TDA2030
14 W hi-fi audio amplifier
Features
■
■
■
■
Wide-range supply voltage, up to 36 V
Single or split power supply
Short-circuit protection to ground
Thermal shutdown
Description
The TDA2030 is a monolithic integrated circuit in the Pentawatt
®
package, intended for use as a low frequency class-AB amplifier. Typically it provides 14 W output power (d = 0.5%) at
14 V/4
Ω. At ±14 V or 28 V, the guaranteed output power is 12 W on a 4
Ω load and 8 W on an 8 Ω
(DIN45500).
The TDA2030 provides high output current and has very low harmonic and crossover distortion.
Furthermore, the device incorporates an original
(and patented) short-circuit protection system comprising an arrangement for automatically limiting the dissipated power so as to keep the operating point of the output transistors within their safe operating range. A conventional thermal shutdown system is also included.
Figure 1.
Ex: Functional block diagram
Pentawatt (horizontal)
Table 1.
Device summary
Order code Package
TDA2030H Pentawatt horizontal
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17
Device overview
Figure 2.
Pin connections (top view)
Figure 3.
Test circuit
TDA2030
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TDA2030 Electrical specifications
2.1 Absolute maximum ratings
Table 2.
Symbol
Absolute maximum ratings
Parameter
V s
V i
V i
I o
P tot
T stg
, T j
Supply voltage
Input voltage
Differential input voltage
Output peak current internally limited)
Power dissipation at T case
= 90 °C
Storage and junction temperature
Value
±18 (36)
Vs
±15
3.5
20
-40 to 150
Unit
V
V
A
W
°C
Table 3.
Symbol
R th j-case
Thermal data
Parameter
Thermal resistance junction-case
Value max 3
Unit
C
Refer to the test circuit in
Figure 3
; V
S
= ±14 V, T amb
= 25°C unless otherwise specified.
Table 4.
Electrical characteristics
Symbol
V
I
V
I
I d b
OS
OS
P s o
Parameter
Supply voltage
Test conditions Min.
Typ.
Max.
± 6
12
± 18
36
Unit
V
Quiescent drain current 40 60 mA
Input bias current 0.2
2 μA
Input offset voltage
Input offset current
V s
= ± 18 (Vs = 36)
± 2
± 20
± 20
± 200 mV nA
Output power d = 0.5%, f = 40 to 15,000 Hz;
G
V
= 30 dB
R
L
= 4 Ω
R
L
= 8 Ω d = 10%, f =1 kHz; G
V
= 30 dB
R
L
= 4 Ω
R
L
= 8 Ω
12
8
12
8
14
9
14
9
W
W
W
W
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Electrical specifications
Table 4.
Symbol d
B
Electrical characteristics (continued)
Distortion
Parameter
Frequency response
(–3 dB)
Input resistance (pin 1)
Test conditions
P o
= 0.1 to 12 W, R
L
= 4 Ω,
G
V
= 30 dB f = 40 to 15.000 Hz
P o
= 0.1 to 8 W, R
L
= 8 Ω,
G
V
= 30 dB f = 40 to 15.000 Hz
P o
= 12 W, R
L
= 4 Ω;
G
V
= 30 dB
R i
G v
G v
Voltage gain (open loop)
Voltage gain (closed loop) f = 1 kHz e
N i
N
Input noise voltage
Input noise current
B = 22 Hz to 22 kHz
SVR Supply voltage rejection
I d Drain current
G
V
R g
= 30 dB; R
= 22 k Ω, f
L
= 4 Ω, ripple
= 100 Hz;
V ripple
= 0.5 Veff
P o
= 14 W, R
L
P o
= 9 W, R
L
= 4 Ω
= 8
Ω
T j
Thermal shutdown junction temperature
TDA2030
Min.
Typ.
Max.
Unit
0.2
0.5
%
0.1
0.5
%
0.5
29.5
10 Hz to 140
5
90
30
3
80
30.5
10
200
Hz
M Ω dB dB
µV pA
40 50 dB
900
500
145 mA
°C
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TDA2030
2.4 Characterizations
Electrical specifications
Figure 4.
Output power vs. supply voltage Figure 5.
Output power vs. supply voltage
Figure 6.
Distortion vs. output power Figure 7.
Distortion vs. output power
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Electrical specifications
Figure 8.
Distortion vs. output power Figure 9.
Distortion vs. frequency
TDA2030
Figure 10.
Distortion vs. frequency Figure 11.
Frequency response with different values of the rolloff capacitor C8
(see typical amplifier with split power supply)
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TDA2030
Figure 12.
Quiescent current vs. supply voltage
Electrical specifications
Figure 13.
Supply voltage rejection vs. voltage gain
Figure 14.
Power dissipation and efficiency vs. output power
Figure 15.
Maximum power dissipation vs. supply voltage (sine wave operation)
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Applications
3 Applications
TDA2030
Figure 16.
Typical amplifier with split power supply
Figure 17.
Typical amplifier with single power supply
Figure 18.
PC board and component layout for a typical amplifier with split power supply
Figure 19.
PC board and component layout for a typical amplifier with single power supply
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TDA2030 Applications
Figure 20.
Bridge amplifier configuration with split power supply (P o
= 28 W, V s
=
±
14 V)
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Practical considerations TDA2030
4.1 Printed circuit board
The layout shown in Figure 19 should be adopted by the designers. If different layouts are
used, the ground points of input 1 and input 2 must be well decoupled from the ground return of the output in which a high current flows.
No electrical isolation is needed between the package and the heatsink with single supply voltage configuration.
The recommended values of the components are those shown on application circuit of
Figure 16
. However, if different values are chosen, then the following table can be helpful.
Table 5.
Component
R
1
R
2
Variations from recommended values
Recommanded value
22 k Ω
680 Ω
Purpose
Closed loop gain setting
Closed loop gain setting
R
3
R
4
R
5
C
1
22 k Ω
1 Ω
3 R
2
1 µF
Non-inverting input biasing
Frequency stability
Upper frequency cutoff
Input DC decoupling
Larger than recommanded value
Increase of gain
Decrease of gain
(1)
Smaller than recommanded value
Decrease in gain
Increase in gain
(1)
Increase of input impedance
Danger of oscillation at high frequencies with inductive loads
Poor high-frequency attenuation
Decrease in input impedance
Danger of oscillation
Increase in lowfrequency cutoff
C
2
22 µF
Inverting input DC decoupling
Increase in lowfrequency cutoff
C
3
C
4
0.1 µF Supply voltage bypass Danger of oscillation Obsolete Product(s) - Obsolete Product(s)
100 µF Supply voltage bypass Danger of oscillation C
5
C
6
C
7
0.22 µF Frequency stability Danger of oscillation
C
8 2 πBR
1
Upper frequency cutoff Smaller bandwidth
D
1
D
2
1N4001 To protect the device against output voltage spikes
1.
Closed loop gain must be higher than 24 dB
Larger bandwidth
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TDA2030 Practical considerations
Table 6.
Component
R
1
R
2
R
3
R
4
R
A
/R
B
C
1
C
2
C
3
C
5
C
7
Single supply application
Recommanded value
150 k Ω
4.7 k Ω
Purpose
Closed loop gain setting
Closed loop gain setting
100 k Ω
1 Ω
100 k Ω
1 µF
22 µF
0.1 µF
100 µF
0.22 µF
Non-inverting input biasing
Frequency stability
Non-inverting input biasing
Input DC decoupling
Inverting DC decoupling
Supply voltage bypass
Supply voltage bypass
Frequency stability
Larger than recommanded value
Smaller than recommanded value
Increase in gain
Decrease in gain
(1)
Increase of input impedance
Danger of oscillation at high frequencies with inductive loads
Decrease in gain
(1)
Increase in gain
Decrease in input
Impedance
Poor high-frequency attenuation
Danger of oscillation
Increase in lowfrequency cutoff
Increase in lowfrequency cutoff
Danger of oscillation
Danger of oscillation
Danger of oscillation
C
8 2
πBR
1
Upper frequency cutoff Smaller bandwidth
D
1
D
2
1N4001 To protect the device against output voltage spikes.
1.
Closed loop gain must be higher than 24 dB
Larger bandwidth
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Short-circuit protection TDA2030
The TDA2030 has an original circuit which limits the current of the output transistors.
Figure 21
shows that the maximum output current is a function of the collector emitter voltage; hence the output transistors work within their safe operating area (
Figure 5 ).
This function can therefore be considered as being peak power limiting rather than simple current limiting.
It reduces the possibility that the device gets damaged during an accidental short-circuit from AC output to ground.
Figure 21.
Maximum output current vs. voltage [V
CEsat
] across each output transistor
Figure 22.
Safe operating area and collector characteristics of the protected power transistor
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TDA2030 Thermal shutdown
The presence of a thermal limiting circuit offers the following advantages:
1.
An overload on the output (even if it is permanent), or an above limit ambient temperature can be easily supported since T j
cannot be higher than 150°C.
2. The heatsink can have a smaller factor of safety compared with that of a conventional circuit. There is no possibility of device damage due to high junction temperature. If for any reason, the junction temperature increases to 150°C, the thermal shutdown simply reduces the power dissipation at the current consumption.
The maximum allowable power dissipation depends upon the size of the external heatsink
(i.e. its thermal resistance); Figure 25 shows this power dissipation as a function of ambient
temperature for different thermal resistances.
Figure 23.
Output power and drain current vs. case temperature (R
L
= 4
Ω)
Figure 24.
Output power and drain current vs. case temperature (R
L
= 8
Ω)
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Thermal shutdown
Figure 25.
Maximum allowable power dissipation vs. ambient temperature
Figure 26.
Example of heatsink
TDA2030
The following table shows the length that the heatsink in
Figure 26 must have for several
values of P tot
and R th
.
Table 7.
Recommended values of heatsink
Dimension Recommended values
P tot
Length of heatsink
R th
of heatsink
12
60
4.2
8
40
6.2
6
30
8.3
Unit
W mm
°C/W
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TDA2030
7 Package mechanical data
Package mechanical data
Figure 27.
Pentawatt (horizontal) package outline and dimensions
G
G1
H2
H3
L
L1
L2
A
C
D
D1
E
F
F1
L7
L9
L10
DIA
L3
L4
L5
L6
DIM.
2.60
15.10
6.00
2.10
4.30
3.65
mm inch
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
4.80
1.37
0.188
0.054
2.40
1.20
0.35
0.80
1.00
3.20
3.40
6.60
6.80
2.80
1.35
1.40
0.094
0.047
0.55
0.014
1.05
0.031
0.039
0.11
0.053
0.022
0.041
0.055
10.05
14.20
5.70
14.60
3.50
3.60
0.126
0.134
0.142
7.00
0.260
0.267
0.275
10.40
10.40
0.395
0.41
0.409
15.00
0.56
6.20
0.224
15.20
0.574
0.59
0.244
0.598
4.10
0.137
1.29
3.00
0.102
15.80
0.594
6.60
0.236
2.70
0.083
4.80
0.170
3.85
0.143
.161
0.05
0.118
0.622
0.260
0.106
0.189
0.151
OUTLINE AND
MECHANICAL DATA
Pentawatt H
L
C A
E
D D1
L1
L3 L2
F
L4
L7
L5
G
G1
H2
H3
F1
Dia.
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Resin between
L9 leads L10
L6
PENTHME.EPS
0015982
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Doc ID 1458 Rev 3 15/17
Revision history TDA2030
Table 8.
Date
June 1998
21-Jun-2011
Document revision history
Revision
2
3
Changes
Second issue
Added
Features on page 1
Removed Pentawatt (vertical) package option
Replaced
Figure 27 with Pentawatt (horizontal) package data
Updated presentation of document, minor textual changes
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TDA2030
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