ECMF04-4HSWM10Y
Datasheet
Automotive common mode filter with ESD protection
D1+ Con 1
D1- Con 2
GND 3
D2+ Con 4
D2- Con 5
10 D1+ IC
9 D1- IC
8 GND
7 D2+ IC
6 D2- IC
Product status link
ECMF04-4HSWM10Y
Product summary
Order code ECMF04-4HSWM10Y
Features
• AEC-Q101 qualified
• 3.5 GHz differential bandwidth to comply with HDMI 2.0, HDMI 1.4, USB 3.1,
MIPI and LVDS
• Common mode attenuation on LTE, GSM, and GPS frequencies:
– -13 dB at 0.7 GHz
– -24 dB at 1.5 GHz
– -30 dB at 2.4 GHZ
– -26 dB at 2.7 GHZ
– -16 dB at 5.0 GHZ
• Wettable flank for automatic optical inspection
• Low PCB space consumption: 3.5 mm²
• Thin package for compact applications: 0.75 mm
• RoHS package
Complies with the following standards
• UL94, V0
• J-STD-020 MSL level 1
• J-STD-002
• IPC7531 footprint and JEDEC registered package
• ISO 10605, IEC 61000-4-2, C = 150 pF – R = 330 Ω level 4:
– 8 kV (contact discharge)
– 15 kV (air discharge)
• ISO 10605, C = 330 pF – R = 330 Ω level 4:
– 8 kV (contact discharge)
– 15 kV (air discharge)
Description
The ECMF04-4HSWM10Y is an integrated common mode filter designed to suppress
EMI/RFI common mode noise on high speed buses HDMI 1.4, USB 3.1 and MIPI. It is designed to replace discrete common mode chokes or LTCC.
The device embeds ESD protections on connector side to meets ISO 10605 requirements.
Packaged in QFN-10L with wettable flank, it is compatible with automatic visual inspection.
DS12859 - Rev 1 - December 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
1
ECMF04-4HSWM10Y
Characteristics
Characteristics
Symbol
V
PP
I
RMS
T op
T stg
Table 1. Absolute maximum ratings (T amb
= 25 °C)
Peak pulse voltage
Parameter
ISO 10605 (C = 330 pF, R = 330 Ω):
Contact discharge
Air discharge
ISO10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω):
Contact discharge
Air discharge
RMS current
Operating ambient temperature range
Storage temperature range
Figure 1. Electrical characteristics (definitions)
I
I
PP
VRM
VCL
IRM
IPP
VBR
RDC fC
Maximum stand-off voltage
Clamping voltage at peak pulse current IPP
Leakage current at VRM
Peak pulse current
Breakdown voltage
DC serial resistance
Differential cut off frequency
I
R
I
RM
V
RM
V
BR
V
CL
V
Value
8
15
Unit kV
8
15
100
-55 to +125
-55 to +150 kV mA
°C
Symbol
V
BR
I
RM
R
DC f c
V
CL
Table 2. Electrical characteristics (T amb
= 25 °C)
Test conditions
I
R
= 1 mA
V
RM
= 3 V
I
DC
= 20 mA
S
DD21
= -3 dB
8 kV contact discharge after 30 ns, ISO 10605 (150 pF – 330 Ω)
Min.
Typ.
Max.
Unit
6 7 V
100 nA
5.5
3.5
27
Ω
GHz
V
DS12859 - Rev 1 page 2/12
ECMF04-4HSWM10Y
Characteristics (curves)
1.1
Characteristics (curves)
Figure 2. Differential attenuation versus frequency
(Z
0_diff
= 100 Ω)
Figure 3. Common mode attenuation versus frequency
(Z
0_com
= 50 Ω)
Figure 4. ISO 10605 - C = 150 pF, R = 330 Ω (+8 kV contact) Figure 5. ISO 10605 - C = 150 pF, R = 330 Ω (-8 kV contact)
Figure 6. TLP characteristic
20
I(A)
15
10
5
0
-5
-10
-15
-20
-40 -30 -20 -10 0 10 20 30
V(V)
40
DS12859 - Rev 1 page 3/12
ECMF04-4HSWM10Y
Characteristics (curves)
Figure 7. HDMI1.4 – 1.485 Gbps eye diagram without device
Figure 8. HDMI1.4 – 1.485 Gbps eye diagram with device
Figure 9. HDMI2.0 – 5.94 Gbps eye diagram without device
(with worst cable and equalizer)
Figure 10. HDMI2.0 – 5.94 Gbps eye diagram with device
(with worst cable and equalizer)
Figure 11. MIPI - 5.83 Gbps eye diagram without device Figure 12. MIPI - 5.83 Gbps eye diagram with device
DS12859 - Rev 1 page 4/12
ECMF04-4HSWM10Y
Characteristics (curves)
Figure 13. USB3.1 – 5 Gbps eye diagram without device
(with worst cable and equalizer)
Figure 14. USB3.1 – 5 Gbps eye diagram with device (with worst cable and equalizer)
DS12859 - Rev 1 page 5/12
2
2.1
ECMF04-4HSWM10Y
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com
. ECOPACK is an ST trademark.
QFN-10L package information
Figure 15. QFN-10L package outline
L
A
D e b A1
A3
E
CD
CW
Table 3. QFN-10L mechanical data
Dimensions
Ref.
A
A1
A3 b
D
E e
L
CW
CD
Min.
0.70
0.00
0.15
2.55
1.30
0.45
0.01
0.10
Millimeters
Typ.
0.75
0.02
0.20
0.20
2.60
1.35
0.50
0.50
0.05
Max.
0.80
0.05
0.25
2.65
1.40
0.55
0.09
Min.
0.0275
0.0000
0.0059
0.1003
0.0511
0.0177
0.0003
0.0039
1. Value in inches are converted from mm and rounded to 4 decimal digits
Inches
(1)
Typ.
0.0295
0.0008
0.0079
0.0079
0.1024
0.0531
0.0197
0.0197
0.0020
Max.
0.0315
0.0020
0.0099
0.1044
0.0552
0.0217
0.0032
DS12859 - Rev 1 page 6/12
3
ECMF04-4HSWM10Y
PCB assembly recommendations
PCB assembly recommendations
Figure 16. Recommended PCB layout
Connector
Differential lanes
(Z0 = 100 )
330 µm
Pad layout
Host
150 µm
5000 µm
350 µm
350 µm
Differential lanes
(Z0 = 100 )
Figure 17. Recommended PCB stack-up Figure 18. Recommended stencil opening (mm)
0.190
0.500
2.190
Stencil opening thickness: 100 µm
Figure 19. Wettable flank profile
3.1
Solder paste
1.
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2.
“No clean” solder paste is recommended.
3.
Offers a high tack force to resist component movement during high speed.
4.
Use solder paste with fine particles: powder particle size is 20-38 μm.
DS12859 - Rev 1 page 7/12
3.2
QFN-10L packing information
Figure 20. Footprint recommendations (mm)
0.200
0.500
2.200
Figure 22. Package orientation in reel
ECMF04-4HSWM10Y
QFN-10L packing information
Figure 21. Marking
XXYM
Dot indicates pin 1
XX: Marking
Y: Year
M: Month
Figure 23. Tape and reel orientation
Pin 1 located according to EIA-481
Note: Pocket dimensions are not on scale
Pocket shape may vary depending on package
Figure 24. Reel dimensions (mm)
Ø 180 max
14.4
2 ± 0.5
Ø 13
Ø 60 Ø 20.2 min
Figure 25. Inner box dimensions (mm)
30
205
205
DS12859 - Rev 1 page 8/12
Figure 26. Tape and reel outline
ECMF04-4HSWM10Y
Solder reflow
3.3
Note:
Ref.
ØD0
ØD1
F
K0
P0
P1
P2
W
Solder reflow
Table 4. Tape and reel mechanical data
Min.
1.40
0.80
1.65
0.85
3.9
3.9
1.95
7.9
Dimensions
Millimeters
Typ.
1.50
1.75
0.95
4.0
4.0
2.00
8.0
Max.
1.50
1.85
1.05
4.1
4.1
2.05
8.3
Figure 27. ST ECOPACK ® recommended soldering reflow profile for PCB mounting
150
100
50
250
Temperature (°C)
200
0 30
2 - 3 °C/s
240-245 °C
60 sec
(90m ax)
-2 °C/s
-3 °C/s
-6° C/s
0.9 °C/s
60 90 120 150 180 210
Time (s)
240 270 300
Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020.
DS12859 - Rev 1 page 9/12
4
ECMF04-4HSWM10Y
Ordering information
Ordering information
Order code
ECMF04-4HSWM10Y
Marking
BY
(1)
Package
QFN-10L
1. The marking can be rotated by 90° to differentiate assembly location
Weight
7 mg
Base qty.
3000
Delivery mode
Tape and reel
DS12859 - Rev 1 page 10/12
Revision history
Date
17-Dec-2019
Version
1
Table 5. Document revision history
Changes
Initial release.
ECMF04-4HSWM10Y
DS12859 - Rev 1 page 11/12
ECMF04-4HSWM10Y
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DS12859 - Rev 1 page 12/12
