Quảng cáo
Quảng cáo
STFW69N65M5
STW69N65M5
N-channel 650 V, 0.037 Ω typ., 58 A MDmesh™ V Power MOSFET in TO-3PF and TO-247 packages
Datasheet
−
production data
Features
Order codes V
DSS
@ T
Jmax
R
DS(on)
max I
D
STFW69N65M5
STW69N65M5
710 V < 0.045 Ω 58 A
■
■
■
■
Worldwide best R
DS(on)
* area
Higher V
DSS
rating and high dv/dt capability
Excellent switching performance
100% avalanche tested TO-3PF
1
2
3
TO-247
1
2
3
Applications
■ Switching applications
Description
These devices are N-channel MDmesh™ V
Power MOSFETs based on an innovative proprietary vertical process technology, which is combined with STMicroelectronics’ well-known
PowerMESH™ horizontal layout structure. The resulting product has extremely low onresistance, which is unmatched among siliconbased Power MOSFETs, making it especially suitable for applications which require superior power density and outstanding efficiency.
Figure 1.
Internal schematic diagram
'
$
3
!-V
Table 1.
Device summary
Order codes
STFW69N65M5
STW69N65M5
Marking
69N65M5
Package
TO-3PF
TO-247
September 2012
This is information on a product in full production.
Doc ID 022906 Rev 2
Packaging
Tube
1/16 www.st.com
16
Contents
Contents
STFW69N65M5, STW69N65M5
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2/16 Doc ID 022906 Rev 2
STFW69N65M5, STW69N65M5 Electrical ratings
Table 2.
Symbol
Absolute maximum ratings
Parameter
V
GS
I
D
I
D
I
DM
(2)
P
TOT dv/dt
(3)
Gate-source voltage
Drain current (continuous) at T
C
= 25 °C
Drain current (continuous) at T
C
= 100 °C
Drain current (pulsed)
Total dissipation at T
C
= 25 °C
Peak diode recovery voltage slope
V
ISO
Insulation withstand voltage (RMS) from all three leads to external heat sink
(t=1s; Tc=25°C)
T stg
T j
Storage temperature
Max. operating junction temperature
1.
Limited by maximum junction temperature.
2.
Pulse width limited by safe operating area
3.
I
SD
≤
58 A, di/dt
≤
DS peak
< V
(BR)DSS,
V
DD
=400 V
Table 3.
Thermal data
Symbol Parameter
Value
TO-3PF
58
(1)
36.5
(1)
232
(1)
79
± 25
15
TO-247
58
36.5
232
330
3500
- 55 to 150
150
R thj-case
Thermal resistance junction-case max
R thj-amb
Thermal resistance junction-ambient max
Table 4.
Symbol
I
AR
E
AS
Avalanche characteristics
Parameter
Avalanche current, repetetive or not repetetive
(pulse width limited by T jmax
)
Single pulse avalanche energy (starting t j
=25°C,
I d
= I
AR
; V dd
=50)
TO-3PF
1.58
Value
TO-247
0.38
50
Value
12
1410
Unit
°C/W
°C/W
Unit
A mJ
V
°C
°C
Unit
V
A
A
A
W
V/ns
Doc ID 022906 Rev 2 3/16
Electrical characteristics STFW69N65M5, STW69N65M5
(T
C
= 25 °C unless otherwise specified)
Table 5.
Symbol
On /off states
Parameter Test conditions
V
(BR)DSS
V
R
I
I
DSS
GSS
GS(th)
DS(on)
Drain-source breakdown voltage
I
D
= 1 mA, V
GS
= 0
Zero gate voltage drain current (V
GS
= 0)
Gate-body leakage current (V
DS
= 0)
V
V
V
DS
DS
GS
= 650 V
= 650 V, T
= ± 25 V
C
=125 °C
Gate threshold voltage V
DS
= V
GS
, I
D
= 250 µA
Static drain-source on-resistance
V
GS
= 10 V, I
D
= 29 A
Min.
Typ.
Max.
Unit
650
3
1
100
V
µA
µA
± 100 nA
4 5 V
0.037
0.045
Ω
Table 6.
Symbol
Dynamic
Parameter Test conditions Min.
Typ.
Max.
Unit
C
C
C
C
C o(tr)
(1) o(er)
(2)
R iss oss rss
G
Input capacitance
Output capacitance
Reverse transfer capacitance
Equivalent capacitance time related
Equivalent capacitance energy related
Intrinsic gate resistance
V
V
V
DS
GS
DS
= 100 V, f = 1 MHz,
= 0
= 0 to 520 V, V
GS f = 1 MHz open drain
= 0
-
-
-
-
6420
170
11
536
146
1.2
-
-
-
pF pF pF pF pF
Ω
Q g
Q gs
Q gd
Total gate charge
Gate-source charge
Gate-drain charge
V
V
DD
GS
= 520 V, I
= 10 V
(see
D
= 29 A,
-
143
38
64
-
1.
Time related is defined as a constant equivalent capacitance giving the same charging time as C oss
when
V
DS
increases from 0 to 80% V
DSS
2.
Energy related is defined as a constant equivalent capacitance giving the same stored energy as C oss when V
DS
increases from 0 to 80% V
DSS nC nC nC
4/16 Doc ID 022906 Rev 2
STFW69N65M5, STW69N65M5 Electrical characteristics
Table 7.
Symbol t d(v) t r(v) t f(i) t c(off)
Switching times
Parameter
Voltage delay time
Voltage rise time
Current fall time
Crossing time
Test conditions
V
DD
= 400 V, I
D
= 38 A,
R
G
= 4.7
Ω,
V
GS
= 10 V
and
)
Min.
Typ.
Max Unit
-
102
13.5
10
19
ns ns ns ns
Table 8.
Symbol
Source drain diode
Parameter Test conditions
I
SD
I
SDM
(1)
V
SD
(2) t rr
Q rr
I
RRM t rr
Q rr
I
RRM
Source-drain current
Source-drain current (pulsed)
Forward on voltage
Reverse recovery time
Reverse recovery charge
Reverse recovery current
Reverse recovery time
Reverse recovery charge
Reverse recovery current
I
I
SD
SD
V
DD
I
SD
= 58 A, V
1.
Pulse width limited by safe operating area.
2.
Pulsed: pulse duration = 300 µs, duty cycle 1.5%
GS
= 0
= 58 A, di/dt = 100 A/µs
= 58 A, di/dt = 100 A/µs
V
DD
= 100 V, T j
)
= 150 °C
)
Min.
Typ.
Max.
Unit
-
-
-
-
480
11
46
592
16
53
58
232
1.5
ns
µC
A ns
µC
A
A
A
V
Doc ID 022906 Rev 2 5/16
Electrical characteristics STFW69N65M5, STW69N65M5
Figure 2.
Safe operating area for TO-3PF
!-V
) $
!
Figure 3.
Thermal impedance for TO-3PF
TO 3 PF
K
δ
=0.5
0.2
/PER
,IMITEDB
$3ON
S
S
MS
MS
10
-1
0.1
0.02
0.05
4J #
4C #
3INLGE
PULSE
0.01
S ingle p u l s e
6 $3 6
10
-2
10
-5
10
-4
10
3
10
-2
10
-1 t p
( s )
Figure 4.
Safe operating area for TO-247
!-V
) $
!
Figure 5.
Thermal impedance for TO-247
S
S
$3ON
/PER
,IMITEDB
4J #
4C #
3INLGE
PULSE
MS
MS
Figure 6.
Output characteristics
) $
!
6
'3
6
6
6 $3 6
!-V
Figure 7.
Transfer characteristics
) $
!
6 $3 6
!-V
6
6/16
6
6 $3 6
Doc ID 022906 Rev 2
6 '3 6
STFW69N65M5, STW69N65M5 Electrical characteristics
Figure 8.
Gate charge vs gate-source voltage Figure 9.
Static drain-source on-resistance
!-V !-V
6 '3
6
2 $3ON
/HM
6 $3
6 $$ 6 6
'3
6 '3 6
) $ !
1 G N#
Figure 10.
Capacitance variations
#
P&
!-V
) $ !
Figure 11.
Output capacitance stored energy
!-V
% OSS
*
#ISS
#OSS
#RSS
6 $3 6 6 $3 6
Figure 12.
Normalized gate threshold voltage vs temperature
V
G S (th)
(norm)
1.10
I
D
=250 µ A
V
D S
=V
G S
AM05459v2
Figure 13.
Normalized on-resistance vs temperature
AM05460v2
R
D S (on)
(norm)
2.1
V
G S
=10V
I
D
=29A
1.9
1.00
1.7
0.90
1.5
1.
3
1.1
0.
8 0
0.70
-50 -25 0 25 50 75 100 T
J
(°C)
0.9
0.7
0.5
-50 -25 0 25 50 75 100 T
J
(°C)
Doc ID 022906 Rev 2 7/16
Electrical characteristics STFW69N65M5, STW69N65M5
Figure 14.
Source-drain diode forward characteristics
V
S D
(V)
T
J
=-50°C
AM05461v1
1.2
Figure 15.
Normalized B
VDSS
vs temperature
V
D S
(norm)
1.0
8
I
D
= 1mA
AM10 3 99v1
1.06
1.0
1.04
0.
8 1.02
T
J
=25°C
0.6
1.00
T
J
=150°C
0.9
8
0.4
0.96
0.2
0
0 10 20 3 0 40 50 I
S D
(A)
0.94
0.92
-50 -25 0 25 50 75 100 T
J
(°C)
Figure 16.
Switching losses vs gate resistance
(1)
%
*
) $ !
6
$$
6
6
'3
6
%ON
!-V
%OFF
1.
Eon including reverse recovery of a SiC diode
2 '
8/16 Doc ID 022906 Rev 2
STFW69N65M5, STW69N65M5
3 Test circuits
Test circuits
Figure 17.
Switching times test circuit for resistive load
Figure 18.
Gate charge test circuit
6 $$
6 K
N&
K
6 '3
6 $
2 '
2 ,
$54
& &
6 $$
6 I 66 '-!8
)
'
#/.34
& K
$54
6 '
0 7
K
0 7
K
!-V !-V
Figure 19.
Test circuit for inductive load switching and diode recovery times
Figure 20.
Unclamped inductive load test circuit
'
!
$
3
$54
"
2
'
!
&!34
$)/$%
!
"
"
'
$
3
, (
& &
6
$$
6 $
) $
,
&
&
6
$$
6 I $54
Figure 21.
Unclamped inductive waveform
6
"2 $33
6 $
!-V
0
W
!-V
Figure 22.
Switching time waveform
Ind u ctive Lo a d T u rn - off
Id
90 % Vd s 90 % Id t d (v)
) $-
Vg s
90 % Vg s
) $
Vg s (I(t))
6
$$ 6 $$
10 % Id
Vd s
10 % Vd s
!-V t r
(v) t c
(off) t f
(i)
AM05540v1
Doc ID 022906 Rev 2 9/16
Package mechanical data
4 Package mechanical data
STFW69N65M5, STW69N65M5
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
10/16 Doc ID 022906 Rev 2
STFW69N65M5, STW69N65M5
L
L2
L3
L4
L5
L6
L7
N
R
Dia
E
F
F2
G
G1
H
A
C
D
D1
Table 9.
Dim.
TO-3PF mechanical data
Min.
5.30
2.80
3.10
1.80
0.80
0.65
1.80
10.30
15.30
9.80
22.80
26.30
43.20
4.30
24.30
14.60
1.80
3.80
3.40
mm
Typ.
5.45
10
Package mechanical data
Max.
5.70
3.20
3.50
2.20
1.10
0.95
2.20
11.50
15.70
10.20
23.20
26.70
44.40
4.70
24.70
15
2.20
4.20
3.80
Doc ID 022906 Rev 2 11/16
Package mechanical data
Figure 23.
TO-3PF drawing
L 3
L
A
C
Di a
L2
H
L5
STFW69N65M5, STW69N65M5
D1
D
E
L6
F2( 3 x)
L7
F( 3 x)
G1
G
R
L4
N
76271 3 2_C
12/16 Doc ID 022906 Rev 2
STFW69N65M5, STW69N65M5
A
A1 b b1 b2 c
D
L1
L2
∅ P
∅
R
S
E e
L
Table 10.
TO-247 mechanical data
Dim.
Min.
4.85
2.20
1.0
2.0
3.0
0.40
19.85
15.45
5.30
14.20
3.70
3.55
4.50
5.30
mm.
Typ.
5.45
18.50
5.50
Package mechanical data
Max.
5.15
2.60
1.40
2.40
3.40
0.80
20.15
15.75
5.60
14.80
4.30
3.65
5.50
5.70
Doc ID 022906 Rev 2 13/16
Package mechanical data
Figure 24.
TO-247 drawing
STFW69N65M5, STW69N65M5
0075 3 25_G
14/16 Doc ID 022906 Rev 2
STFW69N65M5, STW69N65M5 Revision history
Table 11.
Document revision history
Date Revision
27-Feb-2012
28-Sep-2012
1
2
Changes
First release.
– Modified: note
3 of Table 2 , values in Table 4
, typ. values in
– Curves inserted
– Minor text changes
Doc ID 022906 Rev 2 15/16
STFW69N65M5, STW69N65M5
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2012 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
16/16 Doc ID 022906 Rev 2
Tải xuống
Quảng cáo