DCPL-WB-00C2
Wide-band, dual-path directional coupler with ISO port
Features
■
■
■
■
■
■
■
■
■
■
50 Ω nominal input / output impedance wide operating frequency range:
– 824 MHz-2170 MHz low insertion loss (< 0.2 dB)
37 dB typical coupling factor high directivity (> 20 dB) high ESD ruggedness lead-free CSP package
Flip-Chip package small footprint: 1700 x 1850 µm very low profile (< 670 µm thickness)
Benefits
■
■ high RF performance
RF module size reduction
Complies with the following standards:
■ IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
Applications
Multi-band equipment such as:
■
■
■ power amplifier module front end module
GSM/WCDMA mobile phone
October 2010
Lead-free Flip Chip (8 bumps)
Figure 1.
Pin configuration (bump view)
A3 A2
LB Path
B3
C3
HB Path
C2
A1
B1
C1
Description
The DCPL-WB-00C2 is a wide-band, dual-path directional coupler designed to measure cell phone transmission output power in
GSM/WCDMA applications. This dual-path CPL has been customized for wide-band operating frequencies (EGSM and CELL, PCS, DCS,
WCDMA band I) with less than 0.2 dB insertion losses in the transmission bandwidth (824 MHz -
1980 MHz).
This device is built with two different RF couplers
(one dedicated to LB, the other dedicated to HB) sharing the same coupled and isolated ports.The
DCPL-WB-00C2 has been designed using
STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance.
The device is delivered 100% tested in tape and reel.
Doc ID 17994 Rev 1 1/11 www.st.com
11
Characteristics
1 Characteristics
DCPL-WB-00C2
Table 1.
Device pin configuration
Bump Name
B1
B3
C1
C2
C3
A1
A2
A3
Lbin
GND
Lbout
CPLD
ISO
Hbin
GND
Hbout
Description
LB coupler RF input
RF ground
LB coupler RF output
Coupler port
Isolated port
HB coupler RF input
RF ground
HB coupler output
Table 2.
A bsolute maximum rating (limiting values)
Symbol Parameter
Value
Min.
Typ.
Max.
Unit
V
P
IN
ESD (IEC)
Input Power RF
IN
(CW mode)
ESD ratings IEC 61000-4-2 (C = 150 pF, R = 330 Ω)
LB
IN
, LB
OUT
, HB
IN
, HB
OUT
, air discharge
LB
IN
, LB
OUT
, HB
IN
, HB
OUT
, contact discharge
V
ESD (HBM)
Human body model, JESD22-A114-B, All I/O
V
ESD (MM)
Machine model, JESD22-A115-A, All I/O
V
ESD (CDM)
Charge device model, JESD22-C101-C, All I/O
T
OP
Operating temperature
Table 3.
Symbol
Z
OUT
Z
IN
Z
CPL
Z
ISO
±15
±8
2
100
500
-30
Electrical characteristics - impedances (T amb
= 25 °C)
Value
Parameter
Min.
Typ.
Nominal output impedance (LB and HB paths)
Nominal input impedance (LB and HB paths)
Nominal coupled port impedance
Nominal isolated port impedance -
-
-
50
50
50
50
-
-
-
-
-
-
36
Max.
-
-
-
-
-
-
-
-
+85 dBm kV kV
Unit
Ω
Ω
Ω
Ω
V
V
°C
2/11 Doc ID 17994 Rev 1
DCPL-WB-00C2 Characteristics
Table 4.
Symbol
T
OP
Electrical characteristics - LB path RF performance (T amb
= 25 °C)
Value
Parameter Test condition
Min.
Typ.
Max.
Operating temperature -30 +85
Unit
°C f
Frequency range
(bandwidth)
824 960 MHz
IL
LB
RL
LB
CPLD
LB
LB coupling factor
Ripple
LB
Coupling ripple in LB
DIR
LB
LB path insertion loss
LB path return loss
LB coupler directivity
From 824 MHz to 960 MHz
From 824 MHz to 960 MHz
From 824 MHz to 915 MHz
(824 to 849 MHz)
(880 to 915 MHz)
From 824 MHz to 915 MHz
-
15
32
-
22
0.1
-
-
-
-
0.2
37
0.5
-
dB dB dB dB dB
Table 5.
Symbol
T
OP
Electrical characteristics - HB path RF performance (T amb
= 25 °C)
Value
Parameter Test condition
Min.
Typ.
Max.
Unit
Operating temperature -30 +85 °C f
Frequency range
(bandwidth)
1710 1980 MHz
IL
HB
RL
HB
CPLD
HB
HB coupling factor
Ripple
HB
Coupling ripple in HB
DIR
HB
HB path insertion loss
HB path return loss
HB coupler directivity
From 1710 MHz to 2170 MHz
From 1710 MHz to 2170 MHz
From 1710 MHz to 1980 MHz
(1710 to 1785 MHz)
(1850 to 1910 MHz)
(1920 to 1980 MHz)
From 1710 MHz to 1980 MHz
-
15
29
-
22
0.1
-
-
-
-
0.2
34
0.5
-
dB dB dB dB dB
Doc ID 17994 Rev 1 3/11
Characteristics
1.1
DCPL-WB-00C2
RF measurement (on reference evaluation board)
Measurements done on reference evaluation board under 50 Ω, de-embedding at
DCPL-WB-00D3 bumps.
Figure 2.
Low band path insertion loss
0.00
IL - LB (dB)
-0.05
-0.10
-0.15
F (MHz)
-0.20
800 820 840 860 880 900 920 940 960 980 1000
Figure 3.
High band path insertion loss
0.00
IL - HB (dB)
-0.05
-0.10
-0.15
F (MHz)
-0.20
1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200
Figure 4.
Low band path coupling factor
-30
-31
CPLD - LB (dB)
-32
-33
-34
-35
-36
-37
-38
-39
F (MHz)
-40
800 820 840 860 880 900 920 940 960 980 1000
4/11 Doc ID 17994 Rev 1
DCPL-WB-00C2 Characteristics
Figure 5.
High band path coupling factor
-28
-29
-30
-31
CPLD - HB (dB)
-32
-33
-34
-35
36
37
F (MHz)
-38
1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200
Figure 6.
Low band path directivity
24
23
22
21
20
29
28
27
26
25
35
34
33
32
31
30
DIR - LB (dB)
F (MHz)
800 820 840 860 880 900 920 940 960 980 1000
Figure 7.
High band path directivity
DIR - LB (dB)
26
25
24
23
22
21
20
35
34
33
32
31
30
29
28
27
F (MHz)
1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200
Doc ID 17994 Rev 1 5/11
Characteristics
Figure 8.
Demo board description - layer 1
Copper pad diameter:
275 µm
DCPL-WB-00C2
Figure 9.
Solder mask 1 + layer 1
Solder mask diameter:
375 µm
6/11 Doc ID 17994 Rev 1
DCPL-WB-00C2
2 Ordering information scheme
Figure 10.
Ordering information scheme
DCPL – WB
Ordering information scheme
– 00 – C2
Dual high directivity coupler
Wide band
Version
Package
C2 = Coated Flip Chip, bump size = 315 µm
Doc ID 17994 Rev 1 7/11
Package information DCPL-WB-00C2
●
●
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Figure 11.
Package dimensions
315 µm dia.
670 µm
Figure 12.
Footprint
Copper pad diameter :
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 300 µm copper pad diameter
600µm
1.7 mm
600µm
Figure 13.
Marking
Dot, ST logo
ECOPACK status xx = marking z = manufacturing location yww = datecode
(y = year ww = week) x y x z w w
8/11 Doc ID 17994 Rev 1
DCPL-WB-00C2
Figure 14.
Flip-Chip tape and reel specifications
Dot identifying Pin A1 location
2.0
0.22
4.0
Package information
Ø 1.55
ST ST ST
Note:
0.73
All dimensions are typical values in mm
1.80
4.0
User direction of unreeling
More packing information is available in the application notes:
AN1235: "Flip-Chip: Package description and recommendations for use"
AN1751: "EMI Filters: Recommendations and measurements”
Doc ID 17994 Rev 1 9/11
Ordering information DCPL-WB-00C2
Table 6.
Ordering information
Order code Marking Package
DCPL-WB-00C2 RN Flip Chip
Weight
3.65 mg
Base qty
5000
Delivery mode
Tape and reel
Table 7.
Date
Document revision history
Revision
07-Oct-2010 1 Initial release.
Changes
10/11 Doc ID 17994 Rev 1
DCPL-WB-00C2
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Doc ID 17994 Rev 1 11/11
