STTH1003S-Y
Datasheet
Automotive 300 V, 10 A high efficiency ultrafast diode
A
A
K
K
A
K
A
D²PAK
Product status links
STTH1003S-Y
I
F(AV)
V
RRM
Product summary
10 A
T j(max.)
V
F(typ.)
T rr(max.)
300 V
175 °C
0.9 V
13 ns
Features
• AEC-Q101 qualified
• Ultrafast recovery
• Low power losses
• High surge capability
• Low leakage current
• High junction temperature
• ECOPACK ® 2 compliant
Applications
• DC/DC converter
• Reverse battery protection
• Battery management system
• Audio amplification
Description
This STTH1003S-Y is an ultrafast recovery power rectifier dedicated to energy recovery in automotive applications.
This STTH1003S-Y is also intended for the clamping function in an energy recovery block.
The compromise between forward voltage drop and recovery time offers optimized performances.
DS8767 - Rev 2 - January 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
1
STTH1003S-Y
Characteristics
Characteristics
Symbol
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
T stg
T j
Table 1. Absolute ratings (limiting values, at 25 °C, unless otherwise specified)
Parameter
Repetitive peak reverse voltage, T j
= -40 °C to +175 °C
Forward rms current
Average forward current, δ = 0.5, square wave
Surge non repetitive forward current
Storage temperature range
Operating junction temperature range
T
C
= 150 °C t p
= 10 ms sinusoidal
Value
300
20
10
100
-65 to +175
-40 to +175
°C
°C
A
A
Unit
V
A
Symbol
R th(j-c)
Table 2. Thermal parameters
Parameter
Junction to case
Maximum value
4
Unit
°C/W
For more information, please refer to the following application note :
• AN5088 : Rectifiers thermal management, handling and mounting recommendations
Symbol
I
R
(1)
V
F
(2)
Parameter
Reverse leakage current
Forward voltage drop
Table 3. Static electrical characteristics
Test conditions
T j
= 25 °C
T j
= 125 °C
T j
= 25 °C
T j
= 125 °C
I
V
F
R
= V
RRM
= 10 A
1. Pulse test: t p
= 5 ms, δ < 2%
2. Pulse test: t p
=380 µs, δ < 2%
Min.
-
-
-
-
Typ.
10
0.90
To evaluate the conduction losses, use the following equation:
P = 0.86 x I
F(AV)
+ 0.024 x I
F
2
(RMS)
For more information, please refer to the following application notes related to the power losses:
•
•
AN604: Calculation of conduction losses in a power rectifier
AN5028: Calculation of turn-off power losses generated by an ultrafast diode
Max.
10
100
1.30
1.10
Unit
µA
V
DS8767 - Rev 2 page 2/10
STTH1003S-Y
Characteristics
Symbol t rr
Parameter
Reverse recovery time
Table 4. Dynamic electrical characteristics
Test conditions
I
F
= 0.5 A, I rr
= 0.25 A, I
R
= 1 A
I
F
= 1 A, V
R
= 30 V, dI
F
/dt = -50 A/µs
I
RM
S factor t fr
V
FP
Reverse recovery current
Softness factor
Forward recovery time
Forward recovery voltage
T j
= 25 °C I
F
= 10 A, V
R
= 200 V, dl
F
/dt = 200 A/µs
I
I
F
= 10 A, V
FR
= 1.1 x V
F
= 10 A, dl
F
Fmax
, dl
F
/dt = 100 A/µs
/dt = 100 A/µs
Min. Typ. Max. Unit
13 17 ns
28 35
-
5.7
0.3
7.5
A
-
200 ns
2.5
3.5
V
DS8767 - Rev 2 page 3/10
STTH1003S-Y
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Forward voltage drop versus current (maximum values)
100. 0
10. 0
1. 0
0.1
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
Figure 2. Peak reverse recovery current versus dI
F
/dt
(90% confidence)
I
R M
(A)
16
14
12
10
8
2
0
6
4
0
V =200V
T =125°C
50
I = I
F(AV)
I = 0.5xI
F(AV)
F(AV)
100 150 200 250 300 350 400 450 500
Figure 3. Reverse recovery time versus dI confidence)
F
/dt (90 %
100
90
80
70
60
50
40
30
20
10
0
0
I = 0.5xI
F (AV)
I = 2xI
F(AV)
I = I
F(AV)
V =200V
T =125°C
50 100 150 200 250 300 350 400 450 500
Figure 4. Softness factor versus dI
F
/dt (typical values)
0.60
S factor
0.50
0.40
0.30
0.20
0.10
0.00
0
V =200V
T =125°C
50 100 150 200 250 300 350 400 450 500
DS8767 - Rev 2 page 4/10
STTH1003S-Y
Characteristics (curves)
Figure 5. Relative variations of dynamic parameters versus junction temperature (reference: T j
= 125 °C)
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
25
I
RM
50
S factor
75 100 125
Figure 6. Transient peak forward voltage versus dI
F
/dt
(90% confidence)
4
3
6
5
8
7
2
1
0
0
V
FP
(V)
I =I
F(AV)
50 100 150 200 250 300 350 400 450 500
Figure 7. Forward recovery versus dI confidence)
F
/dt (90%
300
250
200
150
100
50
0
0
I =I
F(AV)
V =1.1 x V max.
T =125°C
50 100 150 200 250 300 350 400 450 500
Figure 8. Thermal resistance junction to ambient versus copper surface under tab (typical values)
100
R th(j-a)
(°C/W)
90 Epoxy printed circuit board, copper thickness: 35 µm
80
70
60
50
40
30
20
10
0
0 5 10 15 20 25 30
DPAK
S
Cu
(cm²)
35 40
DS8767 - Rev 2 page 5/10
2
2.1
STTH1003S-Y
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com
. ECOPACK ® is an ST trademark.
•
•
DPAK package information
Epoxy meets UL94, V0
Lead-free packages
Figure 9. DPAK package outline
E b4 c2
A
L2
H
L4
D e e1
Seating plane
A1 b (2x)
A2
L
0.25
V2
Gauge
plane
(L1) c
R
D1
E1
DS8767 - Rev 2 page 6/10
DS8767 - Rev 2
STTH1003S-Y
DPAK package information
Table 5. DPAK mechanical data
Dimensions
Dim.
Min.
Millimeters
Typ.
L
(L1)
L2 b4 c c2
D
D1
A
A1
A2 b
E
E1 e e1
H
L4
R
V2
2.20
0.90
0.03
0.64
5.20
0.45
0.48
6.00
4.95
6.40
4.60
2.159
4.445
9.35
1.00
2.60
0.65
0.60
0°
5.10
4.70
2.286
4.572
2.80
0.80
0.20
1. Inches dimensions given for reference only
8° 0°
Max.
6.60
4.80
2.413
4.699
10.10
1.50
3.00
0.95
1.00
5.40
0.60
0.60
6.20
5.25
2.40
1.10
0.23
0.90
Min.
0.252
0.181
0.085
0.175
0.368
0.039
0.102
0.026
0.024
0.087
0.035
0.001
0.025
0.205
0.018
0.019
0.236
0.195
Inches (1)
Typ.
0.201
0.185
0.090
0.180
0.110
0.031
0.008
Figure 10. DPAK recommended footprint (dimensions are in mm)
6.3
6.1
10.7
B
Max.
0.260
0.189
0.095
0.185
0.398
0.059
0.118
0.037
0.039
0.094
0.043
0.009
0.035
0.213
0.024
0.024
0.244
0.207
8°
1.5
4.572
A
The device must be positioned within page 7/10
3
STTH1003S-Y
Ordering information
Ordering information
Order code
STTH1003SBY-TR
Marking
TH10 03SBY
Table 6. Order code
Package
DPAK
Weight
0.32 g
Base qty.
2500
Delivery mode
Tape and reel
DS8767 - Rev 2 page 8/10
Revision history
Date
24-Oct-2012
28-Jan-2019
Revision
1
2
Table 7. Document revision history
Changes
Initial release.
Added Section Applications . Updated
Table 6 . Added
Figure 8
.
STTH1003S-Y
DS8767 - Rev 2 page 9/10
STTH1003S-Y
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2019 STMicroelectronics – All rights reserved
DS8767 - Rev 2 page 10/10
