STMicroelectronics STP4N90K5 Datasheet
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विज्ञापन
STP4N90K5
Nchannel 900 V, 1.90 Ω typ.,3 A MDmesh™ K5
Power MOSFET in a TO-220 package
Datasheet - production data
TAB
TO-220
1
2
3
Figure 1: Internal schematic diagram
Features
Order code V
DS
R
DS(on)
max.
STP4N90K5 900 V 2.10 Ω
Industry’s lowest R
DS(on)
x area
Industry’s best FoM (figure of merit)
Ultra-low gate charge
100% avalanche tested
Zener-protected
I
D
3 A
Applications
Switching applications
Description
This very high voltage N-channel Power
MOSFET is designed using MDmesh™ K5 technology based on an innovative proprietary vertical structure. The result is a dramatic reduction in on-resistance and ultra-low gate charge for applications requiring superior power density and high efficiency.
Order code
STP4N90K5
Table 1: Device summary
Marking Package
4N90K5 TO-220
Packing
Tube
November 2016 DocID029953 Rev 1
This is information on a product in full production.
1/13 www.st.com
Contents
Contents
STP4N90K5
1 Electrical ratings ............................................................................. 3
2 Electrical characteristics ................................................................ 4
Electrical characteristics (curves) ...................................................... 6
4 Package information ....................................................................... 9
TO-220 package information ........................................................... 10
5 Revision history ............................................................................ 12
2/13 DocID029953 Rev 1
STP4N90K5
1
Electrical ratings
Electrical ratings
Symbol
Table 2: Absolute maximum ratings
Parameter
V
GS
I
D
I
D
I
P
TOT
T j
T stg
Gate-source voltage
Drain current (continuous) at T
C
= 25 °C
Drain current (continuous) at T
C
= 100 °C
Drain current (pulsed)
Total dissipation at T
C
= 25 °C
Peak diode recovery voltage slope
MOSFET dv/dt ruggedness
Operating junction temperature range
Storage temperature range
Value
± 30
3
1.9
12
60
4.5
50
- 55 to 150
Unit
V
A
A
A
W
V/ns
°C
Notes:
(1)
Pulse width limited by safe operating area
(2)
I
SD
≤ 3 A, di/dt ≤ 100 A/μs; V
DS
peak < V
(BR)DSS
, V
DD
= 450 V.
(3)
V
DS
≤ 720 V
Symbol
Table 3: Thermal data
Parameter
R thj-case
R thj-amb
Thermal resistance junction-case
Thermal resistance junction-ambient
Symbol
I
AR
E
AS
Value
2.08
62.5
Table 4: Avalanche characteristics
Parameter
Avalanche current, repetitive or not repetitive (pulse width limited by T jmax
)
Single pulse avalanche energy (starting T j
= 25 °C, I
D
= I
AR
, V
DD
= 50 V)
Unit
°C/W
°C/W
Value Unit
1 A
160 mJ
DocID029953 Rev 1 3/13
Electrical characteristics
2 Electrical characteristics
T
C
= 25 °C unless otherwise specified
Symbol Parameter
Table 5: On/off-state
Test conditions
V
(BR)DSS
Drain-source breakdown voltage V
GS
= 0 V, I
D
= 1 mA
V
GS
= 0 V, V
DS
= 900 V
I
DSS
Zero gate voltage drain current V
GS
= 0 V, V
DS
T
C
= 900 V
I
GSS
Gate body leakage current
V
GS(th)
Gate threshold voltage
V
V
DS
DD
= 0 V, V
= V
GS
, I
GS
D
= ±20 V
= 100 µA
R
DS(on)
Static drain-source on-resistance V
GS
= 10 V, I
D
= 1.5 A
Notes:
(1)
Defined by design, not subject to production test.
Symbol Parameter
Table 6: Dynamic
Test conditions
C iss
C oss
C rss
C
C
R g
Q g
Q gs
Q gd
Input capacitance
Output capacitance
Reverse transfer capacitance
Equivalent capacitance time related
Equivalent capacitance energy related
Intrinsic gate resistance
Total gate charge
Gate-source charge
Gate-drain charge
V
DS
= 100 V, f = 1 MHz,
V
GS
= 0 V
V
DS
= 0 to 720 V,
V
GS
= 0 V f = 1 MHz, I
D
= 0 A
V
DD
= 720 V, I
D
= 3 A
V
GS
= 10 V
(see Figure 15: "Test circuit for gate charge behavior" )
STP4N90K5
Min. Typ. Max. Unit
900 V
1 µA
50 µA
±10 µA
4 5 V
1.90 2.10
Ω
3
Min. Typ. Max. Unit
-
-
-
173
17.9
1
-
-
- pF pF pF
-
-
-
-
-
-
29
11
15.5
5.3
1.45
2.8
-
-
-
-
-
- pF pF
Notes:
(1)
Time related is defined as a constant equivalent capacitance giving the same charging time as C oss
when V
DS increases from 0 to 80% V
DSS
.
(2)
Energy related is defined as a constant equivalent capacitance giving the same stored energy as C oss
when
V
DS
increases from 0 to 80% V
DSS
.
Ω nC nC nC
4/13 DocID029953 Rev 1
STP4N90K5
Symbol Parameter t d(on)
Turn-on delay time t r
Rise time t d(off)
Turn-off delay time t f
Fall time
Table 7: Switching times
Test conditions
V
DD
= 450 V, I
D
= 1.50 A,
R
G
= 4.7 Ω, V
GS
= 10 V
Symbol Parameter
I
SD t rr
Source-drain current
I
Source-drain current
(pulsed)
V
Forward on voltage
Reverse recovery time
I
Q
RRM t rr rr
Reverrse recovery charge
Reverse recovery current
Reverse recovery time
I
Q rr
RRM
Reverse recovery charge
Reverse recovery current
Table 8: Source-drain diode
Test conditions
I
I
I
SD
= 3 A, V
GS
= 0 V
SD
60 V
SD
= 3 A, di/dt = 100 A/µs,V
= 3 A, di/dt = 100 A/µs V
60 V, T
j
= 150 °C
DD
=
Figure 16: "Test circuit for inductive load switching and diode recovery times" )
DD
=
Figure 16: "Test circuit for inductive load switching and diode recovery times" )
Electrical characteristics
Min. Typ. Max. Unit
-
-
-
10.5
11.8
26.4
-
-
- ns ns ns
- 25.5 - ns
Min. Typ. Max. Unit
-
-
-
-
-
-
-
-
-
10.8
494
2.45
9.9
3
12
289
1.56
1.5
A
A
V ns
µC
A ns
µC
A
Notes:
(1)
Pulse width limited by safe operating area
(2)
Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Symbol
Table 9: Gate-source Zener diode
Parameter Test conditions
V
(BR)GSO
Gate-source breakdown voltage I
GS
= ± 1 mA,I
D
= 0 A
Min. Typ. Max. Unit
30 - - V
The built-in back-to-back Zener diodes are specifically designed to enhance the ESD performance of the device. The Zener voltage facilitates efficient and cost-effective device integrity protection, thus eliminating the need for additional external componentry.
DocID029953 Rev 1 5/13
Electrical characteristics
2.1 Electrical characteristics (curves)
Figure 2: Safe operating area
STP4N90K5
Figure 3: Thermal impedance
CG20930
K
δ = 0.5
10 -1
δ = 0.2
δ = 0.1
10 -2
10 -5
/
/
Ƭ
δ = 0.05
δ = 0.02
δ = 0.01
SINGLE PULSE
10 -4 10 -3 10 -2 t t
10 -1 t p
(s)
Figure 4: Output characteristics Figure 5: Transfer characteristics
Figure 6: Gate charge vs gate-source voltage Figure 7: Static drain-source on-resistance
6/13 DocID029953 Rev 1
STP4N90K5
Figure 8: Capacitance variations
Electrical characteristics
Figure 9: Normalized gate threshold voltage vs temperature
Figure 10: Normalized on-resistance vs temperature
Figure 11: Normalized V(BR)DSS vs temperature
Figure 12: Maximum avalanche energy vs starting TJ
Figure 13: Source-drain diode forward characteristics
7/13 DocID029953 Rev 1
Test circuits
3 Test circuits
Figure 14: Test circuit for resistive load switching times
STP4N90K5
Figure 15: Test circuit for gate charge behavior
V
DD
RL
V
GS pulse width
2200
μF
+
1 kΩ
I
G
= CONST
2.7 kΩ
47 kΩ
100 Ω D.U.T.
V
G
AM01469v10
Figure 16: Test circuit for inductive load switching and diode recovery times
Figure 17: Unclamped inductive load test circuit
Figure 18: Unclamped inductive waveform
Figure 19: Switching time waveform
8/13 DocID029953 Rev 1
STP4N90K5
4
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK ® is an ST trademark.
DocID029953 Rev 1 9/13
Package information
4.1 TO-220 package information
Figure 20: TO-220 type A package outline
STP4N90K5
10/13 DocID029953 Rev 1
STP4N90K5
Dim. e1
F
H1
J1
L
L1
L20
D
D1
E e
A b b1 c
L30
øP
Q
Table 10: TO-220 type A mechanical data mm
Min. Typ.
4.40
0.61
1.14
0.48
15.25
1.27
10.00
2.40
4.95
1.23
6.20
2.40
13.00
3.50
16.40
28.90
3.75
2.65
Package information
10.40
2.70
5.15
1.32
6.60
2.72
14.00
3.93
3.85
2.95
Max.
4.60
0.88
1.55
0.70
15.75
DocID029953 Rev 1 11/13
Revision history
5
STP4N90K5
Revision history
Date
02-Nov-2016
Table 11: Document revision history
Revision
1
Changes
First release.
12/13 DocID029953 Rev 1
STP4N90K5
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