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Boxed Processor Fan Heatsink Weight. Intel AT80571RG0601ML, AT80571RG0561ML
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Boxed Processor Specifications
Figure 21.
Overall View Space Requirements for the Boxed Processor
7.2.2
7.2.3
7.3
7.3.1
Boxed Processor Fan Heatsink Weight
The boxed processor fan heatsink will not weigh more than 450 grams. See Chapter 5
and the appropriate Thermal and Mechanical Design Guidelines (see Section 1.2
) for details on the processor weight and heatsink requirements.
Boxed Processor Retention Mechanism and Heatsink
Attach Clip Assembly
The boxed processor thermal solution requires a heatsink attach clip assembly, to secure the processor and fan heatsink in the baseboard socket. The boxed processor will ship with the heatsink attach clip assembly.
Electrical Requirements
Fan Heatsink Power Supply
The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable will be shipped with the boxed processor to draw power from a power header on the
baseboard. The power cable connector and pinout are shown in Figure 22
. Baseboards
must provide a matched power header to support the boxed processor. Table 29
contains specifications for the input and output signals at the fan heatsink connector.
The fan heatsink outputs a SENSE signal, which is an open- collector output that pulses at a rate of 2 pulses per fan revolution. A baseboard pull-up resistor provides V
OH
to match the system board-mounted fan speed monitor requirements, if applicable. Use of the SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector should be tied to GND.
The fan heatsink receives a PWM signal from the motherboard from the 4th pin of the connector labeled as CONTROL.
Datasheet 93
Boxed Processor Specifications
The boxed processor's fanheat sink requires a constant +12 V supplied to pin 2 and does not support variable voltage control or 3-pin PWM control.
The power header on the baseboard must be positioned to allow the fan heatsink power cable to reach it. The power header identification and location should be documented in the platform documentation, or on the system board itself.
location of the fan power connector relative to the processor socket. The baseboard power header should be positioned within 110 mm [4.33 inches] from the center of the processor socket.
Figure 22.
Boxed Processor Fan Heatsink Power Cable Connector Description
1
2
3
4
Pin Signal
GND
+12 V
SENSE
CONTROL
Straight square pin, 4-pin terminal housing with polarizing ribs and friction locking ramp.
0.100" pitch, 0.025" square pin width.
Match with straight pin, friction lock header on mainboard.
1 2 3 4
Table 29.
Fan Heatsink Power and Signal Specifications
Description
+12 V: 12 volt fan power supply
IC:
• Maximum fan steady-state current draw
• Average fan steady-state current draw
• Maximum fan start-up current draw
• Fan start-up current draw maximum duration
Min
11.4
—
—
—
—
Typ
12
1.2
0.5
2.2
1.0
SENSE: SENSE frequency — 2
CONTROL 21 25
NOTES:
1. Baseboard should pull this pin up to 5 V with a resistor.
2. Open drain type, pulse width modulated.
3. Fan will have pull-up resistor for this signal to maximum of 5.25 V.
Max
12.6
—
—
—
—
—
28
Unit
V
A
A
A
Second pulses per fan revolution kHz
Notes
-
-
1
2, 3
94 Datasheet
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Key Features
- IntelĀ® CeleronĀ® E3200 2.4 GHz
- 1 MB L2 LGA 775 (Socket T)
- Processor cores: 2 45 nm 64-bit 65 W
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Table of contents
- 9 Introduction
- 9 Terminology
- 10 Processor Terminology Definitions
- 11 References
- 13 Electrical Specifications
- 13 Power and Ground Lands
- 13 Decoupling Guidelines
- 13 VCC Decoupling
- 13 VTT Decoupling
- 14 FSB Decoupling
- 14 Voltage Identification
- 16 Reserved, Unused, and TESTHI Signals
- 16 Power Segment Identifier (PSID)
- 17 Voltage and Current Specification
- 17 Absolute Maximum and Minimum Ratings
- 18 DC Voltage and Current Specification
- 20 VCC Overshoot
- 21 Die Voltage Validation
- 21 Signaling Specifications
- 22 FSB Signal Groups
- 23 CMOS and Open Drain Signals
- 24 Processor DC Specifications
- 25 Platform Environment Control Interface (PECI) DC Specifications
- 26 GTL+ Front Side Bus Specifications
- 27 Clock Specifications
- 27 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
- 28 FSB Frequency Select Signals (BSEL[2:0])
- 29 Phase Lock Loop (PLL) and Filter
- 29 BCLK[1:0] Specifications
- 33 Package Mechanical Specifications
- 33 Package Mechanical Drawing
- 37 Processor Component Keep-Out Zones
- 37 Package Loading Specifications
- 37 Package Handling Guidelines
- 38 Package Insertion Specifications
- 38 Processor Mass Specification
- 38 Processor Materials
- 38 Processor Markings
- 39 Processor Land Coordinates
- 41 Land Listing and Signal Descriptions
- 41 Processor Land Assignments
- 64 Alphabetical Signals Reference
- 75 Thermal Specifications and Design Considerations
- 75 Processor Thermal Specifications
- 75 Thermal Specifications
- 78 Thermal Metrology
- 78 Processor Thermal Features
- 78 Thermal Monitor
- 80 On-Demand Mode
- 81 PROCHOT# Signal
- 81 THERMTRIP# Signal
- 82 Platform Environment Control Interface (PECI)
- 82 Introduction
- 82 TCONTROL and TCC activation on PECI-Based Systems
- 83 PECI Specifications
- 83 PECI Device Address
- 83 PECI Command Support
- 83 PECI Fault Handling Requirements
- 83 PECI GetTemp0() Error Code Support
- 85 Features
- 85 Power-On Configuration Options
- 85 Clock Control and Low Power States
- 86 Normal State
- 86 HALT and Extended HALT Powerdown States
- 86 HALT Powerdown State
- 87 Extended HALT Powerdown State
- 87 Stop Grant and Extended Stop Grant States
- 87 Stop-Grant State
- 88 Extended Stop Grant State
- 88 Stop Grant Snoop State, and Stop Grant Snoop State
- 88 HALT Snoop State, Stop Grant Snoop State
- 88 Extended HALT Snoop State, Extended Stop Grant Snoop State
- 88 Sleep State
- 89 Deep Sleep State
- 89 Deeper Sleep State
- 90 Technology
- 90 Processor Power Status Indicator (PSI) Signal
- 91 Boxed Processor Specifications
- 91 Introduction
- 92 Mechanical Specifications
- 92 Boxed Processor Cooling Solution Dimensions
- 93 Boxed Processor Fan Heatsink Weight
- 93 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly
- 93 Electrical Requirements
- 93 Fan Heatsink Power Supply
- 95 Thermal Specifications
- 95 Boxed Processor Cooling Requirements
- 97 Variable Speed Fan
- 99 Debug Tools Specifications
- 99 Logic Analyzer Interface (LAI)
- 99 Mechanical Considerations
- 99 Electrical Considerations