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SPV1512
12 V reverse voltage cool bypass switch
Datasheet - preliminary data
Junction temperature range T
J from -40 °C to 150 °C
Applications
Photovoltaic panels
Solar farm
Features
Maximum forward current I
F
= 16 A
Maximum reverse recovery mode V
R
up to
12 V
Very low forward voltage drop:
V
F
= 120 mV @ I
F
= 10 A, T
AMB
= 125 °C
Ultra low reverse leakage current:
I
R
= 100 µA @ V
R
= 12 V, T
AMB
= 125 °C
ESD HBM level (JESD22-A114) up to 8 kV
Surge test level (IEC61000-4-5) up to 2 kV
Description
The SPV1512 is a cool bypass switch with a very low forward voltage drop and ultra low reverse leakage current. The former drastically reduces the power dissipation in bypass mode and prolongs the lifetime of the device, by reducing maintenance costs and shutdown due to a device failure. The latter allows the device to work at very high temperature avoiding thermal runaway phenomenon. These are clearly key benefits for all those applications requiring low power consumption to increase the system lifetime and maximize the power transfer from harvesting source to the load. For all these reasons and the strong ESD robustness, the cool bypass switch is the significant evolution with respect to the traditional standard Schottky diode.
Table 1: Device summary
Order code
SPV1512N
Operating temperature range
-40 to 125 °C
Package
VFQFPN (6x5x0.75) 8L
Packing
Tape and reel
October 2015 DocID023620 Rev 2
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
1/12 www.st.com
Contents
Contents
SPV1512
1 Electrical ratings ............................................................................ 3
2 Electrical characteristics ............................................................... 4
3 Recommended footprint on the application board ...................... 6
4 Package information ...................................................................... 7
VFQFPN (6x5x0.75) package information ....................................... 8
VFQFPN (6x5x0.75) packing information ......................................... 9
5 Revision history ........................................................................... 11
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SPV1512
1
Electrical ratings
Electrical ratings
Symbol
Table 2: Absolute maximum ratings
Parameter
V
R
I
F
T
J
T
STG
R
TH(j-c)
ESD
Max. DC reverse voltage
Max. forward current
Junction temperature range
Storage temperature range
Thermal resistance, junction-to-case
Human body model
Value
12
16
-40 to 150
-40 to 175
4
8
Unit
V
A
°C
°C
°C/W kV
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Electrical characteristics
2 Electrical characteristics
SPV1512
T
AMB
= 25 °C unless otherwise specified
Symbol Parameter
Table 3: Electrical characteristics
Test conditions
V
F
I
R
Forward voltage drop
I
F
= 1 A
I
F
= 10 A
I
F
= 16 A
Reverse leakage current V
R
= 12 V
T
J
= 25 °C
T
J
= 125 °C
T
J
= 25 °C
T
J
= 125 °C
T
J
= 25 °C
T
J
= 125 °C
T
J
= 25 °C
T
J
= 125 °C
Min. Typ. Max. Unit
- 100 -
- 110 -
-
-
115
130
-
- mV
140 -
-
-
-
160
10
100
-
-
-
-
μA
Figure 1: Forward power dissipation vs. forward current
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SPV1512
1000
I
R
[uA]
100
Electrical characteristics
Figure 2: Reverse current vs. reverse voltage
10
1
150
o
C
125 o C
100 o C
75 o
C
50 o
C
25 o C
0.1
4 5 6 7 8 9 10 11
Figure 3: Forward current vs. ambient temperature
12 V
R
[V]
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Recommended footprint on the application board
3
SPV1512
Recommended footprint on the application board
The below figure shows the suggested footprint on the board, in order to improve heat dissipation.
Figure 4: Recommended footprint
7.2 mm
1.8 mm 1.8 mm 3.6 mm
0.9 mm
1.2 mm
0.9 mm
1.2 mm
6.6 mm
R0.3
1.5 mm
1.2 mm
0.9 mm
0.9 mm
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SPV1512
4 Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK ® is an ST trademark.
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Package information
4.1 VFQFPN (6x5x0.75) package information
Figure 5: VFQFPN (6x5x0.75) package outline
SPV1512
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8417098 C
SPV1512
4.2
Dim.
L1 b aaa bbb ccc
N
E
E2 e
L
A
A1
D
D2
Package information
Table 4: VFQFPN (6x5x0.75) package mechanical data mm
Min. Typ. Max.
0.40
0.70
0
4.11
2.35
1.10
0.30
0.45
0.05
0.10
0.10
8
0.75
0.02
5.00
4.26
6.00
2.50
1.27
1.20
0.50
0.85
0.05
4.36
2.60
1.30
VFQFPN (6x5x0.75) packing information
Figure 6: VFQFPN (6x5x0.75) tape outline
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Package information
Figure 7: VFQFPN (6x5x0.75) carrier tape outline
SPV1512
Figure 8: VFQFPN (6x5x0.75) reel outline
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SPV1512
5 Revision history
Date Revision
Table 5: Document revision history
Changes
31-Aug-2012
08-Oct-2015
1
2
Revision history
First release.
Updated the cover image, features, applications, description and device summary table.
Changed the title.
Changed figure titled "Reverse current vs. reverse voltage" and updated the rest of figures relative to section titled “Electrical characteristics”.
Added a new section titled: "Recommended footprint on the application board".
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SPV1512
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2015 STMicroelectronics – All rights reserved
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