ESDAXLC6-1BT2Y
Datasheet
Automotive single line ESD protection for high speed lines in 0402
Product status link
ESDAXLC6-1BT2Y
Features
• AEC-Q101 qualified
• Flow-through routing to keep signal integrity
• Ultra large bandwidth: 12 GHz
• Ultra low capacitance: 0.4 pF
• Extended operating junction temperature range: -55 °C to 150 °C
• RoHS compliant
• Complies with ISO 10605 - C = 150 pF, R = 330 Ω
– ±16 kV (contact discharge)
– ±30 kV (air discharge)
• Complies with ISO 10605 - C = 330 pF, R = 330 Ω
– ±12 kV (contact discharge)
– ±30 kV (air discharge)
• Complies with ISO 7637-3:
– pulse 3a: V s
= -150 V
– pulse 3b: V s
= +150 V
– pulse 2a: V s
= ±85 V
Application
The ESDAXLC6-1BT2Y is designed to protect against electrostatic discharge on automotive circuits such as:
• APIX
• LVDS & digital video interface
• Ethernet and BroadrReach
• USB 2.0 and USB 3.0
• High speed communication buses
• RF front-end
Description
The ESDAXLC6-1BT2Y is an ESD device designed for high-speed lines protection.
DS10560 - Rev 2 - May 2021
For further information contact your local STMicroelectronics sales office.
www.st.com
1
ESDAXLC6-1BT2Y
Characteristics
Characteristics
P
PP
I
PP
T stg
T j
T
L
Symbol
V
PP
Table 1. Absolute maximum ratings (T amb
= 25 °C)
Peak pulse voltage
Parameter
ISO10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω):
Contact discharge
Air discharge
ISO10605 (C = 330 pF, R = 330 Ω)
Contact discharge
Air discharge
Peak pulse power dissipation (8/20 µs)
Peak Pulse current (8/20 µs)
Storage temperature range
Operating junction temperature range
Maximum lead temperature for soldering during 10 s
Figure 1. Electrical characteristics (definitions)
Value Unit
16
30 kV
12
30
40
1.3
-65 to +150
-55 to +150
260
W
A
°C
°C
°C
Ipp
Stand-off voltage
DS10560 - Rev 2
Symbol
V
BR
I
R
V
CL
R d
C
I/O-GND f
C
Table 2. Electrical characteristics (values) (T amb
= 25° C)
Test conditions
I
R
= 1 mA
V
R
= 3 V
I
PP
= 1 A, 8/20 µs
ISO 10605- C = 150 pF, R = 330 Ω
+8 kV contact discharge, measured at 30 ns
TLP, pulse duration 100 ns, 16 A
TLP, pulse duration 100 ns, 16 A
V
I/O
= 0 V, 200 MHz < f < 3 GHz, V
OSC
= 30 mV
S
21
= -3 dB
Min.
Typ.
Max.
Unit
6 9 11
50
V nA
17
37
41
2
0.4
12
0.5
V
Ω pF
GHz page 2/13
ESDAXLC6-1BT2Y
Characteristics (curves)
1.1
Characteristics (curves)
Figure 2. Leakage current versus junction temperature
10
I
R
(nA)
1
0.1
0.01
25 50 75 100 125
Tj(°C)
150
Figure 3. Junction capacitance versus reverse applied voltage
0.4
0.3
0.2
0.1
0
0
0.8
C(pF)
0.7
0.6
0.5
1 2 3 4
VR(V)
5
Figure 4. TLP
0
-10
-20
-30
-60
30
I(A)
20
10
-40 -20 0 20 40
V(V)
60
Figure 6. ESD response to ISO 10605 - C = 150 pF,
R = 330 Ω (-8 kV contact discharge)
Figure 5. S21 attenuation
-2
-3
-1
0
S 21 ( d B )
-4
-5
-6
-7
100 M 300 M 1 G
F( H z)
3 G 10 G 30 G
Figure 7. ESD response to ISO 10605 -
C = 150 pF, R = 330 Ω (+8 kV contact discharge)
DS10560 - Rev 2 page 3/13
ESDAXLC6-1BT2Y
Characteristics (curves)
Figure 8. ESD response to ISO 7637-3 pulse 3a: -150 V Figure 9. ESD response to ISO 7637-3 pulse 3b: +150 V
Figure 10. ESD response to ISO 7637-3 pulse 2a: -85 V Figure 11. ESD response to ISO 7637-3 pulse 2a: +85 V
Figure 12. H2 harmonic versus input power at 710 MHz Figure 13. H3 harmonic versus input power at 710 MHz
DS10560 - Rev 2 page 4/13
ESDAXLC6-1BT2Y
Characteristics (curves)
Figure 14. H2 harmonic versus input power at 824 MHz Figure 15. H3 harmonic versus input power at 824 MHz
Figure 16. H2 harmonic versus input power at 2400 MHz Figure 17. H3 harmonic versus input power at 2400 MHz
DS10560 - Rev 2 page 5/13
2
2.1
ESDAXLC6-1BT2Y
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com
. ECOPACK is an ST trademark.
Package information
E
Figure 18. Package outline
A L1
DS10560 - Rev 2
Ref.
e b1 b2
A
A1
L1
L2
D
E
A1
Min.
0.30
0.00
0.45
0.45
0.95
0.55
0.60
0.20
0.20
Table 3. Package mechanical data
Dimensions
Millimeters
Typ.
0.50
0.50
1.00
0.60
0.65
0.25
0.25
L2
Max.
0.40
0.05
0.55
0.55
1.05
0.65
0.70
0.30
0.30
page 6/13
ESDAXLC6-1BT2Y
Packing and marking information
2.2
Packing and marking information
Figure 19. Marking layout Figure 20. Package orientation in reel
Pin1
X
Pin2
X: Refer to ordering information table for marking.
End
Figure 21. Tape leader and trailer dimensions
Carrier tape Top cover tape
Start
Taped according to EIA-481
Note: Pocket dimensions are not on scale
Pocket shape may vary depending on package
On bidirectional devices, marking and logo may be not always in the same direction
Figure 22. Tape and reel orientation
160 mm min
Trailer Components
100 mm min
400 mm min
Leader
Figure 23. Reel dimensions (mm)
Ø 180 max
14.4
2 ± 0.5
Ø 13
Ø 60 Ø 20.2 min
Figure 24. Inner box dimensions (mm)
30
205
205
DS10560 - Rev 2 page 7/13
Figure 25. Tape outline
ESDAXLC6-1BT2Y
Packing and marking information
DS10560 - Rev 2
Ref.
D0
D1
F
K0
P0
P1
P2
W
Table 4. Tape and reel mechanical data
Min.
1.45
0.35
3.45
0.42
3.9
1.95
1.95
7.9
Dimensions
Millimeters
Typ.
1.5
3.5
0.47
4
2
2
8
Max.
1.6
3.55
0.52
4.1
2.05
2.05
8.3
page 8/13
3
Assembly recommendations
3.1
Recommended footprint
Figure 26. Recommended footprint in mm
0.55
0.4
0.55
ESDAXLC6-1BT2Y
Assembly recommendations
1.5
Note:
3.2
Solder mask defined (SMD) recommended.
Stencil opening design
Stencil opening thickness: 75 μm / 3 mils
Figure 27. Stencil opening recommendations
0.522
0.428
0.522
3.3
Solder paste
1.
Halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
2.
“No clean” solder paste recommended.
3.
Tack force high enough to resist component displacement during PCB movement.
4.
Particles size 20-38 µm per IPCJ STD-005.
DS10560 - Rev 2 page 9/13
3.4
3.5
3.6
ESDAXLC6-1BT2Y
Placement
Placement
1.
It is recommended to use leads recognition instead of package outline for accurate placement on footprint with adequate resolution tool.
2.
Tolerance of ±50 µm (25% offset allowed on the smallest dimension of the smallest pad) is recommended.
3.
1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages.
4.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools.
PCB design preference
1.
Any via around or inside the footprint area must be closed to avoid solderpaste migration in the via.
2.
Position and dimensions of the tracks should be well balanced. A symmetrical layout is recommended to prevent assembly troubles.
Reflow profile
Figure 28. ST ECOPACK recommended soldering reflow profile for PCB mounting
250
Temperature (°C)
200
150
100
50
0 30
0.9 °C/s
60
2 - 3 °C/s
240-245 °C
60 sec
(90 max)
-2 °C/s
-3 °C/s
-6 °C/s
90 120 150
Time (s)
180 210 240 270 300
Note: Minimize air convection currents in the reflow oven to avoid component movement. O
2
rate inside the oven must be below 500 ppm. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020.
DS10560 - Rev 2 page 10/13
4
ESDAXLC6-1BT2Y
Ordering information
Ordering information
Figure 29. Ordering information scheme
ESDA XLC 6 - 1 B T2 Y
ESD array
Extra low capacitance
Breakdown voltage
6 = 6 Volts min
Number of lines
Directional
B = Bidirectional
Package
T2 = Thin SOD882 (0402)
Automotive
Table 5. Ordering information
Order code
ESDAXLC6-1BT2Y
Marking
U
(1)
Package
SOD882T (0402)
Weight
0.80 mg
1. The marking can be rotated by multiples of 90° to differentiate assembly location
Base qty.
12000
Delivery mode
Tape and reel
DS10560 - Rev 2 page 11/13
Revision history
Date
03-Nov-2014
03-May-2021 2
Table 6. Document revision history
Version
1
Changes
Initial release.
Updated SOD882T (0402) package information.
Minor text changes.
ESDAXLC6-1BT2Y
DS10560 - Rev 2 page 12/13
ESDAXLC6-1BT2Y
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DS10560 - Rev 2 page 13/13
