STPS8L30
Low drop power Schottky rectifier
Datasheet - production data
K
A
NC
A
K
DPAK
K
NC
A
Features
Low cost device with low drop forward voltage for less power dissipation and reduced heatsink
Optimized conduction/reverse losses trade-off which leads to the highest yield in the application
High power surface mount miniature package
Avalanche capability specified
ECOPACK ® 2 compliant component for
DPAK on demand
Description
Single Schottky rectifier suited to switched mode power supplies and high frequency DC to DC converters.
Packaged in DPAK, this device is especially intended for use as a rectifier at the secondary of
3.3 V SMPS or DC/DC units, freewheeling and polarity protection applications.
Table 1: Device summary
Symbol Value
I
F(AV)
8 A
V
RRM
T j
(max.)
V
F
(typ.)
30 V
150 °C
0.35 V
October 2016 DocID5515 Rev 5
This is information on a product in full production.
1/9 www.st.com
Characteristics
1 Characteristics
STPS8L30
Symbol
Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Parameter Value
V
RRM
Repetitive peak reverse voltage 30
7 I
F(RMS)
Forward rms current
I
F(AV)
Average forward current
δ = 0.5, square wave
T
C
= 135 °C
I
FSM
Surge non repetitive forward current
P
ARM
Repetitive peak avalanche power
T
T stg j
Storage temperature range
Maximum operating junction temperature (1)
t p
= 10 ms sinusoidal t p
= 10 µs, T j
= 125 °C
8
75
215
Unit
V
A
A
A
W
-65 to +150 °C
150 °C
Notes:
(1)
(dP tot
/dT j
) < (1/R th(j-a)
) condition to avoid thermal runaway for a diode on its own heatsink.
Symbol
Table 3: Thermal parameters
Parameter Max. value Unit
R th(j-c)
Junction to case
Symbol
2.5 °C/W
Table 4: Static electrical characteristics
Parameter Test conditions Min. Typ. Max. Unit
I
R
(1)
Reverse leakage current
V
F
(1)
Forward voltage drop
T j
= 25 °C
T j
= 100 °C
T j
= 25 °C
T j
= 125 °C
T j
= 25 °C
T j
= 125 °C
V
R
= V
RRM
I
F
= 8 A
I
F
= 16 A
-
-
-
-
-
- 15
1
40
0.49
0.35 0.40
0.63
0.448 0.57 mA
V
Notes:
(1)
Pulse test: t p
= 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.23 x I
F(AV)
+ 0.021 x I
F
2
(RMS)
2/9 DocID5515 Rev 5
STPS8L30
1.1 Characteristics (curves)
Characteristics
Figure 1: Average forward power dissipation versus average forward current
5.0
P
F (AV)
(W )
δ = 0.1
δ = 0.2
δ = 0.5
4.0
δ = 0.05
3.0
2.0
1.0
0.0
0 2 4
I
F ( AV )
( A )
6
δ=tp/T
8
δ = 1
T tp
10
6
5
4
3
2
1
0
0
9
8
7
Figure 2: Average forward current versus ambient temperature (δ = 0.5)
25 50
Rth(j-a) = Rth(j-c)
Rth(j-a) = 70 °C/W
75 100 125 150
Figure 3: Normalized avalanche power derating versus pulse duration (T j
= 125 °C)
1
P
ARM
(t
P
) /
P
ARM
(10 µs )
Figure 4: Relative variation of thermal impedance junction to case versus pulse duration
1.0
Z th (j-c) /R th(j-c )
0.1
0.8
0.6
δ = 0.5
0.01
0.4
0.2
δ = 0.2
δ = 0.1
T
0.001
1 10 100 t
P
(µs)
1000
Figure 5: Reverse leakage current versus reverse voltage applied (typical values)
3E+2
1E+2
1E+1
Tj = 150 °C
Tj = 125 °C
0.0
1E-4
Single pulse
1E-3 1E-2
δ =tp/T
1E-1 tp
1E+0
2000
Figure 6: Junction capacitance versus reverse voltage applied (typical values)
C (pF)
F= 1 MHz
V
OSC
= 30 mV
Tj = 25 °C
RMS
1000
1E+0
500
Tj = 25 °C
1E-1
1E-2
200
1E-3
0 5 10 15 20 25 30
100
1
V
R
( V )
10 40
DocID5515 Rev 5 3/9
Characteristics
Figure 7: Forward voltage drop versus forward current
80
70
60
50
40
30
20
10
0
0
STPS8L30
Figure 8: Thermal resistance junction to ambient versus copper surface under tab
R th(j-a)
(°C/W)
100
90
Epoxy printed board FR4, copper thickness = 35 µm
5 10 15
Scu (cm²)
20 25 30 35 40
4/9 DocID5515 Rev 5
STPS8L30
2
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK ® is an ST trademark.
Cooling method: by conduction (C)
Epoxy meets UL 94,V0
DocID5515 Rev 5 5/9
Package information
2.1 DPAK package information
Figure 9: DPAK package outline
STPS8L30
6/9
This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed.
DocID5515 Rev 5
STPS8L30
Ref. e1
H
L
L2
D1
E
E1 e
L4
V2 b4 c c2
D
A
A1
A2 b
Package information
Min.
2.18
0.90
0.03
0.64
4.95
0.46
0.46
5.97
4.95
6.35
4.32
Table 5: DPAK package mechanical data
Dimensions
Millimeters
Max.
2.40
1.10
0.23
0.90
5.46
0.61
0.60
6.22
5.60
6.73
5.50
Min.
0.085
0.035
0.001
0.025
0.194
0.018
0.018
0.235
0.194
0.250
0.170
2.286 typ.
4.40
9.35
1.0
0.60
-8°
4.70
10.40
1.78
1.27
1.02
+8°
0.173
0.368
0.039
0.023
-8°
Inches
0.090 typ.
0.185
0.409
0.070
0.050
0.040
+8°
Max.
0.094
0.043
0.009
0.035
0.215
0.024
0.023
0.244
0.220
0.265
0.216
Figure 10: DPAK recommended footprint (dimensions in mm)
DocID5515 Rev 5 7/9
Ordering information
3 Ordering information
Order code
STPS8L30B-TR
Marking
Table 6: Ordering information
Package Weight Base qty.
LS 30 DPAK 0.32 g 2500
STPS8L30
Delivery mode
Tape and reel
4 Revision history
Date Revision
Table 7: Document revision history
Changes
Jul-2002
16-Apr-2005
01-Mar-2006
18-Oct-2016
2A
3
4
5
First issue
IPAK package Added.
IPAK connector identifiers corrected on page 1. ECOPACK statement added. Document reformatted to current standard.
Updated DPAK package information and reformatted to current standard. Removed IPAK package.
8/9 DocID5515 Rev 5
STPS8L30
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– All rights reserved
DocID5515 Rev 5 9/9
