STMicroelectronics SLLIMM 2nd series STEVAL-IPM15B motor control power board User manual
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広告
UM2014
User manual
STEVAL-IPM15B motor control power board based on the
SLLIMM™ 2nd series of IGBT IPMs
Introduction
The STEVAL-
IPM15B is a compact motor drive power board based on SLLIMM™ (small low-loss intelligent molded module) 2nd series (STGIB15CH60TS-L). It provides an affordable and easy-to-use solution for driving high power motors for a wide range of applications such as power white goods, air conditioning, compressors, power fans, high-end power tools and 3-phase inverters for motor drives in general. The IPM itself consists of short-circuit rugged IGBTs and a wide range of features like undervoltage lockout, smart shutdown, embedded temperature sensor and NTC, and overcurrent protection.
The main characteristics of this evaluation board are small size, minimal BOM and high efficiency. It consists of an interface circuit (BUS and V
CC
connectors), bootstrap capacitors, snubber capacitor, hardware short-circuit protection, fault event and temperature monitoring. In order to increase the flexibility, it is designed to work in single- or three-shunt configuration and with double current sensing options such as using three dedicated onboard op-amps, or op-amps embedded in the MCU. The
Hall/Encoder part completes the circuit.
Thanks to these advanced characteristics, the system has been specifically designed to achieve fast and accurate current feedback conditioning, satisfying the typical requirements for field-oriented control
(FOC).
The STEVAL-IPM15B is compatible with ST's STM32-based control board, enabling designers to build a complete platform for motor control.
Figure 1: SLLIMM 2nd series motor control internal demo board (top view)
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www.st.com
Contents UM2014
Contents
2 Schematic diagrams ........................................................................ 6
3 Main characteristics ...................................................................... 12
4 Filters and key parameters ........................................................... 13
Bootstrap capacitor ......................................................................... 13
Overcurrent protection .................................................................... 14
Fault management ............................................................................ 14
Shunt resistor selection .................................................................... 17
Single- or three-shunt selection ........................................................ 18
5 Current sensing amplifying network ............................................ 19
6 Temperature monitoring ............................................................... 21
Thermal sensor (VTSO) .................................................................. 21
NTC Thermistor ............................................................................... 21
7 Firmware configuration for STM32 PMSM FOC SDK .................. 23
8 Connectors, jumpers and test pins .............................................. 24
10 PCB design guide .......................................................................... 31
Layout of reference board ............................................................... 31
11 Recommendations and suggestions ........................................... 33
12 General safety instructions .......................................................... 34
14 Revision history ............................................................................ 36
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List of tables
List of tables
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List of figures
List of figures
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1
Key features
Key features
Input voltage: 125 - 400 VDC
Nominal power: up to 1500 W
Input auxiliary voltage: up to 20 V DC
Motor control connector (32 pins) interfacing with ST MCU boards
Single- or three-shunt resistors for current sensing (with sensing network)
Two options for current sensing: dedicated op-amps or through MCU
Overcurrent hardware protection
IPM temperature monitoring and protection
Hall sensors (3.3 / 5 V)/encoder inputs (3.3 / 5 V)
IGBT intelligent power module:
SLLIMM™ 2 nd
series IPM (STGIB15CH60TS-L - DBC package)
Universal conception for further evaluation with bread board and testing pins
Very compact size
Figure 2: SLLIMM 2nd series motor control internal demo board: (bottom view)
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Schematic diagrams
2 Schematic diagrams
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Following figures show the whole schematic of the SLLIMM™ 2nd series card for
STGIB15CH60TS-L IPM products. This card consists of an interface circuit (BUS and V
CC connectors), bootstrap capacitors, snubber capacitor, short-circuit protection, fault output circuit, temperature monitoring, single-/three-shunt resistors and filters for input signals. It also includes bypass capacitors for V
CC
and bootstrap capacitors. The capacitors are located very close to the drive IC, which is very helpful in preventing malfunction due to noise.
Two current sensing options are provided: three dedicated onboard op-amps or using opamps embedded on the MCU. Selection is performed through three jumpers.
The Hall/Encoder part (powered at 5 V or 3.3 V) completes the circuit.
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Schematic diagrams
Figure 3: STEVAL-IPM15B circuit schematic (1 of 5)
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Schematic diagrams
Figure 4: STEVAL-IPM15B circuit schematic (2 of 5)
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Schematic diagrams
Figure 5: STEVAL-IPM15B circuit schematic (3 of 5)
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Schematic diagrams
Figure 6: STEVAL-IPM15B circuit schematic (4 of 5)
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Schematic diagrams
Figure 7: STEVAL-IPM15B circuit schematic (5 of 5)
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Main characteristics
3 Main characteristics
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The board is designed to be compatible with DC supply from 125 VDC up to 400 VDC voltage.
A bulk capacitor according to the power level of the application must be mounted. The footprint is already provided on the board.
The SLLIMM integrates six IGBT switches with freewheeling diodes together with high voltage gate drivers. Thanks to this integrated module, the system is specifically designed to achieve power inversion in a reliable and compact design. Such integration reduces the required PCB area and the simplicity of the design increases reliability.
In order to increase the flexibility, it can operate in single- or three-shunt configuration by
modifying solder bridge jumper settings (see
Section 4.3.5: "Single- or three-shunt selection"
Figure 8: STEVAL-IPM15B architecture
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4
4.1
4.2
Filters and key parameters
Filters and key parameters
Input signals
The input signals (LINx and HINx), able to drive the internal IGBTs, are active high. A 100 kΩ (typ.) pull-down resistor is built-in for each input signal. In order to prevent input signal oscillation, an RC filter was added on each input and placed as close as possible to the
IPM. The f ilter is designed using a time constant of 10 ns (1 kΩ and 10 pF).
Bootstrap capacitor
In the 3-phase inverter, the emitters of the low side IGBTs are connected to the negative
DC bus (V
DC-
) as common reference ground, which allows all low side gate drivers to share the same power supply, while the emitter of high side IGBTs is alternately connected to the positive (V
DC+
) and negative (V
DC-
) DC bus during running conditions.
A bootstrap method is a simple and cheap solution to supply the high voltage section. This function is normally accomplished by a high voltage fast recovery diode. The SLLIMM 2 nd series family includes a patented integrated structure that replaces the external diode. It is realized with a high voltage DMOS functioning as diode with series resistor. An internal charge pump provides the DMOS driving voltage. The value of the C
BOOT
capacitor should be calculated according to the application condition.
Figure 9: "CBOOT graph selection"
BOOT
(calculated) versus switching frequency (f sw
), with different values of ∆V
CBOOT
for a continuous sinusoidal modulation and a duty cycle δ = 50%.
The boot capacitor must be two or three times larger than the C
BOOT
calculated in the graph. For this design, a value of 2.2 µF was selected.
Figure 9: CBOOT graph selection
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Filters and key parameters
4.3 Overcurrent protection
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The SLLIMM 2 nd
series integrates a comparator for fault sensing purposes. The comparator has an internal voltage reference V
REF
(510 mV typ.) connected to the inverting input, while the non-inverting input available on the CIN pin can be connected to an external shunt resistor to implement the overcurrent protection function. When the comparator triggers, the device enters the shutdown state.
The comparator output is connected to the SD pin in order to send the fault message to the MCU.
4.3.1
4.3.2
SD Pin
The SD is an input/output pin (open drain type if used as output). Taking into account the voltage reference on SD
(3.3 V), a pull up resistor of 10 kΩ (R23) is used to guarantee the right bias and consequently to keep the current on the open drain DMOS (I od
) lower than 3 mA.
The filter on SD (R28 and C20) has to be sized to obtain the desired re-starting time after a fault event and placed as close as possible to the SD pin.
A shutdown event can be managed by the MCU, in this case the SD functions as the input pin.
Conversely, the SD functions as an output pin when an overcurrent or undervoltage condition is detected.
Fault management
The SLLIMM 2nd series integrates a specific kind of fault management, useful when SD is functioning as output, able to identify the type of fault event.
As previously described, as soon as a fault occurs, the open-drain (DMOS) is activated and
LVGx outputs are forced low.
Two types of fault can be signaled:
Overcurrent (OC) sensed by the internal comparator (CIN);
Undervoltage (UVLO) on supply voltage (VCC).
Each fault enables the SD open drain for a different time (see the table below).
The duration of a shutdown event therefore tells us the type of failure that has occurred.
Table 1: Fault timing
Symbol Parameter Event time
SD open-drain enable time result
OC
UVLO
Over current event
Undervoltage lockout
≤ 20 µs
> 20 µs
≤ 50 µs
20 µs
OC time
50 µs
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Symbol Parameter Event time
Filters and key parameters
SD open-drain enable time result
event
> 50 µs until the
VCC_LS exceed the VCC_LS
UV turn ON threshold
UVLO time
Figure 10: "SD failure due to overcurrent"
shows a shutdown as the result of an overcurrent
event. During the overcurrent, the voltage on the comparator (CIN) exceeds the threshold
(0.51 V typ.) and the shutdown is able to stop the application. In this case, the SD event time is about 20 µs (for OC event less than 20 µs).
Figure 10: SD failure due to overcurrent
Figure 11: "SD failure due to undervoltage (UVLO below 50 µs)"
as the result of an undervoltage condition on the V
CC
supply. If V
CC
drops below the undervoltage threshold, the shutdown can stop the application. If the voltage on V
CC
rises above the V
CC
on threshold in less than 50 µs, the SD event time is about 50 µs.
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Filters and key parameters
Figure 11: SD failure due to undervoltage (UVLO below 50 µs)
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Figure 12: "SD failure due to undervoltage (UVLO above 50 µs)"
event as the result of an undervoltage condition on the V
CC
supply. In this case, the drop on
V
CC
is greater than 50 µs. The SD event time is the same as the duration of drop.
Figure 12: SD failure due to undervoltage (UVLO above 50 µs)
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4.3.3
Filters and key parameters
Shunt resistor selection
The value of the shunt resistor is calculated by the following equation:
Equation 1
𝑅
𝑆𝐻
=
𝑉 𝑟𝑒𝑓
𝐼
𝑂𝐶
Where V ref
is the internal comparator (CIN) (0.51 V typ.) and I
OC
is the overcurrent threshold detection level.
The maximum OC protection level should be set to less than the pulsed collector current in the datasheet. In this design, the overcurrent threshold level is fixed at 30% above the nominal IPM current.
For STGIB15CH60TS-L, I
OC
is 20 A peak, therefore:
Equation 2
𝑅
𝑆𝐻
=
𝑉 𝑟𝑒𝑓+
𝑉
𝐹
𝐼
𝑂𝐶
=
0.51 + 0.3
20
= 0.04Ω
Where V
F
is the voltage drop across diodes D6, D7, D8.
For the power rating of the shunt resistor, the following parameters must be considered:
Maximum load current of inverter (85% of I
Shunt resistor value at T
C
= 25 °C.
Power derating ratio of shunt resistor at T
SH
Safety margin. nom [Arms]
): I load(max)
.
=100 °C
The power rating is calculated by following equation:
Equation 3
𝑃
𝑆𝐻
=
1
2
∙
𝐼
2 𝑙𝑜𝑎𝑑(max)
∙ 𝑅
𝑆𝐻
∙ 𝑚𝑎𝑟𝑔𝑖𝑛
𝐷𝑒𝑟𝑎𝑡𝑖𝑛𝑔 𝑟𝑎𝑡𝑖𝑜
In case of STGIB15CH60TS-L and R
SH
= 0.04 Ω:
I nom
= 15 A --->
𝐼 𝑛𝑜𝑚[𝑟𝑚𝑠]
=
𝐼 𝑛𝑜𝑚
--->
𝐼 𝑙𝑜𝑎𝑑(max)
= 85%(𝐼 𝑛𝑜𝑚[𝑟𝑚𝑠]
) = 9.0𝐴𝑟𝑚𝑠
√2
Power derating ratio of shunt resistor at T
SH
= 100 °C: 80% (from datasheet manufacturer)
Safety margin: 30%
Equation 4
𝑃
𝑆𝐻
=
1
2
∙
9.0
2
∙ 0.04 ∙ 1.3
0.8
= 2.63𝑊
Considering available commercial values, a 5 W shunt resistor was selected.
Based on the previous equations and conditions, minimum shunt resistance and power rating is summarized below.
Table 2: Shunt selection
Device
I nom
(peak)
[A]
OCP
(peak)
[A]
I load(max)
[Arms]
R
SHUNT
[Ω]
Minimum shunt power rating P
SH
[W]
STGIB15CH60TS-L 15 20 9.0 0.04 2.63
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Filters and key parameters
4.3.4 RC filter
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An RC filter network is required to prevent undesired short circuit operation due to the noise on the shunt resistor. In this design, the RC filter, composed of R23, R18, R21, R24 and C19, has a constant time of about 1.3 µs. Adding the turn-off propagation delay of the gate driver and the IGBT turn-off time (hundreds of nanoseconds in total), the total delay time is less than 5 µs of short circuit withstand IGBT time.
4.3.5 Single- or three-shunt selection
Single- or three-shunt resistor circuits can be adopted by setting the solder bridges SW5,
SW6, SW7 and SW8.
The figures below illustrate how to set up the two configurations.
Figure 13: One-shunt configuration
Figure 14: Three-shunt configuration
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Further details regarding sensing configuration are provided in the next section.
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5
Current sensing amplifying network
Current sensing amplifying network
The STEVAL-IPM15B motor control demonstration board can be configured to run in threeshunt or single-shunt configurations for field oriented control (FOC).
The current can be sensed thanks to the shunt resistor and amplified by using the on board operational amplifiers or by the MCU (if equipped with op-amp).
Once the shunt configuration is chosen by setting solder bridge on SW5, SW6, SW7 and
Section 4.3.5: "Single- or three-shunt selection"
choose to send the voltage shunt to the MCU amplified or unamplified.
Single-shunt configuration requires a single op amp and three-shunt configuration requires three op amps; therefore, in single-shunt configuration, the only voltage which is sent to the
MCU to control the sensing is connected to phase V through SW2.
SW1, SW2, SW4 can select which signals are sent to micro, as described below:
Symbol
Table 3: Op-amp sensing configuration
Configuration Bridge Sensing
SW1
Single
Shunt
1-2
2-3 open open
On-board op-amp
SW2
Three
Shunt
Single
Shunt
1-2
2-3
1-2
2-3
MCU op-amp
On board op-amp
MCU op-amp
On-board op-amp
Three
Shunt
1-2
2-3
MCU op-amp
Single
Shunt
1-2
2-3 open open
SW4
Three
Shunt
1-2
2-3
On-board op-amp
MCU op-amp
The operational amplifier TSV994 used on amplifying networks has a 20 MHz gain bandwidth and operates with a single positive supply of 3.3 V.
The amplification network must allow bidirectional current sensing, so that an output offset
V
O
= +1.65 V represents zero current.
Referencing the STGIB15CH60TS-L (I
OCP
= 20 A; R
SHUNT
= 0.04 Ω), the maximum measurable phase current, considering that the output swings from +1.65 V to +3.3 V
(MCU supply voltage) for positive currents and from +1.65 V to 0 for negative currents is:
Equation 5 𝑟 𝑚
=
𝑀𝑎𝑥𝑀𝑒𝑎𝑠𝐶𝑢𝑟𝑟𝑒𝑛𝑡 =
∆𝑉 𝑟 𝑚
∆𝑉
𝑀𝑎𝑥𝑀𝑒𝑎𝑠𝐶𝑢𝑟𝑟𝑒𝑛𝑡
=
= 20𝐴
1.65
20
= 0.08Ω
The overall trans-resistance of the two-port network is:
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Current sensing amplifying network 𝑟 𝑚
= 𝑅
𝑆𝐻𝑈𝑁𝑇
∙ 𝐴𝑀𝑃 = 0.04 ∙ 𝐴𝑀𝑃 = 0.08Ω
𝐴𝑀𝑃 = 𝑟 𝑚
𝑅
𝑆𝐻𝑈𝑁𝑇
=
0.08
0.04
= 2.0
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Finally choosing R a
=R b
and R c
=R d
, the differential gain of the circuit is:
𝐴𝑀𝑃 =
𝑅 𝑐
𝑅 𝑎
= 2.1
An amplification gain of 2.1 was chosen. The same amplification is obtained for all the other devices, taking into account the OCP current and the shunt resistance, as described
The RC filter for output amplification is designed to have a time constant that matches noise parameters in the range of 1.5 µs:
4 ∙ 𝜏 = 4 ∙ 𝑅 𝑒
∙ 𝐶 𝑐
= 1.5𝜇𝑠
𝐶 𝑐
=
1.5µ𝑠
4 ∙ 1000
= 375𝑝𝐹(330𝑝𝐹𝑠𝑒𝑙𝑒𝑐𝑡𝑒𝑑)
Table 4: Amplifying networks
Amplifying network RC filter
Phase
Ra Rb Rc Rd Re Cc
Phase U
Phase V
Phase W
R30
R35
R40
R32
R37
R42
R29
R34
R38
R33
R39
R43
R31
R36
R41
C25
C29
C31
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6
6.1
Temperature monitoring
Temperature monitoring
The SLLIMM 2 nd
series family integrates a temperature sensor (VTSO) on the low side gate driver and a NTC thermistor placed close to the power stage. The board is designed to use both of them which can be selected by using SW3 in order to monitor internal IPM temperature through the MCU.
Thermal sensor (VTSO)
A voltage proportional to the temperature is available on the TSO pin (17) and easily measurable on the TP20 test pin.
The thermal sensor does not need any pull down resistors.
To increase the noise immunity, a capacitor filter of 1 nF (C16) is placed on this pin.
The following graph shows the typical variation of the voltage as a function of temperature.
Figure 15: Thermal sensor voltage vs temperature
6.2 NTC Thermistor
The builtin thermistor (85 kΩ at 25 °C) is inside the IPM and connected between T1 and
T2 pins (26, 25).
A pull up resistor (R10) of 12 kΩ is used in order to guarantee an almost linear voltage variation on the NTC as a function of temperature. This voltage can be easily detected on
TP1 test pin.
The figure below shows the typical voltage on T2 as function of temperature.
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Temperature monitoring
Figure 16: NTC voltage vs temperature
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Firmware configuration for STM32 PMSM FOC
SDK
Firmware configuration for STM32 PMSM FOC SDK
The following table summarizes the parameters which customize the latest version of the
ST FW motor control library for permanent magnet synchronous motor (PMSM): STM32
PMSM FOC SDK for this STEVAL-IPM15B.
Block
Table 5: ST motor control workbench GUI parameters
Parameter Value
Over current protection
Bus voltage sensing
Rated bus voltage info
Current sensing
Command stage
Comparator threshold
Overcurrent network offset
Overcurrent network gain
Bus voltage divider
Min rated voltage
Max rated voltage
Nominal voltage
Current reading typology
Shunt resistor value
Amplifying network gain
Phase U Driver
Phase V Driver
Phase W Driver
V ref
+ V f
= 0,81 V
0
0.1 V/A
1/125
125 V
400 V
325 V
Single- or three-shunt
0.04 Ω
2.1
HS and LS: Active high
HS and LS: Active high
HS and LS: Active high
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Connectors, jumpers and test pins
8 Connectors, jumpers and test pins
Connector Reference
J2
Table 6: Connectors
Description / pinout
Motor control connector
1 - emergency stop
3 - PWM-1H
5 - PWM-1L
7 - PWM-2H
9 - PWM-2L
11 - PWM-3H
13 - PWM-3L
15 - current phase A
17 - current phase B
19 - current phase C
21 - NTC bypass relay
23 - dissipative brake
PWM
25 - +V power
27- PFC sync.
29 - PWM VREF
31 - measure phase A
33 - measure phase B
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2 - GND
4 - GND
6 - GND
8 - GND
10 - GND
12 - GND
14 - HV bus voltage
16 - GND
18 - GND
20 - GND
22 - GND
24 - GND
26 - heat sink temperature
28 - VDD_m
30 - GND
32 - GND
34 - measure phase C
J3
Motor connector
phase A
phase B
phase C
J4
VCC supply (20 VDC max)
positive
negative
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Connector Reference
Connectors, jumpers and test pins
Description / pinout
J7
Supply connector (DC
– 125V to 400 V)
1. L - phase
2. N - neutral
J9
Jumper
SW3
SW1
SW2
SW4
SW13
SW14
SW15
SW9, SW16
SW5, SW6
SW7, SW8
Hall sensors / encoder input connector
1. Hall sensors input 1 / encoder A+
2. Hall sensors input 2 / encoder B+
3. Hall sensors input 3 / encoder Z+
4. 3.3 or 5 Vdc
5. GND
Table 7: Jumpers
Description
TSO/NTC
TSO: jumper on 1-2
NTC: jumper on 2-3
To choose current U to send to control board:
Jumper on 1-2: from amplification
Jumper on 2-3: directly from motor output
To choose current V to send to control board
Jumper on 1-2: from amplification
Jumper on 2-3: directly from motor output
To choose current W to send to control board:
Jumper on 1-2: from amplification
Jumper on 2-3: directly from motor output
To modify phase A hall sensor network
To modify phase B hall sensor network
To modify phase C hall sensor network
To choose input power for Hall/Encoder
Jumper on 1-2: 5 V
Jumper on 2-3: 3.3 V
To choose one-shunt or three-shunt configuration.
(Through solder bridge)
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TP19
TP20
TP21
TP22
TP23
TP24
TP25
TP11
TP12
TP13
TP14
TP15
TP16
TP17
TP18
Test Pin
TP1
TP2
TP3
TP4
TP5
TP6
TP7
TP8
TP9
TP10
Connectors, jumpers and test pins
Jumper Description
SW5, SW6 close
SW7, SW8 open
SW5, SW6 open
SW7, SW8 close
Table 8: Test pins
Description
NTC (T2 pin)
VBOOTw
VBOOTv
VBOOTu
HinU (high side U control signal input)
HinV (high side V control signal input)
HinW (high side W control signal input)
VCCH phase A (U pin) phase B (V pin)
Ground
LinU (high side U control signal input) phase C (W pin)
LinV (high side V control signal input)
LinW (high side W control signal input)
Negative DC input for U phase
CIN
Negative DC input for V phase
Negative DC input for W phase
TSO (TSO pin)
Ground
Ground
SD (shutdown pin)
Current_A_amp
Current_B_amp
Current_C_amp TP26 one shunt three shunt
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9
Bill of materials
Bill of materials
The components used to build the demonstration board are listed below. The majority of the active components used are available from STMicroelectronics.
Item Qty Reference Value
Table 9: Bill of materials
Tol.
[%]
Voltage current
Watt Package Manuf.
1 4 10 nF ±10 50 V -
Capacitor,
SMD 1206
Any
2
3
4
9
4
3
C2,C22,C2
6,C28
C10, C11,
C14,
C15, C17,
C18,
C35, C36,
C37
C20, C25,
C29, C31
10 pF
330 pF
C5, C6, C7 2.2 µF
±10
±10
±10
100 V
50 V
25 V
-
-
-
Capacitor,
SMD 1206
Capacitor,
SMD 1206
Capacitor,
SMD 1206
Any
Any
Any
5 6
C8, C13,
C23, C32,
C33, C34
100 nF ±10 50 V -
Capacitor,
SMD 1206
Any
6
7
8
9
10
11
12
13
14
15
2
2
1
3
2
5
1
1
1
1
C12, C21 4.7 µF
C19, C16 1 nF
C9
C24, C27,
C30
C3, C4
D1, D3,
D4, D5, D6
Diode
BAT48J
D2
J2
J3
J4
0.1 µF
100 pF
47 µF
LED Red
Connector
Connector
Connector
±10
±10
±10
±10
±10
-
-
-
-
-
50 V
50 V
630 V
100 V
50 V
-
-
-
400 V
50 V
-
-
-
-
-
-
-
-
-
-
Elyt. capacitor,
4x4
Capacitor,
SMD 1206
Capacitor,
SMD 1812
Capacitor,
SMD 1206
Elyt. capacitor,
4x4
Schottky
Diode,
SOD323
LED 3 mm,
2 mA, universal
Connector
34-pins
Connector
- 7 mm - 3 pole
Connector
- 5 mm - 2 pole
Any
Any
Any
Any
Any
ST
Any
Any
Any
Any
DocID028899 Rev 1 27/37
Bill of materials
Item Qty Reference Value
16 1 J1
17 1 J5
Connector
Connector
18
19
20
21
23
24
25
22
26
27
2
1
6
1
R1, R2
470 kΩ
1 R4
7.5 kΩ
1
3
21
3
1
R3
120 Ω
R7, R13,
R17
R5, R6,
R8, R9,
R14, R15,
R19,
R20, R23,
R30,
R32, R31,
R18,
R21, R24,
R36,
R35, R41,
R42,
R40, R37
R11, R16,
R22
3.9 kΩ
1 kΩ
3.3 kΩ
R28
10 kΩ
R10
12 kΩ
R29, R33,
R34,
R38, R39,
R43
2.1 kΩ
R12
5.6 kΩ
28
29
3
6
R25, R26,
R27
0.04 Ω
R44, R45,
R46,
R50, R51,
R52
4.
7 kΩ
Tol.
[%]
Voltage current
- 300 V
- 63 V
±1
±1
±1
±1
400 V
400 V
400 V
25 V
UM2014
Manuf. Watt Package
-
-
1/8
1/8
1/8
1/8
Connector
- 7 mm - 2 pole
Five pins of pin header
Resistor,
SMD 1206
Capacitor,
SMD 1206
Resistor,
SMD 1206
Resistor,
SMD 1206
Any
Any
Any
Any
Any
Any
±1 25 V
±1
±1
±1
25 V
25 V
25 V
±1 25 V
±1 25 V
- -
±1 25 V
1/8
Resistor,
SMD 1206
Any
1/8
1/8
1/8
Resistor,
SMD 1206
Resistor,
SMD 1206
Resistor,
SMD 1206
Any
Any
Any
1/8
Resistor,
SMD 1206
Any
1/8
-
Resistor,
SMD 1206
Any
Resistor,
SMD 2512
Vishay
WSH281
8R0400F
EA
1/8
Resistor,
SMD 1206
Any
28/37 DocID028899 Rev 1
UM2014
Item
30
31
32
33
34
35
36
Qty Reference Value
Tol.
[%]
3
6
R47, R48,
R49
SW1,
SW2,
SW3,S
W4, SW9,
SW16
2.4 kΩ
Jumper 2.54
±1
-
6
SW10,
SW11,
SW12,
SW13,
SW14,
SW15
Jumper 2.54 -
12
2
2
26
-
SW7, SW8
Solder
Bridge
SW5, SW6 open
TP13,
TP14,
TP15,
TP16,
TP17,
TP18,
TP19,
TP20,
TP21,
TP22,
TP23,
TP24,
TP25,
TP26
TP1, TP2,
TP3,
TP4, TP5,
TP6,
TP7, TP8,
TP9,
TP10,
TP11,
TP12,
2.54 mm, low profile, connector
-
PCB terminal
1 mm
-
-
-
37 1 U1 TSV994 -
38
39
1
3
U2
RC1,RC6,
RC10
Voltage current
25 V
-
-
-
-
-
-
-
STGIB15CH6
0TS-L
-
0 OHM
-
Any Any
-
-
-
-
-
Bill of materials
Watt Package Manuf.
1/8
Resistor,
SMD 1206
Any
-
Three pins of pin header
Any
Two pins of pin header
Any
-
-
-
Test pin
Any
NA
Any
Any
-
-
Any
Op amp,
SO14
STGIB15C
H60TS-L
Resistor,
SMD 0805
ST
ST
Any
DocID028899 Rev 1 29/37
Bill of materials
Item Qty Reference Value
40
41
7
9
RC2,RC3,
RC4,RC5,
RC7,RC8,
RC9 to close switch for:
SW1,
SW2,
SW3,
SW4,
SW9,
SW10,
SW11,
SW12,
SW16
Not assembled
- -
Tol.
[%]
Voltage current
Not assembled
Watt Package
UM2014
Manuf.
Not assembled
Any
- - - Any
30/37 DocID028899 Rev 1
UM2014
PCB design guide
10 PCB design guide
Optimization of PCB layout for high voltage, high current and high switching frequency applications is a critical point. PCB layout is a complex matter as it includes several aspects, such as length and width of track and circuit areas, but also the proper routing of the traces and the optimized reciprocal arrangement of the various system elements in the
PCB area.
A good layout can help the application to properly function and achieve expected performance. On the other hand, a PCB without a careful layout can generate EMI issues, provide overvoltage spikes due to parasitic inductance along the PCB traces and produce higher power loss and even malfunction in the control and sensing stages.
In general, these conditions were applied during the design of the board:
PCB traces designed as short as possible and the area of the circuit (power or signal) minimized to avoid the sensitivity of such structures to surrounding noise.
Good distance between switching lines with high voltage transitions and the signal line sensitive to electrical noise.
The shunt resistors were placed as close as possible to the low side pins of the
SLLIMM. To decrease the parasitic inductance, a low inductance type resistor (SMD) was used.
RC filters were placed as close as possible to the SLLIMM pins in order to increase their efficiency.
10.1 Layout of reference board
All the components are inserted on the top of the board. Only the IPM module is inserted on the bottom to allow the insertion of a suitable heatsink for the application.
Figure 17: Silk screen and etch - top side
DocID028899 Rev 1 31/37
PCB design guide
Figure 18: Silk screen and etch - bottom side
UM2014
32/37 DocID028899 Rev 1
UM2014
11
Recommendations and suggestions
Recommendations and suggestions
The BOM list is not provided with a bulk capacitor already inserted in the PCB.
However, the necessary space has been included (C1) and therefore it is advisable to use an appropriate bulk capacity to stabilize the bus supply voltage.
Similarly, the BOM list does not include the heat sink. It is possible put the heat sink, above the IPM on the bottom of the PCB, with thermal conductive foil and screws. The value of R
TH
has to be considered for good thermal performance; it depends on certain factors such as current phase, switching frequency, power factor and ambient temperature.
DocID028899 Rev 1 33/37
General safety instructions
12
UM2014
General safety instructions
Warning: the evaluation board works with high voltage which could be deadly for the users. Furthermore all circuits on the board are not isolated from the line input. Due to the high power density, the components on the board as well as the heat sink can be heated to a very high temperature, which can cause a burning risk when touched directly. The users should be engineers and technicians who are experienced in power electronics technology and make sure that no danger or risk may occur while operating this board.
After the operation of the evaluation board, the bulk capacitor C1 (if used) may still store a high energy for several minutes. So it must be first discharged before any direct touching of the board.
In order to protect the bulk capacitor C1, it is strongly recommended for the users to use an external brake chopper after C1 (to discharge the high brake current back from the induction motor).
34/37 DocID028899 Rev 1
UM2014
13 References
1. STGIB15CH60TS-L datasheet
2. TSV994 datasheet
3. STTH15R06 datasheet
4. UM1052 user manual
5. AN 4076
References
DocID028899 Rev 1 35/37
Revision history
14 Revision history
Date
09-Feb-2016
Table 10: Document revision history
Version Changes
1 Initial release.
UM2014
36/37 DocID028899 Rev 1
UM2014
IMPORTANT NOTICE
– PLEASE READ CAREFULLY
STMicroelectronics NV and its sub sidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2016 STMicroelectronics
– All rights reserved
DocID028899 Rev 1 37/37
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