Intel SR2500 manual

Intel

®

Server Chassis SR2500

Intel

®

Server System SR2500AL

Technical Product Specification

Intel order number D31980-009

Revision – 1.6

November 2008

Enterprise Platforms and Services Division – Marketing

Revision History

Intel® Server System SR2500AL

Revision History

Date

June 2006

August 2006

January 2007

February 2007

August 2007

October 2007

November 2008

Revision

Number

1.0

1.1

1.2

1.3

1.4

1.5

1.6

Modifications

Initial release.

Updated Active Midplane Diagram.

Updated single power supply population rules.

Updated fan numbering orientation.

Updated ASR2500FHR population table.

Updated figure 16.

Updated regulatory section.

Updated power supply illustrations to show proper placement when using only one power supply.

Updated figure 18 to reflect proper fan circuitry. Edited processor support and platform control section.

Updated Power Sub-System. Updated Table 54.

Add introduction of Midplane2

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Intel order number D31980-009

Revision – 1.6

Intel® Server System SR2500AL Disclaimers

Disclaimers

Information in this document is provided in connection with Intel

®

products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked

"reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel® Server System SR2500AL may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

This document and the software described in it is furnished under license and may only be used or copied in accordance with the terms of the license. The information in this manual is furnished for informational use only, is subject to change without notice, and should not be construed as a commitment by Intel Corporation. Intel Corporation assumes no responsibility or liability for any errors or inaccuracies that may appear in this document or any software that may be provided in association with this document.

Except as permitted by such license, no part of this document may be reproduced, stored in a retrieval system, or transmitted in any form or by any means without the express written consent of Intel Corporation.

Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.

*Other brands and names may be claimed as the property of others.

Copyright © Intel Corporation 2007.

Revision – 1.6

Intel order number D31980-009

iii

Table of Contents

Table of Contents

Intel® Server System SR2500AL

1.

Product Overview ................................................................................................................. 1

1.1

Chassis Views ......................................................................................................... 1

1.2

1.3

Chassis Dimensions ................................................................................................ 2

System Components ............................................................................................... 2

1.4

1.5

1.6

1.7

1.8

1.9

1.10

1.11

System Boards ........................................................................................................ 3

Control Panel Options.............................................................................................. 4

Hard Drive and Peripheral Bays .............................................................................. 7

Power Sub-system................................................................................................... 7

System Cooling........................................................................................................ 8

Chassis Security ...................................................................................................... 8

Rack and Cabinet Mounting Options ....................................................................... 8

Front Bezel Features ............................................................................................... 9

2.

Power Sub-System ............................................................................................................. 11

2.1

2.2

Mechanical Overview............................................................................................. 11

Single Power Supply Module Population ............................................................... 12

2.3

2.4

2.5

2.6

Handle and Retention Mechanism......................................................................... 12

Hot-swap Support .................................................................................................. 12

Airflow .................................................................................................................... 13

AC Power Cord Specification Requirements ......................................................... 13

2.7

Output Cable Harness ........................................................................................... 13

2.7.1

P1 – Server Board Power Connector .................................................................... 14

2.7.2

P2 – Processor Power Connector ......................................................................... 14

2.7.3

P3 – Power Signal Connector................................................................................ 15

2.7.4

P4 – Backplane Power Connector ......................................................................... 15

2.7.5

P5 Mid-plane Power Connector ............................................................................. 15

2.8

AC Input Requirements ......................................................................................... 15

2.8.1

Efficiency ............................................................................................................... 16

2.8.2

AC Input Voltage Specification .............................................................................. 16

2.8.3

AC Line Dropout / Holdup ...................................................................................... 16

2.8.4

AC Line 5 VSB Holdup .......................................................................................... 16

2.8.5

AC Inrush............................................................................................................... 17

2.9

Protection Circuits.................................................................................................. 17

2.9.1

Over-Current Protection (OCP).............................................................................. 17

2.9.2

Over-Voltage Protection (OVP) ............................................................................. 17

2.9.3

Over-Temperature Protection (OTP) ..................................................................... 18

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Intel® Server System SR2500AL

2.10

Table of Contents

DC Output Specification ........................................................................................ 18

2.10.1

Output Power / Currents ........................................................................................ 18

2.10.2

Standby Output / Standby Mode............................................................................ 18

2.11

Power Supply Status LED ..................................................................................... 19

3.

Cooling Sub-System .......................................................................................................... 20

3.1

3.2

Non-redundant Fan Module ................................................................................... 21

Redundant System Fan Module ............................................................................ 23

3.3

Air Flow Support .................................................................................................... 25

3.3.1

Power Supply Zone ............................................................................................... 25

3.3.2

Full Height Riser Zone ........................................................................................... 25

3.3.3

CPU / Memory / Low Profile PCI Zone .................................................................. 26

3.4

Drive Bay Population ............................................................................................. 26

4.

Platform Control ................................................................................................................. 27

4.1

Overview ................................................................................................................ 27

5.

System Board Interconnects............................................................................................. 28

5.1

Mid-plane ............................................................................................................... 28

5.2

5.3

Bridge Board.......................................................................................................... 36

Hot-Swap SATA/SAS Backplane........................................................................... 36

6.

Peripheral and Hard Drive Sub-System............................................................................ 44

6.1

Slimline Drive Bay.................................................................................................. 44

6.2

Hard Drive Bays..................................................................................................... 46

6.2.1

Hot-swap Drive Trays ............................................................................................ 46

6.3

Optional Tape Drive or 6 th

Hard Drive Flex Bay..................................................... 47

6.4

Mid-plane Options.................................................................................................. 48

6.4.1

Passive Mid-plane ................................................................................................. 48

6.4.2

Active Mid-plane with SAS /SAS RAID Support .................................................... 49

6.4.3

Active Midplane2 with SAS/SAS RAID Support..................................................... 49

6.5

Hot-Swap SAS/SATA Backplane........................................................................... 52

6.5.1

SAS/SATA Backplane Layout................................................................................ 53

6.5.2

SAS/SATA Backplane Functional Architecture...................................................... 55

7.

Standard Control Panel ..................................................................................................... 57

7.1

7.2

Control Panel Buttons........................................................................................... 57

Control Panel LED Indicators ................................................................................ 58

7.2.1

Power / Sleep LED ................................................................................................ 60

7.2.2

System Status LED................................................................................................ 60

7.2.3

Drive Activity LED .................................................................................................. 61

7.2.4

System Identification LED...................................................................................... 61

7.3

Control Panel Connectors...................................................................................... 62

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Intel order number D31980-009 v

Table of Contents

Intel® Server System SR2500AL

7.4

Internal Control Panel Interconnect ....................................................................... 63

8.

Intel

®

Local Control Panel.................................................................................................. 65

8.1

LED Functionality................................................................................................... 66

8.1.1

Power / Sleep LED ................................................................................................ 67

8.1.2

System Status LED................................................................................................ 67

8.1.3

Drive Activity LED .................................................................................................. 68

8.1.4

System Identification LED...................................................................................... 68

8.2

Intel

®

Local Control Panel Interconnects ............................................................... 69

9.

PCI Riser Cards and Assembly ......................................................................................... 71

9.1

Riser Card Options ................................................................................................ 72

9.2

PCI Riser Card Mechanical Drawings ................................................................... 73

10.

Supported Intel

®

Server Boards........................................................................................ 77

10.1

Intel

®

Server Board S5000PAL / S5000XAL Feature Set ...................................... 77

10.1.1

Processor Support ................................................................................................. 79

11.

Environmental and Regulatory Specifications ............................................................... 80

11.1

11.2

System Level Environmental Limits ....................................................................... 80

Serviceability and Availability................................................................................. 80

11.3

11.4

11.5

11.6

Replacing the Back up Battery .............................................................................. 81

Product Regulatory Compliance ............................................................................ 82

Use of Specified Regulated Components .............................................................. 82

Electromagnetic Compatibility Notices .................................................................. 84

11.6.1

USA ....................................................................................................................... 84

11.6.2

FCC Verification Statement ................................................................................... 85

11.6.3

ICES-003 (Canada) ............................................................................................... 85

11.6.4

Europe (CE Declaration of Conformity) ................................................................. 85

11.6.5

Japan EMC Compatibility ...................................................................................... 85

11.6.6

BSMI (Taiwan) ....................................................................................................... 86

11.6.7

RRL (Korea)........................................................................................................... 86

11.6.8

CNCA (CCC-China) ............................................................................................... 86

11.7

11.8

Product Ecology Compliance................................................................................. 87

Other Markings ...................................................................................................... 89

Appendix A: Chassis Integration and Usage Tips ................................................................. 91

Appendix B: POST Code Diagnostic LED Decoder ............................................................... 92

Appendix C: POST Error Beep Codes..................................................................................... 96

Glossary..................................................................................................................................... 97

Reference Documents .............................................................................................................. 98

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Intel® Server System SR2500AL

List of Figures

List of Figures

Figure 1. Front View with Optional Bezel...................................................................................... 1

Figure 2. Front View without Bezel (Shown with Standard Control Panel Option) ....................... 1

Figure 3. Back View – (Shown with 1+1 Power Supply Configuration)......................................... 1

Figure 4. Major Chassis Components........................................................................................... 2

Figure 5. Back Panel Feature Overview ....................................................................................... 3

Figure 6. Control Panel Modules .................................................................................................. 4

Figure 7. Standard Control Panel Overview ................................................................................. 5

Figure 8. LCD Control Panel Overview ......................................................................................... 6

Figure 9. Front Panel Feature Overview ....................................................................................... 7

Figure 10. Optional Front Bezel .................................................................................................... 9

Figure 11. Front Bezel Supporting Standard Control Panel.......................................................... 9

Figure 12. Front Bezel Supporting Intel

®

Local Control Panel .................................................... 10

Figure 13. Mechanical Drawing for Dual (1+1 configuration) Power Supply Enclosure with PDM11

Figure 14. Power Supply Blank................................................................................................... 12

Figure 15. Non-Redundant Fan Module ..................................................................................... 21

Figure 16. Non-Redundant Fan Header Assignments on Mid-plane .......................................... 22

Figure 17. Fan Module Assembly ............................................................................................... 23

Figure 18. Redudant Fan Header Assignments on Mid-plane .................................................... 24

Figure 19. CPU Air Duct with Air Baffle ...................................................................................... 26

Figure 20. Drive Blank ................................................................................................................ 26

Figure 21. Passive Mid-plane Board........................................................................................... 28

Figure 22. SAS/SAS RAID Mid-plane Board .............................................................................. 29

Figure 22. Active SAS/SAS RAID Midplane 2 Board .................................................................. 35

Figure 23. Bridge Board.............................................................................................................. 36

Figure 24. Hot-Swap SAS/SATA Backplane (Front Side View) .................................................. 37

Figure 25. Hot-Swap SAS/SATA Backplane (Back Side View) .................................................. 37

Figure 26. Optional 6 th

Hard Drive (Front View).......................................................................... 44

Figure 27. Slim-Line Optical Drive Assembly.............................................................................. 44

Figure 28. 50-pin Connector to Slimline Optical Device ............................................................. 45

Figure 29. Hard Drive Tray Assembly ......................................................................................... 46

Figure 30. Optional 6 th

Hard Drive (Front View).......................................................................... 47

Figure 31. Optional Tape Drive (Front View) .............................................................................. 47

Figure 32. Passive Mid-plane Board........................................................................................... 48

Figure 33. Active Mid-plane with SAS / SAS RAID Support ....................................................... 49

Figure 34. Architecture Overview................................................................................................ 51

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List of Figures

Intel® Server System SR2500AL

Figure 35. Hot-swap SAS/SATA Backplane (Front Side View) .................................................. 53

Figure 36. Hot-swap SAS/SATA Backplane (Back Side View) ................................................... 54

Figure 37. SAS/SATA Backplane Functional Block Diagram ..................................................... 55

Figure 38. Standard Control Panel Assembly Module ................................................................ 57

Figure 39. Control Panel Buttons................................................................................................ 57

Figure 40. Control Panel LEDs ................................................................................................... 58

Figure 41. Standard Control Panel PCB ..................................................................................... 63

Figure 42. Intel

®

Local Control Panel Assembly Module............................................................. 65

Figure 43. Intel

®

Local Control Panel Overview .......................................................................... 65

Figure 44. Low Profile PCIe* Riser ............................................................................................. 71

Figure 45. Low Profile Passive PCI Express* Riser Card ........................................................... 73

Figure 46. Full Height PCI Express* Riser Card ......................................................................... 74

Figure 47. Full Height Passive PCI-X* Riser Card ...................................................................... 75

Figure 48. Full Height Active PCI-X* Riser Card......................................................................... 76

Figure 49. Intel

®

Server Board S5000PAL .................................................................................. 78

Figure 50. Intel

®

Server Board S5000PAL Components............................................................. 79

Figure 51. Diagnostic LED Placement Diagram ......................................................................... 92

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Intel® Server System SR2500AL

List of Tables

List of Tables

Table 1. Chassis Dimensions ....................................................................................................... 2

Table 2. Power Harness Cable Definitions ................................................................................. 13

Table 3. P1 Main Power Connector ............................................................................................ 14

Table 4. P2 Processor Power Connector.................................................................................... 14

Table 5. P3 Power Signal Connector.......................................................................................... 15

Table 6. P4 Hot Swap Backplane Power Connector .................................................................. 15

Table 7. P5 Mid-plane Power Connector ................................................................................... 15

Table 8. Efficiency...................................................................................................................... 16

Table 9. AC Input Rating............................................................................................................. 16

Table 10. Over-Current Protection Limits / 240VA Protection .................................................... 17

Table 11. Over-Voltage Protection (OVP) Limits ........................................................................ 18

Table 12. LED Indicators ............................................................................................................ 19

Table 13 Nonredundant Cooling Zones ..................................................................................... 21

Table 14. Non-redundant Fan Connector Pin Assingment ........................................................ 22

Table 15. Nonredundant Fan Header Assignment .................................................................... 23

Table 16 Redundant Cooling Zones .......................................................................................... 23

Table 17 Redundant Fan Connector Pin Assingment................................................................ 24

Table 18 Redundant Fan Header Assignment........................................................................... 25

Table 19. 120-pin Server Board-to-Mid-plane Bridge Board Connector Pin-out......................... 29

Table 20. Mid-plane Fan Header Pin-outs .................................................................................. 31

Table 21. Mid-plane Power Connector Pin-out ........................................................................... 31

Table 22. Mid-plane-to-Backplane Card Edge Connector #1 Pin-out ......................................... 32

Table 23. Mid-plane-to-Backplane Card Edge Connector #2 Pin-out ......................................... 33

Table 24. Active Mid-plane SAS RAID Battery Backup Connector Pin-out ................................ 34

Table 25. Passive Mid-plane SATA/SAS Connector Pin-outs .................................................... 34

Table 26. 2x4 SAS/SATA Backplane Power Connector Pin-out (J7L2) ..................................... 38

Table 27. 1x7 6th HDD / Tape Drive Option Power Connector Pin-out (J2M1) .......................... 38

Table 28. 6th HDD Option SATA/SAS I/O Connector Pin-out (J4L1) ......................................... 38

Table 29. 2x22 Slim-Line IDE Optical Drive Connector Pin-out (J5N1) ...................................... 38

Table 30. Slim-Line Optical Drive Slot Connector (J1A1) ........................................................... 39

Table 31. IDE Device Master/Slave Configuration Jumper (J6L1) ............................................. 39

Table 32. I2C Connector (J6L3).................................................................................................. 40

Table 33. PCIe X4 Slot Connector from Mid-plane (J4N1) ......................................................... 40

Table 34. PCIe* X4 Slot Connector from Mid-plane (J6N1)........................................................ 41

Table 35. USB Floppy Drive Connector (J2A1) .......................................................................... 41

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Intel order number D31980-009 ix

List of Tables

Intel® Server System SR2500AL

Table 36. Intel

®

Local Control Panel (LCP) Connector (J9A1)................................................... 42

Table 37. Control Panel Slot Connector (J9B1).......................................................................... 42

Table 38. SAS/SATA Hard Drive Connector Pin-outs (J2C3, J2B1, J4C1, J4B1, J7C1)............ 43

Table 39. J1L1 50-pin Connector to Slimline Optical Device...................................................... 45

Table 40. Hard Drive LED Function Definitions .......................................................................... 56

Table 41. Hard Drive Activity LED Functionality ......................................................................... 56

Table 42. Control Button and Intrusion Switch Functions ........................................................... 58

Table 43. Control Panel LED Functions...................................................................................... 59

Table 44. SSI Power LED Operation .......................................................................................... 60

Table 45. Control Panel LED Operation ..................................................................................... 60

Table 46. External USB Connectors (J1B1) ............................................................................... 62

Table 47. Video Connector (J1A1).............................................................................................. 62

Table 48. 64-pin Control Panel Connector (J6B1) ...................................................................... 64

Table 49. Control Panel LED Functions...................................................................................... 66

Table 50. SSI Power LED Operation .......................................................................................... 67

Table 51. Control Panel LED Operation ..................................................................................... 67

Table 52. 50-pin Control Panel Connector.................................................................................. 69

Table 53. Internal USB Header................................................................................................... 70

Table 54. System Environmental Limits Summary ..................................................................... 80

Table 55. Product Safety & Electromagnetic (EMC) Compliance ............................................... 83

Table 56: POST Progress Code LED Example .......................................................................... 92

Table 57. Diagnostic LED POST Code Decoder ........................................................................ 93

Table 58. POST Error Beep Codes ............................................................................................ 96

Table 59. BMC Beep Codes ....................................................................................................... 96

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Intel® Server System SR2500AL

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List of Tables

Revision – 1.6

Intel order number D31980-009 xi

1. Product Overview

The Intel

®

Server Chassis SR2500 is a 2U server chassis that is designed to support the Intel

®

Server Board S5000PAL. The server board and the chassis have features that are designed to support the high-density server market. This chapter provides a high-level overview of the chassis features. Greater detail for each major chassis component or feature is provided in the following chapters.

The chassis differs from previous generation products in that the majority of cables have been removed from the system and in their place are a series of board-to-board interconnects. The benefits of using board-to-board interconnects are simplification of platform integration and improved airflow for more reliable cooling.

A second significant change from the previous generation is the introduction of the mid-plane circuit board. There are two options for the mid-plane circuit board: the first option provides

SAS RAID support. The second option is a passive SATA/SAS mid-plane that can be used with either the SATA only connectors from the server board, or SATA/SAS connectors from an addin card.

1.1 Chassis Views

TP02091

Figure 1. Front View with Optional Bezel

TP02092

Figure 2. Front View without Bezel (Shown with Standard Control Panel Option)

Revision – 1.6

TP02093

Figure 3. Back View – (Shown with 1+1 Power Supply Configuration)

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0BProduct Overview

1.2 Chassis Dimensions

Table 1. Chassis Dimensions

Intel® Server System SR2500AL

Width without rails

Width with rails

Depth without CMA

Depth with CMA

Max. Weight

1.3 System Components

430 mm 16.93”

451.3 mm 17.77”

704.8 mm 27.75”

838.2 mm 33.0”

29.5 kg 65 lbs

E

F

B

C

D

A

G

N

H

M

I

L

K

J

A

TP02094

A. Rack Handles

B. SAS/SATA Backplane

C. Air Baffles

D. Power Distribution Module

E. Power Supply Modules

F. Riser Card Assembly

G. System Memory

Figure 4. Major Chassis Components

H. CPU Air Duct

I. System Fan Assembly

J. Standard Control Panel

K. Flex Bay – 6 th

HDD or Tape (Optional)

L. Hard Drive Bays

M. Slim-Line Optical Drive Bay

N. Front Bezel (Optional)

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The I/O connector locations on the back of the chassis are pre-cut, so the use of an I/O shield is not required. The supplied EMI gasket must be installed to maintain Electromagnetic

Interference (EMI) compliance levels.

A B C D

P

O

N

M

L K

J

I H G F E

TP02095

Figure 5. Back Panel Feature Overview

A. Low Profile PCIe* Add-in Card Slots

B. Full Height PCI Add-in Card Slots

C. Upper Power Supply Module

I. USB 6

J. USB 5

K. Video

D. Upper Power Receptacle

E. Lower Power Receptacle

L.

M.

DB-9 Serial A Connector

NIC 2

F. Lower Power supply Module N. NIC 1

G. Intel

®

Remote Management Module NIC (Optional) O. RJ45 Serial B Connector

H. Intel

®

I/O Expansion Module (Optional) P.

PS2* Keyboard and Mouse

Connectors

1.4 System Boards

The complete system includes the use of several system boards which are used as internal interconnects and provide feature accessibility. The following provides a brief description for each.

• Bridge Board – PCB used to route signals from the server board to the mid-plane and control panel boards.

• Mid-plane – A PCB used to determine the desired hard drive interface for the system.

Two mid-plane options are available for this system: o

Active SAS/SAS RAID – cable less solution with onboard SAS controller o

Passive SATA – cabled to SATA ports on the server board or from add-in adapter.

• Backplane – Hot swap backplane capable of supporting both SATA and SAS hard drives.

• Riser Cards – PCI riser cards used to provide up to five add-in card slots to the system.

Available riser card options for this system include: o

Low profile, two slot PCI Express* o

Full height, three slot PCI-X* (passive) o

Full height, three slot PCI-X (active) with onboard PXH PCI bridge chip o

Full height, two PCI Express slots + one PCI-X slot

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0BProduct Overview

Intel® Server System SR2500AL

• Optical Drive Interposer Card – Used to interface optical drive with 44-pin IDE cable as cabled from the server board.

• Control Panel – A PCB providing system status and control functionality features. Two control panel options are available for this system o

Standard Control Panel o

Intel

®

Local Control Panel with LCD support

• RAID Activation Keys – The system provides different RAID options depending on the mid-plane option selected. Two RAID Activation Keys are available for this system o

Hardware RAID Activation Key – Used on the Active SAS/SAS RAID Mid-plane to enable hardware RAID support. o

Software SATA RAID 5 Activation Key – This RAID key plugs into a connector on the server board. It is used to enable the software SATA RAID 5 functionality of the Intel

®

6321ESB I/O Controller Hub SATA ports of the server board when cabled to the passive mid-plane.

1.5 Control Panel Options

The chassis can support either of two control panels: a Standard Control Panel and an Intel

®

Local Control Panel with LCD support. The control panel assemblies are pre-assembled and modular in design. The entire module assembly slides into a predefined slot in the front of the chassis.

A

B

Figure 6. Control Panel Modules

TP02097

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The standard control panel supports several push buttons and status LEDs, along with USB and video ports to centralize system control, monitoring, and accessibility. The following diagram overviews the layout and functions of the control panel.

A B C D E F G

H

I

L K J

TP02098

Figure 7. Standard Control Panel Overview

A. NIC #2 Activity LED

B. NIC #1 Activity LED

C. Power / Sleep Button

D. Power / Sleep LED

E. Hard Drive Activity LED

F. System Status LED

G. System Identification LED

H. System Identification Button

I. System Reset Button

J. USB 2.0 Connector

K. Recessed NMI Button (Tool Required)

L. Video Connector

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0BProduct Overview

Intel® Server System SR2500AL

The Intel

®

Local Control Panel utilizes a combination of control buttons, LEDs, and an LCD display to provide system accessibility, monitoring, and control functions. The following diagram provides an overview of this control panel.

A B

C

D

E

F

O N M L K J I H G

TP02099

Figure 8. LCD Control Panel Overview

A USB 2.0 Port

B LCD Display

C Menu Control Button, Scroll up

D Menu Control Button, Scroll down

E Menu Control Button, Scroll left

F Menu Control Button, Enter

I

J

K

L

Power/Sleep Button

System Status LED

NIC 2 Activity LED

NIC 1 Activity LED

M Hard Disk Drive Activity LED

N Reset Button

O USB 2.0 Port

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1.6 Hard Drive and Peripheral Bays

The chassis is designed to support several different hard drive and peripheral configurations.

The system includes a hot swap backplane capable of supporting either SAS or SATA drives.

The sixth bay (see letter “B” in the figure below) can optionally be configured to support a sixth hard drive or 3.5” tape drive.

A B C

D

TP02096

Figure 9. Front Panel Feature Overview

A. Slimline Optical Drive Bay

B. 6th HDD Drive or Tape Drive Bay (Optional)

C. System Control Panel

D. 3.5” Hard Drive Bays (5)

1.7 Power Sub-system

The power subsystem of the chassis consists of an integrated power distribution board and module enclosure which is capable of housing up to two 750 Watt power supply modules supporting 1+0 or redundant 1+1 power configurations. In a 1+1 redundant configuration, each power supply module is hot-swappable should one fail.

The power sub-system has several integrated management features including:

• Status LED on each power module

• Over-temperature protection circuitry

• Over-voltage protection circuitry

With the addition of server management software, the power subsystem is capable of supporting several system management features including:

• Remote Power On/Off

• FRU Information Reporting

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0BProduct Overview

Intel® Server System SR2500AL

Each power supply module operates within the following voltage ranges and ratings:

PARAMETER

Line Voltage

(110)

Line Voltage

(220)

Frequency

MIN

90V rms

RATED MAX

140V rms

Start-up

Vac

85Vac

±4Vac

180V rms

200-240 264V rms

-

Power

Off

Vac

75Vac

±5Vac

-

Max Input

AC Current

Max Rated

Input AC

Current

12 A rms

1,3

11.0A

rms

4

47 Hz 50/60Hz 63 Hz

1 Maximum input current at low input voltage range shall be measured at 90Vac, at max load.

2 Maximum input current at high input voltage range shall be measured at 180VAC, at max load.

3

This is not to be used for determining agency input current markings.

4 Maximum rated input current is measured at 100VAC and 200VAC.

2,3

5.5A

rms

4

1.8 System Cooling

The chassis is offered with two system cooling options. The first option is a three fan solution providing sufficient airflow to maintain internal system thermal requirements when the external ambient temperature remains within specified limits. The second option is a 5+1 fan configuration. Refer to section 3.2 for details. Should a single fan failure occur, this option provides support for hot-swap fans and fan redundancy.

In addition to the system fan options, each power supply module installed provides two additional non-redundant fans which pull air from inside the chassis out the back.

1.9 Chassis Security

The chassis provides support for a lockable front bezel which prevents unauthorized access to the system control buttons and hard drives. In addition, a chassis intrusion switch is provided allowing server management software to monitor removal of the top cover from the chassis.

1.10 Rack and Cabinet Mounting Options

The chassis was designed to support 19” wide by up to 30” deep server cabinets. The chassis supports three rack mount options: o

A fixed mount relay rack / cabinet mount kit (Product order code - AXXBRACKETS ) which can be configured to mount the system into either a 2-post rack or 4-post cabinet o

A tool-less full extracting slide rail kit (Product order code – AXXHERAIL) designed to support an optional cable management arm (Product order code – AXXRACKCARM). o

A basic slide rail kit (Product order code – AXXBASICRAIL) designed to mount the chassis into a standard (19” by up to 30” deep) EIA-310D compatible server cabinet.

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1.11 Front Bezel Features

The optional front bezel is made of molded plastic and uses a snap-on design. When installed, its design allows for maximum airflow to maintain system cooling requirements.

TP02100

Figure 10. Optional Front Bezel

Separate front bezels are available to support systems that use either a standard control panel or the Intel

®

Local Control Panel with LCD support.

When the standard control panel is used, light pipes on the backside of the front bezel allow the system status LEDs to be monitored with the front bezel in the closed position. The front bezel lock is provided to prevent unauthorized access to hard drives, peripheral devices and the control panel.

Figure 11. Front Bezel Supporting Standard Control Panel

TP02101

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0BProduct Overview

Intel® Server System SR2500AL

When the local control panel is used, the control panel module can be adjusted to extend further out from the chassis face to allow the LCD panel to protrude from the front bezel.

AF000054

Figure 12. Front Bezel Supporting Intel

®

Local Control Panel

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2. Power Sub-System

The power sub-system of the chassis consists of an integrated Power Distribution Module

(PDM), a power module enclosure, and support for up to two 750 Watt power supply modules.

The power sub-system can be configured to support a single module in a 1+0 non-redundant configuration, or dual modules in a 1+1 redundant power configuration. In a 1+1 configuration, a single failed power module can be hot-swapped with the system running. Either configuration will support up to a maximum of 750 Watts of power.

This chapter provides technical details to the operation of the power supply module and power sub-system.

2.1 Mechanical Overview

The drawing below displays the Power Distribution Module and the power supply module enclosure assembly.

Figure 13. Mechanical Drawing for Dual (1+1 configuration) Power Supply Enclosure with PDM

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2.2 Single Power Supply Module Population

In single power module configurations, server management firmware requires that the power supply module be populated in the top power module slot. The non-operating slot must have the power supply blank installed.

AF000023

Figure 14. Power Supply Blank

Configuring a single power supply module in the bottom location will cause the server management firmware and BIOS to generate a system error during POST and the error will be reported to the System Event Log (SEL).

2.3 Handle and Retention Mechanism

Each power supply module includes a handle for module insertion to or removal from the module enclosure. Each module has a simple retention mechanism to hold the power module in place once it is inserted. This mechanism will withstand the specified platform mechanical shock and vibration requirements. The tab on the retention mechanism is colored

green

to indicate it is a hot-swap touch point. The latch mechanism is designed to prevent insertion or removal of the module with the power cord plugged in. This will aid the hot-swapping procedure.

2.4 Hot-swap Support

Hot-swapping a power supply module is the process of extracting and re-inserting a power supply module from an operating power system. During this process the output voltages shall remain within specified limits. Up to two power supply modules may be on a single AC line.

The power supply module can be hot-swapped by the method listed below.

Extraction: on removal, the power cord is unplugged first, and then the power module is removed. This can be done in standby mode or power-on mode.

Insertion: The module is inserted first, and then the power cord is plugged in. If powered off, the system and the power supply will power on into standby mode or power-on mode.

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2.5 Airflow

Each power supply module incorporates two non-redundant 40mm fans for self cooling and partial system cooling. The fans will provide no less than 10 CFM airflow through the power supply when installed in the system and operating at maximum fan speed. The cooling air will enter the power module from the PDB side (pre-heated air from the system).

2.6 AC Power Cord Specification Requirements

The AC power cord used must meet the following specification requirements:

Cable Type

Wire Size

Temperature Rating

Amperage Rating

Voltage Rating

SJT

16 AWG

105º C

13A

125V

2.7 Output Cable Harness

The power distribution board provides a cable harness providing connectors to the various system boards. The harness size, connectors, and pin outs are shown below. Listed or recognized component appliance wiring material (AVLV2), CN, rated 105

°

C min, 300Vdc min shall be used for all output wiring.

Length mm

90, 90° angle

115, 90° angle

100

150

220

Table 2. Power Harness Cable Definitions

To connector #

P1

No of pins

2x12

Description

Main Power Connector

P2

P3

P4

P5

2x4

1x5

2x4

2x5

Processor Power Connector

Server Board Signal Connector

Backplane Power Connector

Mid-plane Power Connector

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2.7.1 P1 – Server Board Power Connector

Connector housing: 24- Pin Molex* Mini-Fit Jr.

39-01-2245 or equivalent

Contact: Molex Mini-Fit, HCS, Female, Crimp 44476 or equivalent

Table 3. P1 Main Power Connector

PIN

1

SIGNALS

+3.3 VDC

18 AWG COLOR

Orange

PIN SIGNAL

13 +3.3 VDC

-12 VDC

14

5V RS

5 COM

Red

Red (24 AWG)

Black

6 +5 Red

7 COM

8 PWR OK

9 5Vsb

10 +12 V3

Black

Gray

Purple

Yellow/Blue

Yellow/Blue

17 COM

21 +5 VDC

23 +5 VDC

24 COM

2.7.2 P2 – Processor Power Connector

Connector housing: 8- Pin Molex 39-01-2085 or equivalent

Contact: Molex 44476-1111 or equivalent

18 AWG

COLORS

Orange

Blue

Black

Green

Black

Black

Black

N.C.

Red

Red

Red

Black

PIN

1

Table 4. P2 Processor Power Connector

SIGNAL

COM

18 AWG COLORS

Black

PIN

5

SIGNAL 18 AWG COLORS

+12 V1 Yellow

+12

Yellow

+12

Yellow/Black

+12

Yellow/Black

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2.7.3 P3 – Power Signal Connector

Connector housing: 5-pin Molex 50-57-9705 or equivalent

Contacts: Molex 16-02-0087 or equivalent

Table 5. P3 Power Signal Connector

PIN

1

SIGNAL

I2C Clock (SCL)

2 I2C Data (SDL)

3 SMBAlert#

4 ReturnS

5 3.3RS

24 AWG COLORS

White/Green

White/Yellow

White

Black

White/Brown

2.7.4 P4 – Backplane Power Connector

Connector housing: 8 Pin Molex Mini-Fit Jr. PN# 39-01-2245 or equivalent

Contact: Molex Mini-Fit, HCS, Female, Crimp 44476 or equivalent

PIN

Table 6. P4 Hot Swap Backplane Power Connector

SIGNAL 18 AWG COLORS PIN SIGNAL 18 AWG COLORS

5 +12 Yellow/Green

6 +12 Yellow/Green

2.7.5 P5 Mid-plane Power Connector

Connector housing: 10 Pin Molex Mini-Fit Jr. 43025-1000 or equivalent

Contact: Molex Mini-Fit, HCS, Female, Crimp 43030-0007 or equivalent

PIN

1

3

4

+5V

+3.3V

Table 7. P5 Mid-plane Power Connector

SIGNAL

COM

20 AWG Colors

Black

Red

Orange

PIN SIGNAL 20 AWG Colors

6 +12 V4 Yellow/Green

7 +12 Yellow/Green

8

9

+12 V4

+12 V4

Yellow/Green

Yellow/Green

2.8 AC Input Requirements

The power supply module incorporates universal power input with active power factor correction, which reduces line harmonics in accordance with the EN61000-3-2 and JEIDA MITI standards.

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2.8.1 Efficiency

The following table provides the required minimum efficiency level at various loading conditions.

These are provided at three different load levels; 100%, 50% and 20%. Efficiency is tested over an AC input voltage range of 115VAC to 220VAC.

Loading

Recommended Efficiency

Table 8. Efficiency

100% of maximum

~80%

50% of maximum

~83%

20% of maximum

~78%

2.8.2 AC Input Voltage Specification

The power supply must operate within all specified limits over the input voltage range shown in the following table.

PARAMETER

Line Voltage

(110)

Line Voltage

(220)

Frequency

MIN

90V rms

Table 9. AC Input Rating

RATED MAX

Start-up

Vac

140V rms

85Vac

±4Vac

180V rms

200-240 264V rms

-

Power

Off

Vac

75Vac

±5Vac

-

Max Input

AC Current

Max Rated

Input AC

Current

12 A rms

1,3

11.0A

rms

4

6.0 A rms

2,3

5.5A

rms

4

47 Hz 50/60Hz 63 Hz

Notes:

1. Maximum input current at low input voltage range shall be measured at 90Vac, at max load.

2. Maximum input current at high input voltage range shall be measured at 180VAC, at max load.

3. This is not to be used for determining agency input current markings.

4. Maximum rated input current is measured at 100VAC and 200VAC.

Harmonic distortion of up to 10% of the rated AC input voltage must not cause the power supply to go out of specified limits. The power supply shall power off at or below 75Vac ±5Vac. The power supply shall start up at or above 85VAC ±4Vac. Application of an input voltage below

85VAC shall not cause damage to the power supply or blow a fuse.

2.8.3 AC Line Dropout / Holdup

An AC line dropout is defined to be when the AC input drops to 0VAC at any phase of the AC line for any length of time. During an AC dropout of one cycle or less the power supply must meet dynamic voltage regulation requirements over the rated load. If the AC dropout lasts longer than one cycle the power supply should recover and meet all turn-on requirements. The power supply must meet the AC dropout requirement over rated AC voltages, frequencies, and output loading conditions. Any dropout of the AC line shall not cause damage to the power supply.

20ms Min when tested under the following conditions: Max combined load = 525W,

12ms Min when tested under the following conditions: Max combined load = 750W

2.8.4 AC Line 5 VSB Holdup

The 5VSB output voltage should stay in regulation under its full load (static or dynamic) during an AC dropout of 70ms min (=5VSB holdup time) whether the power supply is in ON or OFF state (PSON asserted or de-asserted).

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2.8.5 AC Inrush

AC line inrush current shall not exceed 40A peak for up to one-quarter of the AC cycle, after which, the input current should be no more than the specified maximum input current. The peak inrush current shall be less than the ratings of its critical components (including input fuse, bulk rectifiers, and surge limiting device).

The power supply must meet the inrush requirements for any rated AC voltage, during turn on at any phase of AC voltage, during a single cycle AC dropout condition as well as upon recovery after AC dropout of any duration, and over the specified temperature range (T op

). It is acceptable that AC line inrush current may reach up to 60A peak for up to 1 msec.

2.9 Protection Circuits

Protection circuits inside the PDB and the power supply shall cause the power supply’s main

+12V output to shut down, or shall cause a shut down of any of the three outputs on the PDB.

Either of these shutdowns will result in shutting down the entire power supply / PDB combination. If the power supply latches off due to a protection circuit tripping, an AC cycle

OFF for 15 seconds shall be able to reset the power supply and the PDB.

2.9.1 Over-Current Protection (OCP)

Each DC/DC converter output on the PDB shall have individual OCP protection circuits. The power supply and power distribution board (PS and PDB) shall shutdown and latch off after an over-current condition occurs. This latch shall be cleared by an AC power interruption. The following table provides the over-current limits. The values are measured at the PDB harness connectors. The DC/DC converters shall not be damaged from repeated power cycling in this condition. The +12V output from the power supply is divided on the PDB into four channels and each is limited to 240VA of power. There shall be current sensors and limit circuits to shut down the entire PS and PDB if the limit is exceeded. The limits are listed below.

Table 10. Over-Current Protection Limits / 240VA Protection

Output Voltage

+3.3V

+5V

-12V

+12V1

+12V2

+12V3

+12V4

MIN OCP TRIP LIMITS

110% min (= 26.4A min)

110% min (= 33A min)

125% min (= 0.625A min)

112.5% min (= 18.0A min)

112.5% min (= 18.0A min)

112.5% min (= 18.0A min)

112.5% min (= 18.0A min)

MAX OCP TRIP LIMITS

150% max (= 36A max)

150% max (= 45A max)

400% max (= 2.0A max)

20A max

20A max

20A max

20A max

2.9.2 Over-Voltage Protection (OVP)

Each DC/DC converter output on the PDB shall have individual OVP circuits built in and they shall be locally sensed. The PS and PDB shall shutdown and latch off after an over-voltage condition occurs. This latch shall be cleared by an AC power interruption. The following table provides the over-voltage limits. The values are measured at the PDB harness connectors. The voltage shall never exceed the maximum levels when measured at the power pins of the output harness connector during any single point of fail. The voltage shall never trip any lower than the minimum levels when measured at the power pins of the PDB connector.

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Table 11. Over-Voltage Protection (OVP) Limits

Output Voltage OVP MIN (V) OVP MAX (V)

+3.3V 3.9 4.5

+5VSB 5.7 6.5

+12V1/2/3/4 13.0 14.5

2.9.3 Over-Temperature Protection (OTP)

The power supply will be protected against over-temperature conditions caused by loss of fan cooling or excessive ambient temperature. In an OTP condition the power supply will shutdown.

When the power supply temperature drops to within specified limits, the power supply shall restore power automatically, while the 5 Vsb remains constantly on. The OTP trip level shall have a minimum of 4

°C of ambient temperature hysteresis, so that the power supply will not oscillate on and off due to a temperature recovery condition. The power supply shall alert the system of the OTP condition via the power supply FAIL signal and the PWR LED.

2.10 DC Output Specification

2.10.1 Output Power / Currents

The following table defines power and current ratings for this 750W continuous (860W pk) power supply in 1+0 or 1+1 redundant configuration. The combined output power of both outputs shall not exceed the rated output power. The power supply must meet both static and dynamic voltage regulation requirements for the minimum loading conditions. Also, the power supply shall be able to supply the listed peak currents and power for a minimum of 10 seconds.

Outputs are not required to be peak loaded simultaneously.

MAX Load

MIN DYNAMIC Load

MIN STATIC Load

PEAK Load

Max Output Power (continuous)

Peak Output Power

+12V +5Vsb

62.0A 3.0A

3.0A 0.1A

0.0A 0.1A

70.0A(12s min)

12V x 62A = 744W max

12V x 70A = 840W pk

5.0A (0.5s min @ turn-on)

5V x 3A = 15W max

5V x 5A = 25W pk

2.10.2 Standby Output / Standby Mode

The 5Vsb output shall be present when an AC input greater than the power supply turn-on AC voltage is applied. Applying an external 5.25V to 5Vsb shall not cause the power supply to shut down or exceed operating limits. When the external voltage is removed the voltage shall return to the power supplies operating voltage without exceeding the dynamic voltage limits.

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2.11 Power Supply Status LED

Each power supply module will have a single bi-color LED to indicate power supply status. The

LED operation is defined below.

Table 12. LED Indicators

Power Supply Condition

No AC power to all power supplies

No AC power to this PSU only (for 1+1 configuration)

or

Power supply critical event causing a shutdown: failure, fuse blown (1+1 only), OCP, OVP, Fan Failed

Power supply warning events where the power supply continues to operate: high temp, high power, high current, slow fan.

AC present / Only 5VSB on (PS Off)

Output ON and OK

OFF

Bi-Color LED

AMBER

1Hz Blink AMBER

1Hz Blink GREEN

GREEN

The LED is visible on the rear panel of each installed power supply module.

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2BCooling Sub-System

3. Cooling Sub-System

Intel® Server System SR2500AL

Several components and configuration requirements make up the cooling sub-system of the chassis. These include the system fan module, the power supply fans, air baffles, CPU air duct, and drive bay population. All are necessary to provide and regulate the air flow and air pressure needed to maintain the system’s thermals when operating at or below maximum specified

thermal limits. See Table 54. System Environmental Limits.

Two system fan assembly options are available for this chassis. The first option is a nonredundant three fan solution providing sufficient airflow to maintain internal system thermal requirements when the external ambient temperature remains within specified limits. The second option is a redundant fan solution. Three parallel sets of fans are arranged in series to provide redundant cooling in the event of a single fan failure. Each cooling option utilizes two fan types: a 60mm variable speed fan and an 80mm variable speed fan.

The chassis uses a variable fan speed control engine to provide adequate cooling for the system at various ambient temperature conditions, under various server workloads, and with the least amount of acoustic noise possible. The fans operate at the lowest speed for any given condition in order to minimize acoustics. The Baseboard Management Controller (BMC) integrated on the Intel

®

Server Board S5000PAL is used for the variable fan speed control function. The controller monitors selective component temperatures and the ambient temperature, as well as each fan’s RPM to determine the necessary airflow. The BMC sets the fan speeds to the appropriate RPM in order to maintain proper cooling. The BMC controller will also log errors into the System Event Log (SEL) when temperature sensors exceed their safe operating ranges, or if any of the fans fail to operate at safe airflow speeds. In the event of a fan failure, the BMC will boost the remaining fans to compensate for the lost air flow. A chassis with redundant fans can continue to operate in this degraded condition while the non-redundant chassis may not. If the cooling is not sufficient under a failed fan condition, the system will eventually shutdown to protect itself from thermal damage.

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3.1 Non-redundant Fan Module

TP02119

Figure 15. Non-Redundant Fan Module

This option provides the primary airflow for system configurations that do not require redundant cooling.

Table 13 Nonredundant Cooling Zones

Fan

System Fan #1

System Fan #2

System Fan #3

Power Supply

Fans 2 fans per module

Cooling

Zone

CPU1

CPU2

PCI

Power

Supply

Description of greatest cooling influence

Primary cooling for CPU1 and memory

Primary cooling for hard drives 4 and 5, CPU2, the MCH, and the low profile PCI cards

Primary cooling for hard drives 2 and 3, Full

Height PCI cards, PXH and IOP80333 chipset

Primary cooling for hard drives 0 and 1, and the power supply module(s)

The system fan module has been designed for ease of use and has support for several management features that can be utilized by the server board management system.

• The fan module houses two different fan sizes. System fans 1 and 2 use an 80mm fan, while system fan 3 uses a 60mm fan.

• Each fan is designed for tool-less insertion to or removal from the fan module housing.

Note: The fans are NOT hot-swappable. The system must be turned off in order to replace a failed fan.

• Each fan within the module is capable of supporting multiple speeds. If the internal ambient temperature of the system exceeds the value programmed into the thermal sensor data record (SDR), the BMC firmware will increase the speed for all the fans within the fan module.

• Each fan connector within the module supplies a tachometer signal that allows the BMC to monitor the status of each fan. If one of the fans should fail, the remaining fans will increase their rotation and attempt to maintain the thermal requirements of the system.

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• Each fan has an associated fault LED on the mid-plane located next to the fan header.

In the event of a fan failure, the fault LED for the failing fan can be illuminated by system management.

Table 14. Non-redundant Fan Connector Pin Assingment

Pin Signal Name Description

2 PWM

3 12V

4 12V

Fan speed control signal

Power for fan

Power for fan

5 Tachometer A Fan RPM sensor output

Two pulse per revolution for the 80mm fan

Four pulses per revolution for the 60mm fan

6 Return Return path to ground

7 Return Return path to ground

9 LED Cathode Loopback signal to pin 10

10 LED Anode Loopback signal to pin 9

The system fans plug into headers on the mid-plane board according to the following diagram.

22

Figure 16. Non-Redundant Fan Header Assignments on Mid-plane

Intel order number D31980-009

Revision – 1.6

Table 15. Nonredundant Fan Header Assignment

Fan ID

Fan #1 - CPU1 cooling

Fan #2 - CPU2 cooling

Fan #3 - PCI Cooling

Mid-plane Fan Header Name

FAN_2

FAN_4

FAN_5

3.2 Redundant System Fan Module

TP02102

Figure 17. Fan Module Assembly

Table 16 Redundant Cooling Zones

Fan

System Fan #1 & #2

System Fan #2 & #3

System Fan #5 & #6

Power Supply Fans 2 fans per module

Cooling

Zone

Description of greatest cooling influence

CPU1 Primary cooling for CPU1 and memory

CPU2 Primary cooling for hard drives 4 and 5, CPU2, the BNB, and the low profile PCI cards

PCI

Power

Supply

Primary cooling for hard drives 2 and 3, Full

Height PCI cards, PXH and IOP80333 chipset

Primary cooling for hard drives 0 and 1, and the power supply module(s)

Each 10-pin fan connector provides power and ground, PWM control, tachometer output, a fan present detection signal, and a fault LED signal allowing it to be monitored independently by server management software. The following table provides the pin-out and description for the connectors on each fan.

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Table 17 Redundant Fan Connector Pin Assingment

Pin Signal Name Description

2 PWM

3 12V

4 12V

Fan speed control signal

Power for fan

Power for fan

5 Tachometer A Fan RPM sensor output

Two pulses per revolution for the 80mm fan

Four pulses per revolution for the 60mm fan

6 Return Return path to ground

7 Return Return path to ground

8 Fan Presence Detection if fan is installed in system

9 LED Cathode LED in fan

10 LED Anode Reserved, unused by the redundant fan

The system fans are hot-pluggable and do not have any cable connections. They mate directly to the fan module. The system fan module plugs into headers on the mid-plane board according the following diagram.

24

Figure 18. Redudant Fan Header Assignments on Mid-plane

Intel order number D31980-009

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Table 18 Redundant Fan Header Assignment

Fan ID

Fan #1 - CPU1 Cooling

Fan #2 - CPU1 Cooling

Fan #3 - CPU2 Cooling

Fan #4 - CPU2 Cooling

Fan #5 - PCI Cooling

Fan #6 - PCI Cooling

Mid-plane Fan Header Name

FAN_1

FAN_2

FAN_3

FAN_4

FAN_5

FAN_6

The system fan module has been designed for ease of use and has support for several management features that can be utilized by the server board management system.

• The fan module houses two different fan sizes. System fans 1, 2, 3 and 4 use an 80mm fan, while system fans 5 and 6 use a 60mm fan.

• Each fan is designed for tool-less insertion to or removal from the fan module and can be hot-swapped in the event of failure.

• Each fan within the module is equipped with a failure LED. In the event of a fan failure, the failure LED on the failing fan can be illuminated by server management.

• Each fan within the module is capable of supporting multiple speeds. If the internal ambient temperature of the system exceeds the value programmed into the thermal sensor data record (SDR), the BMC firmware will increase the speed for all the fans within fan module.

• Each fan connector within the module supplies a tachometer signal that allows the BMC to monitor the status of each fan. If one of the fans should fail, the remaining fans will increase their rotation and attempt to maintain the thermal requirements of the system.

3.3 Air Flow Support

To control airflow within the system, the chassis uses an air baffle and a CPU air duct to isolate and direct airflow to three critical zones: the power supply zone, the full height PCI riser zone, and the CPU/memory/low profile PCI riser zone.

3.3.1 Power Supply Zone

An air baffle is used to isolate the air flow of the main system board zones from the zone directly behind the power supply. As the power supply fans pull pre-heated air through the power supply from inside the chassis, the zone behind it must remain as cool as possible by drawing air from the leftmost drive bays only.

3.3.2 Full Height Riser Zone

The full height riser zone is the area between the power supply assembly and the full height riser card of the riser assembly. The air flow through this area is generated by system fan 3 of the fan module in a non-redundant fan configuration. In a redundant fan configuration, the air flow for this zone is provided by system fans 5 and 6. Air is drawn from the drive bay area through the fan and pushed out of the system through ventilation holes the back side of the chassis.

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3.3.3 CPU / Memory / Low Profile PCI Zone

The CPU / memory / low profile PCI zone is the area between the low profile riser card of the riser assembly and the right chassis wall. In a non-redundant fan configuration, the air flow for this zone is generated by system fans 1 and 2 of the fan module. In a redundant fan configuration, the air flow for this zone is provided by system fans 1, 2, 3 and 4. Air is drawn from the drive bay area, through the fans, directed through the CPU air duct, and out through ventilation holes on both the back wall and rear side wall of the chassis.

The CPU air duct is used to direct air flow through the processor heat sinks for both single and dual processor configurations. For single processor configurations, a flexible air baffle is attached to the air duct as shown in the following diagram.

AF000048

Figure 19. CPU Air Duct with Air Baffle

Operating a single processor configuration without the air baffle installed will result in the processor over heating and may cause the system to shutdown.

3.4 Drive Bay Population

To maintain the proper air pressure within the system, all hard drive bays must be populated with either a hard drive, or drive blank.

26

Figure 20. Drive Blank

TP02104

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Revision – 1.6

4. Platform Control

This server system has embedded platform control which is capable of automatically adjusting system performance and acoustic levels.

P

M e a r n f o a r g m e a m n e c n e t

P e

T r h f r o o r t m t l l i a n n g c e

I n t e g r a t

C o n t r t o l e l d

M a

A c o u s t i c n a g e m c m e n t M

T h e r m a l o n i t o r i i n n g

F a

C n o

S n p t r e o e l d

4.1 Overview

Platform control optimizes system performance and acoustics levels through:

ƒ Performance Management

ƒ Thermal

ƒ Fan Speed Control

The platform components used to implement platform control include:

ƒ Baseboard Management Controller functions of the ESB-2

ƒ LM94 Sensor Monitoring Chip

ƒ Variable Speed System Fans

ƒ Sensor Data Records as loaded by the FRUSDR Utility type

For additional details on platform control, please see the Intel

®

S5000 Server Board Family

Datasheet

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4BSystem Board Interconnects

5. System Board Interconnects

Intel® Server System SR2500AL

The chassis incorporates several design changes from the previous generation Intel 2U server chassis, resulting in improved cable routing. System boards within the chassis include the midplane, bridge board, hot-swap backplane, and control panel. This chapter describes the interconnect features of each, and defines the pin-outs for each of their connectors. Functional details of each system board are described in later chapters.

5.1 Mid-plane

The mid-plane is new to this generation of Intel high density server platforms. Its design and use, along with that of the bridgeboard and hot-swap backplane, improve cable routing within the system. The mid-plane is the key system board of the chassis. It serves as the primary interface between the server board, hot-swap backplane, and control panel. Two mid-planes are offered for this chassis: a passive SATA/SAS, and an active SAS/SAS RAID.

The passive midplane is a simple pass through from the backplane to the SATA connectors on the baseboard or SAS/SATA connectors on an add-in card.

The following diagram shows the location for each connector found on the passive mid-plane board.

B

C

A

D

E

F

G

H

I

J

AF000047

Figure 21. Passive Mid-plane Board

A

B

Power Connector

Fan 6 Connector

C Fan 5 Connector

D SAS/SATA Connectors

E Bridge Board Connector

F Fan 4 Connector

G Fan 3 Connector

H Fan 1 Connector

I

J

Fan 2 Connector

Backplane Connector

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4BSystem Board Interconnects

The chassis also supports an active SAS / SAS RAID mid-plane. This system board incorporates an LSI* LSISAS1068 SAS controller onto the board. See Chapter 5 for details describing SAS / SAS RAID support. The following diagram shows the location for each connector found on this board.

C

A

B

D

E

F

G

H

I

J

L

K

AF000046

Figure 22. SAS/SAS RAID Mid-plane Board

A

Optional RAID Cache Battery

Backup Connection

B Power Connector

C Mini-DIMM Connector

D Fan 6 Connector

E

F

Fan 5 Connector

Bridge Board Connector

G Fan 4 Connector

H Fan 3 Connector

I Fan 1 Connector

J Fan 2 Connector

RAID Activation Key

K

L

Connector

Backplane Connector

The following tables define the connector pin-outs for both mid-plane boards.

Table 19. 120-pin Server Board-to-Mid-plane Bridge Board Connector Pin-out

PIN SIGNAL NAME

1 GND

2 PE1_ESB_TX_DN3

3 PE1_ESB_TX_DP3

4 GND

5 PE_WAKE_N

6 GND

7 PE1_ESB_TX_DN2

8 PE1_ESB_TX_DP2

9 GND

10 FAN_PRSNT5_N

11 GND

Revision – 1.6

PIN SIGNAL NAME

61 SMB_SENSOR_3V3SB_CLK_BUF

62 SMB_SENSOR_3V3SB_DAT_BUF

63 FM_BRIDGE_PRSNT_N

64 GND

65 PE1_ESB_RX_DN_C3

66 PE1_ESB_RX_DP_C3

67 GND

68 FAN_PRSNT6_N

69 GND

70 PE1_ESB_RX_DN_C2

71 PE1_ESB_RX_DP_C2

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4BSystem Board Interconnects

PIN SIGNAL NAME

12 PE1_ESB_TX_DN1

13 PE1_ESB_TX_DP1

14 GND

15 RST_PS_PWRGD

16 GND

17 PE1_ESB_TX_DN0

18 PE1_ESB_TX_DP0

19 GND

20 FM_RAID_MODE

21 GND

22 CLK_IOP_DN

23 CLK_IOP_DP

24 GND

25 SGPIO_DATAOUT1

26 SGPIO_DATAOUT0

27 SGPIO_LOAD

28 SGPIO_CLOCK

29 GND

30 USB2_ESB_DP

31 USB2_ESB_DN

32 GND

33 USB2_ESB_OC_N

34 NIC1_LINK_LED_N

35 NIC1_ACT_LED_N

36 LED_STATUS_AMBER_R1

37 NIC2_LINK_LED_N

38 NIC2_ACT_LED_N

39 LED_STATUS_GREEN_BUF_R1

40 GND

41 SMB_PBI_5VSB_DAT

42 SMB_PBI_5VSB_CLK

43 GND

44 V_IO_HSYNC2_BUF_FP

45 V_IO_VSYNC2_BUF_FP

46 GND

47 V_IO_BLUE_CONN_FP

48 V_IO_GREEN_CONN_FP

49 V_IO_RED_CONN_FP

50 GND

51 LED_FAN6_FAULT

52 LED_FAN5_FAULT

53 LED_FAN4_FAULT

54 FAN_PWM3

55 GND

56 PCI_FAN_TACH10

57 FAN_TACH8

58 FAN_TACH6

59 FAN_TACH4_H7

60 FAN_TACH2_H7

Intel® Server System SR2500AL

PIN SIGNAL NAME

72 GND

73 FAN_PRSNT4_N

74 GND

75 PE1_ESB_RX_DN_C1

76 PE1_ESB_RX_DP_C1

77 GND

78 RAID_KEY_PRES

79 GND

80 PE1_ESB_RX_DN_C0

81 PE1_ESB_RX_DP_C0

82 GND

83 FAN_PRSNT1_N

84 FAN_PRSNT3_N

85 FAN_PRSNT2_N

86 GND

87 USB1_ESB_DP

88 USB1_ESB_DN

89 GND

90 USB1_ESB_OC_N

91 USB0_ESB_OC_N

92 GND

93 USB0_ESB_DP

94 USB0_ESB_DN

95 GND

96 FP_NMI_BTN_N

97 BMC_RST_BTN_N

98 FP_PWR_BTN_N

99 FP_ID_SW_L

100 GND

101 SMB_IPMB_5VSB_DAT

102 SMB_IPMB_5VSB_CLK

103 GND

104 LED_HDD_ACTIVITY_N

105 LED_HDD_5V_A

106 FP_PWR_LED_R_N

107 FP_PWR_LED_3VSB

108 FP_ID_LED_R1_N

109 FM_SIO_TEMP_SENSOR

110 LED_FAN3_FAULT

111 LED_FAN2_FAULT

112 LED_FAN1_FAULT

113 FAN_PWM_CPU1

114 GND

115 FAN_PWM_CPU2

116 PCI_FAN_TACH9

117 FAN_TACH7

118 FAN_TACH5

119 FAN_TACH3_H7

120 FAN_TACH1_H7

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Table 20. Mid-plane Fan Header Pin-outs

J2B1 - FAN_1

PIN SIGNAL NAME

1 FAN_TACH5

2 FAN_PWM_CPU1

3 P12V

4 P12V

5 FAN_TACH1_H7

6 GND

7 GND

8 FAN_PRSNT1_N

9 LED_FAN1_FAULT

10 LED_FAN1

J2B2 - FAN_2

PIN SIGNAL NAME

1 FAN_TACH6

2 FAN_PWM_CPU1

3 P12V

4 P12V

5 FAN_TACH2_H7

6 GND

7 GND

8 FAN_PRSNT2_N

9 LED_FAN2_FAULT

10 LED_FAN2

J2B3 - FAN_3

PIN SIGNAL NAME

1 FAN_TACH7

2 FAN_PWM_CPU2

3 P12V

4 P12V

5 FAN_TACH3_H7

6 GND

7 GND

8 FAN_PRSNT3_N

9 LED_FAN3_FAULT

10 LED_FAN3

J3B1 - FAN_4

PIN SIGNAL NAME

1 FAN_TACH8

2 FAN_PWM_CPU2

3 P12V

4 P12V

5 FAN_TACH4_H7

6 GND

7 GND

8 FAN_PRSNT4_N

9 LED_FAN4_FAULT

10 LED_FAN4

J7B1 - FAN_5

PIN SIGNAL NAME

1 FAN_TACH10

2 FAN_PWM3

3 P12V

4 P12V

5 FAN_TACH9

6 GND

7 GND

8 FAN_PRSNT5_N

9 LED_FAN5_FAULT

10 LED_FAN5

J7B2 - FAN_6

PIN SIGNAL NAME

1 UNUSED

2 FAN_PWM3

3 P12V

4 P12V

5 FAN_TACH10

6 GND

7 GND

8 FAN_PRSNT6_N

9 LED_FAN6_FAULT

10 LED_FAN6

Table 21. Mid-plane Power Connector Pin-out

PIN Signal Description

1 GND

2 GND

3 P5V

4 P3V3

5 GND

6 P12V

7 P12V

8 P12V

9 P12V

10 P5V_STBY

Revision – 1.6

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4BSystem Board Interconnects

Intel® Server System SR2500AL

PIN SIGNAL NAME

A1 RST_PS_PWRGD

A2 GND

A3 GND

A4 SATA1_RX_N

A5 SATA1_RX_P

A6 GND

A7 GND

A8 SATA1_TX_P

A9 SATA1_TX_N

A10 GND

A11 GND

A12 USB2_ESB_OC_N

A13 GND

A14 GND

A15 SATA3_RX_N

A16 SATA3_RX_P

A17 GND

A18 GND

A19 GND

A20 SATA3_TX_P

A21 SATA3_TX_N

A22 GND

A23 GND

A24 SATA5_RX_N

A25 SATA5_RX_P

A26 GND

A27 GND

A28 SATA5_TX_P

A29 SATA5_TX_N

A30 GND

A31 GND

A32 P5V_STBY

Table 22. Mid-plane-to-Backplane Card Edge Connector #1 Pin-out

J7A1 - HSBP#1 I/F

PIN SIGNAL NAME

B1 GND

B2 SATA0_RX_N

B3 SATA0_RX_P

B4 GND

B5 GND

B6 SATA0_TX_N

B7 SATA0_TX_P

B8 GND

B9 GND

B10 USB2_ESB_DN

B11 USB2_ESB_DP

B12 GND

B13 SATA2_RX_N

B14 SATA2_RX_P

B15 GND

B16 NC_RESERVEDB16

B17 SMB_SAS_EDGE_DAT

B18 NC_RESERVEDB18

B19 SMB_SAS_EDGE_CLK

B20 NC_RESERVEDB20

B21 GND

B22 SATA2_TX_P

B23 SATA2_TX_N

B24 GND

B25 GND

B26 SATA4_RX_N

B27 SATA4_RX_P

B28 GND

B29 GND

B30 SATA4_TX_P

B31 SATA4_TX_N

B32 GND

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Table 23. Mid-plane-to-Backplane Card Edge Connector #2 Pin-out

PIN SIGNAL NAME

A1 SGPIO_DATAOUT0

A2 SGPIO_DATAOUT1

A3 GND

A4 GND

A5 SATA_ADDIN2_RX_N

A6 SATA_ADDIN2_RX_P

A7 GND

A8 GND

A9 SATA_ADDIN2_TX_P

A10 SATA_ADDIN2_TX_N

A11 GND

A12 SMB_PBI_3VSB_DAT

A13 SMB_PBI_3VSB_CLK

A14 USB0_ESB_OC_N

A15 GND

A16 GND

A17 USB0_ESB_DP

A18 USB0_ESB_DN

A19 GND

A20 LED_NIC1_ACT_N

A21 LED_NIC1_LINK_N

A22 FM_SIO_TEMP_SENSOR

A23 LED_NIC2_LINK_N

A24 LED_NIC2_ACT_N

A25 GND

A26 V_BLUE_CONN_FP

A27 V_GREEN_CONN_FP

A28 V_RED_CONN_FP

A29 GND

A30 V_HSYNC2_BUF_FP

A31 V_VSYNC2_BUF_FP

A32 GND

J4A1 - HSBP#2 I/F

PIN SIGNAL NAME

B1 SGPIO_CLOCK

B2 GND

B3 SATA_ADDIN1_RX_N

B4 SATA_ADDIN1_RX_P

B5 GND

B6 GND

B7 SATA_ADDIN1_TX_N

B8 SATA_ADDIN1_TX_P

B9 GND

B10 GND

B11 SGPIO_LOAD

B12 SMB_IPMB_5VSB_DAT

B13 SMB_IPMB_5VSB_CLK

B14 GND

B15 USB1_ESB_DP

B16 USB1_ESB_DN

B17 GND

B18 GND

B19 USB1_ESB_OC_N

B20 LED_HDD_ACTIVITY_N

B21 LED_HDD_5V_A

B22 FP_ID_SW_L

B23 BMC_RST_BTN_N

B24 FP_PWR_BTN_N

B25 FP_NMI_BTN_N

B26 FP_PWR_LED_3VSB

B27 FP_PWR_LED_R_N

B28 FP_ID_LED_R1_N

B29 GND

B30 LED_STATUS_AMBER_R1

B31 LED_STATUS_GREEN_BUF_R1

B32 FP_LED

Revision – 1.6

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4BSystem Board Interconnects

Intel® Server System SR2500AL

Table 24. Active Mid-plane SAS RAID Battery Backup Connector Pin-out

PIN Signal Description

1 P12V

2 GND

3 NC_P5V_MONITOR

4 GND

5 P1V8_VBAT_RAID

6 GND

7 PWRGD_P3V3_STBY

8 GND

9 P1V8_VBAT_RAID

10 GND

11 PX_RESET_N

12 GND

13 SMB_CLK_P3V3

14 GND

15 SMB_DAT_P3V3

16 BBU_PFAIL_N

17 BBU_DDR_SEL

18 BBU_BBE

19 BBU_BBSTROBE

20 BBU_BBSTATUS

Table 25. Passive Mid-plane SATA/SAS Connector Pin-outs

J5A2 - SAS_7

PIN SIGNAL NAME

1 GND

J6A1 - SAS_6 J5B1 - SAS_4 J6B1 - SAS_2

PIN SIGNAL NAME PIN SIGNAL NAME PIN SIGNAL NAME

1 GND 1 GND 1 GND

2 SATA_ADDIN1_TX_P 2 SATA5_TX_P

3 SATA_ADDIN1_TX_N 3 SATA5_TX_N

4 GND 4 GND

5 SATA_ADDIN1_RX_N 5 SATA5_RX_N

6 SATA_ADDIN1_RX_P 6 SATA5_RX_P

7 GND 7 GND

2 SATA3_TX_P

3 SATA3_TX_N

4 GND

5 SATA3_RX_N

6 SATA3_RX_P

7 GND

2 SATA1_TX_P

3 SATA1_TX_N

4 GND

5 SATA1_RX_N

6 SATA1_RX_P

7 GND

J5A1- SAS_8 J6A2 - SAS_5 J5B2 - SAS_3 J6B2 - SAS_1

PIN SIGNAL NAME

1 GND

PIN SIGNAL NAME

1 GND

2 SATA_ADDIN2_TX_P 2 SATA4_TX_P

PIN SIGNAL NAME

1 GND

2 SATA2_TX_P

PIN SIGNAL NAME

1 GND

2 SATA0_TX_P

3 SATA_ADDIN2_TX_N 3 SATA4_TX_N

4 GND 4 GND

5 SATA_ADDIN2_RX_N 5 SATA4_RX_N

6 SATA_ADDIN2_RX_P 6 SATA4_RX_P

7 GND 7 GND

3 SATA2_TX_N

4 GND

5 SATA2_RX_N

6 SATA2_RX_P

7 GND

3 SATA0_TX_N

4 GND

5 SATA0_RX_N

6 SATA0_RX_P

7 GND

The system also supports an active SAS/SAS RAID midplane2. This system board incorporates an LSI LSISAS1078 SAS controller onto the board. The following figure shows the location for each connector found on this board.

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Intel® Server System SR2500AL

B

A

C

D

E

4BSystem Board Interconnects

F

G

H

I

J

L

K

A.

Optional RAID Cache Battery

Backup Connection

B. Power Connector

C. Mini-DIMM Connector

D. Fan 6 Connector

E. Fan 5 Connector

F. Bridge Board Connector

G. Fan 4 Connector

H. Fan 3 Connector

I. Fan 1 Connector

J. Fan 2 Connector

K.

RAID Activation Key

Connector

L. Backplane Connector

Figure 23. Active SAS/SAS RAID Midplane 2 Board

AF002790

Revision – 1.6

Intel order number D31980-009

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4BSystem Board Interconnects

Intel® Server System SR2500AL

5.2 Bridge Board

The chassis utilizes a bridge board to route signals from the server board to the mid-plane board. The bridge board carries signals for three USB ports, SSI front panel control signals, video, various I2C buses, fan control signals, and a PCIe* x4 bus for SAS controller function.

See Table 19. 120-pin Server Board-to-Mid-plane Bridge Board Connector Pin-out.

AF000037

Figure 24. Bridge Board

5.3 Hot-Swap SATA/SAS Backplane

The hot swap backplane provides support for both SAS and SATA hard drives. There are no hard drive cables that connect to the backplane. All hard drive control signals are routed from the mid-plane board which plugs directly into the backplane.

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Intel® Server System SR2500AL

A

B

4BSystem Board Interconnects

C

D

AF000045

Figure 25. Hot-Swap SAS/SATA Backplane (Front Side View)

A Slimline Optical Drive Connector

B USB Floppy Connector

C Control Panel Connector

D SAS/SATA Hot Swap Connectors

A

B C

D

E

AF000044

Revision – 1.6

Figure 26. Hot-Swap SAS/SATA Backplane (Back Side View)

A Power Connector (for 6 th

Hard Drive or

SATA Tape Drive)

B SAS/SATA Connector (for 6 th

Hard

Drive or SATA Tape Drive)

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4BSystem Board Interconnects

Intel® Server System SR2500AL

Table 26. 2x4 SAS/SATA Backplane Power Connector Pin-out (J7L2)

Pin # Signal Name

1 Ground

2 Ground

3 P5V

4 P5V

5 P12V

6 P12V

7 P5V_STBY

8 P3V3

Table 27. 1x7 6th HDD / Tape Drive Option Power Connector Pin-out (J2M1)

Pin # Signal Name

1 P12V

2 Ground

3 Ground

4 P5V

5 SASS_PRSTNT_L

6 LED_SASS_ACT_L

7 P3V3

Table 28. 6th HDD Option SATA/SAS I/O Connector Pin-out (J4L1)

Pin # Signal Name

1 Ground

2 SASS_TX_DP

3 SASS_TX_DN

4 Ground

5 SASS_RX_DN

6 SASS_RX_DP

7 Ground

38

Table 29. 2x22 Slim-Line IDE Optical Drive Connector Pin-out (J5N1)

Pin # Signal Name

1 RST_IDE_L

2 Ground

3 RIDE_DD <15..0> 7

4

5

6

7

RIDE_DD <15..0> 8

RIDE_DD <15..0> 6

RIDE_DD <15..0> 9

RIDE_DD <15..0> 5

8

9

RIDE_DD <15..0> 10

RIDE_DD <15..0> 4

10 RIDE_DD <15..0> 11

11 RIDE_DD <15..0> 3

12 RIDE_DD <15..0> 12

13 RIDE_DD <15..0> 2

Pin # Signal Name

23 RIDE_DIOW_N

24 Ground

25 RIDE_DIOR_N

26 Ground

27 RIDE_DIORDY

28 IDE_ALE_H

29 RIDE_DDACK_N

30 Ground

31 IRQ_IDE

32 TP_PIDE_32

33 RIDE_DA1

34 IDE_PRI_CBLSNS

35 RIDE_DA0

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Intel® Server System SR2500AL

Pin # Signal Name

14 RIDE_DD <15..0> 13

15 RIDE_DD <15..0> 1

16 RIDE_DD <15..0> 14

17 RIDE_DD <15..0> 0

18 RIDE_DD <15..0> 15

19 Ground

20 Not Used

21 RIDE_DDREQ

22 Ground

4BSystem Board Interconnects

Pin # Signal Name

36 RIDE_DA2

37 RIDE_DCS1_N

38 RIDE_DCS3_N

39 LED_IDE_L

40 Ground

42 Not Used

Pin # Signal Name

A1 RST_IDE_L

A2 Ground

A3 RIDE_DD<15..0> 7

A4 Ground

A5 RIDE_DD<15..0> 6

A6 Ground

A7 RIDE_DD<15..0> 5

A8 Ground

A9 RIDE_DD<15..0> 4

A10 Ground

A11 RIDE_DD<15..0> 3

A12 Ground

A13 RIDE_DD<15..0> 2

A14 Ground

A15 RIDE_DD<15..0> 1

A16 Ground

A17 RIDE_DD<15..0> 0

A18 Ground

A19 RIDE_DIOW_N

A20 Ground

A21 RIDE_DIORDY

A22 Ground

A23 IRQ_IDE

A24 Ground

A25 RIDE_DA1

A26 Ground

A27 RIDE_DA0

A28 Ground

A29 RIDE_DCS1_N

A30 P5V

A31 P5V

A32 LED_IDE_L

Table 30. Slim-Line Optical Drive Slot Connector (J1A1)

PRSNT1_N 12V

12V 12V

12V RSVD

GND GND

JTAG2 SMCLK

JTAG3 SMDAT

JTAG4 GND

JTAG5 3_3V

3_3V JTAG1

3_3V 3_3VAUX

PERST_N WAKE_N

---------------KEY --------------------

GND RSVD

REFCLK+ GND

REFCLK – PETP0

GND PETN0

PERP0 GND

PERN0 PRSNT2_N

GND GND

RSVD PETP1

GND PETN1

PERP1 GND

PERN1 GND

GND PETP2

GND PETN2

PERP2 GND

PERN2 GND

GND PETP3

GND PETN3

PERP3 GND

PERN3 RSVD

GND PRSNT2_N

RSVD GND

Pin # Signal Name

B1 RIDE_DD<15..0> 8

B2 Ground

B3 RIDE_DD<15..0> 9

B4 Ground

B5 RIDE_DD<15..0> 10

B6 Ground

B7 RIDE_DD<15..0> 11

B8 Ground

B9 RIDE_DD<15..0> 12

B10 Ground

B11 RIDE_DD<15..0> 13

B12 Ground

B13 RIDE_DD<15..0> 14

B14 Ground

B15 RIDE_DD<15..0> 15

B16 Ground

B17 RIDE_DDREQ

B18 Ground

B19 RIDE__DIOR_N

B20 Ground

B21 RIDE_DDACK_N

B22 TP_PIDE_32

B23 IDE_PRI_CBLSNS

B24 Ground

B25 RIDE_DA2

B26 Ground

B27 RIDE_DCS3_N

B28 P5V

B29 P5V

B30 P5V

B31 IDE_ALE_S_H

B32 Ground

Table 31. IDE Device Master/Slave Configuration Jumper (J6L1)

Jumper

Setting

Configuration

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4BSystem Board Interconnects

Table 32. I2C Connector (J6L3)

Pin # Signal Description

1 SMB_VSC_12C_DAT0

2 GROUND

3 SMB_VSC_12C_CLK0

Intel® Server System SR2500AL

Table 33. PCIe X4 Slot Connector from Mid-plane (J4N1)

Pin

#

Signal Name

A1 SGPIO_DATA0

A2 SGPIO_DATA1

Pin

#

Signal Name

B1 SGPIO_CLOCK

B2 Ground

A3 Ground

A4 Ground

A5 SAS7_RX_DN

A6 SAS7_RX_DP

A7 Ground

A8 Ground

A9 SAS7_TX_DP

A10 SAS7_TX_DN

B3 SAS6_RX_DN

B4 SAS6_RX_DP

B5 Ground

B6 Ground

B7 SAS6_TX_DN

B8 SAS6_TX_DP

B9 Ground

B10 Ground

A11 Ground B11 SGPIO_LOAD

A12 SMB_PB1_5VSB_DAT B12 SMB_IPMB_5VSB_DAT

A13 SMB_PB1_5VSB_CLK

A14 USB_OC1_N

B13 SMB_IPMB_5VSB_CLK

B14 Ground

A15 Ground

A16 Ground

A17 USB_P1P

A18 USB_P1N

A19 Ground

A20 LED_NIC1_ACT_L

A21 LED_NIC1_LINK_R_L

A22 FP_THERM_SENSOR

B15 USB_P2P

B16 USB_P2N

B17 Ground

B18 Ground

B19 USB_OC2_N

B20 LED_HDD_ACT_R_L

B21 PV_HDD_LED_3V_A

B22 FP_ID_SW_L

A23 LED_NIC2_LINK_R_L

A24 LED_NIC2_ACT_L

B23 RST_FP_BTN_L

B24 FP_PWR_BTN_L

A25 Ground B25 FP_NMI_BTN_L

A26 V_IO_BLUE_CONN_FP B26 FP_PWR_LED_5VSB

A27 V_IO_GREEN_CONN_FP B27 LED_FP_PWR_R_L

A28 V_IO_RED_CONN_FP B28 LED_FP_ID_R_L

A29 Ground B29 Ground

A30 V_IO_HSYNC_BUFF_FP_L B30 LED_FP_SYS_FLT1_R_L

A31 V_IO_VSYNC_BUFF_FP_L B31 LED_FP_SYS_FLT2_R_L

A32 Ground B32 FP_FLT_LED_5VSB

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4BSystem Board Interconnects

Table 34. PCIe* X4 Slot Connector from Mid-plane (J6N1)

Pin

#

Signal Name

A1 RST_PWRGD_PS

A2 Ground

A3 Ground

A4 SAS1_RX_DN

A5 SAS1_RX_DP

A6 Ground

A7 Ground

A8 SAS1_TX_DP

A9 SAS1_TX_DN

A10 Ground

A11 Ground

A12 USB_OC3_N

A13 Ground

A14 Ground

A15 SAS3_RX_DN

A16 SAS3_RX_DP

A17 Ground

A18 Ground

A19 Ground

A20 SAS3_TX_DP

A21 SAS3_RT_DN

A22 Ground

A23 Ground

A24 SAS5_RX_DN

A25 SAS5_RX_DP

A26 Ground

A27 Ground

A28 SAS5_TX_DP

A29 SAS5_TX_DN

A30 Ground

A31 Ground

A32 P5V_STBY

Pin

#

Signal Name

B1 Ground

B2 SAS0_RX_DN

B3 SAS0_RX_DP

B4 Ground

B5 Ground

B6 SAS0_TX_DN

B7 SAS0_TX_DP

B8 Ground

B9 Ground

B10 USB_P3N

B11 USB_P3P

B12 Ground

B13 SAS2_RX_DN

B14 SAS2_RX_DP

B15 Ground

B17 SMB_SAS_3V3_SDA

B19 SMB_SAS_3V3_SCL

B21 Ground

B22 SAS2_TX_DP

B23 SAS2_TX_DN

B24 Ground

B25 Ground

B26 SAS4_RX_DN

B27 SAS4_RX_DP

B28 Ground

B29 Ground

B30 SAS4_TX_DP

B31 SAS4_TX_DN

B32 Ground

Table 35. USB Floppy Drive Connector (J2A1)

Pin # Signal Description

1 P5V_USB_FP_P3

2 USB_P3N

3 USB_P3P

4 Ground

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Table 36. Intel

®

Local Control Panel (LCP) Connector (J9A1)

Pin # Signal Description

1 SMB_IPMB_5VSB_DAT

2 Ground

3 SMB_IPMB_5VSB_CLK

4 P5V_STBY_R

Table 37. Control Panel Slot Connector (J9B1)

Pin # Signal Name

A1 Ground

A2 V_IO_VSYNC_BUFF_FP_L

A3 Ground

A4 V_IO_HSYNC_BUFF_FP_L

A5 Ground

A6 V_IO_BLUE_BUFF_FP_L

A7 Ground

A8 V_IO_GREEN_BUFF_FP_L

A9 Ground

A10 V_IO_RED_BUFF_FP_L

A11 Ground

A12 Ground

A13 RST_FP_BTN_L

A14 Ground

A15 FP_CHASSIS_INTRU

A16 Ground

A17 SMB_PB1_5VSB_DAT

A18 SMB_PB1_5VSB_CLK

A19 Ground

A20 FP_NMI_BTN_L

A21 Ground

A22 USB_P1P

A23 USB_P1N

A24 Ground

A25 Ground

A26 P5V_USB_P1

A27 P5V_USB_P2

A28 Ground

A29 Ground

A30 USB_P2P

A31 USB_P2N

A32 Ground

PRSNT1_N 12V

12V 12V

12V RSVD

GND GND

JTAG2 SMCLK

JTAG3 SMDAT

JTAG4 GND

JTAG5 3_3V

3_3V JTAG1

3_3V 3_3VAUX

PERST_N WAKE_N

-------------- KEY --------------

GND RSVD

REFCLK + GND

REFCLK – PETP0

GND PETN0

PERP0 GND

PERN0 PRSNT2_N

GND GND

RSVD PETP1

GND PETN1

PERP1 GND

PERN1 GND

GND PETP2

GND PETN2

PERP2 GND

PERN2 GND

GND PETP3

GND PETN3

PERP3 GND

PERN3 RSVD

GND PRSNT2_N

RSVD GND

Pin # Signal Name

B1 FP_THERM_SENSOR

B2 P5V

B3 P5V

B4 P5V

B5 V_VIDEO_IN_USE

B6 Ground

B7 P5V_STBY

B8 Ground

B9 FP_FLT_LED_5VSB

B10 Ground

B11 LED_FP_SYS_FLT1_R_L

B12 FP_ID_SW_L

B13 LED_FP_ID_R_L

B14 SMB_IPMB_5VSB_DAT

B15 SMB_IPMB_5VSB_CLK

B16 Ground

B17 LED_NIC1_ACT_L

B18 LED_NIC1_LINK_R_L

B19 FP_PWR_BTN_L

B20 FP_PWR_LED_5VSB

B21 PV_HDD_LED_3V_A

B22 Ground

B23 Ground

B24 LED_NIC2_ACT_L

B25 LED_NIC2_LINK_R_L

B26 LED_HDD_FLT_R_L

B27 LED_HDD_ACT_RR_L

B28 LED_FP_PWR_R_L

B29 LED_FP_SYS_FLT2_R_L

B30 Ground

B31 Ground

B32 RST_PWRGD_PS

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4BSystem Board Interconnects

Table 38. SAS/SATA Hard Drive Connector Pin-outs (J2C3, J2B1, J4C1, J4B1, J7C1)

Pin# Signal Description

SI Ground

S2 SAS#_TX_DP (# = 0…4)

S3 SAS#_TX_DN (# = 0…4)

S4 Ground

S5 SAS#_RX_DN (# = 0…4)

S6 SAS#_RX_DP (# = 0…4)

S7 Ground

P4 Ground

P5 Ground

P6 P3V3

P7 P5V

P8 P5V

P9 P5V

P10 Ground

P11 LED_SAS#_ACT_L (# =

0…4)

P12 Ground

P13 P12V

P14 P12V

P15 P12V

PTH0 Ground

PTY1 Ground

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6. Peripheral and Hard Drive Sub-System

The chassis can be configured to support several different hard drive and peripheral configurations. The peripheral/hard drive sub-system consists of a drive bay, supporting a slimline optical drive, hard drives, and flex bay; a mid-plane; and hot-swap backplane. This chapter describes the details for each sub-system component.

A

B C

D

TP02108

A. Slimline IDE Optical Drive Bay

B. Optional 6th HDD Drive or Tape Drive Bay

C. System Control Panel

D. 3.5” Hard Drive Bays x5

Figure 27. Optional 6 th

Hard Drive (Front View)

6.1 Slimline Drive Bay

The chassis provides a slim-line drive bay that is designed to support a single slim-line IDE optical drive or USB Floppy Drive. A list of supported drives can be found in the Intel

®

Server

Board S5000PAL/S5000XAL Tested Hardware and OS List. Either drive type is mounted to a tool-less tray which allows for easy installation into and removal from the chassis. Once inserted into the chassis, the assembly locks into place. It is not hot-swappable. For removal, the system must be powered down, the chassis top cover removed and the locking latch disengaged.

44

AF000043

Figure 28. Slim-Line Optical Drive Assembly

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5BPeripheral and Hard Drive Sub-System

The IDE Optical drive assembly includes an interposer board which plugs into the back of the optical drive. The interposer board is a card-edge type card that eliminates the need for cable connections. As the drive assembly is inserted into the drive bay, the edge connector is blind mated to a slot connector on the backplane.

The interposer board has two connectors. The first connector is the industry standard 50-pin

IDE interface used by all slim-line optical devices. The second connector is the card edge used to connect directly to the hot-swap backplane board.

AF000042

Figure 29. 50-pin Connector to Slimline Optical Device

Revision – 1.6

Table 39. J1L1 50-pin Connector to Slimline Optical Device

PIN SIGNAL NAME

1 TP_LCH

2 TP_RCH

3 TP_GND

4 GND

5 RST_IDE_S_L

6 IDE_SDD8

7 IDE_SDD7

8 IDE_SDD9

9 IDE_SDD6

10 IDE_SDD10

11 IDE_SDD5

12 IDE_SDD11

13 IDE_SDD4

14 IDE_SDD12

15 IDE_SDD3

16 IDE_SDD13

17 IDE_SDD2

18 IDE_SDD14

19 IDE_SDD1

20 IDE_SDD15

21 IDE_SDD0

22 IDE_SDDREQ

23 GND

24 IDE_SDIOR_L

25 IDE_SDIOW_L

Intel order number D31980-009

PIN SIGNAL NAME

26 GND

27 IDE_SIORDY

28 IDE_SDDACK_L

29 IRQ_IDE_S

30 IDEIO16_L

31 IDE_SDA1

32 IDE_CBL_DET_S

33 IDE_SDA0

34 IDE_SDA2

35 IDE_SDCS0_L

36 IDE_SDCS1_L

37 IDE_SEC_HD_ACT_L

38 P5V

39 P5V

40 P5V

41 P5V

42 P5V

43 GND

44 GND

45 GND

46 GND

47 IDEP_ALE_H

48 GND

49 UNUSED

50 UNUSED

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The USB floppy drive assembly includes a USB cable which plugs into the back of the USB

floppy drive and is then routed to the backplane’s 4-pin USB connector J2A1 (See Table 35.

USB Floppy Drive Connector (J2A1).

Note: The optional internal USB floppy drive accessory kit (product order code –

AXXUSBFLOPPY) includes a slim-line USB floppy drive, a USB cable, and mounting hardware to install the drive into either the slim-line drive bay or one of the hard drive bays.

6.2 Hard Drive Bays

The chassis can be configured to support up to 6

1

hot-swap 3.5” x1” SAS or SATA hard disk

drives. Hard drives are mounted to hot-swap drive trays for easy insertion to or extraction from the drive bay.

6.2.1 Hot-swap Drive Trays

Each hard drive must be mounted to a hot-swap drive tray, making insertion and extraction of the drive from the chassis very simple. Each drive tray has its own dual purpose latching mechanism which is used to both insert/extract drives from the chassis and lock the tray in place. Each drive tray supports a light pipe providing a drive status indicator, located on the backplane, to be viewable from the front of the chassis.

E

A

B

C

D

TP02106

Figure 30. Hard Drive Tray Assembly

A. Hard Drive

B. Drive Carrier

C. Side Rail

D. Mounting Screw

E. Hard Drive Connector

1

Default 5 Hard Drives + one optional 6

Th

Hard Drive using Flex Bay

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5BPeripheral and Hard Drive Sub-System

6.3 Optional Tape Drive or 6

th

Hard Drive Flex Bay

For system configurations that require either a Tape Drive or a 6 th

hard disk drive, a dual purpose drive bay is provided. By default this drive bay is covered by two face plates as shown in the following diagram. The drive bay is located next to the control panel.

TP02108

Figure 31. Optional 6 th

Hard Drive (Front View)

To configure a 6 th

hard drive, the lower face plate is removed and the 6 th

hard drive accessory kit is installed (product order code – ASR2500SIXDRV). This kit includes a backplane board insert, power cable, and drive carrier.

To install a 3.5” tape drive, both face plates are removed and the optional tape drive kit is installed (product order codes – ASR2500SATAPE or ADRTAPEKIT). Both tape drive kits include tape drive mounting tray and necessary cables.

Note: To remove the tape drive tray from the chassis, a spring latch located inside the chassis on the back right side of the carrier must be released to allow the drive tray to slide free. Do not attempt to pull out the drive tray without first releasing the spring latch. Doing so may damage the plastic faceplate.

TP02105

Figure 32. Optional Tape Drive (Front View)

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5BPeripheral and Hard Drive Sub-System

Intel® Server System SR2500AL

6.4 Mid-plane Options

New to this generation of high density server platform is the concept of the mid-plane. The midplane is the interconnect between the server board and both the hot-swap backplane and control panel. It is also used to determine which hard drive technology is to be supported. Two different Mid-plane options are available for this platform 1) a passive mid-plane capable of supporting SATA ports from the server board or SAS using ports from an add-in card; 2) an active SAS / SAS RAID mid-plane. This section will describe the hard drive interface support of each of the mid-plane boards.

6.4.1 Passive Mid-plane

The passive mid-plane is used as an interconnect, routing drive control signals from either the on-board SATA ports of the baseboard or SAS/SATA ports from an add-in card to the hot-swap backplane. The hard drive controller signals are cabled to the mid-plane which then routes the signals to the hot-swap backplane through two edge connectors that plug directly into it. See

Table 22. Mid-plane-to-Backplane Card Edge Connector #1 Pin-out and Table 23. Mid-plane-to-

Backplane Card Edge Connector #2 Pin-out.

A

B

C

D

E

F

G

H

I

J

AF000047

Figure 33. Passive Mid-plane Board

A Power Connector

B Fan 6 Connector

C Fan 5 Connector

D SAS/SATA Connectors

E Bridge Board Connector

F Fan 4 Connector

G Fan 3 Connector

H Fan 1 Connector

I

J

Fan 2 Connector

Backplane Connector

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6.4.2 Active Mid-plane with SAS /SAS RAID Support

The active mid-plane is used to provide SAS / SAS RAID support. It has integrated on to it an

Intel IOP80333 IO processor and an LSI* LSLSAS1068 3Gb/s SAS controller. Together they provide support for up to six SAS drives in this chassis. By default, this mid-plane option provides software RAID levels 0, 1, and 10 utilizing Intel

®

Embedded RAID Technology II. With the installation of optional RAID enablement devices, the mid-plane can support hardware RAID levels 0, 1, 5, 10, and 50. The mid-plane attaches to the hot-swap backplane by two card edge connectors which eliminates the need for any hard drive cables. The following sub-sections describe the board level SAS / SAS RAID functionality.

C

A

B

D

E

F

G

H

I

J

L

K

AF000046

Figure 34. Active Mid-plane with SAS / SAS RAID Support

A

RAID Battery Backup Unit

Connector

Power Connector B

C Mini-DIMM Connector

D Fan 6 Connector

E

F

Fan 5 Connector

Bridge Board Connector

G Fan 4 Connector

H Fan 3 Connector

I

J

K

L

Fan 1 Connector

Fan 2 Connector

RAID Activation Key

Connector

Backplane Connector

6.4.3 Active Midplane2 with SAS/SAS RAID Support

The active midplane2 is used to provide SAS/SAS RAID support. It has an integrated LSI

LSISAS1078 3 Gb/s RAID On-a-Chip (ROC) device. It provides support for up to eight SAS drives in this system. By default, this midplane2 option provides software RAID levels 0, 1, and

10 and utilizes Intel

®

Embedded RAID Technology II. With the installation of optional RAID enablement devices, the midplane2 can support hardware RAID levels 0, 1, 5, 6, 10, 50 and 60.

The midplane2 attaches to the hot-swap backplane by two card edge connectors, which eliminates the need for any hard drive cables. The following sub-sections describe the board level SAS/SAS RAID functionality.

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5BPeripheral and Hard Drive Sub-System

C

B

D

A

E

Intel® Server System SR2500AL

F

G

H

I

J

L

K

AF002790

A.

RAID Battery Backup Unit

Connector

B. Power Connector

C. Mini-DIMM Connector

D. Fan 6 Connector

E. Fan 5 Connector

F. Bridge Board Connector

G. Fan 4 Connector

H. Fan 3 Connector

I. Fan 1 Connector

J. Fan 2 Connector

K.

RAID Activation Key

Connector

L. Backplane Connector

Figure 35. Active Midplane2 with SAS/SAS RAID Support

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6.4.3.1 Architectural Overview

5BPeripheral and Hard Drive Sub-System

Figure 36. Architecture Overview

6.4.3.2 x4 PCIe* Card Edge Interfaces

Two x4 PCIe* card edges are used to connect the active mid-plane to the hot-swap backplane.

See Table 22. Mid-plane-to-Backplane Card Edge Connector #1 Pin-out and Table 23. Midplane-to-Backplane Card Edge Connector #2 Pin-out for details. The use of card edge

connectors to the back plane eliminates all hard drive cabling.

6.4.3.3 IOP80333 IO processor

The Intel 80333 IO processor is a multi-function device that integrates the Intel Xscale

®

core with intelligent peripherals and two PCIe* to PCI-X* bridges. It will be connected to the server board’s x4 PCIe lane and serve as bridge for PCI-X 133MHz secondary bus. The IOP80333 also includes fully functional RAID support.

6.4.3.4 LSI* LSISAS1068 SAS Controller

The LSI* LSISAS1068 controller resides on the Channel A PCI-X bus of the IOP80333 supporting transfer rates of up to 3GB/s. It includes an Address Translation Unit (ATU) supporting transactions between PCI address space and 80333 address space. Address translation for the ATU is controlled through programmable registers accessible from both the

PCI interface and the Intel Xscale

®

core. The LSISAS1068 controller includes its own Flash

ROM and NVSRAM to support SAS only software RAID. Software RAID Levels supported include 0, 1, and 10.

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6.4.3.5 Optional Hardware RAID Support

The active mid-plane supports options to provide full hardware RAID support. Options required to enable hardware RAID support include an Intel

®

RAID Activation Key (product order code -

AXXRAK18E) and installation of a Mini-DIMM for Intel RAID Cache support. To protect from data loss during an unexpected power loss event, an Intel

®

RAID Smart Battery Backup module

(AXXRSBBU3) is also supported. Hardware RAID levels supported include 0, 1, 5, 10, and 50.

6.4.3.5.1 Intel

®

RAID Activation Key

The Intel

®

RAID Activation Key enables the full intelligent SAS Hardware RAID solution engineered around the Intel

®

80333 I/O Processor @ 500MHz. The activation key plugs directly in to a connector (J1A10) on the mid-plane board. With no RAID activation key installed, only

SAS Software RAID levels 0, 1, and 10 are supported.

6.4.3.5.2 Intel RAID Cache support

To further enable support for hardware RAID, the active mid-plane provides a 244-pin mini-

DIMM connector (J8C1), supporting a single registered ECC non-parity DDR2-400 MHz Mini-

DIMM to provide Intel RAID cache. Mini-DIMM capacities supported range from 128MB to 1GB.

Note: See the Intel

®

Server Board S5000PAL Tested Memory List for a list of Intel validated mini-DIMMs.

6.4.3.5.3 Intel

®

RAID Smart Battery Backup Module

With an Intel

®

RAID Smart Battery Backup module installed, data loss is prevented when data is still present in the RAID Cache Module and power is unexpectedly lost. Depending on the cache module capacity used, the battery backup unit can provide 48 to 72 hours of battery backup power to allow data stored in the RAID cache to be processed. A 2x10 connector (J9A2) is used

to attach the battery backup unit to the mid-plane. See Table 24. Active Mid-plane SAS RAID

Battery Backup Connector Pin-out for details.

6.5 Hot-Swap SAS/SATA Backplane

The chassis supports a multifunctional SAS/SATA backplane with the following features:

• Vitesse* VSC410 enclosure management controller o

External non-volatile Flash ROM o

Four C interfaces o

Compliance with SCSI Accessed Fault Tolerant Enclosures (SAF-TE) specification o

Compliance with Intelligent Platform Management Interface (IPMI)

• Five SAS/SATA compatible hot-swap hard drive connectors

• Designed to support an optional 6 th

hard drive, or power for an optional tape drive.

• Hard Drive Status and Fault LEDs for each hard drive connector

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• Card edge connectors for most interconnects, including: o

Mid-plane o

Control o

Slim-line IDE Optical Drive

• One 2x4-pin Power Connector

6.5.1 SAS/SATA Backplane Layout

The hot-swap backplane installs on the back side of the hot-swap drive bay inside the chassis.

Alignment features on the chassis and backplane assembly make for easy tool-less installation.

The following diagram shows the layout of components and connectors found on the board.

A

B

C

D

AF000045

Figure 37. Hot-swap SAS/SATA Backplane (Front Side View)

A Slim-line Optical Drive Connector

B Slim-line USB Floppy Connector

C Control Panel Connector

D SAS/SATA Hot Swap Connectors

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5BPeripheral and Hard Drive Sub-System

A

B C

Intel® Server System SR2500AL

D

E

AF000044

Figure 38. Hot-swap SAS/SATA Backplane (Back Side View)

A Power Connector (for 6 th

Hard Drive or

Tape Drive)

B SAS/SATA Connector (for 6 th

Hard

Drive or SATA Tape Drive)

Notes: To prevent the backplane from flexing when installing or removing hard drives from the drive bay, make sure the mid-plane is securely fastened and the system top cover is in place.

Make sure all system boards, peripherals, and cables are detached from the backplane before removing the backplane from the system. Failure to detach components from the backplane before removal may result in component damage.

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6.5.2 SAS/SATA Backplane Functional Architecture

The figure below shows the functional blocks of the SAS/SATA backplane.

LM75

EEPROM

HBA Connector

SEEPROM

(FRU)

SEEPROM

Connector

I2C Bus0

I2C Bus1

I2C Bus2

Flash

Room

VSC410

LED

BUS SW

SAS_I2C

IPMB_I2C

I2C Connector

4P LCD Connector

SAS/SATA HDD0

Connector (29P)

SAS/SATA HDD3

Connector (29P)

SAS/SATA HDD4

Connector (29P)

SAS/SATA HDD5

Connector (7P)

(to 2U SAS/SATA

HDD Optional Board)

6th SAS/SATA

HDD Optional Board

SAS/SATA HDD1

Connector (29P)

SAS/SATA HDD2

Connector (29P)

SAS/SATA PWR, LED,

PRSNT Connector (7P)

(to 2U SAS/SATA

HDD Optional Board)

64P Connector X2

(from midplane)

Midplane

4P USB Connector

(for USB CD-ROM/FDD)

64P Front Panel Connector

(to Front Panel Board)

44P Internal

IDE Connector

(from baseboard)

64P Internal

IDE Connector

(to 64P CD-ROM

Interposer Board)

VRS RST

AF000040

Figure 39. SAS/SATA Backplane Functional Block Diagram

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6.5.2.1 Enclosure Management Controller

The backplane utilizes the features of the Vitesse* VSC410 to implement several enclosure management functions. The chip provides in-band SAF-TE and SES management and utilizes the four I

2

C interfaces listed below.

1. I2C bus 0 is connected to an EEPROM which stores configuration and FRU data

2. I2C bus 1 is connected to an LM75 temperature sensor

3. I2C bus 2 is connected to an IPMB bus from the server board.

4. I2C bus 3 is connected to the LSISAS1068 SAS controller.

6.5.2.2 Hard Drive Activity and Fault LEDs

The backplanes support an activity/fault LED for each of the hard drive connectors. The LED will illuminate green for activity or amber for a drive fault. The green activity LED is driven by the

SAS/SATA hard disk drive directly. The amber fault LED is driven by the VSC410* management controller whenever a fault condition is detected. When the drive is used in a

RAID configuration, the RAID controller will have control over the fault LED and it may exhibit different behavior.

Table 40. Hard Drive LED Function Definitions

Status LED Definition

The activity LED functionality is controlled directly by the hard drives. This causes the LED to function differently between SAS and SATA drives. The expected operation is outlined below.

Table 41. Hard Drive Activity LED Functionality

Condition

Power on with no drive activity

Power on with drive activity

Power on and drive spun down

Power on and drive spinning up

Drive Type

SAS

SATA

SAS

SATA

SAS

SATA

SAS

SATA

Ready LED stays on

Behavior

Ready LED stays off

Ready LED blinks off when processing a command

Ready LED blinks on when processing a command

Ready LED stays off

Ready LED stays off

Ready LED blinks*

Ready LED stays off

6.5.2.3 Optional 6 th

Hard Drive

The backplane is capable of supporting a 6 th

hot-swap SAS/SATA hard drive with the addition of an optionally installed backplane add-in board. The 6 th

drive add-in board assembly consists of a PCB with power and interface connectors, and a mounting bracket allowing for the add-in card to slide into a fitted cut out on the existing backplane.

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7. Standard Control Panel

6BStandard Control Panel

The standard control panel supports several push buttons and status LEDs, along with USB and video ports to centralize system control, monitoring, and accessibility to within a common compact design.

The control panel assembly comes pre-assembled and is modular in design. The control panel assembly module slides into a slot on the front of the chassis and is blind mated with a slot connector on the backplane. It is not hot-swappable.

TP02110

Figure 40. Standard Control Panel Assembly Module

7.1 Control Panel Buttons

The standard control panel assembly houses several system control buttons. Each of their functions is listed in the table below.

A

B

C

D

Figure 41. Control Panel Buttons

TP02111

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Intel® Server System SR2500AL

Table 42. Control Button and Intrusion Switch Functions

Reference

B

C

D

Feature Function

Sleep Button

ID Button

Toggles the system power on/off. This button also functions as a Sleep

Button if enabled by an ACPI-compliant operating system.

Toggles the front panel ID LED and the server board ID LED on/off. The server board ID LED is visible through the rear of the chassis and allows you to locate the server you’re working on from behind a rack of servers.

Reset Button Reboots and initializes the system.

NMI Button Pressing the recessed button with a paper clip or pin puts the server in a halt state for diagnostic purposes and allows you to issue a non-maskable interrupt. After issuing the interrupt, a memory download can be performed to determine the cause of the problem.

7.2 Control Panel LED Indicators

The control panel houses six LEDs, which are viewable with or without the front bezel to display the system’s operating state.

Power and

Sleep LED

NIC1 and NIC2

Activity LEDs

Hard Drive

Activity LED

System

Status LED

System

Identity LED

Figure 42. Control Panel LEDs

TP02112

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6BStandard Control Panel

The following table identifies each LED and describes their functionality.

Table 43. Control Panel LED Functions

LED

NIC1 / NIC2

Activity

Color State

Green On

Description

NIC

Power / Sleep

(on standby power)

System Status

(on standby power)

Disk Activity

System Identification

Green

Off

Green

On

Blink

1,4

Off

Legacy power on / ACPI S0 state

Sleep / ACPI S1 state

Power Off / ACPI S4 or S5 state Off

Green/Amber Alternating

Blink

Green On

Pre DC Power On – 15-20 second BMC

Initialization

Running / normal operation

Blink

1,2

Degraded

Amber On

Blink

1,2

Critical or non-recoverable condition.

Non-critical condition.

Off POST / system stop.

Random blink Provides an indicator for disk activity.

Blue On

No hard disk activity

Identify active via command or button.

Notes:

1. Blink rate is ~1 Hz with at 50% duty cycle.

2. The amber status takes precedence over the green status. When the amber LED is on or blinking, the green

LED is off.

3. Also off when the system is powered off (S4/S5) or in a sleep state (S1).

4. The power LED sleep indication is maintained on standby by the chipset. If the system is powered down without going through BIOS, the LED state in effect at the time of power off will be restored when the system is powered on until the BIOS clears it. If the system is not powered down normally, it is possible that the

Power LED will be blinking at the same time that the system status LED is off due to a failure or configuration change that prevents the BIOS from running.

The current limiting resistors for the power LED, the system fault LED, and the NIC LEDs are located on the server board.

Revision – 1.6

Intel order number D31980-009

59

6BStandard Control Panel

Intel® Server System SR2500AL

7.2.1 Power / Sleep LED

Table 44. SSI Power LED Operation

State

Power Off

Power Mode

Non-ACPI

Power On Non-ACPI

Off

On

LED Description

System power is off, and the BIOS has not initialized the chipset.

System power is on, but the BIOS has not yet initialized the chipset.

S5 ACPI Off Mechanical is off, and the operating system has not saved any context to the hard disk.

S4 ACPI Off Mechanical is off. The operating system has saved context to the hard disk.

S3-S1 ACPI

1

DC power is still on. The operating system has saved context and gone into a level of low-power state.

S0 ACPI Steady on System and the operating system are up and running.

Notes:

1. Blink rate is ~ 1Hz with at 50% duty cycle.

7.2.2 System Status LED

Table 45. Control Panel LED Operation

Color

Off

Green/

Amber

State

N/A

Alternating

Blink

Criticality

Not ready

Not ready

Green Solid on

Green Blink

Amber Blink

Ok

Degraded

Non-critical

Description

AC power off

Pre DC Power On – 15-20 second BMC Initialization when

AC is applied to the server. Control Panel buttons are disabled until BMC initialization is complete.

System booted and ready

System degraded

　 Unable to use all of the installed memory (more than one

DIMM installed).

　 Correctable errors over a threshold of 10 and migrating to a spare DIMM (memory sparing). This indicates that the user no longer has spared DIMMs indicating a redundancy lost condition. Corresponding DIMM LED should light up.

　 In mirrored configuration, when memory mirroring takes place and system loses memory redundancy. This is not covered by (2).

　 Redundancy loss such as power-supply or fan. This does not apply to non-redundant sub-systems.

　 PCIe* link errors

　 CPU failure / disabled – if there are two processors and one of them fails

　 Fan alarm – Fan failure. Number of operational fans should be more than minimum number needed to cool the system

　 Non-critical threshold crossed – Temperature and voltage

　 Critical voltage threshold crossed

　 VRD hot asserted

　 Minimum number of fans to cool the system not present or failed

　 In non-sparing and non-mirroring mode if the threshold of ten correctable errors is crossed within the window

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Intel® Server System SR2500AL

Amber Solid on Critical, nonrecoverable

6BStandard Control Panel

Fatal alarm – system has failed or shutdown

　 DIMM failure when there is one DIMM present, no good memory present

　 Run-time memory uncorrectable error in non-redundant mode

　 IERR signal asserted

　 Processor 1 missing

　 Temperature (CPU ThermTrip, memory TempHi, critical threshold crossed)

　 No power good – power fault

　 Processor configuration error (for instance, processor stepping mismatch)

7.2.2.1 System Status LED – BMC Initialization

When AC power is first applied to the system and 5V-STBY is present, the BMC controller on the server board requires 15-20 seconds to initialize. During this time, the system status LED will blink, alternating between amber and green, and the power button functionality of the control panel is disabled, preventing the server from powering up. Once BMC initialization has completed, the status LED will stop blinking and the power button functionality is restored and can be used to turn on the Server.

7.2.3 Drive Activity LED

The drive activity LED on the front panel indicates drive activity from the onboard hard disk controllers. The Intel

®

Server Board S5000PAL also provides a header giving access to this

LED for add-in controllers.

7.2.4 System Identification LED

The blue system identification LED is used to help identify a system for servicing. This is especially useful when the system is installed when in a high density rack or cabinet that is populated with several similar systems.

The blue system ID LED can be illuminated using either of two mechanisms.

- By pressing the system ID button on the system control panel, the ID LED will display a solid blue color until the button is pressed again.

- By issuing the appropriate hex IPMI chassis identify value, the ID LED will either blink blue for 15 seconds and turn off or will blink indefinitely until the appropriate hex IPMI chassis identify value is issued to turn it off.

Revision – 1.6

Intel order number D31980-009

61

6BStandard Control Panel

7.3 Control Panel Connectors

The control panel has two external I/O connectors:

• One USB port

• One VGA video port

The following tables provide the pin-outs for each connector.

Intel® Server System SR2500AL

Table 46. External USB Connectors (J1B1)

Pin # Description

1 PWR_FP_USB2

2 USB_DN2_FP_R

3 USB_DP2_FP_R

4 GND

5 GND

6 GND

7 GND

Table 47. Video Connector (J1A1)

Description Pin # Pin # Description

VGA_RED 1 9 GND

VGA_GREEN 2 10 GND

VGA_BLUE 3 11 Unused

VGA_INUSE_L 7 15 VGA_DDCCLK

If a monitor is connected to the control panel video connector, the rear video port on the server board will be disabled and the control panel video will be enabled. The video source is the same for both connectors and is switched between the two, with the control panel having priority over the rear video. This provides for easy front accessibility to the server.

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6BStandard Control Panel

7.4 Internal Control Panel Interconnect

All control panel signals are directed through a single 64-pin card edge connector eliminating the need for any cables. When installed into the chassis control panel bay, the control panel card edge connector is blind mated with a slot connector on the backplane.

Standard Control

Panel PCB

AF000039

Figure 43. Standard Control Panel PCB

Revision – 1.6

Intel order number D31980-009

63

6BStandard Control Panel

Intel® Server System SR2500AL

The following table defines the pin-out for the 64-pin edge connector.

Table 48. 64-pin Control Panel Connector (J6B1)

PIN SIGNAL NAME

A1 GND

A2 VGA_VSYNC_FP_L

A3 GND

A4 VGA_HSYNC_FP_L

A5 GND

A6 VGA_BLUE_FP

A7 GND

A8 VGA_GREEN_FP

A9 GND

A10 VGA_RED_FP

A11 GND

A12 GND

A13 FP_RST_BTN_L

A14 GND

A15 NC_FP_CHASSIS_L

A16 GND

A17 BP_I2C_5V_SDA

A18 BP_I2C_5V_SCL

A19 GND

A20 FP_NMI_BTN_L

A21 GND

A22 USB_DP2_FP

A23 USB_DN2_FP

A24 GND

A25 GND

A26 PWR_FP_USB2

A27 PWR_FP_USB3

A28 GND

A29 GND

A30 USB_DP3_FP

A31 USB_DN3_FP

A32 GND

PIN SIGNAL NAME

B1 1_WIRE_BUS

B2 P5V

B3 P5V

B4 P5V

B5 VGA_INUSE_L

B6 GND

B7 P5V_STBY

B8 GND

B9 FAULT_LED_5VSB

B10 GND

B11 FP_SYS_FLT_LED1_R_L

B12 FP_ID_SW_L

B13 FP_ID_LED_R_L

B14 NC_IPMB_5VSB_SDA

B15 NC_IPMB_5VSB_SCL

B16 GND

B17 NIC1_ACT_LED_L

B18 NIC1_LINK_LED_R_L

B19 FP_PWR_BTN_L

B20 PWR_LED_5VSB

B21 HDD_LED_P3V3_A

B22 GND

B23 GND

B24 NIC2_ACT_LED_L

B25 NIC2_LINK_LED_R_L

B26 HDD_FAULT_LED_R_L

B27 HDD_LED_ACT_R_L

B28 FP_PWR_LED_R_L

B29 FP_SYS_FLT_LED2_R_L

B30 GND

B31 GND

B32 NC_RST_P6_PWRGOOD

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Revision – 1.6

Intel® Server System SR2500AL

8. Intel

®

Local Control Panel

7BIntel® Local Control Panel

The Intel

®

Local Control Panel utilizes a combination of control buttons, LEDs, and LCD display to provide system accessibility, monitoring, and control functions. The pre-assembled module slides into a slot on the front of the chassis where a card edge connector is blind mated to a matching slot edge connector on the backplane eliminating any cable attachments. The Intel

®

Local Control Panel module is designed so that it can be adjusted for use with or without an outer front bezel.

TP02113

Figure 44. Intel

®

Local Control Panel Assembly Module

The following diagram provides an overview of the control panel features.

A B

C

D

E

F

O N M L K J I H G

TP02099

Figure 45. Intel

®

Local Control Panel Overview

A LCD Display

B LCD Menu Control Button – Up

I

J

System Status LED

NIC 2 Activity LED

C LCD Menu Control Button – Down K

D LCD Menu Control Button – Previous Option L

E LCD Menu Control Button – Previous Page

F ID LED

M

N

NIC 1 Activity LED

Hard Drive Activity LED

System Reset Button

USB 2.0 Port

G Power LED

H System Power Button

O

P

NMI Button (Tool Required)

USB 2.0 Port

Revision – 1.6

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65

7BIntel® Local Control Panel

Intel® Server System SR2500AL

8.1 LED Functionality

The following table identifies each LED and describes their functionality.

Table 49. Control Panel LED Functions

LED

NIC1 / NIC2

Activity

Color State

Green On

Description

NIC

Power / Sleep

(on standby power)

System Status

(on standby power)

Disk Activity

System Identification

Green On

Blink

1,4

Legacy power on / ACPI S0 state

Sleep / ACPI S1 state

Off Off

Green/Amber Alternating

Blink

Green On

Power Off / ACPI S4 or S5 state

Pre DC Power On – 15-20 second BMC

Initialization

Running / normal operation

Blink

1,2

Degraded

Amber On

Blink

1,2

Off

Critical or non-recoverable condition.

Non-critical condition.

Off POST / system stop.

Green Random blink Provides an indicator for disk activity.

3

Off Off No hard disk activity

Blue On Identify active via command or button.

Notes:

1. Blink rate is ~1 Hz with at 50% duty cycle.

2. The amber status takes precedence over the green status. When the amber LED is on or blinking, the green

LED is off.

3. Also off when the system is powered off (S4/S5) or in a sleep state (S1).

4. The power LED sleep indication is maintained on standby by the chipset. If the system is powered down without going through BIOS, the LED state in effect at the time of power off will be restored when the system is powered on until the BIOS clears it. If the system is not powered down normally, it is possible that the

Power LED will be blinking at the same time that the system status LED is off due to a failure or configuration change that prevents the BIOS from running.

The current limiting resistors for the power LED, the system fault LED, and the NIC LEDs are located on the Intel

®

Server Board S5000PAL.

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Revision – 1.6

Intel® Server System SR2500AL

7BIntel® Local Control Panel

8.1.1 Power / Sleep LED

Table 50. SSI Power LED Operation

State

Power Off

Power Mode

Non-ACPI

Power On Non-ACPI

Off

On

LED Description

System power is off, and the BIOS has not initialized the chipset.

System power is on, but the BIOS has not yet initialized the chipset.

S5 ACPI Off Mechanical is off, and the operating system has not saved any context to the hard disk.

S4 ACPI Off Mechanical is off. The operating system has saved context to the hard disk.

S3-S1 ACPI

1

DC power is still on. The operating system has saved context and gone into a level of low-power state.

S0 ACPI Steady on System and the operating system are up and running.

Notes:

1. Blink rate is ~ 1Hz with at 50% duty cycle.

8.1.2 System Status LED

Table 51. Control Panel LED Operation

Color

Off

Green/

Amber

State

N/A

Alternating

Blink

Criticality

Not ready

Not ready

Green Solid on

Green Blink

Amber Blink

Ok

Degraded

Non-critical

Description

AC power off

Pre DC Power On – 15-20 second BMC Initialization when

AC is applied to the server. Control Panel buttons are disabled until BMC initialization is complete.

System booted and ready

System degraded

　 Unable to use all of the installed memory (more than one

DIMM installed).

　 Correctable errors over a threshold of 10 and migrating to a spare DIMM (memory sparing). This indicates that the user no longer has spared DIMMs indicating a redundancy lost condition. Corresponding DIMM LED should light up.

　 In mirrored configuration, when memory mirroring takes place and system loses memory redundancy. This is not covered by (2).

　 Redundancy loss such as power-supply or fan. This does not apply to non-redundant sub-systems.

　 PCIe link errors

　 CPU failure / disabled – if there are two processors and one of them fails

　 Fan alarm – Fan failure. Number of operational fans should be more than minimum number needed to cool the system

　 Non-critical threshold crossed – Temperature and voltage

　 Critical voltage threshold crossed

　 VRD hot asserted

　 Minimum number of fans to cool the system not present or failed

　 In non-sparing and non-mirroring mode if the threshold of ten correctable errors is crossed within the window

Revision – 1.6

Intel order number D31980-009

67

7BIntel® Local Control Panel

Amber Solid on Critical, nonrecoverable

Intel® Server System SR2500AL

Fatal alarm – system has failed or shutdown

　 DIMM failure when there is one DIMM present, no good memory present

　 Run-time memory uncorrectable error in non-redundant mode

　 IERR signal asserted

　 Processor 1 missing

　 Temperature (CPU ThermTrip, memory TempHi, critical threshold crossed)

　 No power good – power fault

　 Processor configuration error (for instance, processor stepping mismatch)

8.1.2.1 System Status LED – BMC Initialization

When AC power is first applied to the system and 5V-STBY is present, the BMC controller on the server board requires 15-20 seconds to initialize. During this time, the system status LED will blink, alternating between amber and green, and the power button functionality of the control panel is disabled, preventing the server from powering up. Once BMC initialization has completed, the status LED will stop blinking and the power button functionality is restored and can be used to turn on the server.

8.1.3 Drive Activity LED

The drive activity LED on the front panel indicates drive activity from the onboard hard disk controllers. The Intel

®

Server Board S5000PAL also provides a header giving access to this

LED for add-in controllers.

8.1.4 System Identification LED

The blue system identification LED is used to help identify a system for servicing. This is especially useful when the system is installed when in a high density rack or cabinet that is populated with several similar systems.

The blue system ID LED can be illuminated using either of two mechanisms.

- By pressing the system ID button on the system control panel, the ID LED will display a solid blue color until the button is pressed again.

- By issuing the appropriate hex IPMI chassis identify value, the ID LED will either blink blue for 15 seconds and turn off or will blink indefinitely until the appropriate hex IPMI chassis identify value is issued to turn it off.

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Revision – 1.6

Intel® Server System SR2500AL

7BIntel® Local Control Panel

8.2 Intel

®

Local Control Panel Interconnects

The Intel

®

Local Control Panel module includes the control panel interface board and an interposer board. Connectors on the control panel interface board are cabled to matching connectors on the interposer board. When the pre-assembled control panel module is installed into the chassis, a card edge connector on the interposer card is blind mated with a slot edge connector on the backplane. This section will define the pin-out for each connector and header found on both the control panel interface board and interposer board.

•

A 64-pin card edge connector on the interposer board is used to route signals to/from the backplane to the control panel interface board. The backplane is used as a conduit for communication to the server board.

•

Signals from the card edge connector are routed to control panel interface board through matching 50-pin connectors on the interposer board and control panel interface board.

The 50-pin connectors are attached using a small 50-pin flat cable.

•

USB signals from the card edge connector are routed to the control panel interface board through matching 10-pin connectors on the interposer board and control panel interface board. The 10-pin connectors are attached using a small 10-pin round cable.

•

A 4-pin IPMI header (not used).

• A 4-pin NMI/Temp Sensor header.

The following tables provide the pin-outs for each connector.

Revision – 1.6

Table 52. 50-pin Control Panel Connector

PIN SIGNAL NAME

A1 GND

A2 VGA_VSYNC_FP_L

A3 GND

A4 VGA_HSYNC_FP_L

A5 GND

A6 VGA_BLUE_FP

A7 GND

A8 VGA_GREEN_FP

A9 GND

A10 VGA_RED_FP

A11 GND

A12 GND

A13 FP_RST_BTN_L

A14 GND

A15 NC_FP_CHASSIS_L

A16 GND

A17 BP_I2C_5V_SDA

A18 BP_I2C_5V_SCL

A19 GND

A20 FP_NMI_BTN_L

A21 GND

A22 USB_DP2_FP

A23 USB_DN2_FP

A24 GND

A25 GND

PIN SIGNAL NAME

B1 1_WIRE_BUS

B2 P5V

B3 P5V

B4 P5V

B5 VGA_INUSE_L

B6 GND

B7 P5V_STBY

B8 GND

B9 FAULT_LED_5VSB

B10 GND

B11 FP_SYS_FLT_LED1_R_L

B12 FP_ID_SW_L

B13 FP_ID_LED_R_L

B14 NC_IPMB_5VSB_SDA

B15 NC_IPMB_5VSB_SCL

B16 GND

B17 NIC1_ACT_LED_L

B18 NIC1_LINK_LED_R_L

B19 FP_PWR_BTN_L

B20 PWR_LED_5VSB

B21 HDD_LED_P3V3_A

B22 GND

B23 GND

B24 NIC2_ACT_LED_L

B25 NIC2_LINK_LED_R_L

Intel order number D31980-009

69

7BIntel® Local Control Panel

PIN SIGNAL NAME

A26 PWR_FP_USB2

A27 PWR_FP_USB3

A28 GND

A29 GND

A30 USB_DP3_FP

A31 USB_DN3_FP

A32 GND

Intel® Server System SR2500AL

PIN SIGNAL NAME

B26 HDD_FAULT_LED_R_L

B27 HDD_LED_ACT_R_L

B28 FP_PWR_LED_R_L

B29 FP_SYS_FLT_LED2_R_L

B30 GND

B31 GND

B32 NC_RST_P6_PWRGOOD

Table 53. Internal USB Header

Pin # Description

1 PWR_FP_USB2

2 PWR_FP_USB3

3 USB_DP2_FP

4 USB_DN2_FP

5 USB_DP3_FP

6 USB_DN3_FP

7 GND

8 GND

9 TP_USB0_P9

10 TP_USB0_P10

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Intel® Server System SR2500AL

9. PCI Riser Cards and Assembly

8BPCI Riser Cards and Assembly

The chassis supports different riser card options depending on the add-in card configuration desired. The riser assembly for the chassis is tool-less. Stand-offs on the bracket allow the riser cards to slide onto the assembly where a latching mechanism than holds each riser in place.

Holding down the latch releases the risers for easy removal.

When re-inserting the riser assembly into the chassis, tabs on the back of the assembly should be aligned with slots on the back edge of the chassis. The tabs fit into the slots securing the riser assembly to the chassis when the top cover is in place.

The riser assembly provides two extraction levers to assist with riser assembly removal from the riser slots.

AF000038

Figure 46. Low Profile PCIe* Riser

Revision – 1.6

Intel order number D31980-009

71

8BPCI Riser Cards and Assembly

Intel® Server System SR2500AL

9.1 Riser Card Options

The Intel

®

Server Board S5000PAL has two riser slots capable of supporting riser cards for both

1U and 2U system configurations. Because of board placement resulting in different pin orientations, and expanded technology support associated with the full-height riser, the riser slots are not the same and require different riser cards.

The low profile riser slot (J5B1) utilizes a 98-pin connector. It is capable of supporting up to two low profile PCIe* add-in cards. The x8 PCIe bus can support bus speeds of up to 20Gb/S. The following table provides the supported bus throughput for the given riser card used and the number of add-in cards installed.

Low Profile Riser 1 add-in card 2 add-in cards

2U X4 X4

Note: There are no population rules for installing a single low profile add-in card in the 2U low profile riser card; a single add in card can be installed in either PCI Express* slot. While each slot can accommodate a x8 card, each slot will only support x4 bus speeds.

The full height riser slot (J4F1) implements Intel

®

Adaptive Slot Technology. This 280-pin connector is capable of supporting riser cards that meet either the PCI-X* or PCI Express* technology specifications. The following tables show the maximum bus speed supported with different add-in card populations.

Full Height Riser

PCI-X “Passive” (Product

Order Code –

ADRPCIXRIS)

1 add-in card

2U – 3 add-in card slots Up to 100MHz in top PCI slot

2 add-in cards

Up to 100MHz using top and middle slots

3 add-in cards

66MHz

Note: For the 2U PCI-X* (passive) riser card, add-in cards should be installed starting with the top slot first, followed by the middle, and then the bottom. Any add-in card populated in the bottom PCI slot will cause the bus to operate at 66MHz.

Full Height Riser

PCI-X “Active” (Product

Order Code –

ADRACTRIS)

2U

1 add-in card

Up to 133MHz

2 add-in cards

Up to 133MHz

3 add-in cards

Up to 133MHz

Note: Each PCI slot on the 2U PCI-X* (active) riser card operates on an independent PCI bus.

Using an add-in card that operates below 133MHz will not affect the bus speed of the other PCI slots.

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Intel® Server System SR2500AL

Full Height Riser

PCI Express* (Product

Order Code –

ASR2500FHR)

1 add-in card

2U – 3 add-in card slots Single PCIe* x4 in top slot or x8 in middle slot

Or

PCI-X* – Up to 133MHz in bottom slot

8BPCI Riser Cards and Assembly

2 add-in cards 3 add-in cards

Single PCIe – x4 in either slot or x8 in middle slot and PCI-

X – Up to 133MHz

Or

Dual PCIe – x4

Dual PCIe – x4

And

PCI-X – Up to 133MHz

9.2 PCI Riser Card Mechanical Drawings

Ø 6.00

[0.236]

5.00 [0.197]

Ø 3.50

[0.138]

R2.00

[0.079]

Detail A

Scale 2.000

Well Buying

DMI-02D-30-3

Pad

10.16 [0.400]

See Detail A

2X 67.75 [2.667]

66.17 [2.605]

46.98 [1.850]

41.98 [1.653]

24.32 [0.958]

23.32 [0.918]

19.32 [0.761]

10.90 [0.429]

8.40 [0.331]

2X R1.00

[0.039]

1.90 [0.075]

39.15 [1.541]

2X Molex

SD-87715-013

6012A0100101

74.75 [2.943]

64.25 [2.530]

54.25 [2.136]

35.32 [1.391]

33.16 [1.306]

27.32 [1.076]

17.24 [0.679]

12.84 [0.506]

8.40 [0.0331]

0.00 [0.000]

12.15 [0.478]

Side 2

Ground Pad

TP02322

Figure 47. Low Profile Passive PCI Express* Riser Card

Revision – 1.6

Intel order number D31980-009

73

8BPCI Riser Cards and Assembly

Ø 8.26

[0.325]

Both Side

Ground Pad

3.50 [0.138]

Ø 3.50 [0.138]

Detail A

Scale 2.000

5.00

[0.197]

Ø 6.00

[0.236]

R2.00

[0.079]

Intel® Server System SR2500AL

4X Side 1

No Component

4X 2.50 [0.098]

20˚

1.60

[0.063]

74.75 [2.943]

70.43 [2.773]

67.67 [2.664]

58.18 [2.291]

50.11 [1.973]

38.29 [1.508]

35.40 [1.394]

32.20 [1.268]

27.40 [1.079]

2X 17.15 [0.675]

8.40 [0.331]

3.50 [0.138]

0.00 [0.000]

0.5 X 45˚ 6 Pcs

10.76

[0.424]

Side 2 Ground Pad

See Detail B

Side 2

No Component

8.40 [0.331]

12.15 [0.478]

66.05 [2.600]

1.90 [0.075]

1.90 [0.075]

66.00 [2.598]

Detail B

Scale 2.000

5.00

[0.197]

Notes:

1. PCB tolerance:

A: 62 mil (1.58 mm) ± 7 mil

B: 93 mil (2.36 mm) ± 9 mil

C: 98 mil (2.49 mm) ± 9 mil

2. If there is needed:

sheet 1: Board profile and mounting hole

2: Pin location

3: Constrain area on both sides

3. No indicated radii should be 2.00 mm

Figure 48. Full Height PCI Express* Riser Card

See Detail A

5X R1.00 [0.039]

68.90 [2.713]

2X 67.78 [2.668]

2X 47.46 [1.868]

2X R1.27 [0.050]

6.25 [0.246]

TP02320

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Intel order number D31980-009

Revision – 1.6

Intel® Server System SR2500AL

Ø 8.26

[0.325]

Both Side

Ground Pad

3.50 [0.138]

5.00

[0.197]

Ø 6.00

[0.236]

R2.00

[0.079]

Ø 3.50 [0.138]

Detail A

Scale 2.000

See Detail A

74.75 [2.943]

72.84 [2.868]

67.67 [2.664]

52.52 [2.068]

1.60

[0.063]

35.40 [1.394]

32.20 [1.268]

27.40 [1.079]

2X 17.15 [0.675]

8.40 [0.331]

0.00 [0.000]

0.5 X 45˚ 6 Pcs

10.76

[0.424]

8BPCI Riser Cards and Assembly

Side 2 Ground Pad

See Detail B

Side 2

No Component

1.90 [0.075]

66.05 [2.600]

8.40

[0.331]

12.15 [0.478]

1.90 [0.075]

66.00 [2.598]

5X R1.00 [0.039]

68.90 [2.713]

58.18 [2.291]

38.29 [1.508]

2X R1.27 [0.050]

6.25 [0.246]

3.50 [0.138]

Detail B

Scale 2.000

5.00

[0.197]

Notes:

1. PCB tolerance:

A: 62 mil (1.58 mm) ± 7 mil

B: 93 mil (2.36 mm) ± 9 mil

C: 98 mil (2.49 mm) ± 9 mil

2. If there is needed:

sheet 1: Board profile and mounting hole

2: Pin location

3: Constrain area on both sides

3. No indicated radii should be 2.00 mm

Figure 49. Full Height Passive PCI-X* Riser Card

TP02321

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Intel order number D31980-009

75

8BPCI Riser Cards and Assembly

Intel® Server System SR2500AL

See Detail A

74.75 [2.943]

72.84 [2.868]

67.67 [2.664]

58.18 [2.291]

52.52 [2.068]

38.39 [1.508]

35.40 [1.394]

32.20 [1.268]

27.40 [1.079]

17.15 [0.675]

2X 8.40 [0.331]

3.50 [0.138]

0.00 [0.000]

0.5 X 45˚ 6 Pcs

1.90 [0.075]

66.05 [2.600]

Side 2 Ground Pad

See Detail B

8.40

[0.331]

12.15 [0.478]

1.90 [0.075]

66.00 [2.598]

R1.00 [0.039]

70.50 [2.776]

68.90 [2.713]

56.63 [2.230]

2X R1.27

[0.050]

8.40 [0.331]

6.25 [0.246]

Notes:

1. PCB tolerance:

A: 62 mil (1.58 mm) ± 7 mil

B: 93 mil (2.36 mm) ± 9 mil

C: 98 mil (2.49 mm) ± 9 mil

2. If there is needed:

sheet 1: Board profile and mounting hole

2: Pin location

3: Constrain area on both sides

3. No indicated radii should be 2.00 mm

Ø 8.26

[0.325]

3.50 [0.138]

Detail A

Scale 2.000

5.00

[0.197]

Ø 6.00

[0.236]

10.76

[0.424]

2X R2.00

[0.079]

Detail B

Scale 2.000

5.00

[0.197]

1.60

[0.063]

TP02323

Figure 50. Full Height Active PCI-X* Riser Card

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Intel® Server System SR2500AL

10. Supported Intel

®

Server Boards

9BSupported Intel® Server Boards

The chassis is mechanically and functionally designed to support the Intel

®

Server Board

S5000PAL and Intel

®

Server Board S5000XAL. The following sections provide an overview of the server board feature sets. The Technical Product Specification for the server board should be referenced for more detailed information.

10.1 Intel

®

Server Board S5000PAL / S5000XAL Feature Set

The Intel

®

Server Board S5000PAL and Intel

®

Server Board S5000XAL are monolithic printed circuit boards with features that were designed to support the high-density 1U and 2U server markets.

Feature

Processors

Description

771-pin LGA sockets supporting 1 or 2 Dual-Core Intel

®

Xeon

®

processors 5000 sequence, with system bus speeds of 667 MHz, 1066 MHz, or 1333 MHz

Memory 8 Keyed DIMM slots supporting fully buffered DIMM technology (FBDIMM) memory. 240-pin

DDR2-533 and DDR2-677 FBDIMMs must be used.

Chipset Intel

®

5000 Chipset Family which includes the following components:

Intel

®

5000P Memory Controller Hub or Intel

®

5000X Memory Controller Hub

Intel

®

6321ESB I/O Controller Hub1

Note: Intel will only make available an OEM SKU of this server board using the Intel

®

5000X Memory

Controller Hub.

On-board

Connectors/Headers

External connections:

ƒ Stacked PS/2* ports for keyboard and mouse

ƒ RJ45 Serial B port

ƒ Two RJ45 NIC connectors for 10/100/1000 Mb connections

ƒ Two USB 2.0 ports

Add-in PCI, PCI-X*, PCI

Express* Cards

On-board Video

On-board Hard Drive

Controller

LAN

System Fans

System Management

Internal connectors/headers:

ƒ One USB port header, capable of providing two USB 2.0 ports

ƒ One DH10 Serial A header

ƒ Six SATA ports via the ESB-2 and integrated SW RAID 0/1/10 support

ƒ One 44pin (power + I/O) ATA/100 connector for optical drive support

Intel

®

Remote Management Module (Intel

®

RMM) connector (Intel

®

RMM use is optional)

Intel

®

I/O Expansion Module Connector supporting:

ƒ Dual GB NIC Intel ®

I/O Expansion Module (Optional)

ƒ External SAS Intel

®

I/O Expansion Module (Optional)

ƒ Infiniband* I/O Expansion Module (Optional)

ƒ SSI-compliant 24-pin control panel header

ƒ SSI-compliant 24-pin main power connector, supporting the ATX-12V standard on the first 20 pins

ƒ 8-Pin +12V Processor Power Connector

ƒ

One low profile riser slot supporting 1U or 2U PCIe* riser cards

ƒ

One full height riser slot supporting 1U or 2U PCI-X* and PCIe* riser cards

ATI* ES1000 video controller with 16MB DDR SDRAM

ƒ

Six ESB-2 SATA ports.

ƒ Intel ®

Embedded Server RAID Technology II with SW RAID levels 0/1/10.

ƒ

Optional support for SW RAID 5 with activation key.2

Two 10/100/1000 Intel

®

82563EB PHYs supporting Intel

®

I/O Acceleration Technology

Six 4-pin Fan Headers supporting two processor fans, and four system fans

Support for Intel

®

System Management Software

1

For the remainder of this document, the Intel

®

6321ESB I/O Controller Hub may be refferred to as ESB-2.

2

Onboard SATA SW RAID 5 support provided as a post-launch product feature.

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9BSupported Intel® Server Boards

A

B

C D E F

QQ

PP

FF

EE

DD

CC

BB

AA

OO

NN

LL

MM

KK

JJ

II

HH

GG

Z

G

H

I

Intel® Server System SR2500AL

M

N

J

K

L

Y

X

W V U T

S R

Figure 51. Intel

®

Server Board S5000PAL

O

P

Q

TP02071

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Revision – 1.6

Intel® Server System SR2500AL

Description

A BIOS Bank Select Jumper

B Intel

®

6321ESB I/O Controller Hub

C IO Module Option Connector

D POST Code Diagnostic LEDs

E Intel

®

Adaptive Slot – Full Height

F PCI Express* Riser Slot – Low Profile

G System Identification LED - Blue

H External IO Connectors

I Status LED – Green / Amber

J Serial ‘B’ Port Configuration Jumper

K System Fan #4 Header

L System Fan #3 Header

M FBDIMM Slots

N Intel

Intel

®

®

5000P Memory Controller Hub (MCH) or

5000X Memory Controller Hub (MCH)

O CPU #1 Connector

P CPU #2 Connector

Q CPU #1 Fan Header

R Voltage Regulator Heat Sink

S CPU #2 Fan Header

T Bridge Board Connector

U ATA-100 Optical Drive Connector (Power+IO)

9BSupported Intel® Server Boards

V

Description

System Fan #2 Header

W CPU Power Connector

X

Y

Main Power Connector

Battery

Z Power Supply Management Connector

AA Dual Port USB 2.0 Header

BB System Fan #1 Header

CC SSI 24-pin Control Panel Header

DD SATA 0

EE SATA 1

FF SATA 2

GG SATA 3

HH SATA 4

JJ SATA SW RAID 5 Activation Key Connector

KK Intel

®

Remote Management Module (RMM)

Connector

LL System Recovery Jumper Block

MM Chassis Intrusion Switch Header

NN 3-pin IPMB Header

OO Intel

®

Local Control Panel Header

PP Serial ‘A’ Header

Intel

®

RMM NIC Connector

Figure 52. Intel

®

Server Board S5000PAL Components

10.1.1 Processor Support

The server system supports one or two Dual-Core Intel

®

Xeon

®

processors 5000 sequence, with system bus speeds of 667 MHz, 1066 MHz, and 1333 MHz, and core frequencies starting at

2.67 GHz. Previous generations of the Intel

®

Xeon

®

processor are not supported on this server board.

For additional information on processor compatibility and a list of supported processors, please see the Intel

®

Server Board S5000PAL/S5000XAL Technical Product Specification (TPS).

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Intel® Server System SR2500AL

11. Environmental and Regulatory Specifications

11.1 System Level Environmental Limits

The table below defines the system level operating and non-operating environmental limits

Table 54. System Environmental Limits Summary

Parameter Limits

Operating Temperature

Non-Operating

+10

°C to +35°C with the maximum rate of change not to exceed 10°C per hour

-40

°C to +70°C

Temperature

Non-Operating Humidity

90%, non-condensing @ 28

°C

Acoustic noise Sound Pressure: 55 dBA (Rack mount) in an idle state at typical office ambient temperature. (23 +/- degrees C) Sound Power: 7.0 BA in an idle state at typical office ambient temperature. (23 +/- 2 degrees C)

Shock, operating Half sine, 2 g peak, 11 mSec

Shock, unpackaged

Shock, packaged

Vibration, unpackaged

Trapezoidal, 25 g, velocity change 136 inches/sec

Non-palletized free fall in height 24 inches (≧40 lbs to < 80 lbs)

5 Hz to 500 Hz, 2.20 g RMS random

Shock, operating

ESD

System Cooling

Requirement in BTU/Hr

Half sine, 2 g peak, 11 mSec

+/-15kV except I/O port +/-8KV per Intel Environmental test specification

3264 BTU/hour

11.2 Serviceability and Availability

The system is designed to be serviced by qualified technical personnel only.

The desired Mean Time To Repair (MTTR) of the system is 30 minutes including diagnosis of the system problem. To meet this goal, the system enclosure and hardware have been designed to minimize the MTTR.

Following are the maximum times that a trained field service technician should take to perform the listed system maintenance procedures, after diagnosis of the system and having identified the failed component.

Activity

Remove cover

Remove and replace hard disk drive

Remove and replace power supply module

Remove and replace system fan (non-hot swappable)

Remove and replace system fan (hot swappable)

Remove and replace backplane board

Remove and replace midplane board

Remove and replace control panel module

Remove and replace server board

Time

Estimate

1 min

5 min

1 min

7 min

1 min

12 min

10 min

2 min

15 min

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10BEnvironmental and Regulatory Specifications

11.3 Replacing the Back up Battery

The lithium battery on the server board powers the real time clock (RTC) for up to 10 years in the absence of power. When the battery starts to weaken, it loses voltage, and the server settings stored in CMOS RAM in the RTC (for example, the date and time) may be wrong.

Contact your customer service representative or dealer for a list of approved devices.

WARNING

Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the equipment manufacturer. Discard used batteries according to manufacturer’s instructions.

ADVARSEL!

Lithiumbatteri - Eksplosionsfare ved fejlagtig håndtering. Udskiftning må kun ske med batteri af samme fabrikat og type. Levér det brugte batteri tilbage til leverandøren.

ADVARSEL

Lithiumbatteri - Eksplosjonsfare. Ved utskifting benyttes kun batteri som anbefalt av apparatfabrikanten. Brukt batteri returneres apparatleverandøren.

VARNING

Explosionsfara vid felaktigt batteribyte. Använd samma batterityp eller en ekvivalent typ som rekommenderas av apparattillverkaren. Kassera använt batteri enligt fabrikantens instruktion.

VAROITUS

Paristo voi räjähtää, jos se on virheellisesti asennettu. Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin. Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.

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Intel® Server System SR2500AL

11.4 Product Regulatory Compliance

The server chassis product, when correctly integrated per this guide, complies with the following safety and electromagnetic compatibility (EMC) regulations.

Intended Application – This product was evaluated as Information Technology Equipment

(ITE), which may be installed in offices, schools, computer rooms, and similar commercial type locations. The suitability of this product for other product categories and environments (such as: medical, industrial, telecommunications, NEBS, residential, alarm systems, test equipment, etc.), other than an ITE application, may require further evaluation.

Notifications to Users on Product Regulatory Compliance and Maintaining

Compliance

To ensure regulatory compliance, you must adhere to the assembly instructions in this guide to ensure and maintain compliance with existing product certifications and approvals. Use only the described, regulated components specified in this guide. Use of other products / components will void the UL listing and other regulatory approvals of the product and will most likely result in noncompliance with product regulations in the region(s) in which the product is sold.

To help ensure EMC compliance with your local regional rules and regulations, before computer integration, make sure that the chassis, power supply, and other modules have passed EMC testing using a server board with a microprocessor from the same family (or higher) and operating at the same (or higher) speed as the microprocessor used on this server board. The final configuration of your end system product may require additional EMC compliance testing.

For more information please contact your local Intel Representative. This is an FCC Class A device and its use is intended for a commercial type market place.

11.5 Use of Specified Regulated Components

To maintain the UL listing and compliance to other regulatory certifications and/or declarations, the following regulated components must be used and conditions adhered to. Interchanging or use of other component will void the UL listing and other product certifications and approvals.

Updated product information for configurations can be found on the Intel Server Builder Web site at the following URL: http://channel.intel.com/go/serverbuilder

If you do not have access to Intel’s Web address, please contact your local Intel representative.

Server chassis (base chassis is provided with power supply and fans)

⎯UL listed.

Server board

⎯you must use an Intel server board—UL recognized.

Add-in boards

⎯must have a printed wiring board flammability rating of minimum UL94V-

1. Add-in boards containing external power connectors and/or lithium batteries must be

UL recognized or UL listed. Any add-in board containing modem telecommunication circuitry must be UL listed. In addition, the modem must have the appropriate telecommunications, safety, and EMC approvals for the region in which it is sold.

Peripheral Storage Devices - must be UL recognized or UL listed accessory and TUV or

VDE licensed. Maximum power rating of any one device or combination of devices can not exceed manufacturers specifications. Total server configuration is not to exceed the maximum loading conditions of the power supply.

The following table references Server Chassis Compliance and markings that may appear on the product. Markings below are typical markings however, may vary or be different based on how certification is obtained.

Note: Certifications Emissions requirements are to Class A

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10BEnvironmental and Regulatory Specifications

Table 55. Product Safety & Electromagnetic (EMC) Compliance

Compliance Regional

Description

Compliance

Reference

Australia / New Zealand AS/NZS 3548 (Emissions)

Compliance Reference Marking Example

N232

Argentina IRAM Certification (Safety)

Belarus

Canada / USA

China

CENELEC Europe

Germany

International

Japan

Belarus Certification

CSA 60950 – UL 60950

(Safety)

None Required

Industry Canada ICES-003

(Emissions)

FCC

CFR 47, Part 15 (Emissions)

CANADA ICES-003 CLASS A

CANADA NMB-003 CLASSE A

This device complies with Part 15 of the

FCC Rules. Operation of this device is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) This device must accept interference receive, including interference that may cause undesired operation.

CNCA – CB4943 (Safety)

GB 9254 (Emissions)

GB17625 (Harmonics)

Low Voltage Directive

93/68/EEC

;

EMC Directive

89/336/EEC

EN55022 (Emissions)

EN55024 (Immunity)

EN61000-3-2 (Harmonics)

EN61000-3-3 (Voltage Flicker)

CE Declaration of Conformity

GS Certification – EN60950

None Required CB Certification – IEC60950

CISPR 22 / CISPR 24

VCCI Certification

Korea

Russia

Revision – 1.6

RRL Certification

MIC Notice No. 1997-41 (EMC)

& 1997-42 (EMI)

GOST-R Certification

GOST R 29216-91 (Emissions)

GOST R 50628-95 (Immunity)

인증번호: CPU-Model Name

(A)

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10BEnvironmental and Regulatory Specifications

Compliance Regional

Description

Ukraine

Compliance

Reference

Ukraine Certification

Taiwan BSMI CNS13438

Intel® Server System SR2500AL

Compliance Reference Marking Example

None Required

R33025

11.6 Electromagnetic Compatibility Notices

11.6.1 USA

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

For questions related to the EMC performance of this product, contact:

5200 N.E. Elam Young Parkway

Hillsboro, OR 97124

1-800-628-8686

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

ƒ

ƒ

ƒ

ƒ

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and the receiver.

Connect the equipment to an outlet on a circuit other than the one to which the receiver is connected.

Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications not expressly approved by the grantee of this device could void the user’s authority to operate the equipment. The customer is responsible for ensuring compliance of the modified product.

Only peripherals (computer input/output devices, terminals, printers, etc.) that comply with FCC

Class B limits may be attached to this computer product. Operation with noncompliant peripherals is likely to result in interference to radio and TV reception.

All cables used to connect to peripherals must be shielded and grounded. Operation with cables, connected to peripherals that are not shielded and grounded may result in interference to radio and TV reception.

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11.6.2 FCC Verification Statement

Product Type: SR2500; S5000PAL

10BEnvironmental and Regulatory Specifications

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

For questions related to the EMC performance of this product, contact:

Intel Corporation

5200 N.E. Elam Young Parkway

Hillsboro, OR 97124-6497

Phone: 1 (800)-INTEL4U or 1 (800) 628-8686

11.6.3 ICES-003 (Canada)

Cet appareil numérique respecte les limites bruits radioélectriques applicables aux appareils numériques de Classe A prescrites dans la norme sur le matériel brouilleur: “Appareils

Numériques”, NMB-003 édictée par le Ministre Canadian des Communications.

(English translation of the notice above) This digital apparatus does not exceed the Class A limits for radio noise emissions from digital apparatus set out in the interference-causing equipment standard entitled “Digital Apparatus,” ICES-003 of the Canadian Department of

Communications.

11.6.4 Europe (CE Declaration of Conformity)

This product has been tested in accordance too, and complies with the Low Voltage Directive

(73/23/EEC) and EMC Directive (89/336/EEC). The product has been marked with the CE Mark to illustrate its compliance.

11.6.5 Japan EMC Compatibility

Electromagnetic Compatibility Notices (International)

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Intel® Server System SR2500AL

English translation of the notice above:

This is a Class A product based on the standard of the Voluntary Control Council For

Interference (VCCI) from Information Technology Equipment. If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.

11.6.6 BSMI (Taiwan)

The BSMI Certification number and the following warning is located on the product safety label which is located on the bottom side (pedestal orientation) or side (rack mount configuration).

11.6.7 RRL (Korea)

Following is the RRL certification information for Korea.

English translation of the notice above:

1. Type of Equipment (Model Name): On License and Product

2. Certification No.: On RRL certificate. Obtain certificate from local Intel representative

3. Name of Certification Recipient: Intel Corporation

4. Date of Manufacturer: Refer to date code on product

5. Manufacturer/Nation: Intel Corporation/Refer to country of origin marked on product

11.6.8 CNCA (CCC-China)

The CCC Certification Marking and EMC warning is located on the outside rear area of the product.

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10BEnvironmental and Regulatory Specifications

11.7 Product Ecology Compliance

Intel has a system in place to restrict the use of banned substances in accordance with world wide product ecology regulatory requirements. The following is Intel’s product ecology compliance criteria.

Compliance Regional

Description

Compliance Reference

Compliance Reference

Marking Example

California

China

California Code of Regulations, Title 22, Division 4.5;

Chapter 33: Best Management Practices for

Perchlorate Materials.

China RoHS

Administrative Measures on the Control of Pollution

Caused by Electronic Information Products” (EIP) #39.

Referred to as China RoHS.

Mark requires to be applied to retail products only.

Mark used is the Environmental Friendly Use Period

(EFUP). Number represents years.

Special handling may apply. See www.dtsc.ca.gov/hazardo uswaste/perchlorate

This notice is required by

California Code of

Regulations, Title 22,

Division 4.5; Chapter 33:

Best Management

Practices for Perchlorate

Materials. This product / part includes a battery which contains

Perchlorate material.

Intel Internal

Specification

China Recycling (GB18455-2001)

Mark requires to be applied to be retail product only.

Marking applied to bulk packaging and single packages. Not applied to internal packaging such as plastics, foams, etc.

All materials, parts and subassemblies must not contain restricted materials as defined in Intel’s

Environmental Product Content Specification of

Suppliers and Outsourced Manufacturers – http://supplier.intel.com/ehs/environmental.htm

None Required

Europe

Waste Electrical and Electronic Equipment

(WEEE) Directive 2002/96/EC – Mark applied to system level products only.

European Directive 2002/95/EC -

Restriction of Hazardous Substances (RoHS)

Threshold limits and banned substances are

noted below.

Quantity limit of 0.1% by mass (1000 PPM) for:

Lead, Mercury, Hexavalent Chromium,

Polybrominated Biphenyls Diphenyl Ethers

(PBB/PBDE)

Quantity limit of 0.01% by mass (100 PPM) for:

Cadmium

None Required

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10BEnvironmental and Regulatory Specifications

Compliance Regional

Description

Germany

Compliance Reference

German Green Dot

Applied to Retail Packaging Only for Boxed Boards

Intel® Server System SR2500AL

Compliance Reference

Marking Example

Intel Internal

Specification

All materials, parts and subassemblies must not contain restricted materials as defined in Intel’s

Environmental Product Content Specification of

Suppliers and Outsourced Manufacturers – http://supplier.intel.com/ehs/environmental.htm

None Required

International ISO11469 - Plastic parts weighing >25gm are intended to be marked with per ISO11469.

Recycling Markings – Fiberboard (FB) and Cardboard

(CB) are marked with international recycling marks.

Applied to outer bulk packaging and single package.

>PC/ABS<

Japan Japan Recycling

Applied to Retail Packaging Only for Boxed Boards

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11.8 Other Markings

Compliance

Description

Stand-by Power

10BEnvironmental and Regulatory Specifications

Compliance Reference

60950 Safety Requirement

Applied to product is stand-by power switch is used.

Compliance Reference

Marking Example

Multiple Power Cords 60950 Safety Requirement

Applied to product if more than one power cord is

used.

Ground Connection 60950 Deviation for Nordic Countries

.

English:

This unit has more than one power supply cord. To reduce the risk of electrical shock, disconnect (2) two power supply cords before servicing.

Simplified Chinese:

注意：

本设备包括多条电源系统电缆。

为避免遭受电击，在进行维修之

前应断开两（2）条电源系统电

缆。

Traditional Chinese:

注意：

本設備包括多條電源系統電纜。

為避免遭受電擊，在進行維修之

前應斷開兩（2）條電源系統電

纜。

German:

Dieses Geräte hat mehr als ein

Stromkabel. Um eine Gefahr des elektrischen Schlages zu verringern trennen sie beide (2)

Stromkabeln bevor

Instandhaltung.

Line1 :

“WARNING:”

Swedish on line2:

“Apparaten skall anslutas till jordat uttag, när den ansluts till ett nätverk.”

Finnish on line 3:

“Laite on liitettävä suojamaadoituskoskettimilla varustettuun pistorasiaan.”

English on line 4:

“Connect only to a properly earth grounded outlet.”

Country of Origin Logistic Requirements

Applied to products to indicate where product was

made.

Made in XXXX

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< This page intentionally left blank >

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Appendix A: Chassis Integration and Usage Tips

Appendix A: Chassis Integration and Usage Tips

This appendix provides a list of useful information that is unique to the Intel

®

Server Chassis

SR2500 and should be kept in mind while integrating and configuring your system. o

In a single power supply configuration, the power supply must be placed in the lower slot. A power supply blank must be installed in the upper slot in order to maintain proper airflow in the system. o

Do not mix DIMMs of different heights. For tall DIMMS the DIMM baffle must be removed from the Processor Air Duct for proper fitment. The baffle must be installed for shorter

DIMMS to ensure proper airflow and DIMM cooling. o

You must run the FRUSDR utility to load the proper Sensor Data Records for this chassis on to the server board. Failure to do so may result in possible false errors being reported to the

System Event Log. It is best to download the latest FRUSDR Utility for your particular server board using the Intel

®

Server Deployment Toolkit or from the following web site: http://support.intel.com/support/motherboards/server o

To ensure proper cooling of your server, all air baffles and air ducts must be in place. In addition, all drive bays must be populated with either a drive or a drive blank and both power supply slots must be populated by either a power supply or a power supply blank. o

Processor fans are not supported and are not needed in the Intel

®

Server Chassis SR2500. o

The Mid-plane board must be removed from the system before removal of the Backplane. o

In order to remove or replace the Mid-plane board, the fan cage must first be removed. o

There are three indentations in the top of the chassis. These are for the Intel Safety Label, the Windows Certification Label, and a Customer Defined Label.

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Appendix B: POST Code Diagnostic LED Decoder

Intel® Server System SR2500AL

Appendix B: POST Code Diagnostic LED Decoder

During the system boot process, BIOS executes a number of platform configuration processes, each of which is assigned a specific hex POST code number. As each configuration routine is started, BIOS will display the given POST code to the POST Code Diagnostic LEDs found on the back edge of the server board. To assist in troubleshooting a system hang during the POST process, the Diagnostic LEDs can be used to identify the last POST process to be executed.

Each POST code will be represented by a combination of colors from the four LEDs. The LEDs are capable of displaying three colors: green, red, and amber. The POST codes are divided into two nibbles, an upper nibble and a lower nibble. Each bit in the upper nibble is represented by a red LED and each bit in the lower nibble is represented by a green LED. If both bits are set in the upper and lower nibbles then both red and green LEDs are lit, resulting in an amber color. If both bits are clear, then the LED is off.

In the below example, BIOS sends a value of ACh to the diagnostic LED decoder. The LEDs are decoded as follows:

• red bits = 1010b = Ah

• green bits = 1100b = Ch

Since the red bits correspond to the upper nibble and the green bits correspond to the lower nibble, the two are concatenated to be ACh.

LEDs

Table 56: POST Progress Code LED Example

Red

8h

Green Red

4h

Green

Result Amber Green

MSB

Red

2h

Green

Red

Red

1h

Green

Off

LSB

USB Port

USB Port

Back edge of baseboard

Diagnostic LEDs

MSB LSB

Figure 53. Diagnostic LED Placement Diagram

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Intel® Server System SR2500AL

Appendix B: POST Code Diagnostic LED Decoder

Table 57. Diagnostic LED POST Code Decoder

Description

Checkpoint

Diagnostic LED Decoder

G=Green, R=Red, A=Amber

MSB

Host Processor

LSB

Chipset

0x21h

Memory

0x23h

0x24h

0x25h

OFF OFF R G Initializing a chipset component

OFF OFF

OFF

OFF

G

G

A

R

R

G Detecting presence of memory

OFF Programming timing parameters in the memory controller

G Configuring memory parameters in the memory controller

PCI Bus

0x50h

0x51h

0x52h

0x53h

0x54h

0x55h

0x56h

0x57h

USB

0x58h

0x59h

ATA / ATAPI / SATA

0x5Ah G

0x5Bh G

SMBUS

G

G

OFF

OFF

OFF

OFF

OFF

OFF

OFF

OFF

A

A

A

R OFF

R OFF

R

R

A

G

G

OFF

OFF

G

G

R OFF

R OFF

R

R

G

G

R Enumerating PCI busses

A Allocating resources to PCI busses

R Hot Plug PCI controller initialization

A Reserved for PCI bus

R Reserved for PCI bus

A Reserved for PCI bus

R Reserved for PCI bus

A Reserved for PCI bus

R Resetting USB bus

A Reserved for USB devices

R Resetting PATA / SATA bus and all devices

A Reserved for ATA

0x5Dh

Local Console

G

0x70h

0x71h

0x72h

OFF

OFF

OFF

Remote Console

A

R

R

R

OFF

R

R

A

0x78h

0x79h

0x7Ah

G

G

G

R

R

R

R

R

A

Keyboard (PS2 or USB)

0x90h R OFF OFF

0x91h R OFF OFF

A Reserved for SMBUS

R Resetting the video controller (VGA)

A Disabling the video controller (VGA)

R Enabling the video controller (VGA)

R Resetting the console controller

A Disabling the console controller

R Enabling the console controller

R Resetting the keyboard

A Disabling the keyboard

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Appendix B: POST Code Diagnostic LED Decoder

Checkpoint

Diagnostic LED Decoder

G=Green, R=Red, A=Amber

MSB LSB

Intel® Server System SR2500AL

Description

0x93h

0x94h

0x95h

R

R

R

Mouse (PS2 or USB)

0x98h

0x99h

A

A

OFF G

G OFF

G OFF

OFF OFF

OFF OFF

A Enabling the keyboard

R Clearing keyboard input buffer

A Instructing keyboard controller to run Self Test (PS2 only)

R Resetting the mouse

A Detecting the mouse

0x9Bh

Fixed Media

A OFF G A Enabling the mouse

0xB0h

0xB1h

0xB2h

0xB3h

Removable Media

0xB8h A

R

R

OFF

OFF

R

R

R Resetting fixed media device

A Disabling fixed media device

Detecting presence of a fixed media device (IDE hard drive detection,

R OFF A R etc.)

R OFF A A Enabling / configuring a fixed media device

OFF R R Resetting removable media device

0xB9h

0xBAh

0xBCh

0xD2

0xD3

0xD4

0xD5

0xD6

0xD7

0xD8

0xD9

0XDA

0xDB

0xDC

0xDE

A OFF R A Disabling removable media device

Detecting presence of a removable media device (IDE CDROM

A OFF A R detection, etc.)

A G R R Enabling / configuring a removable media device

Boot Device Selection

0xD0 R

0xD1 R

R OFF

R OFF

R

R

R

R

R

R

A

A

A

A

A

A

R

R

A

A

A

A

R

R

R

R

A

A

G

G

OFF

OFF

G

G

OFF

OFF

G

G

OFF

G

0xDF A A

Pre-EFI Initialization (PEI) Core

G

R

A

Trying boot device selection

Trying boot device selection

R Trying boot device selection

A Trying boot device selection

R Trying boot device selection

A

R

A

Trying boot device selection

Trying boot device selection

Trying boot device selection

R Trying boot device selection

A Trying boot device selection

R Trying boot device selection

A Trying boot device selection

R Trying boot device selection

R

A

Trying boot device selection

Trying boot device selection

0xE2h

0xE1h

R

R

R

R

A

R

OFF Initial memory found, configured, and installed correctly

G Reserved for initialization module use (PEIM)

0xE3h R R A G Reserved for initialization module use (PEIM)

Driver Execution Environment (DXE) Core

0xE5h R A R G Started dispatching drivers

DXE Drivers

0xE7h

94

R A A G Waiting for user input

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Intel® Server System SR2500AL

Checkpoint

Diagnostic LED Decoder

G=Green, R=Red, A=Amber

MSB LSB

0xE9h A R R

Appendix B: POST Code Diagnostic LED Decoder

G Entering BIOS setup

Description

0xEEh A A A OFF Calling Int 19. One beep unless silent boot is enabled.

Runtime Phase / EFI Operating System Boot

0xF4h R A R R Entering Sleep state

0xF8h

0xF9h

0xFAh

A R R R

(ExitBootServices ( ) has been called)

Operating system has switched to virtual address mode

A R R A

(SetVirtualAddressMap ( ) has been called)

Operating system has requested the system to reset (ResetSystem ()

A R A R has been called)

Pre-EFI Initialization Module (PEIM) / Recovery

0x30h OFF OFF R R Crisis recovery has been initiated because of a user request

0x31h OFF OFF R A Crisis recovery has been initiated by software (corrupt flash)

0x34h

0x35h

0x3Fh

OFF

OFF

G

G

G

G

R

R

A

R

A

A

Loading crisis recovery capsule

Handing off control to the crisis recovery capsule

Unable to complete crisis recovery.

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Appendix C: POST Error Beep Codes

Intel® Server System SR2500AL

Appendix C: POST Error Beep Codes

The following table lists POST error beep codes. Prior to system Video initialization, BIOS uses these beep codes to inform users on error conditions. The beep code is followed by a user visible code on POST Progress LEDs.

Table 58. POST Error Beep Codes

Beeps

3

Error Message

Memory error

6 BIOS rolling back error

POST Progress Code Description

System halted because a fatal error related to the memory was detected.

The system has detected a corrupted BIOS in the flash part, and is rolling back to the last good BIOS.

The BMC may generate beep codes upon detection of failure conditions. Beep codes are sounded each time the problem is discovered, such as on each power-up attempt, but are not sounded continuously. Codes that are common across all Intel

®

server boards and systems that use the Intel

®

5000 Series Chipsets are listed in Table 59. Each digit in the code is represented

by a sequence of beeps whose count is equal to the digit.

Table 59. BMC Beep Codes

Code Reason for Beep

1-5-2-1 CPU: Empty slot / population error – Processor slot 1 is not populated.

1-5-2-2 CPU: No processors (terminators only)

Associated Sensors

CPU Population Error

N/A

1-5-2-3 CPU: Configuration error (e.g., VID mismatch) N/A

1-5-2-4 CPU: Configuration error (e.g., BSEL mismatch) N/A

1-5-4-2 Power fault: DC power unexpectedly lost (power good dropout)

1-5-4-3 Chipset control failure

1-5-4-4 Power control fault

Power Unit – power unit failure offset

N/A

Power Unit – soft power control failure offset

Supported?

Yes

No

No

No

Yes

No

Yes

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Intel® Server System SR2500AL Glossary

Glossary

Word / Acronym

ACA Australian Communication Authority

Definition

BMC

CMOS

Baseboard Management Controller

Complementary Metal Oxide Silicon

D2D DC-to-DC

EMP Emergency Management Port

FRB

FRU

LCD

MTBF

MTTR

Fault Resilient Boot

Field Replaceable Unit

Liquid Crystal Display

Mean Time Between Failure

Mean Time to Repair

PFC

PSU

Power Factor Correction

Power Supply Unit

SCA Single Connector Attachment

SDR Sensor Data Record

SE Single-Ended

UART Universal Asynchronous Receiver Transmitter

USB

VCCI

Universal Serial Bus

Voluntary Control Council for Interference

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Reference Documents

Intel® Server System SR2500AL

Reference Documents

See the following documents for additional information: o

Intel

®

Server Board S5000PAL Technical Product Specification o

Intel

®

5000 Series Chipsets Server Board Family Datasheet o

Intel

®

Server Chassis SR2500 Power Distribution Board for 750W Power Supply

Specification o

Intel

®

Server Chassis SR2500 750 Watt AC Power Supply Module Specification o

Intel

®

Server Board S5000PAL/S5000XAL Tested Hardware and OS List

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