STMicroelectronics STPSC10H12 Datasheet
जाहिरात
जाहिरात
STPSC10H12
Datasheet
1200 V power Schottky silicon carbide diode
K
K
A
K
TO-220AC
A
DO-247 LL
K
A
K
K
K
A
DPAK HV 2L
K
NC
A
D²PAK
Features
• No or negligible reverse recovery
• Switching behavior independent of temperature
• Robust high voltage periphery
• Operating from -40 °C to 175 °C
• Low V
F
• ECOPACK ® 2 compliant
Description
The SiC diode, available in TO-220AC, DPAK HV, D²PAK and DO-247 LL, is an ultrahigh performance power Schottky rectifier. It is manufactured using a silicon carbide substrate. The wide band-gap material allows the design of a low V
F
Schottky diode structure with a 1200 V rating. Due to the Schottky construction, no recovery is shown at turn-off and ringing patterns are negligible. The minimal capacitive turn-off behavior is independent of temperature. Especially suited for use in PFC and secondary side applications, this ST SiC diode will boost the performance in hard switching conditions. This rectifier will enhance the performance of the targeted application. Its high forward surge capability ensures a good robustness during transient phases.
Product status
STPSC10H12
Table 1. Device summary
Symbol
I
F(AV)
V
RRM
T j
(max)
V
F
(typ)
Value
10 A
1200 V
175 °C
1.35 V
DS11566 - Rev 5 - April 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
1
STPSC10H12
Characteristics
Characteristics
Table 2. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol
V
RRM
I
F(RMS)
Parameter
Repetitive peak reverse voltage (T j
= -40 °C to +175 °C)
Forward rms current
I
I
I
F(AV)
FRM
FSM
Average forward current
Repetitive peak forward current
Surge non repetitive forward current
TO-220AC, DPAK HV 2L, D²PAK, T
C
DO-247 LL, T
C
t
TO-220AC, DPAK HV 2L, D²PAK, T
C
= 155 °C, T j
= 175 °C, δ = 0.1
DO-247 LL, T
C
= 150 °C, T j
= 175 °C, δ = 0.1
T
C
= 25 °C t p
= 10 ms sinusoidal p
= 10 µs square
T
C
= 150 °C
T
C
= 25 °C
T stg
Storage temperature range
T j
Operating junction temperature range
Value
1200
25
10
38
42
71
60
420
-65 to +
175
-40 to +
175
1. Value based on Rth(j-c) max.
Unit
V
A
A
A
A
°C
°C
Symbol
R th(j-c)
Junction to case
Table 3. Thermal parameters
Parameter
TO-220AC, DPAK HV 2L, D²PAK
DO-247 LL
Typ.
0.65
0.70
Max.
0.9
0.95
Unit
°C/W
Symbol
I
R
V
F
Parameter
Reverse leakage current
Forward voltage drop
Table 4. Static electrical characteristics
Test conditions
T j
= 25 °C
T j
= 150 °C
T j
= 25 °C
T j
= 150 °C
I
V
F
R
= V
RRM
= 10 A
1. Pulse test: t p
= 10 ms, δ < 2%
2. Pulse test: t p
= 500 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 1.03 x I
F(AV)
+ 0.122 I
F
2
(RMS)
Min.
-
-
-
-
Typ.
5
30
1.35
1.75
Max.
60
400
1.50
2.25
Unit
µA
V
DS11566 - Rev 5 page 2/18
STPSC10H12
Characteristics
Table 5. Dynamic electrical characteristics
Symbol
Q
Cj
C j
Parameter
Total capacitive charge
Total capacitance
Test conditions
V
R
= 800 V
V
R
= 0 V, T c
= 25 °C, F = 1 MHz
V
R
= 800 V, T c
= 25 °C, F = 1 MHz
1. Most accurate value for the capacitive charge:
VR
Qcj VR = ∫ Cj V dV
Min.
Typ.
Max.
Unit
57 nC
-
725
47
-
pF
DS11566 - Rev 5 page 3/18
STPSC10H12
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Forward voltage drop versus forward current
(typical values)
20
I
F
(A)
Pulse test : t p
= 500 µs
15
T a
= 25 °C
10
5
0
0.0
0.5
1.0
1.5
2.0
T a
= 150 °C
V
F
(V)
2.5
3.0
Figure 2. Reverse leakage current versus reverse voltage applied (typical values)
1.E+02
I
R
(µA)
1.E+01
1.E+00
T j = 150 °C
T j = 25 °C
1.E-01
1.E-02
V
R
(V)
1.E-03
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
Figure 3. Peak forward current versus case temperature
(TO-220AC, DPAK HV 2L, D²PAK)
Figure 4. Peak forward current versus case temperature
(DO-247 LL)
100
I
M
(A)
δ = 0.1
80
60
40
δ = 0.3
δ = 0.5
20
0
0
δ = 1
25
δ = 0.7
50
T
δ = tp/T tp
75
T
C
(°C)
100 125 150 175
100
I
M
(A)
80
δ = 0.1
60
40
δ = 0.3
δ = 0.5
20
δ = 1
0
0 25
δ = 0.7
50 75
T
C
(°C)
100 125
T
δ =tp/T tp
150 175
DS11566 - Rev 5 page 4/18
STPSC10H12
Characteristics (curves)
Figure 5. Junction capacitance versus reverse voltage applied (typical values)
700
C j
(pF)
600
500
400
300
200
100
0
0.1
1.0
10.0
100.0
F = 1 MHz
V osc
= 30 mV
Tj = 25 °C
RMS
V
R
(V)
1000.0
10000.0
Figure 6. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, DPAK HV 2L,
D²PAK)
Zth(j-c) / Rth(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 tp(s)
1.E+00
Figure 7. Relative variation of thermal impedance junction to case versus pulse duration (DO-247LL)
1.0
Z th(j-c)
/R th(j-c)
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 t p
(s)
1.E+00
Figure 8. Non- repetitive peak surge forward current versus pulse duration (sinusoidal waveform)
1.E+03
I
FSM(A)
Ta = 25 °C
Ta = 150 °C
1.E+02
1.E+01
1.E-05 1.E-04 1.E-03 tp(s)
1.E-02
DS11566 - Rev 5 page 5/18
STPSC10H12
Characteristics (curves)
Figure 9. Total capacitive charges versus reverse voltage applied (typical values)
60
Q
Cj(nC)
Figure 10. Thermal resistance junction to ambient versus copper surface under tab on epoxy printed board FR4, e
Cu
= 35 μm (typical values)
50
40
30
20
10
0
0 100 200 300 400 500 600
VR(V)
700 800
100
Rth(j-a)(°C/W)
90
80
70
60
50
40
30
20
10
0
0 5 10 15 20 25 30
DPAK HV 2L
S
Cu
(cm²)
35 40
Figure 11. Thermal resistance junction to ambient versus copper surface under tab for D²PAK package (typical values)
40
30
20
10
0
0
60
50
80
R th(j-a)
(°C/W)
70
5
D²PAK
Epoxy printed board FR4, copper thickness = 35 µm
10 15 20 25 30
S
Cu
35
(cm²)
40
DS11566 - Rev 5 page 6/18
2
STPSC10H12
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com
. ECOPACK ® is an ST trademark.
DS11566 - Rev 5 page 7/18
STPSC10H12
TO-220AC package information
2.1
•
•
•
•
TO-220AC package information
Cooling method: by conduction (C)
Epoxy meets UL94,V0
Recommended torque value: 0.55 N·m
Maximum torque value: 0.7 N·m
Figure 12. TO-220AC package outline
H2
Ø I
L5
L6
L2
F1 L9
L4
F
C
A
D
M
E
L7
G
DS11566 - Rev 5 page 8/18
DS11566 - Rev 5
Ref.
F1
G
H2
L2
L4
A
C
D
E
F
L5
L6
L7
L9
M
Diam
STPSC10H12
TO-220AC package information
13.00
2.65
15.25
6.20
3.50
Min.
4.40
1.23
2.40
0.49
0.61
1.14
4.95
10.00
Table 6. TO-220AC package mechanical data
Dimensions
Millimeters
Max.
4.60
1.32
2.72
0.70
0.88
1.70
5.15
10.40
Min.
0.173
0.048
0.094
0.019
0.024
0.044
0.194
0.393
16.40 typ.
14.00
2.95
15.75
6.60
3.93
0.511
0.104
0.600
0.244
0.137
2.6 typ.
3.75
3.85
0.147
Inches
0.645 typ.
0.102 typ.
0.551
0.116
0.620
0.259
0.154
Max.
0.181
0.051
0.107
0.027
0.034
0.066
0.202
0.409
0.151
page 9/18
2.2
•
•
•
•
DO-247 LL package information
Cooling method: by conduction (C)
Epoxy meets UL94,V0
Recommended torque value: 0.8 N·m
Maximum torque value: 1.0 N·m
Figure 13. DO-247 LL package outline
STPSC10H12
DO-247 LL package information
DS11566 - Rev 5 page 10/18
DS11566 - Rev 5
STPSC10H12
DO-247 LL package information
Table 7. DO-247 LL package mechanical data
Dimensions
Ref.
Millimeters
P
P1
Q
S
W e
E1
E2
L
L1 b2 c
D
D1
E
A
A1
A2 b
Min.
4.70
2.21
1.50
0.99
1.65
0.38
20.80
13.08
15.49
13.46
3.43
19.81
3.56
7.06
5.38
5.44 typ.
6.17 typ.
1. Inches dimensions given for reference only
Max.
5.31
2.59
2.49
1.40
2.39
0.89
21.46
16.26
3.99
20.32
4.50
3.66
7.39
6.20
0.15
0.530
0.135
0.780
0.140
0.278
0.219
Min.
0.185
0.087
0.059
0.039
0.065
0.015
0.819
0.515
0.610
Inches
0.214
0.243
Max.
0.209
0.102
0.098
0.055
0.094
0.035
0.845
0.640
0.157
0.800
0.177
0.144
0.291
0.244
0.006
page 11/18
2.3
•
•
D²PAK package information
Cooling method: by conduction (C)
Epoxy meets UL 94,V0
Figure 14. D²PAK package outline
STPSC10H12
D²PAK package information
DS11566 - Rev 5 page 12/18
DS11566 - Rev 5
Ref.
L2
R
V2
J1
L
L1
E1
E2 e e1
H c2
D
D1
D2
E
A
A1 b b2 c
STPSC10H12
D²PAK package information
4.88
15.00
2.49
1.90
1.27
1.30
Min.
1.19
8.60
6.90
1.10
10.00
8.10
6.85
4.36
0.00
0.70
1.14
0.38
Table 8. D²PAK package mechanical data
Dimensions
Millimeters
Max.
1.36
9.35
8.00
1.50
10.55
8.90
7.25
4.60
0.25
0.93
1.70
0.69
Min.
0.047
0.339
0.272
0.043
0.394
0.319
0.266
0.172
0.000
0.028
0.045
0.015
2.54 typ.
5.28
15.85
2.90
2.79
1.65
1.78
0.190
0.591
0.097
0.075
0.049
0.050
0.4 typ.
0° 8° 0°
Inches
0.100
0.015
Max.
0.053
0.368
0.311
0.060
0.415
0.346
0.282
0.181
0.010
0.037
0.067
0.027
0.205
0.624
0.112
0.110
0.065
0.070
8°
Figure 15. D²PAK Recommended footprint
16.90
12.20
3.50
2.54
1.60
5.08
9.75
page 13/18
2.4
•
•
DPAK HV 2L package information
Cooling method: by conduction (C)
Epoxy meets UL 94,V0
Figure 16. DPAK HV 2L package outline
STPSC10H12
DPAK HV 2L package information
DS11566 - Rev 5 page 14/18
DS11566 - Rev 5
STPSC10H12
DPAK HV 2L package information
Ref.
c2
D
D1
E
E1
A
A1 b b3 c
L3
L4
M
P e
H
L
6.48
4.95
9.70
1.02
0.000
1. Maximum plastic protrusion
Min.
2.16
0.06
0.71
5.004
0.46
0.76
5.97
Table 9. DPAK HV 2L package mechanical data
Dimensions
Millimeters
Typ.
2.29
0.08
0.76
5.10
0.51
0.81
6.10
5.84 REF
6.60
5.08
2.29 REF
9.83
1.14
6.73
Max.
2.40
0.13
1.07
5.21
0.56
0.86
6.22
5.21
10.08
1.40
1.14
0.15
Min.
0.085
0.002
0.028
0.197
0.018
0.029
0.235
0.255
0.195
0.382
0.040
0.000
Inches
Typ.
0.090
0.003
0.029
0.201
0.020
0.032
0.240
0.230 REF
0.260
0.200
0.90 REF
0.387
0.045
7° 7°
5°
Figure 17. Footprint (dimensions in mm)
6.10
1.80
2.80
1.50
0.397
0.055
0.045
0.006
5°
Max.
0.094
0.005
0.030
0.205
0.025
0.034
0.245
0.265
0.205
6.30
4.572
10.70
page 15/18
3
STPSC10H12
Ordering information
Ordering information
Order code
STPSC10H12D
STPSC10H12WL
STPSC10H12B-TR1
STPSC10H12G-TR
Table 10. Ordering information
Marking
STPSC10H12D
STPSC10H12WL
STPSC 10H12
STPSC10H12G
Package
TO-220AC
DO-247 LL
DPAK HV 2L
D²PAK
Weight
1.86 g
5.9 g
0.368 g
1.48 g
Base qty.
50
30
2500
1000
Delivery mode
Tube
Tube
Tape and reel
Tape and reel
DS11566 - Rev 5 page 16/18
Revision history
Date
03-May-2016
06-Feb-2016
10-Apr-2017
10-Sep-2017
23-Apr-2018
Revision
1
2
3
4
5
Table 11. Document revision history
Changes
First issue
Added DPAK HV 2L package.
Updated Table 5: "Dynamic electrical characteristics".
Added D²PAK package.
Added DO-247 LL package.
Updated Section 1: "Characteristics" and Table 10:
"Ordering information".
Updated
Figure 13. DO-247 LL package outline
.
STPSC10H12
DS11566 - Rev 5 page 17/18
STPSC10H12
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2018 STMicroelectronics – All rights reserved
DS11566 - Rev 5 page 18/18
डाउनलोड
जाहिरात