ESDL20-1BF4
Low clamping and low capacitance bidirectional single line ESD protection
Datasheet - production data
Description
The ESDL20-1BF4 is a bidirectional single line
TVS diode designed to protect the data line or other I/O ports against ESD transients.
The device is ideal for applications where both reduced line capacitance and board space saving are required.
Figure 1: Functional diagram
0201 package
Features
Low V
BR
/V
CL
ratio
Bidirectional device
Low leakage current < 10 nA
0201 package
Ultra low PCB area: 0.18 mm 2
ECOPACK®2 compliant component
Exceeds the IEC 61000-4-2 level 4 standard
IEC 61000-4-2 level 4:
±30 kV (air discharge)
±20 kV (contact discharge)
Applications
Where transient over voltage protection in ESD sensitive equipment is required, such as:
Smartphones, mobile phones and accessories
Tablets and notebooks
Portable multimedia devices and accessories
Wearable, home automation, healthcare
Highly integrated systems
July 2017 DocID030559 Rev 2
This is information on a product in full production.
1/9 www.st.com
Characteristics
1 Characteristics
Symbol
V
PP
P
PP
I
PP
T j
T stg
T
L
Table 1: Absolute maximum ratings
Parameter
Peak pulse voltage
Contact discharge
Air discharge
Peak pulse power dissipation (8/20 μs)
Peak pulse current (8/20 μs)
Operating junction temperature range
Storage temperature range
Maximum lead temperature for soldering during 10 s
Figure 2: Electrical characteristics (definitions)
ESDL20-1BF4
Value
20
30
90
2.4
-55 to +150
-65 to +150
260
Unit kV
W
A
°C
°C
°C
Symbol
V
BR
I
RM
V
CL
C
LINE
I
R
= 1 mA
V
RM
= 20 V
Table 2: Electrical characteristics (T amb
= 25 °C)
Parameter Min. Typ. Max. Unit
8kV contact discharge after 30 ns, IEC 61000-4-2
F = 1 MHz, V
LINE
= 0 V, V
OSC
= 30 mV
22
39
13
25
10
13.5
V nA
V pF
2/9 DocID030559 Rev 2
ESDL20-1BF4
Figure 3: Leakage current versus junction temperature (typical values)
6
IR ( nA)
VR = VRM = 20 V
5
Characteristics
Figure 4: Junction capacitance versus applied voltage (typical values)
4
3
2
1
C (pF )
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0 2 4 6 8 10 12 14
T j
= 25°C
F = 1 MHz
V
OSC
= 30 mV
16
V
R
(V)
18 20
0
25
10 V/div
54 V
1
50
38 V
2
75
37 V
3
100 125
Tj (°C)
150
Figure 5: ESD response to IEC 61000-4-2
(+8 kV contact discharge)
34 V
4
3
4
1
2
Peak clamping voltage
Clamping voltage at 30 ns
Clamping voltage at 60 ns
Clamping voltage at 100 ns
10V/div
Figure 6: ESD response to IEC 61000-4-2
(-8 kV contact discharge)
1
2
3
4
Peak clamping voltage
Clamping voltage at 30 ns
Clamping voltage at 60 ns
Clamping voltage at 100 ns
36 V
2
36 V
3
35 V
4
1
53 V
20 ns/div
20 ns/div
25
IPP (A)
Figure 7: TLP characteristic
20
15
10
5
0
20 25 30 35 40
VCL (V)
45
0.00
Figure 8: S21 attenuation measurement result
S21(dB)
S21-1
-5.00
-10.00
-15.00
-20.00
-25.00
-30.00
100.0k
1.0M
10.0M
100.0M
F(Hz)
1.0G
DocID030559 Rev 2 3/9
Package information
2
2.1
Package information
ESDL20-1BF4
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK ® is an ST trademark.
0201 package information
Figure 9: 0201 package outline
4/9 DocID030559 Rev 2
ESDL20-1BF4
Ref.
E
E1 fD fE
A b
D
D1
Table 3: 0201 package mechanical data
Dimensions
Millimeters
Min.
0.270
0.1675
0.560
0.260
0.205
0.0175
0.0175
Typ.
0.300
0.1875
0.580
0.3375
0.280
0.225
0.0275
0.0275
Figure 10: Marking
Package information
Max.
0.330
0.2075
0.600
0.300
0.245
0.0375
0.0375
Pin1 Pin2
Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose.
0.22
Figure 11: Tape and reel specification (in mm)
Bar indicates Pin 1
Ø 1.5 ± 0.1
2.0 ± 0.05
4.0 ± 0.1
0.36 ± 0.03
All dimensions in mm
2 2 2
2
2
2 2
0.38 ± 0.03
2.0 ± 0.05
User direction of unreeling
DocID030559 Rev 2 5/9
Recommendation on PCB assembly
3
3.1
Recommendation on PCB assembly
Footprint
1. Footprint in mm a. SMD footprint design is recommended.
Figure 12: Footprint in mm
ESDL20-1BF4
3.2 Stencil opening design
1. Recommended design reference a. Stencil opening thickness: 75 μm / 3 mils
Figure 13: Recommended stencil window position in mm (inches)
3.3 Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed.
4. Use solder paste with fine particles: powder particle size 20-38 µm.
6/9 DocID030559 Rev 2
ESDL20-1BF4
3.4 Placement
Recommendation on PCB assembly
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering
3. Standard tolerance of ±0.05 mm is recommended.
4. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools.
3.5 PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open vias.
2. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away.
3.6 Reflow profile
Figure 14: ST ECOPACK® recommended soldering reflow profile for PCB mounting
Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-
STD-020.
DocID030559 Rev 2 7/9
Ordering information
4 Ordering information
Figure 15: Ordering information scheme
ESDL20-1BF4
ESD L 20 1 B F4
ESD protection
L : Low capacitance
20 : Stand-off voltage at 20 V min.
Number of lines
B = Bi-directional
Package
F4 = 0201
5
Order code
ESDL20-1BF4
Marking
2 (1)
Table 4: Ordering information
Package Weight Base qty.
0201 0.116 mg 15000
Notes:
(1)
The marking can be rotated by multiples of 90° to differentiate assembly location.
Delivery mode
Tape and reel
Revision history
Date Revision
Table 5: Revision history table
Changes
14-Jun-2017
28-Jul-2017
1
2
First issue.
Updated footprint title.
8/9 DocID030559 Rev 2
ESDL20-1BF4
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DocID030559 Rev 2 9/9
