STMicroelectronics STTH1302 Datasheet
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STTH1302
High efficiency ultrafast diode
Datasheet - production data
K
A1
A2
A1
A2
D 2 PAK
K
K
Features
Suited for SMPS
Low losses
Low forward and reverse recovery time
High surge current capability
High junction temperature
ECOPACK ® 2 compliant component for
D²PAK on demand
A1
A2
Description
Dual center tap rectifier suited for switch mode power supplies and high frequency DC to DC converters.
This device is especially intended for use in low voltage, high frequency inverters, freewheeling and polarity protection applications.
Table 1: Device summary
Symbol Value
I
F(AV)
V
RRM
T j
(max)
V
F
(typ) t rr
(typ)
2 x 6.5 A
200 V
175 °C
0.81 V
16 ns
August 2017 DocID8794 Rev 4
This is information on a product in full production.
1/11 www.st.com
Characteristics
1 Characteristics
STTH1302
Table 2: Absolute ratings (limiting values, per diode, at 25 °C, unless otherwise specified)
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(peak)
I
FSM
T stg
T j
Symbol
Repetitive peak reverse voltage
Forward rms current
Average forward current
δ = 0.5, square wave
T
C
= 155 °C Per diode
T
C
= 145 °C Per device
Surge non repetitive forward current t p
= 10 ms sinusoidal
Storage temperature range
Maximum operating junction temperature
Table 3: Thermal parameter
Parameter
200
20
6.5
13
70
-65 to +175
175
V
A
A
A
°C
°C
R th(j-c)
I
V
Junction to case
Reverse leakage current
Forward voltage drop
T j
= 25 °C
T j
= 125 °C
T j
= 25 °C
T j
= 125 °C
T j
= 25 °C
T j
= 125 °C
Per diode
Total
3
1.9
°C/W
R th(c)
Coupling
When the diodes 1 and 2 are used simultaneously:
ΔT j(diode1)
= P
(diode1)
x R th(j-c) (per diode)
+ P
(diode2)
x R th(c)
Symbol
0.8 °C/W
Table 4: Static electrical characteristics (per diode)
Parameter Test conditions Min. Typ. Max. Unit
V
R
= V
RRM
I
F
= 6.5 A
I
F
= 13 A
-
-
-
-
-
-
3
6
60
1.10
0.81 0.95
1.25
0.95 1.10
µA
V
Notes:
(1)
Pulse test: t p
= 5 ms, δ < 2%
(2)
Pulse test: t p
= 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.80 x I
F(AV)
+ 0.023 x I
F
2
(RMS)
Max. value Unit
2/11 DocID8794 Rev 4
STTH1302
Symbol t rr
Characteristics
Table 5: Dynamic electrical characteristics (per diode)
Parameter Test conditions Min. Typ. Max. Unit
Reverse recovery time
I
F
= 0.5 A,
I rr
= 0.25 A,
I
R
= 1 A
- 16 25 ns t fr
V
FP
Forward recovery time
Forward recovery voltage
T j
= 25 °C
I
F
= 6.5 A, dI
F
/dt = 100 A/µs ,
V
FR
= 1.1 x V
Fmax
,
I
F
= 6.5 A, dI
F
/dt = 100 A/µs
-
-
70
2.2 ns
V
DocID8794 Rev 4 3/11
Characteristics STTH1302
1.1 Characteristics (curves)
8
Figure 1: Average forward power dissipation versus average forward current (per diode)
P F(AV) (W)
δ = 0.1
δ = 0.2
δ = 0.5
7
δ = 0.05
6
δ = 1
5
60
50
40
Figure 2: Peak current versus duty cycle
(per diode)
I
M
δ =tp/T
T tp
4 30
P=10W
3
2
T
1
0
0
I F(AV) (A)
1 2 3 4 5 6
δ =tp/T
7 tp
8
Figure 3: Forward voltage drop versus forward current (per diode)
20
10
0
0.0
0.1
P=2W
P=5W
0.2
0.3
0.6
0.7
0.8
0.9
1.0
Figure 4: Relative variation of thermal impedance junction to case versus pulse duration
Zth (j-c) / Rth (j-c)
1.0
100.0
I
F
(A)
0.4
δ
0.5
Tj = 125 °C
Typical values
δ = 0.5
10.0
Tj = 125 °C
Maximum values δ = 0.2
Tj = 25 °C
Maximum values
δ = 0.1
1.0
Single pulse T
V
F
(V)
0.1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
0.1
1.E-03
6
5
4
3
2
8
Figure 5: Average forward current versus ambient temperature (δ = 0.5, per diode)
I F(AV) (A)
7
Rth (j-a) =Rth (j-c)
D²PAK
D²PAK (S=1cm²)
Rth (j-a) =50°C/W
1.E-02 tp(s)
1.E-01
δ =tp/T tp
1.E+00
100
Figure 6: Junction capacitance versus reverse voltage applied (typical values, per diode)
C (pF)
F = 1 MHz
V osc
= 30 mV
RMS
T j
= 25 °C
1
0
0 25 50 75
T amb
(°C)
100 125 150 175
10
1 10 100
V
R
(V)
1000
4/11 DocID8794 Rev 4
STTH1302
Figure 7: Reverse recovery charges versus dI
F
/dt
(typical values, per diode)
Q rr
(nC)
240
220
I
F
= 6.5 A
V
R
= 200 V
200
180
160
140
120
100
80
60
40
20
0
10
T j
= 125 °C
100
T j
= 25 °C dI
F
/dt (A/µs)
1000
12
Figure 9: Peak reverse recovery current versus dI
F
/dt (typical values, per diode)
I
RM
(A)
I
F
V
R
= 6.5 A
= 100 V
10
Characteristics
80
Figure 8: Reverse recovery time versus dI
F
/dt
(typical values, per diode) t rr
(ns)
70
I
F
V
R
= 6.5 A
= 100 V
60
50
40
30
20
10
0
10
1.4
1.2
T j
= 25 °C
Figure 10: Relative variation of dynamic parameters versus junction temperature
I
F
= 6.5 A
V
R
= 100 V
Reference: T j
= 125 °C
T j
= 125 °C
100 dI
F
/dt (A/µs)
1000
1.0
8
T j
= 125 °C
0.8
I
RM
6
0.6
4
Q rr
0.4
T j
= 25 °C
2
0
10 100
0.2
dI
F
/dt (A/µs)
1000
0.0
25 50 75 100 125
T j
(°C)
150
Figure 11: Thermal resistance junction to ambient versus copper surface under tab
20
10
0
0
80
R th (j-a)
(°C/W )
70
60
50
40
30
5
D²PAK
Epoxy printed board FR4, copper thickness = 35 µm
10 15 20 25 30
S
Cu
(cm²)
35 40
DocID8794 Rev 4 5/11
Package information
2 Package information
STTH1302
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK ® is an ST trademark.
Cooling method: by conduction (C)
Epoxy meets UL94,V0
6/11 DocID8794 Rev 4
STTH1302
2.1 D²PAK package information
Figure 12: D²PAK package outline
Package information
This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed.
DocID8794 Rev 4 7/11
Package information
Ref. e e1
H
J1
D2
E
E1
E2
A
A1 b b2 c c2
D
D1
L
L1
L2
R
V2
STTH1302
4.88
15.00
2.49
1.90
1.27
1.30
Min.
4.36
0.00
0.70
1.14
0.38
1.19
8.60
6.90
1.10
10.00
8.10
6.85
Table 6: D²PAK package mechanical data
Dimensions
Millimeters
Max.
4.60
0.25
0.93
1.70
0.69
1.36
9.35
8.00
1.50
10.55
8.90
7.25
Min.
0.172
0.000
0.028
0.045
0.015
0.047
0.339
0.272
0.043
0.394
0.319
0.266
2.54 typ.
5.28
15.85
2.90
2.79
1.65
1.78
0.190
0.591
0.097
0.075
0.049
0.050
0.4 typ.
0° 8° 0°
Inches
0.100
0.015
0.205
0.624
0.112
0.110
0.065
0.070
Max.
0.181
0.010
0.037
0.067
0.027
0.053
0.368
0.311
0.060
0.415
0.346
0.282
8°
8/11 DocID8794 Rev 4
STTH1302 Package information
Figure 13: D²PAK recommended footprint (dimensions in mm)
DocID8794 Rev 4 9/11
Ordering information
3 Ordering information
Order code
STTH1302CG-TR
Table 7: Ordering information
Marking Package Weight Base qty.
STTH1302CG D 2 PAK 1.38 g 1000
STTH1302
Delivery mode
Tape and reel
4 Revision history
Date
Table 8: Document revision history
Revision Changes
27-Jun-2012
21-Aug-2017
3
4
Initial version, previously mentioned as revision 2A.
Updated features, package silhouette and Table 1: "Device summary" in cover page.
Updated Section 1: "Characteristics" ,
Section 2: "Package information"
and Table 7: "Ordering information" .
10/11 DocID8794 Rev 4
STTH1302
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2017 STMicroelectronics
– All rights reserved
DocID8794 Rev 4 11/11
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