STMicroelectronics STTH1002C-Y Datasheet
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STTH1002C-Y
Automotive high efficiency ultrafast diode
Features
■
■
■
■
■
■
Suited for SMPS
Low losses
Low forward and reverse recovery times
High junction temperature
Low leakage current
AEC-Q101 qualified
Description
Dual center tap rectifier suited for switch mode power supplies and high frequency DC to DC converters.
Packaged in DPAK and D
2
PAK, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection for automotive applications.
K
A1
A2
A1
K
A2
DPAK
STTH1002CBY
K
K
K
A2
A1
D
2
PAK
STTH1002CGY
Table 1.
Device summary
Symbol
I
F(AV)
V
RRM
T j
(max)
V
F
(typ) t rr
(typ)
Value
Up to 2 x 8 A
200 V
175 °C
0.78 V
20 ns
November 2011 Doc ID 17536 Rev 2 1/9 www.st.com
9
Characteristics
1 Characteristics
STTH1002C-Y
Table 2.
Symbol
V
RRM
Absolute ratings (limiting values, per diode)
Repetitive peak reverse voltage
Parameter
I
F(RMS)
Forward rms current
I
F(AV)
I
FSM
T stg
T j
Avarage forward current
δ
= 0.5
Surge non repetitive forward current
Storage temperature range
Operating junction temperature range
D
2
PAK
DPAK
T c
= 155 °C Per diode
T c
= 150 °C Per device
T c
= 135 °C Per diode
T c
= 125 °C Per device t p
= 10 ms sinusoidal
Value
200
20
10
5
10
8
16
50
-65 to + 175
-40 to + 175
Unit
V
A
A
A
°C
°C
Table 3.
Symbol
Thermal parameters
R th(j-c)
Junction to case
Parameter
Per diode
Per device
R th(j-c)
Coupling
When the diodes 1 and 2 are used simultaneously:
Δ
T j
(diode1) = P(diode1) x R th(j-c)
(per diode) + P(diode2) x R th(c)
Table 4.
Symbol
Static electrical characteristics (per diode)
Parameter Test conditions Min.
I
R
(1)
V
F
(2)
Reverse leakage current
Forward voltage drop
T j
= 25 °C
T j
= 125 °C
T j
= 25 °C
V
R
= V
RRM
I
F
= 5 A
T j
= 25 °C I
F
= 10 A
T j
= 150 °C I
F
= 5 A
T j
= 150 °C I
F
= 10 A
1.
Pulse test: t p
= 5 ms,
δ
< 2 %
2.
Pulse test: t p
= 380 µs,
δ
< 2 %
To evaluate the conduction losses use the following equation:
P = 0.73 x I
F(AV)
+ 0.032 I
F
2
(RMS)
Typ.
3
0.78
Value (max) Unit
4.0
2.5
1.0
°C/W
Max.
5
40
1.1
1.25
0.89
1.05
Unit
µA
V
2/9 Doc ID 17536 Rev 2
STTH1002C-Y Characteristics
Table 5.
Symbol t rr
I
RM t fr
V
FP
Dynamic electrical characteristics
Parameter Test conditions
Reverse recovery time T j
= 25 °C
Reverse recovery current
T j
= 125 °C
Forward recovery time T j
= 25 °C
I
F
= 1 A V
R
= 30 V dI
F
/dt = 100 A/µs
I
F
= 5 A V
R
= 160 V dI
F
/dt = 200 A/µs
I
F
= 5 A dI
F
/dt = 100 A/µs
V
FR
= 1.1 x V
Fmax
Forward recovery voltage
T j
= 25 °C I
F
= 5 A dI
F
/dt = 100 A/µs
Min.
Typ.
20
Max.
25
Unit ns
5.9
7.6
110
A ns
2.4
V
Doc ID 17536 Rev 2 3/9
Characteristics STTH1002C-Y
Figure 1.
60
50
40
Peak current versus duty cycle
(per diode)
30
P = 10W
I
M T
20
P = 5W δ
=tp/T tp
10 P = 2W
0
0.0
0.1
0.2
0.3
0.4
δ
0.5
0.6
0.7
0.8
0.9
1.0
Figure 2.
Forward voltage drop versus forward current
(typical values, per diode)
100
I
FM
(A)
90
80
70
60
50
40
30
20
10
V
FM
(V)
0
0.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
2.75
3.00
Figure 3.
Forward voltage drop versus forward current
(maximum values, per diode)
100
I
FM
(A)
90
50
40
30
20
80
70
60
10
V
FM
(V)
0
0.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
2.75
3.00
Figure 4.
Relative variation of thermal impedance junction to case versus pulse duration
1.0
Z th(j-c)
/R th(j-c)
Single pulse
0.1
1.E-03 1.E-02 1.E-01 1.E+00
Figure 5.
Junction capacitance versus reverse voltage applied
(typical values, per diode)
100
C(pF)
F=1MHz
V OSC =30mV RMS
Figure 6.
Reverse recovery charges versus dI
F
/dt (typical values, per diode)
10
0 50 100 150 200
240
220
200
180
160
140
120
100
80
60
40
20
0
10 100 1000
4/9 Doc ID 17536 Rev 2
STTH1002C-Y Characteristics
Figure 7.
Reverse recovery time versus dI
F
/dt
(typical values, per diode)
Figure 8.
Peak reverse recovery current versus dI
F
/dt
(typical values, per diode)
80
70
60
50
40
30
20
10
0
10 100 1000
4
3
2
1
0
8
7
6
5
13
12
11
10
9
I
RM
(A)
10 100 1000
Figure 9.
Dynamic parameters versus junction temperature
1.4
Q ; I
RM
[T ]/Q ;I [T =125°C]
1.2
1.0
0.8
0.6
0.4
0.2
0.0
25 50
I
RM
75
Q rr
150
20
10
0
0
60
50
40
30
Figure 10.
Thermal resistance junction to ambient versus copper surface under tab for D
2
PAK
80
R th(j-a)
(°C/W)
Epoxy printed circuit board FR4, copper thickness = 35 µm
70
2 4 6
S(Cu)(cm²)
8 10 12 14 16 18 20 100 125
Figure 11.
Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness = 35 µm) for DPAK
100
R th(j-a)
(°C/W)
40
30
20
10
0
0
90
80
70
60
50
2 4 6
S(Cu)(cm²)
8 10 12 14 16 18 20
Doc ID 17536 Rev 2 5/9
Package mechanical data
2 Package mechanical data
STTH1002C-Y
●
●
Epoxy meets UL94, V0
Cooling method: by conduction (method C)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Table 6.
DPAK dimensions
H
L4
E
B2
G
0.60 MIN.
B
L2
A2
V2
A1
R
C2
A
C
R
D
Ref.
G
H
L2
L4
V2
B
B2
C
A
A1
A2
C2
D
E
Dimensions
Millimeters Inches
Min.
Max.
2.20
0.90
0.03
0.64
5.20
0.45
0.48
6.00
6.40
4.40
9.35
0.80 typ.
4.60
10.10
0.60
0°
1.00
8°
2.40
1.10
0.23
0.90
5.40
0.60
0.60
6.20
6.60
Min.
Max.
0.086
0.035
0.001
0.025
0.204
0.017
0.018
0.236
0.251
0.173
0.368
0.181
0.397
0.031 typ.
0.023
0°
0.039
8°
0.094
0.043
0.009
0.035
0.212
0.023
0.023
0.244
0.259
Figure 12.
Footprint (dimensions in mm)
6.7
3 3
1.6
6.7
2.3
2.3
1.6
6/9 Doc ID 17536 Rev 2
STTH1002C-Y Package mechanical data
Table 7.
L2
L
L3
D
2
PAK dimensions
E
G
B2
B
A1
C2
C
A2
A
R
D
M *
V2
* FLAT ZONE NO LESS THAN 2mm
B2
C
C2
D
E
G
A
A1
A2
B
L
L2
L3
M
R
V2
Ref.
Dimensions
Millimeters Inches
Min.
Max.
4.40
2.49
0.03
0.70
1.14
0.45
1.23
8.95
10.00
4.88
15.00
1.27
1.40
15.85
1.40
1.75
2.40
3.20
0.40 typ.
0° 8°
4.60
2.69
0.23
0.93
1.70
0.60
1.36
9.35
10.40
5.28
Min.
Max.
0.173
0.098
0.001
0.027
0.045
0.017
0.048
0.352
0.393
0.192
0.590
0.050
0.055
0.624
0.055
0.069
0.094
0.126
0.016 typ.
0° 8°
0.181
0.106
0.009
0.037
0.067
0.024
0.054
0.368
0.409
0.208
Figure 13.
Footprint (dimensions in mm)
16.90
10.30
3.70
1.30
5.08
8.90
Doc ID 17536 Rev 2 7/9
Ordering information STTH1002C-Y
Table 8.
Ordering information
Order code Marking
STTH1002CBY-TR
STTH1002CGY-TR
STTH1002CY
STTH1002CGY
Package
DPAK
D
2
PAK
Weight
0.3 g
1.48 g
Base qty
2500
1000
Delivery mode
Tape and reel
Table 9.
Date
Document revision history
Revision
21-Oct-2010
03-Nov-2011
1
2
Changes
First issue.
Updated
8/9 Doc ID 17536 Rev 2
STTH1002C-Y
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Doc ID 17536 Rev 2 9/9
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