HSP051-4M5
Datasheet
4-line ESD protection for high speed
I/O 1 1
5 I/O 2
GND 2
4 I/O 3
I/O 4 3
Product status link
HSP051-4M5
Features
• Very compact 500 µm pitch package, for easy PCB layout
• Very-large bandwidth: 11.5 GHz
• Very-low capacitance: 0.2 pF (I/O to I/O) and 0.35 pF (I/O to GND)
• Very low dynamic resistance : 0.35 Ω
• Low leakage current: < 1 nA
• High ESD protection level
• High integration
• Suitable for high density boards
• Extended operating junction temperature range : -40 °C to 150 °C
• Exceeds IEC 61400-4-2 level standard:
– ±20 kV (contact discharge)
– ±30 kV (air discharge)
Applications
The HSP051-4M5 is designed to protect against to electro-static discharge submicron technology circuits driving:
• HDMI 2.1, HDMI 2.0 and HDMI 1.4
• USB 3.1 Gen 1 and Gen 2
• Display port
• Digital video interface
• Serial ATA
The ultra-low variation of the capacitance ensures very low influence on signal-skew.
The large bandwidth make it compatible with HDMI 2.1 8K (12 Gbps), HDMI 2.0
4K/2K (5.94 Gbps) and USB 3.1 Gen 2 (10 Gbps).
Description
The HSP051-4M5 is a 4-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines.
The device is packaged in μQFN 1.3 mm x 0.8 mm with a 500 μm pitch.
DS11462 - Rev 3 - February 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
1
HSP051-4M5
Characteristics
Characteristics
Symbol
V
PP
I
PP
T stg
T j
T
L
Table 1. Absolute maximum ratings (T amb
= 25 °C)
Value
Peak pulse voltage
Parameter
IEC 61000-4-2:
Contact discharge
Air discharge
Peak pulse current (8/20 µs)
Storage temperature range
Operating junction temperature range
Maximum lead temperature for soldering during 10 s
20
30
3
-65 to +150
-40 to +150
260
Figure 1. Electrical characteristics - parameters definition
Unit kV
A
°C
Symbol
V
BR
V
CL
I
RM
V
RM
I
F
I
R
I
PP
V
F
R
d
=
=
=
=
=
=
=
=
=
Parameter
Breakdown voltage
Clamping voltage
Leakage current at V
RM
Stand-off voltage
Forward current
Breakdown current
Peak pulse current
Forward voltage drop
Dynamic resistance
V
I
PP
V
F
I
R
I
RM
I
I
F
V
RM
V
BR
V
CL
I
V
DS11462 - Rev 3 page 2/15
HSP051-4M5
Characteristics
Symbol
V
BR
V
RM
I
RM
V
CL
R d
Table 2. Electrical characteristics (T amb
= 25 °C)
Test conditions Parameter
Breakdown voltage
Reverse working voltage
I
R
= 1 mA
Leakage current
Reverse Clamping voltage
Dynamic resistance, TLP measurement (pulse duration 100 ns)
C
I/O - I/O
C
I/O - GND
Capacitance V
I/O
= 0 V, V
OSC
= 30 mV
V
RM
= 3.6 V per line
V
RM
= 5 V per line
I pp
= 3A, 8/20µs
TLP measurement (pulse duration
100 ns), 16 A I pp
8 kV contact discharge after 30 ns,
IEC 61000-4-2
I/O to GND
GND to I/O
F = 2.5 GHZ to 9 GHz
F = 200 MHZ to 2.5 GHz
F = 2.5 GHZ to 9 GHz f
C
Differential mode cut-off frequency at - 3dB
Min.
Typ.
Max.
Unit
5.7
6.4
V
5
< 1
3
50
70
11.3
nA
13.7
V
13
0.35
0.45
0.20
0.30
0.60
0.76
0.35
0.43
11.50
Ω pF
GHz
DS11462 - Rev 3 page 3/15
HSP051-4M5
Characteristics (curves)
1.1
Characteristics (curves)
Figure 2. Leakage current versus junction temperature
(typical values)
10
Ir(nA)
V
R
=V
RM
V
RM
3.6V
5V
1
0.1
25 50 75 100 125
Tj(°C)
150
Figure 3. S21 attenuation measurement
-7.5
-9
-10.5
-1.5
-3
-4.5
-6
0
S21(dB)
-12
10M 100M
Parameter
Fc @ -3dB
|S21| @ 10GHz
Value
11.4GHz
-2.2dB
1G
F/Hz
10G 100G
Figure 4. HDMI2.1 12 Gbps eye diagram without
HSP051-4M5 (with worst cable model (WCM3), EQ with 8 dB CTLE and One-tap DFE
200mV /div
Figure 5. HDMI2.1 12 Gbps eye diagram with HSP051-4M5
(with worst cable model (WCM3), EQ with 8 dB CTLE and
One-tap DFE
200mV/div
13.9 ps/div
13.9ps /div
DS11462 - Rev 3 page 4/15
HSP051-4M5
Characteristics (curves)
Figure 6. HDMI2.0 5.94 Gbps eye diagram without
HSP051-4M5 (with worst cable model and equalizer)
250mV/div
Figure 7. HDMI2.0 5.94 Gbps eye diagram with
HSP051-4M5 (with worst cable model and equalizer)
250mV/div
28.1ps /div 28.1ps /div
Figure 8. USB3.1 Gen 2 10.0 Gbps eye diagram without
HSP051-4M5 (with type C connector, reference cable, equalizer with ADC = 6 dB and DFE)
100mV/div
Figure 9. USB3.1 Gen 2 10.0 Gbps eye diagram with
HSP051-4M5 (with type C connector, reference cable, equalizer with ADC = 6 dB and DFE)
100mV/div
16.7ps /div 16.7ps/div
DS11462 - Rev 3 page 5/15
HSP051-4M5
Characteristics (curves)
Figure 10. USB3.1 Gen 1 5.0 Gbps eye diagram without
HSP051-4M5 (with type C connector, reference cable and equalizer)
100mV/div
Figure 11. USB3.1 Gen 2 10.0 Gbps eye diagram with
HSP051-4M5 (with type C connector, reference cable and equalizer)
100mV/div
33.3ps/div 33.3ps/div
Figure 12. ESD response to IEC61000-4-2 (+8 kV contact discharge)
Figure 13. ESD response to IEC61000-4-2 (-8 kV contact discharge)
ESD level V pp
V
CL
@30ns V
CL
@60ns V
CL
@100ns
+8kV 155V 13V 12V 10V
ESD level V pp
V
CL
@30ns V
CL
@60ns V
CL
@100ns
-8kV -138V -8V -7V -4V
Figure 14. TLP Characteristic (pulse duration 100 ns)
DS11462 - Rev 3 page 6/15
Figure 15. TDR measurement without HSP051-4M5
5 Ω /div
Z
0 DIFF min
Z
0 DIFF max
Without HSP051 4M5
96 Ω
100 Ω
HSP051-4M5
Characteristics (curves)
Figure 16. TDR measurement with HSP051-4M5
5 Ω /div
Z
0 DIFF min
Z
0 DIFF max
With HSP051 4M5
85 Ω
100 Ω
200ps/div 200ps/div
DS11462 - Rev 3 page 7/15
2
2.1
HSP051-4M5
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com
. ECOPACK ® is an ST trademark.
MicroQFN-5L package information
Figure 17. MicroQFN-5L package outline
D
E
TOP VIEW
A2
A3
PIN #1 ID k
1
SIDE VIEW e
2 b
3
A1
A
L
5 4
BOTTOM VIEW
DS11462 - Rev 3 page 8/15
DS11462 - Rev 3
Ref.
D e
E
L k
A
A1
A2
A3 b
HSP051-4M5
MicroQFN-5L package information
Min.
0.31
0.00
0.15
0.15
1.20
0.70
0.20
0.20
Table 3. MicroQFN-5L package mechanical data
Dimensions
Millimeters
Typ.
1.30
0.50
0.80
0.25
0.25
0.38
0.02
0.25
0.130
0.20
Max.
0.40
0.05
0.35
0.25
1.40
0.90
0.30
Min.
0.012
0.000
0.005
0.005
0.047
0.027
0.007
0.007
Inches
Typ.
0.051
0.020
0.031
0.010
0.010
0.015
0.001
0.010
0.005
0.008
Figure 18. Footprint (dimensions in mm)
5 4
Max.
0.016
0.002
0.014
0.010
0.056
0.036
0.012
0.3
0.2
0.5
1 2 3
0.45
page 9/15
DS11462 - Rev 3
Figure 19. Marking
HSP051-4M5
MicroQFN-5L package information
H 1
Figure 20. Tape and reel specification
Dot identifying Pin A1 location
0.20
2.0
4.0
Ø 1.55
0.4
All dimensions are typical values in mm
0.9 4.0
User direction of unreeling page 10/15
HSP051-4M5
Recommendation on PCB assembly
3
Recommendation on PCB assembly
3.1
3.2
Solder paste
1.
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2.
“No clean” solder paste is recommended.
3.
Offers a high tack force to resist component movement during high speed.
4.
Solder paste with fine particles: powder particle size is 20-45 μm.
Placement
1.
Manual positioning is not recommended.
2.
It is recommended to use the lead recognition capabilities of the placement system, not the outline centering
3.
Standard tolerance of ±0.05 mm is recommended.
4.
3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages.
5.
To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool.
6.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools.
DS11462 - Rev 3 page 11/15
3.3
3.4
HSP051-4M5
PCB design preference
PCB design preference
1.
To control the solder paste amount, the closed via is recommended instead of open vias.
2.
The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away.
Reflow profile
Figure 21. ST ECOPACK ® recommended soldering reflow profile for PCB mounting
250
Temperature (°C)
200
150
100
50
0 30
0.9 °C/s
60
2 - 3 °C/s
240-245 °C
60 sec
(90 max)
-2 °C/s
-3 °C/s
-6 °C/s
90 120 150
Time (s)
180 210 240 270 300
Note:
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020.
DS11462 - Rev 3 page 12/15
4
Ordering information
Figure 22. Ordering information scheme
HSP 05 1 - 4 M5
HSP051-4M5
Ordering information
High speed line protection
05 : V
BR
(5.7 V min)
1 : version 1
4 : 4 lines protected
M5: µQFN-5L (1.3 mm x 0.8 mm)
Table 4. Ordering information
Order code
HSP051-4M5
Marking
H1
(1)
Package
µQFN-5L
Weight
1.04 mg
1. The marking can be rotated by multiples of 90° to differentiate assembly location
Base qty.
6000
Delivery mode
Tape and reel
DS11462 - Rev 3 page 13/15
Revision history
Date
04-Feb-2016
21-Dec-2018
07-Feb-2019
Revision
1
2
3
Table 5. Document revision history
Changes
Initial release.
New version of product.
Updated link syntax.
HSP051-4M5
DS11462 - Rev 3 page 14/15
HSP051-4M5
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DS11462 - Rev 3 page 15/15
