STPSC8H065
Datasheet
650 V, 8 A high surge silicon carbide power Schottky diode
K
TO-220AC
K
A
D²PAK
NC
A
K
K
A
A
K
TO-220AC insulated
K
DPAK
NC
A
Product status
STPSC8H065
Product summary
Symbol Value
I
F(AV)
V
RRM
T j(max.)
8 A
650 V
175 °C
Product label
Features
• No reverse recovery charge in application current range
• Switching behavior independent of temperature
• High forward surge capability
• Insulated package TO-220AC Ins:
– Insulated voltage: 2500 V
RMS
– Typical package capacitance: 7 pF
• Power efficient product
• ECOPACK ® 2 compliant component
Applications
• Switch mode power supply
• PFC
• DCDC converters
• LLC topologies
• Boost diode
Description
This 8 A, 650 V SiC diode is an ultrahigh performance power Schottky diode. It is manufactured using a silicon carbide substrate. The wide band gap material allows the design of a Schottky diode structure with a 650 V rating. Due to the Schottky construction, no recovery is shown at turn-off and ringing patterns are negligible. The minimal capacitive turn-off behavior is independent of temperature.
This STPSC8H065 is especially suited for use in PFC applications. This ST SiC diode will boost the performance in hard switching conditions. Its high forward surge capability ensures a good robustness during transient phases.
DS9225 - Rev 8 - January 2020
For further information contact your local STMicroelectronics sales office.
www.st.com
1
STPSC8H065
Characteristics
Characteristics
Table 1. Absolute ratings (limiting values at 25 °C unless otherwise specified)
Symbol
V
RRM
I
F(RMS)
Repetitive peak reverse voltage
Forward rms current
Parameter Value
650
22
Unit
V
A
I
I
I
F(AV)
FSM
FRM
Average forward current
Surge non repetitive forward current
Repetitive peak forward current
TO-220AC, DPAK, D 2 PAK, T c
= 140 °C (1) , DC
TO-220AC Ins,T c
= 95 °C (1)
t p
= 10 ms sinusoidal, T c
= 25 °C t p
= 10 ms sinusoidal, T c
= 125 °C t p
= 10 µs square, T c
= 25 °C
TO-220AC, DPAK, D 2 PAK, T c
= 140 °C
(1) , T
j
= 175 °C, δ = 0.1
TO-220AC Ins,T c
= 95 °C (1) , T
j
= 175 °C, δ = 0.1
T stg
T j
Storage temperature range
Operating junction temperature range
(2)
1. Value based on R th(j-c)
max.
2. (dP tot
/dT j
) < (1/R th(j-a)
) condition to avoid thermal runaway for a diode on its own heatsink.
8
75
69
420
33
A
A
A
-55 to +175 °C
-40 to +175 °C
Symbol
R th(j-c)
Junction to case
Table 2. Thermal resistance parameters
Parameter
TO-220AC, DPAK, D 2 PAK
TO-220AC Ins
Typ. value
1.3
2.45
Max. value
1.6
3.8
Unit
°C/W
Symbol
I
R
(1)
V
F
(2)
Parameter
Reverse leakage current
Forward voltage drop
Table 3. Static electrical characteristics
Test conditions
T j
= 25 °C
T j
= 150 °C
T j
= 25 °C
T j
= 150 °C
V
I
R
F
= V
RRM
= 8 A
1. t p
= 10 ms, δ < 2%
2. t p
= 500 μs, δ < 2%
Min.
-
-
-
-
•
•
To evaluate the conduction losses, use the following equation:
P = 1.35 x I
F(AV)
+ 0.144 x I
F
2
(RMS)
For more information, please refer to the following application notes related to the power losses :
AN604: Calculation of conduction losses in a power rectifier
AN4021: Calculation of reverse losses on a power diode
Typ.
7
65
1.56
1.98
Max.
80
335
1.75
2.50
Unit
µA
V
DS9225 - Rev 8 page 2/16
Table 4. Dynamic electrical characteristics
Symbol
Q
C cj j
Parameter
Total capacitive charge
Total capacitance
Test conditions
V
R
= 400 V
V
R
= 0 V, T c
= 25 °C, F = 1 MHz
V
R
= 400 V, T c
= 25 °C, F = 1 MHz
1.
Most accurate value for the capacitive charge:
0
VR
Cj V dV
STPSC8H065
Characteristics
Typ.
23.5
414
38
Unit nC pF
DS9225 - Rev 8 page 3/16
STPSC8H065
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Forward voltage drop versus forward current
(typical values, low level)
16
I
F
( A)
Pulse test : t p
=500µs
14
12
10
8
6
4
2
0
0.0
0.5
T a
=100 °C
T a
=25 °C
1.0
1.5
2.0
2.5
T a
=150 °C
T a
=175 °C
3.0
V
F
(V)
3.5
Figure 2. Forward voltage drop versus forward current
(typical values, high level)
80
I
F
( A)
Pulse test : t p
=500µs
70
60
50
40
30
20
10
0
0
T a
=25 °C
T a
=100 °C
T a
=150 °C
1 2 3
T a
=175 °C
4 5 6 7
V
F
(V)
8
Figure 3. Reverse leakage current versus reverse voltage applied (typical values)
1.E+03
I
R
(µA)
1.E+02
1.E+01
1.E+00
T j
=150 °C
T j
=175 °C
1.E-01
1.E-02
0
T j
=25 °C
V
R
(V)
50 100 150 200 250 300 350 400 450 500 550 600 650
Figure 4. Peak forward current versus case temperature
(TO-220AC, DPAK, D 2 PAK)
80
I
M
(A)
70
δ =0.1
60
50
40
30
20
10
0
0
δ =0.3
δ =0.5
δ =1
2 5
δ =0.7
50 75
T
C
(°C)
100 125
δ=tp/T
T
150 tp
175
DS9225 - Rev 8 page 4/16
STPSC8H065
Characteristics (curves)
Figure 5. Peak forward current versus case temperature
(TO-220AC Ins)
60
I
M
(A)
δ =0.1
50
T
δ=tp/T tp
40
30
δ =0.3
δ =0.5
20
10
0
0
δ =1
δ =0.7
2 5 50 75
T
C
(°C)
100 125 150 175
Figure 6. Junction capacitance versus reverse voltage applied (typical values)
500
Cj (pF)
450
400
350
300
250
200
150
100
50
0
0.1
1 .0
V
R
(V)
10.0
100.0
V
F=1 MHz
OSC
=30 mV
RMS
T j
=25 °C
1000.0
Figure 7. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, DPAK and
D²PAK)
Figure 8. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC Ins)
Z th(j-c)
/R th(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Single pulse
0.0
1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 t p
(s)
1.E+00
Z th(j-c)
/R th(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Single pulse
0.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 t p
(s)
1.E+01
Figure 9. Non-repetitive peak surge forward current versus pulse duration (sinusoidal waveform)
1.E+03
I
FSM
(A)
T a
=25 °C
T a
=125 °C
1.E+02
1.E+01
1.E-05 1.E-04 1.E-03 t p
(s)
1.E-02
Figure 10. Total capacitive charges versus reverse voltage applied (typical values)
28
Q
Cj
(nC)
24
20
16
12
8
4
0
0 50 100 150 200 250 300 350
V
R
(V)
400
DS9225 - Rev 8 page 5/16
2
2.1
STPSC8H065
Package information
Package information
•
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com
. ECOPACK is an ST trademark.
DPAK package information
Epoxy meets UL94, V0
Figure 11. DPAK package outline
E b4 c2
A
L2
H
L4
D e e1
Seating plane
A1 b (2x)
A2
L
0.25
V2
Gauge
plane
(L1) c
R
D1
E1
DS9225 - Rev 8 page 6/16
DS9225 - Rev 8
STPSC8H065
DPAK package information
Table 5. DPAK mechanical data
Dimensions
Dim.
Min.
Millimeters
Typ.
L
(L1)
L2 b4 c c2
D
D1
A
A1
A2 b
E
E1 e e1
H
L4
R
V2
2.20
0.90
0.03
0.64
5.20
0.45
0.48
6.00
4.95
6.40
4.60
2.159
4.445
9.35
1.00
2.60
0.65
0.60
0°
5.10
4.70
2.286
4.572
2.80
0.80
0.20
1. Inches dimensions given for reference only
8° 0°
Max.
6.60
4.80
2.413
4.699
10.10
1.50
3.00
0.95
1.00
5.40
0.60
0.60
6.20
5.25
2.40
1.10
0.23
0.90
Min.
0.252
0.181
0.085
0.175
0.368
0.039
0.102
0.026
0.024
0.087
0.035
0.001
0.025
0.205
0.018
0.019
0.236
0.195
Inches (1)
Typ.
0.201
0.185
0.090
0.180
0.110
0.031
0.008
Figure 12. DPAK recommended footprint (dimensions are in mm)
6.3
6.1
10.7
B
Max.
0.260
0.189
0.095
0.185
0.398
0.059
0.118
0.037
0.039
0.094
0.043
0.009
0.035
0.213
0.024
0.024
0.244
0.207
8°
1.5
4.572
A
The device must be positioned within page 7/16
2.2
•
•
D²PAK package information
Epoxy meets UL94, V0.
Cooling method: by conduction (C)
Figure 13. D²PAK package outline
STPSC8H065
D²PAK package information
Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed.
DS9225 - Rev 8 page 8/16
DS9225 - Rev 8
STPSC8H065
D²PAK package information
Ref.
L2
R
V2
J1
L
L1
E1
E2 e e1
H c2
D
D1
D2
E
A
A1 b b2 c
4.88
15.00
2.49
2.29
1.27
1.30
Min.
1.23
8.95
7.50
1.10
10.00
8.30
6.85
4.40
0.03
0.70
1.14
0.45
Table 6. D²PAK package mechanical data
0°
Millimeters
Typ.
7.75
1.30
8.50
7.05
2.54
0.40
5.28
15.85
2.69
2.79
1.40
1.75
Dimensions
Max.
Min.
Inches (for reference only)
Typ.
Max.
1.36
9.35
8.00
1.50
10.40
8.70
7.25
4.60
0.23
0.93
1.70
0.60
0.173
0.001
0.028
0.045
0.018
0.048
0.352
0.295
0.043
0.394
0.335
0.266
0.305
0.051
0.343
0.278
0.100
0.053
0.368
0.315
0.060
0.409
0.346
0.282
0.181
0.009
0.037
0.067
0.024
0.190
0.591
0.097
0.090
0.049
0.050
0.205
0.624
0.106
0.110
0.055
0.069
0.015
8° 0° 8°
Figure 14. D²PAK recommended footprint (dimensions are in mm)
Footprint_26 page 9/16
2.3
STPSC8H065
TO-220AC package information
•
•
•
•
TO-220AC package information
Epoxy meets UL 94,V0
Cooling method: by conduction (C)
Recommended torque value: 0.55 N·m
Maximum torque value: 0.70 N·m
H2
Figure 15. TO-220AC package outline
0.10
Ø I
Gate note (1)(2)
L5
C
A
L7
L6
L2
F1 L9
D
Gate note (1)(2)
L4
F
M
G
E
(1) : Max resin gate protusion 0.5 mm
(2) : Resin gate position is accepted in each of the two positions shown on the drawings or their symmetrical
DS9225 - Rev 8 page 10/16
DS9225 - Rev 8
Ref.
F1
G
H2
L2
L4
A
C
D
E
F
L5
L6
L7
L9
M
Diam
STPSC8H065
TO-220AC package information
Table 7. TO-220AC package mechanical data
Dimensions
Min.
4.40
1.23
2.40
0.49
0.61
1.14
4.95
10.00
13.00
2.65
15.25
6.20
3.50
3.75
Millimeters
16.40 typ.
2.60 typ.
Max.
4.60
1.32
2.72
0.70
0.88
1.70
5.15
10.40
14.00
2.95
15.75
6.60
3.93
3.85
0.511
0.104
0.600
0.244
0.137
Inches (for reference only)
Min.
Max.
0.173
0.048
0.094
0.019
0.024
0.044
0.194
0.393
0.181
0.051
0.107
0.027
0.034
0.066
0.202
0.409
0.645 typ.
0.551
0.116
0.620
0.259
0.154
0.102 typ.
0.147
0.151
page 11/16
2.4
•
•
•
•
TO-220AC Ins. package information
Epoxy meets UL 94,V0
Cooling method: by conduction (C)
Recommended torque value: 0.55 N·m
Maximum torque value: 0.70 N·m
B
Figure 16. TO-220AC Ins. package outline
Ø I
L
STPSC8H065
TO-220AC Ins. package information b2
C
F
A
I4 a1 c2 l2 a2
M c1 e b1
DS9225 - Rev 8 page 12/16
DS9225 - Rev 8
Ref.
b2
C c1 c2 e
A a1 a2
B b1
I4
M
ØI
F
L
I2
STPSC8H065
TO-220AC Ins. package information
Min.
15.20
2.40
4.80
6.20
2.65
1.14
15.80
13.00
10.00
0.61
1.23
4.40
0.49
3.75
Table 8. TO-220AC Ins. package mechanical data
Millimeters
Typ.
3.75
16.40
2.60
2.72
5.40
6.60
2.95
1.70
16.80
14.00
10.40
0.88
1.32
4.60
0.70
Max.
15.90
Dimensions
Min.
Inches (for reference only)
Typ.
Max.
0.598
0.625
0.147
0.094
0.189
0.244
0.104
0.044
0.622
0.511
0.393
0.024
0.048
0.173
0.019
0.645
0.102
0.107
0.212
0.259
0.116
0.066
0.661
0.551
0.409
0.034
0.051
0.181
0.027
3.85
0.147
0.151
page 13/16
3
STPSC8H065
Ordering Information
Ordering Information
Order code
STPSC8H065D
STPSC8H065DI
STPSC8H065G-TR
STPSC8H065B-TR
Marking
STPSC8H065D
STPSC 8H065DI
STPSC8H065G
STPSC 8H065
Table 9. Ordering information
Package
TO-220AC
TO-220AC Ins
D 2 PAK
DPAK
Weight
1.86 g
2.12 g
1.48 g
0.32 g
Base qty.
50
50
1000
2500
Delivery mode
Tube
Tube
Tape and reel
Tape and reel
DS9225 - Rev 8 page 14/16
STPSC8H065
Revision history
Date
31-Aug-2012
10-Oct-2012
07-Nov-2013
07-Jan-2014
21-Jul-2015
22-Feb-2016
05-Feb-2019
09-Jan-2020
7
8
Table 10. Document revision history
Version
1
2
3
4
5
6
Changes
First issue.
Added Max. value to Table 3.
Updated Figure 1, Figure 2, Figure 13, Figure 14, and Table 9.
Added TO-220AC Ins package.
Updated Table 10 and reformatted to current standard.
Updated cover image.
Updated D²PAK package information. Added Section Applications and Section
Sustainable technology program.
Updated Features.
DS9225 - Rev 8 page 15/16
STPSC8H065
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© 2020 STMicroelectronics – All rights reserved
DS9225 - Rev 8 page 16/16
