STPS4S200
Datasheet
4 A - 200 V power Schottky rectifier
Product status
STPS4S200
Product summary
Symbol
I
F(AV)
V
RRM
T
j(max.)
V
F(typ.)
Value
4 A
200 V
175 °C
0.64 V
Features
• Negligible switching losses
• High junction temperature capability
• Very small conduction losses
• Low leakage current
• T j
= -40 °C minimum operating
• ECOPACK2 component
Applications
• Inverter
• Lighting
• Battery charger
• Telecom power
• Home appliance
Description
Single chip Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters.
Packaged in SMB Flat Notch, SMB Flat, SMC and DPAK, the STPS4S200 is ideal for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications.
DS10646 - Rev 5 - June 2021
For further information contact your local STMicroelectronics sales office.
www.st.com
1
STPS4S200
Characteristics
Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol Parameter
V
RRM
I
F(RMS)
Repetitive peak reverse voltage
Forward rms current
I
F(AV)
Average forward current, δ = 0.5, square wave
Storage temperature range
Operating junction temperature range
(1)
SMB Flat Notch, SMC, SMB
Flat
DPAK
T
L
= 125 °C
I
FSM
T stg
T j
Surge non repetitive forward current t
T c
= 160°C p
= 10 ms sinusoidal
1. (dP tot
/dT j
) < (1/R th(j-a)
) condition to avoid thermal runaway for a diode on its own heatsink.
Value
200
10
4
130
Unit
V
A
A
A
-65 to +175 °C
-40 to +175 °C
Symbol
R th(j-l)
R th(j-c)
Table 2. Thermal resistance parameter
Parameter
Junction to lead (SMB Flat Notch, SMC, SMB Flat)
Junction to case DPAK
For more information, please refer to the following application note :
• AN5088 : Rectifiers thermal management, handling and mounting recommendations
Max. value
15
3.2
Unit
°C/W
Symbol
I
R
(1)
V
F
(2)
Parameter
Reverse leakage current
Forward voltage drop
Table 3. Static electrical characteristics
Test conditions
T j
= 25 °C
T j
= 125 °C
T j
= 25 °C
T j
= 125 °C
I
V
F
R
= V
RRM
= 4 A
1. Pulse test: t p
= 5 ms, δ < 2%
2. Pulse test: t p
= 380 µs, δ < 2%
Min.
-
-
-
-
Typ.
0.70
0.64
To evaluate the conduction losses, use the following equation:
P = 0.63 x I
F(AV)
+ 0.020 x I
F
2
(RMS)
For more information, please refer to the following application notes related to the power losses :
• AN604: Calculation of conduction losses in a power rectifier
• AN4021: Calculation of reverse losses on a power diode
Max.
5
2.50
0.87
0.71
Unit
µA mA
V
DS10646 - Rev 5 page 2/16
STPS4S200
Characteristics (curves)
1.1
Characteristics (curves)
2.0
1.5
1.0
0.5
0.0
0.0
Figure 1. Average forward power dissipation versus average forward current
3.5
P
F (AV)
(W)
δ = 0.05
δ = 0.1 δ = 0.2
δ = 0.5
3.0
δ = 1
2.5
0.5
1.0
T
1.5
2.0
δ= tp/T
2.5
3.0
tp
IF
(AV)
(A)
3.5
4.0
4.5
Figure 2. Average forward current versus ambient temperature (δ = 0.5)
10
I
F(AV)
(A)
8
6
4
T
2
0
0
δ =tp/T
25 tp
50 75
DPAK
R th(j-a)
=R th(j-c)
100
SMB-Flat & SMC
R th(j-a)
=R th(j-l)
125
T amb
(°C)
150 175
Figure 3. Relative variation of thermal impedance junction to case versus pulse duration (DPAK)
1.0
Z th(j-c)
/R th(j-c)
0.9
DPAK
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-05
Single pulse
1.E-04 1.E-03 1.E-02 1.E-01 tP(s)
1.E+00
Figure 4. Relative variation of thermal impedance junction to lead versus pulse duration (SMB flat, SMB flat Notch)
1.0
Z th(j-l)
/R th(j-l)
0.9
0.8
0.7
SMB Flat
SMB Flat Notch
0.6
0.5
0.4
0.3
0.2
0.1
Single pulse
0.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 t
P
(s)
1.E+01
Figure 5. Relative variation of thermal impedance junction to lead versus pulse duration (SMC)
1.0
Z th(j-l)
/R th(j-l)
SMC
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Single pulse
0.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 t p
(s)
1.E+02
Figure 6. Reverse leakage current versus reverse voltage applied (typical values)
1.E+04
I
R(µA)
T j
= 150 °C
1.E+03
T j
= 125 °C
1.E+02
1.E+01
T j
= 100 °C
T j
= 75 °C
1.E+00
T j
= 50 °C
T j
= 25 °C
1.E-01
1.E-02
0
VR(V)
20 40 60 80 100 120 140 160 180 200
DS10646 - Rev 5 page 3/16
α α
STPS4S200
Characteristics (curves)
Figure 7. Junction capacitance versus reverse voltage applied (typical values)
1000
C(pF)
F = 1 MHz
V
OSC
= 30 mV
RMS
T j
= 25 °C
100
Figure 8. Forward voltage drop versus forward current
(typical values)
10.00
I
F(A)
T j
= 125 °C
1.00
T j
= 25 °C
0.10
10
1 10
VR(V)
100 1000
0.01
VF(V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Figure 9. Forward voltage drop versus forward current
(maximum values)
10.00
I
F(A)
T j
= 125 °C
1.00
0.10
T j
= 25 °C
0.01
VF(V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9 1.0
Figure 10. Thermal resistance junction to ambient versus copper surface under tab (DPAK)
100
R th(j-a)
(°C/W)
90 Epoxy printed circuit board, copper thickness: 35 µm
80
70
60
50
40
30
20
10
0
0 5 10 15 20 25 30
DPAK
S
Cu
(cm²)
35 40
Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SMB Flat, SMB Flat
Notch)
200
R th(j-a) (°C/W)
Epoxy printed board FR4, copper thickness: 35 μm
SMB flat
SMB flat Notch
150
100
50
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
S
Cu
(cm²)
4.5
5.0
Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (SMC)
160
140
120
100
80
60
40
20
0
0.0
R th(j-a)
(°C/W)
Epoxy p ri nted ci rcuit board FR4, coppe r t hickness: 35 µm
SMC
0.5
1.0
1.5
2.0
2.5
3.0
3.5
S
4.0
Cu
(cm²)
4.5
5.0
DS10646 - Rev 5 page 4/16
α
α
2
STPS4S200
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com
. ECOPACK is an ST trademark.
DS10646 - Rev 5 page 5/16
2.1
•
•
SMB Flat Notch package information
Epoxy meets UL94, V0
Lead-free package
Figure 13. SMB Flat Notch package outline
A
A1
STPS4S200
SMB Flat Notch package information
G1 b
D
V c
V1
DS10646 - Rev 5
Ref.
D
E
E1
G
G1 b c
A
A1
L3
V
V1
L
L1
L2
Min.
0.90
1.95
0.15
3.30
5.20
4.05
0.75
0.02
Table 4. SMB Flat Notch mechanical data
Dimensions
Millimeters
Typ.
Max.
1.10
Min.
0.035
0.05
2.20
0.40
3.95
5.60
4.60
0.077
0.006
0.130
0.205
0.159
2.00
1.20
1.20
0.030
0.30
0.60
0.001
8°
8°
Inches
Typ.
0.002
0.079
0.047
0.012
0.024
Max.
0.043
0.087
0.016
0.156
0.220
0.181
0.047
8°
8° page 6/16
STPS4S200
SMB Flat Notch package information
Figure 14. Footprint recommendations, dimensions in mm (inches)
1.20
(0.047)
3.44
(0.136)
1.20
(0.047)
2.07
(0.082)
5.84
(0.230) millimeters
(inches)
DS10646 - Rev 5 page 7/16
STPS4S200
SMB Flat package information
2.2
•
•
SMB Flat package information
Epoxy meets UL94, V0
Lead-free package
Figure 15. SMB Flat package outline
A
D
L 2x
E E1 c
L1 2 x
L2 2 x b
Ref.
E
E1
L
L1
L2 c
D
A b
Min.
0.90
1.95
0.15
3.30
5.10
4.05
0.75
Table 5. SMB Flat mechanical data
Dimensions
Millimeters
Typ.
Max.
1.10
2.20
0.40
3.95
5.60
4.60
1.50
Min.
0.035
0.076
0.005
0.129
0.200
0.159
0.029
0.40
0.60
Inches
Typ.
0.016
0.024
Max.
0.044
0.087
0.016
0.156
0.221
0.182
0.060
DS10646 - Rev 5 page 8/16
STPS4S200
SMB Flat package information
Figure 16. Footprint recommendations, dimensions in mm (inches)
1.20
(0.047)
3.44
(0.136)
1.20
(0.047)
2.07
(0.082)
5.84
(0.230) millimeters
(inches)
DS10646 - Rev 5 page 9/16
2.3
•
SMC package information
Epoxy meets UL94, V0
Figure 17. SMC package outline
E1
D
E
A1
A2
C
E2
L b
Ref.
D
E
E1
E2
L b c
A1
A2
STPS4S200
SMC package information
Table 6. SMC package mechanical data
Dimensions
Millimeters
Min.
5.55
7.75
6.60
4.40
0.75
1.90
0.05
2.90
0.15
Max.
6.25
8.15
7.15
4.70
1.50
2.45
0.20
3.20
0.40
Inches (for reference only)
Min.
Max.
0.0748
0.0020
0.1142
0.0059
0.2185
0.3051
0.2598
0.1732
0.0295
0.0965
0.0079
0.1260
0.0157
0.2461
0.3209
0.2815
0.1850
0.0591
DS10646 - Rev 5 page 10/16
3.14
(0.124)
Figure 18. SMC recommended footprint
1.54
(0.061)
5.11
(0.201)
1.54
(0.061)
STPS4S200
SMC package information
8.19
(0.323) millimeters
(inches)
DS10646 - Rev 5 page 11/16
STPS4S200
DPAK package information
2.4
•
•
DPAK package information
Epoxy meets UL 94,V0
Cooling method: by conduction (C)
Figure 19. DPAK package outline
E b4 c2
A
Thermal pad
E1
L2
D
D1
H
L4
R e e1 b
A1
A2
L1
L
0.25
V2
Gauge plane c
R
Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed.
DS10646 - Rev 5 page 12/16
DS10646 - Rev 5
Ref.
D
D1
E
E1 e
A
A1
A2 b b4 c c2
L2
L4
V2 e1
H
L
6.7
STPS4S200
DPAK package information
0.46
0.46
5.97
4.95
6.35
4.32
Min.
2.18
0.90
0.03
0.64
4.95
4.40
9.35
1.0
0.60
-8°
Table 7. DPAK package mechanical data
Dimensions
Millimeters
2.286 typ.
0.61
0.60
6.22
5.60
6.73
5.50
Max.
2.40
1.10
0.23
0.90
5.46
4.70
10.40
1.78
1.27
1.02
+8°
Inches (for reference only)
0.018
0.018
0.235
0.194
0.250
0.170
Min.
0.085
0.035
0.001
0.025
0.194
0.024
0.023
0.244
0.220
0.265
0.216
Max.
0.094
0.043
0.009
0.035
0.215
0.090 typ.
0.173
0.368
0.039
0.023
-8°
0.185
0.409
0.070
0.050
0.040
+8°
Figure 20. DPAK recommended footprint (dimensions in mm)
12.7
6.7
3.0
3.0
4.572
A
B
The device must be positioned within 0.05 AB
1.6
page 13/16
3
STPS4S200
Ordering Information
Ordering information
Order code
STPS4S200B-TR
STPS4S200S
STPS4S200UF
STPS4S200UFN
Marking
S4 200B
S42
FG42
B42
Table 8. Ordering information
Package
D²PAK
SMC
SMB Flat
SMB Flat Notch
Weight
0.032 g
0.250 g
0.050 g
0.056 g
Base qty.
10 000
2500
5000
5000
Delivery mode
Tape and reel
Tape and reel
Tape and reel
Tape and reel
DS10646 - Rev 5 page 14/16
Revision history
Date
17-Oct-2014
26-Aug-2015
15-May-2017
31-Jan-2019
01-Jun-2021
Version
1
2
3
4
5
Table 9. Document revision history
Changes
First release.
Added device in SMC package.
Updated document accordingly.
Updated DPAK package information and reformatted to current standard.
Added Section 2.1 SMB Flat Notch package information .
Removed normalized avalanche curve.
STPS4S200
DS10646 - Rev 5 page 15/16
STPS4S200
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks . All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2021 STMicroelectronics – All rights reserved
DS10646 - Rev 5 page 16/16
