vhyst (V)
2.8
1.5
2.6
1.4
1.3
2.4
1.2
2.2
1.1
2
1
1.8
0.9
1.6
0.8
1.4
0.7
1.2
0.6
1
0.5
-50
-25
0
25
50
75
100
125
150
175
Tc (ºC)
14/38
-50
-25
0
25
50
75
Tc (ºC)
Doc ID 10891 Rev 7
100
125
150
175
VN750-E
Electrical specifications
Figure 19. Overvoltage shutdown
Figure 20. Open-load off-state voltage
detection threshold
Vol (V)
Vov (V)
5
50
48
4.5
Vin=0V
46
4
44
3.5
42
40
3
38
2.5
36
2
34
1.5
32
30
1
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
Tc (°C)
50
75
100
125
150
175
Tc (ºC)
Figure 21. Turn-on voltage slope
Figure 22. Turn-off voltage slope
dVout/dt/(on) (V/ms)
dVout/dt(off) (V/ms)
1000
500
900
450
Vcc=13V
Rl=6.5Ohm
800
Vcc=13V
Rl=6.5Ohm
400
700
350
600
300
500
250
400
200
300
150
200
100
100
50
0
0
-50
-25
0
25
50
75
100
125
150
175
Tc (ºC)
-50
-25
0
25
50
75
100
125
150
175
Tc (ºC)
Figure 23. Ilim Vs Tcase
Ilim (A)
20
18
Vcc=13V
16
14
12
10
8
6
4
2
0
-50
-25
0
25
50
75
100
125
150
175
Tc (ºC)
Doc ID 10891 Rev 7
15/38
Electrical specifications
VN750-E
Figure 24. Application schematic
9
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2.5
GND protection network against reverse battery
2.5.1
Solution 1: resistor in the ground line (RGND only)
This can be used with any type of load.
The following is an indication on how to size the RGND resistor.
1.
RGND ≤ 600mV / (IS(on)max).
2.
RGND ≥ (−VCC) / (-IGND)
where -IGND is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device datasheet.
Power Dissipation in RGND (when VCC<0: during reverse battery situations) is:
PD= (-VCC)2/RGND
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the
maximum on-state currents of the different devices.
Please note that if the microprocessor ground is not shared by the device ground then the
RGND produces a shift (IS(on)max * RGND) in the input thresholds and the status output
values. This shift varies depending on how many devices are ON in case of several high
side drivers sharing the same RGND.
If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then ST suggests to utilize Solution 2 (2.5.2: Solution 2: diode (DGND) in
the ground line).
16/38
Doc ID 10891 Rev 7
VN750-E
2.5.2
Electrical specifications
Solution 2: diode (DGND) in the ground line
A resistor (RGND=1 kΩ) should be inserted in parallel to DGND if the device drives an
inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this
case, the presence of the ground network produces a shift (≈600mV) in the input threshold
and in the status output values if the microprocessor ground is not common to the device
ground. This shift does not vary if more than one HSD shares the same diode/resistor
network.
Series resistor in input and status lines are also required to prevent that, during battery
voltage transient, the current exceeds the absolute maximum rating.
The safest configuration for unused input and status pin is to leave them unconnected.
2.6
Load dump protection
Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the
VCC max DC rating. The same applies if the device is subject to transients on the VCC line
that are greater than the ones shown in the ISO 7637-2: 2004(E) table.
2.7
Microcontroller I/Os protection
If a ground protection network is used and negative transient are present on the VCC line,
the control pins are pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent
the µC I/Os pins to latch-up.
The value of these resistors is a compromise between the leakage current of µC and the
current required by the HSD I/Os (Input levels compatibility) with from latching-up limit of µC
I/Os.
-VCCpeak/Ilatchup ≤ Rprot ≤ (VOHµC-VIH-VGND) / IIHmax
Calculation example:
For VCCpeak= - 100 V and Ilatchup ≥ 20 mA; VOHµC ≥ 4.5 V
5 kΩ ≤ Rprot ≤ 65 kΩ.
Recommended values: Rprot =10 kΩ.
2.8
Open-load detection in off-state
Off-state open-load detection requires an external pull-up resistor (RPU) connected between
output pin and a positive supply voltage (VPU) like the +5 V line used to supply the
microprocessor.
The external resistor has to be selected according to the following requirements:
1.
no false open-load indication when load is connected: in this case we have to avoid
VOUT to be higher than VOlmin; this results in the following condition
VOUT=(VPU/(RL+RPU))RL<VOlmin.
2.
no misdetection when load is disconnected: in this case the VOUT has to be higher than
VOLmax; this results in the following condition RPU<(VPU–VOLmax)/IL(off2).
Doc ID 10891 Rev 7
17/38
Electrical specifications
VN750-E
Because Is(OFF) may significantly increase if Vout is pulled high (up to several mA), the pullup resistor RPU should be connected to a supply that is switched off when the module is in
standby.
The values of VOLmin, VOLmax and IL(off2) are available in the electrical characteristics
section.
Figure 25. Open-load detection in off-state
V batt.
VPU
VCC
RPU
INPUT
DRIVER
+
LOGIC
IL(off2)
OUT
+
R
STATUS
VOL
GROUND
18/38
Doc ID 10891 Rev 7
RL
VN750-E
2.9
Electrical specifications
PPAK/P2PAK maximum demagnetization energy (VCC=13.5V)
Figure 26. PPAK /P2PAK maximum turn-off current versus inductance
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Values are generated with RL =0 Ω.In case of repetitive pulses, Tjstart (at the beginning of
each demagnetization) of every pulse must not exceed the temperature specified above for
curves A and B.
Doc ID 10891 Rev 7
19/38
Package and PCB thermal data
VN750-E
3
Package and PCB thermal data
3.1
P2PAK thermal data
Figure 27. P2PAK PC board
GAPGRI00194
Note:
Layout condition of Rth and Zth measurements (PCB FR4 area = 60 mm x 60 mm, PCB
thickness = 2 mm, Cu thickness=35 µm, Copper areas: 0.97 cm2, 8 cm2).
Figure 28. P2PAK Rthj-amb Vs. PCB copper area in open box free air condition
57+MBDPEƒ&:
7M7DPE ƒ&
3&%&XKHDWVLQNDUHDFPA
*$3*5,
20/38
Doc ID 10891 Rev 7
VN750-E
Package and PCB thermal data
Figure 29. P2PAK thermal impedance junction ambient single pulse
=7+ƒ&:
FP
FP
FP
7LPHV
*$3*5,
Equation 1: pulse calculation formula
Z
THδ
= R
TH
⋅δ+Z
THtp
(1 – δ)
where δ = tP/T
Figure 30. P2PAK thermal fitting model of a single channel
GAPGRI00197
Doc ID 10891 Rev 7
21/38
Package and PCB thermal data
Table 10.
3.2
VN750-E
P2PAK thermal parameter
Area/island (cm2)
0.5
R1 (°C/W)
0.15
R2 (°C/W)
0.7
R3 (°C/W)
0.7
R4 (°C/W)
4
R5 (°C/W)
9
R6 (°C/W)
37
C1 (W·s/°C)
0.0006
C2 (W·s/°C)
0.0025
C3 (W·s/°C)
0.055
C4 (W·s/°C)
0.4
C5 (W·s/°C)
2
C6 (W·s/°C)
3
6
22
5
PPAK thermal data
Figure 31. PPAK PC board
GAPGRI00172
Note:
22/38
Layout condition of Rth and Zth measurements (PCB FR4 area = 60 mm x 60 mm, PCB
thickness = 2 mm, Cu thickness=35 µm, Copper areas: 0.44 cm2, 8 cm2).
Doc ID 10891 Rev 7
VN750-E
Package and PCB thermal data
Figure 32. PPAK Rthj-amb Vs. PCB copper area in open box free air condition
57+MBDPE ž&:
3&%&XKHDWVLQNDUHDFPA
*$3*5,
Figure 33. PPAK thermal impedance junction ambient single pulse
=7 +ƒ&:
FP FP 7 LPH V
*$3*5,
Doc ID 10891 Rev 7
23/38
Package and PCB thermal data
VN750-E
Equation 2: pulse calculation formula
Z
THδ
= R
TH
⋅δ+Z
THtp
(1 – δ)
where δ = tP/T
Figure 34. PPAK thermal fitting model of a single channel
GAPGRI00200
Table 11.
24/38
PPAK thermal parameter
Area/island (cm2)
0.5
R1 (°C/W)
0.15
R2 (°C/W)
0.7
R3 (°C/W)
1.6
R4 (°C/W)
2
R5 (°C/W)
15
R6 (°C/W)
61
C1 (W·s/°C)
0.0006
C2 (W·s/°C)
0.0025
C3 (W·s/°C)
0.08
C4 (W·s/°C)
0.3
C5 (W·s/°C)
0.45
C6 (W·s/°C)
0.8
Doc ID 10891 Rev 7
6
24
5
VN750-E
Package and packing information
4
Package and packing information
4.1
ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
4.2
PENTAWATT mechanical data
Figure 35. PENTAWATT package dimensions
Table 12.
PENTAWATT mechanical data
mm
Dim.
Min.
Typ.
Max.
A
4.8
C
1.37
D
2.4
Doc ID 10891 Rev 7
2.8
25/38
Package and packing information
Table 12.
VN750-E
PENTAWATT mechanical data (continued)
mm
Dim.
Min.
Typ.
D1
1.2
1.35
E
0.35
0.55
F
0.8
1.05
F1
1
1.4
G
3.2
3.4
3.6
G1
6.6
6.8
7
H2
H3
10.4
10.05
10.4
L
17.85
L1
15.75
L2
21.4
L3
22.5
L5
2.6
3
L6
15.1
15.8
L7
6
6.6
M
4.5
M1
4
Diam.
26/38
Max.
3.65
Doc ID 10891 Rev 7
3.85
VN750-E
4.2.1
Package and packing information
PENTAWATT (in-line) mechanical data
Figure 36.
PENTAWATT (in-line) package dimensions
Table 13.
PENTAWATT (in-line) mechanical data
millimeters
Symbol
Min
Typ
Max
A
4.3
4.8
C
1.17
1.37
D
2.4
2.8
E
0.35
0.55
F
0.8
1.05
F2
1.1
1.4
F3
1.25
1.55
G
3.2
3.6
G1
6.6
7
H1
9.3
9.7
H2
10.4
H3
10.05
10.4
L2
23.05
23.8
L3
25.3
26.1
Doc ID 10891 Rev 7
27/38
Package and packing information
Table 13.
VN750-E
PENTAWATT (in-line) mechanical data (continued)
millimeters
Symbol
Min
Max
L4
0.9
2.9
L5
2.6
3
L6
15.1
15.8
L7
6
6.6
V4
Diam.
28/38
Typ
90°
3.65
Doc ID 10891 Rev 7
3.85
VN750-E
4.3
Package and packing information
P2PAK mechanical data
Figure 37. P2PAK package dimensions
P010R
Doc ID 10891 Rev 7
29/38
Package and packing information
VN750-E
P2PAK mechanical data
Table 14.
mm
Dim.
Min.
Max.
A
4.30
4.80
A1
2.40
2.80
A2
0.03
0.23
b
0.80
1.05
c
0.45
0.60
c2
1.17
1.37
D
8.95
9.35
D2
E
8.00
10.00
E1
10.40
8.50
e
3.20
3.60
e1
6.60
7.00
L
13.70
14.50
L2
1.25
1.40
L3
0.90
1.70
L5
1.55
2.40
0.40
R
V2
0º
Package weight
30/38
Typ.
8º
1.40 Gr. (typ)
Doc ID 10891 Rev 7
VN750-E
4.4
Package and packing information
PPAK mechanical data
Figure 38. PPAK package dimensions
*$3*5,
Doc ID 10891 Rev 7
31/38
Package and packing information
Table 15.
VN750-E
PPAK mechanical data
mm
Dim.
Min.
Max.
A
2.20
2.40
A1
0.90
1.10
A2
0.03
0.23
B
0.40
0.60
B2
5.20
5.40
C
0.45
0.60
C2
0.48
0.60
D1
5.1
D
6.00
6.20
E
6.40
6.60
E1
4.7
e
1.27
G
4.90
5.25
G1
2.38
2.70
H
9.35
10.10
L2
0.8
L4
0.60
L5
1
2.80
R
0.2
0º
Package weight
8º
Gr. 0.3
Doc ID 10891 Rev 7
1.00
1.00
L6
V2
32/38
Typ.
VN750-E
4.5
Package and packing information
PENTAWATT packing information
The devices can be packed in tube or tape and reel shipments (see the Device summary on
page 1).
Figure 39. PENTAWATT tube shipment (no suffix)
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4.6
P2PAK packing information
The devices can be packed in tube or tape and reel shipments (see the Device summary on
page 1).
Figure 40. P2PAK tube shipment (no suffix)
%
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Doc ID 10891 Rev 7
*$3*5,
33/38
Package and packing information
VN750-E
Figure 41. P2PAK tape and reel (suffix “13TR”)
REEL DIMENSIONS
All dimensions are in mm.
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
1000
1000
330
1.5
13
20.2
24.4
60
30.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
All dimensions are in mm.
W
P0 (± 0.1)
P
D (± 0.1/-0)
D1 (min)
F (± 0.05)
K (max)
P1 (± 0.1)
24
4
12
1.5
1.5
11.5
6.5
2
End
Start
Top
cover
tape
No components
Components
No components
500mm min
Empty components pockets
saled with cover tape.
500mm min
User direction of feed
GAPGRI00203
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4.7
Package and packing information
PPAK packing information
The devices can be packed in tube or tape and reel shipments (see the Device summary on
page 1).
Figure 42. PPAK suggested pad layout
*$3*5,
Figure 43. PPAK tube shipment (no suffix)
$
&
%
Base Q.ty
75
Bulk Q.ty
3000
Tube length (± 0.5)
532
A
6
B
21.3
C (± 0.1)
0.6
*$3*5,
All dimensions are in mm.
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Package and packing information
VN750-E
Figure 44. PPAK tape and reel
REEL DIMENSIONS
All dimensions are in mm.
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
2500
2500
330
1.5
13
20.2
16.4
60
22.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 (± 0.1)
P
D (± 0.1/-0)
D1 (min)
F (± 0.05)
K (max)
P1 (± 0.1)
All dimensions are in mm.
16
4
8
1.5
1.5
7.5
2.75
2
End
Start
Top
cover
tape
No components
Components
No components
500mm min
Empty components pockets
saled with cover tape.
500mm min
User direction of feed
GAPGRI00204
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5
Revision history
Revision history
Table 16.
Document revision history
Date
Revision
07-Oct-2004
1
Initial release.
2
Document reformatted and restructured.
Added content, list of figures and tables.
Added ECOPACK® packages information.
Updated Figure 41: P2PAK tape and reel (suffix “13TR”):
– changed component spacing (P) in tape dimensions table from 16
mm to 12 mm.
3
Removed SO-8 package into the following tables:
Table 1, Table 3 and Table 4.
Figure 2: Removed SO-8 package top view.
Removed SO-8 package information in the following sections:
Section Note:: Values are generated with RL =0 W.In case of
repetitive pulses, Tjstart (at the beginning of each demagnetization) of
every pulse must not exceed the temperature specified above for
curves A and B. andSection 4: Package and packing information
Modified Section 2.1: Absolute maximum ratings and Section 4.1:
ECOPACK® packages.
23-Nov-2009
4
Updated features list.
Added PENTAWATT in-line package into the document:
– Updated Table 1: Device summary
– Added Section 4.2.1: PENTAWATT (in-line) mechanical data.
17-Nov-2010
5
Updated following tables:
– Table 3: Absolute maximum ratings
– Table 4: Thermal data
11-May-2012
6
– Update entire document following ST template.
– Update Table 15 and Figure 38.
19-Sep-2013
7
Updated Disclaimer.
24-Nov-2008
12-May-2009
Changes
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VN750-E
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