Power Supply Current. Infineon SAK-TC1762-128F66HL AC, SAK-TC1762-128F80HL AC

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Power Supply Current. Infineon SAK-TC1762-128F66HL AC, SAK-TC1762-128F80HL AC | Manualzz

TC1762

Preliminary Electrical Parameters

4.2.6

Power Supply Current

Table 4-10

provides the characteristics of the power supply current in the TC1762.

Table 4-10 Power Supply Current (Operating Conditions apply)

Parameter Symbol Limit Values

Min. Typ. Max.

Unit Test

Conditions /

Remarks

PORST low current at

V

DD

PORST low current at

V

DDP

I

I

DD_PORST

DDP_PORST

CC –

CC –

96

1)

138

2)

12

1)

13

2)

mA The PLL running at the base frequency mA The PLL running at the base frequency mA f

CPU

= 80MHz f

CPU

/ f

SYS

= 1:1

Active mode core supply current

3)4)

Active mode core supply current

3)4)

I

I

DD

DD

CC –

CC –

290

1)

330

2)

250

1)

300

2)

– mA f

CPU

= 66MHz f

CPU

/ f

SYS

= 1:1

Active mode analog supply current

Oscillator and PLL core power supply

Oscillator and PLL pads power supply

I

I

I

I

DDAx;

DDMx

DDOSC

DDOSC3

CC –

CC –

CC –

5

3.6

5) mA See

ADC0/FADC mA – mA –

FLASH power supply current

I

DDFL3

CC – – 45 mA –

LVDS port supply

(via V

DDP

)

6)

Maximum Allowed

Power Dissipation

7)

I

P

LVDS

Dmax

CC –

SR

– 25 mA LVDS pads active

P

D

× R

TJA

< 25°C – At worst case,

T

A

= 125 °C

1) Maximum value measured at T

A

= 125 °C.

2) Maximum value measured at T

J

= 150 °C.

3) Infineon Power Loop: CPU and PCP running, all peripherals active. The power consumption of each custom application will most probably be lower than this value, but must be evaluated separately.

4) The I

DD

decreases typically to 240mA if the f

CPU

is decreased to 40 MHz, at constant T

J

Infineon Max. Power Loop.

= 150 °C, for the

5) Estimated value; double-bonded at package level with V

DDP

.

6) In case the LVDS pads are disabled, the power consumption per pair is negligible (less than 1

µA).

7) For the calculation of the junction to ambient thermal resistance R

TJA

, see

Chapter 5.1

.

Data Sheet 88 V1.0, 2008-04

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