ams AS6221 Digital Temperature Sensor Demo User Guide
AMS AS6221 is a digital temperature sensor that offers reliable temperature measurement with ±0.5°C accuracy over the temperature range of -40°C to +125°C. It features a high resolution of 0.0078°C and a fast response time of 200ms, making it ideal for applications requiring precise and rapid temperature monitoring. The AS6221 operates at a low supply voltage, ranging from 1.71V to 3.6V, and consumes minimal power, making it suitable for battery-powered devices. It can be easily interfaced with microcontrollers or other devices through its I²C interface. The compact WLCSP package (2.0mm x 2.
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Application Note
AN000325
AS62xx
Thermal Design Guideline for PCB Reference
Design
v4-00 • 2020-Nov-23
Document Feedback AS62xx
Content Guide
Content Guide
Introduction ................................... 3
Ordering Information .................................... 3
Components on PCB .................... 4
Temperature Sensing on Same PCB Layer
Side .............................................................. 4
Temperature Sensing on the Opposite PCB
Layer Side .................................................... 4
Response Time .............................. 6
Reduce Thermal Load with PCB Cut ........... 6
Flex PCB....................................................... 7
Revision Information ..................... 8
Legal Information ........................... 9
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Introduction
1 Introduction
The AS62xx device family is a digital temperature sensor family for applications that require small form factors, ultra-low power consumption and high accuracy.
Temperature monitoring could be challenging and with this document, some design guidelines are listed to support you in your product design.
1.1 Ordering Information
Ordering Code Package
AS6221-AWLT-S
AS6221-AWLT-L
AS6212-AWLT-S
AS6212-AWLT-L
AS6214-AWLT-S
AS6214-AWLT-L
AS6218-AWLT-S
AS6218-AWLT-L
WLCSP
WLCSP
WLCSP
WLCSP
WLCSP
WLCSP
WLCSP
WLCSP
AS6204-AWLM-S
AS6204-AWLT-L
WLCSP
WLCSP
AS6200C-AWLM-S WLCSP
AS6200C-AWLT-L WLCSP
AS6200-AWLT-S
AS6200-AWLT-L
WLCSP
WLCSP
Marking Delivery Form
AS6221
AS6221
AS6212
AS6212
AS6214
AS6214
AS6218
AS6218
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
AS6204
AS6204
Tape & Reel
Tape & Reel
AS6MCC Tape & Reel
AS6MCC Tape & Reel
AS6200
AS6200
Tape & Reel
Tape & Reel
Delivery Quantity
500 pcs/reel
5000 pcs/reel
500 pcs/reel
5000 pcs/reel
500 pcs/reel
5000 pcs/reel
500 pcs/reel
5000 pcs/reel
500 pcs/reel
5000 pcs/reel
500 pcs/reel
5000 pcs/reel
500 pcs/reel
5000 pcs/reel
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Temperature Sensing of Components on PCB
2 Temperature Sensing of Components on
PCB
2.1 Temperature Sensing on Same PCB Layer Side
In order to get a good sensing results the AS62xx should be placed as near as possible to the component you want to sense. Connect the common GND plane as close as possible together as
Keep other copper layers and vias away from sensor to minimize the thermal load
Figure 1:
Copper Connection on Same Layer for Heat Transfer
The advantage of same side measuring is that to keep influence of other heat sources of the bottom side away from the sensor.
2.2 Temperature Sensing on the Opposite PCB Layer Side
Thermal vias can be used in case the sensing component is on the bottom side as shown in Figure 2.
In order to reduce thermal load make sure there are no copper layers between sensor and the component you want to sense.
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Figure 2:
Temperature Sensing over Thermal Via
AS62xx
Temperature Sensing of Components on PCB
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Thermal Load vs. Temperature Response Time
3 Thermal Load vs. Temperature Response
Time
3.1 Reduce Thermal Load with PCB Cut
3.1.1 Cutout Through PCB
To further improve the response time of the sensor, it is recommended to reduce the thermal capacity of the PCB. One important measure is to keep the area around the sensor free of any copper planes.
In addition to that, a cutout as can be seen in Figure 3 should be applied.
Figure 3:
PCB Cutout
3.1.2 PCB Cutout Area
In addition, to reduce thermal load of the PCB the bottom side can be cut out as shown in Figure 4
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Figure 4:
PCB Cutout Bottom Side
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Thermal Load vs. Temperature Response Time
3.2 Flex PCB
example shows how it can be done to measure the housing temperature. A thermal tape or adhesive can be used to fix the rigid flex to the case. The exposed pad increases the thermal conduction. In best case, use a thermal via to connect the sensor ground.
Figure 5:
Sensor on Rigid Flex PCB
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4 Revision Information
AS62xx
Revision Information
Changes from previous version to current revision v4-00 Page
●
●
Updated Ordering Information table with AS6221
3
Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
Correction of typographical errors is not explicitly mentioned.
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5 Legal Information
AS62xx
Legal Information
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten, Austria-Europe. Trademarks Registered. All rights reserved.
The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.
Information in this document is believed to be accurate and reliable. However, ams AG does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.
Applications that are described herein are for illustrative purposes only. ams AG makes no representation or warranty that such applications will be appropriate for the specified use without further testing or modification. ams AG takes no responsibility for the design, operation and testing of the applications and end-products as well as assistance with the applications or end-product designs when using ams AG products. ams AG is not liable for the suitability and fit of ams AG products in applications and end-products planned. ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data or applications described herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other services. ams AG reserves the right to change information in this document at any time and without notice.
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RoHS Compliant: The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories plus additional 4 substance categories (per amendment EU 2015/863), including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specified lead-free processes. ams Green (RoHS compliant and no Sb/Br/Cl): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) and do not contain Chlorine (Cl not exceed 0.1% by weight in homogeneous material).
Important Information: The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
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8141 Premstaetten
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