Electrical characteristics STM32F101x4, STM32F101x6
5.3.5
The parameters given in
Table 11
are derived from tests performed under the ambient temperature and V
DD
supply voltage conditions summarized in
Table 8
.
Symbol
Table 11. Embedded internal reference voltage
Parameter Conditions Min Typ Max Unit
V
REFINT
Internal reference voltage
T
S_vrefint
(1)
ADC sampling time when reading the internal reference voltage
–40 °C < T
A
< +85 °C 1.16 1.20
1.24
5.1
17.1
(2)
V
RERINT
(2)
Internal reference voltage spread over the temperature range
V
DD
= 3 V ±10 mV 10
V
µs mV
T
Coeff
(2)
Temperature coefficient 100 ppm/
°C
1. Shortest sampling time can be determined in the application by multiple iterations.
2. Guaranteed by design, not tested in production.
Supply current characteristics
The current consumption is a function of several parameters and factors such as the operating voltage, ambient temperature, I/O pin loading, device software configuration, operating frequencies, I/O pin switching rate, program location in memory and executed binary code.
The current consumption is measured as described in
Figure 11: Current consumption measurement scheme
.
All Run-mode current consumption measurements given in this section are performed with a reduced code that gives a consumption equivalent to Dhrystone 2.1 code.
Maximum current consumption
The MCU is placed under the following conditions:
• All I/O pins are in input mode with a static value at V
DD
or V
SS
(no load)
• All peripherals are disabled except if it is explicitly mentioned
• The Flash access time is adjusted to f
HCLK wait state from 24 to 36 MHz)
frequency (0 wait state from 0 to 24 MHz, 1
• Prefetch in on (reminder: this bit must be set before clock setting and bus prescaling)
• When the peripherals are enabled f
PCLK1
= f
HCLK/2
, f
PCLK2
= f
HCLK
The parameters given in
Table 12 are derived from tests performed under the ambient
temperature and V
DD
supply voltage conditions summarized in
Table 8
.
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STM32F101x4, STM32F101x6 Electrical characteristics
Table 12. Maximum current consumption in Run mode, code with data processing running from Flash
Max
(1)
Symbol Parameter Conditions f
HCLK
Unit
T
A
= 85 °C
36 MHz 26
I
DD
Supply current in Run mode
External clock
(2)
, all peripherals enabled
External clock
(2)
, all peripherals Disabled
24 MHz
16 MHz
8 MHz
36 MHz
24 MHz
16 MHz
8 MHz
13
10
6
18
13
7
19 mA
1. Based on characterization, not tested in production.
2. External clock is 8 MHz and PLL is on when f
HCLK
> 8 MHz.
Table 13. Maximum current consumption in Run mode, code with data processing running from RAM
Max
(1)
Symbol Parameter Conditions f
HCLK
Unit
T
A
= 85 °C
I
DD
Supply current in
Run mode
External clock
(2)
, all peripherals enabled
External clock
(2)
all peripherals disabled
36 MHz
24 MHz
16 MHz
8 MHz
36 MHz
24 MHz
16 MHz
8 MHz
20
14
10
6
15
10
7
5 mA
1. Based on characterization, tested in production at V
DD max, f
HCLK
max.
2. External clock is 8 MHz and PLL is on when f
HCLK
> 8 MHz.
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Electrical characteristics STM32F101x4, STM32F101x6
Figure 12. Typical current consumption in Run mode versus frequency (at 3.6 V) code with data processing running from RAM, peripherals enabled
25
20
15
36 MHz
16 MHz
8 MHz
10
5
0
– 45°C 25 °C 70 °C
Temperat u re (°C)
85 °C
Figure 13. Typical current consumption in Run mode versus frequency (at 3.6 V) code with data processing running from RAM, peripherals disabled
16
14
12
10
8
6
4
2
0
36 MHz
16 MHz
8 MHz
– 45°C 25 °C 70 °C
Temperat u re (°C)
85 °C
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Table 14. Maximum current consumption in Sleep mode, code running from Flash or RAM
Max
(1)
Symbol Parameter Conditions f
HCLK
Unit
T
A
= 85 °C
36 MHz 14
I
DD
Supply current in
Sleep mode
External clock
(2)
all peripherals enabled
External clock
(2)
, all peripherals disabled
24 MHz
16 MHz
8 MHz
36 MHz
24 MHz
16 MHz
8 MHz
4.5
4
3
4
5
10
7 mA
1. Based on characterization, tested in production at V
DD max and f
HCLK
max with peripherals enabled.
2. External clock is 8 MHz and PLL is on when f
HCLK
> 8 MHz.
Table 15. Typical and maximum current consumptions in Stop and Standby modes
Typ
(1)
Max
Symbol Parameter Conditions
V
DD
/V
BAT
= 2.0 V
V
DD
/ V
BAT
= 2.4 V
V
DD
/V
BAT
= 3.3 V
T
A
=
85 °C
(2)
Unit
I
DD
Supply current in
Stop mode
Regulator in Run mode,
Low-speed and high-speed internal
RC oscillators and high-speed oscillator OFF (no independent watchdog)
Regulator in Low Power mode,
Low-speed and high-speed internal
RC oscillators and high-speed oscillator OFF (no independent watchdog)
Supply current in
Standby mode
Low-speed internal RC oscillator and independent watchdog ON
Low-speed internal RC oscillator
ON, independent watchdog OFF
I
DD_VBAT
Low-speed internal RC oscillator and independent watchdog OFF, low-speed oscillator and RTC OFF
Backup domain supply current
Low-speed oscillator and RTC ON
1. Typical values are measured at T
A
= 25 °C.
2. Based on characterization, not rested in production.
-
-
-
-
-
0.9
21.3
11.3
2.6
2.4
1.7
1.1
21.7
11.7
3.4
3.2
2
1.4
160
145
-
-
3.2
1.9
µA
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45
40
35
30
25
20
15
10
5
0
Figure 14. Typical current consumption on V
BAT different
with RTC on versus temperature at
V
BAT
values
2.5
2
1.5
1
0.5
0
2 V
2.4 V
3 V
3 .6 V
–40 °C 25 °C 70 °C
Temper a ture (°C)
8 5 °C 105 °C a i17 3 51
Figure 15. Typical current consumption in Stop mode with regulator in Run mode versus temperature at V
DD
= 3.3 V and 3.6 V
3.3 V
3.6 V
–45 °C 25 °C
Temperat u re (°C)
85 °C
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Figure 16. Typical current consumption in Stop mode with regulator in Low-power mode versus temperature at V
DD
= 3.3 V and 3.6 V
25
20
15
10
5
0
3.3 V
3.6 V
–45 °C 25 °C
Temperat u re (°C)
85 °C
3
2.5
2
1.5
1
Figure 17. Typical current consumption in Standby mode versus temperature at V
DD
3.3 V and
=
3.6 V
3.5
3.3 V
3.6 V
0.5
0
–45 °C 25 °C
Temperat u re (°C)
85 °C
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Electrical characteristics STM32F101x4, STM32F101x6
Typical current consumption
The MCU is placed under the following conditions:
• All I/O pins are in input mode with a static value at V
DD
or V
SS
(no load)
• All peripherals are disabled except if it is explicitly mentioned
• The Flash access time is adjusted to f
HCLK wait state from 24 to 36 MHz)
frequency (0 wait state from 0 to 24 MHz, 1
• Prefetch is on (reminder: this bit must be set before clock setting and bus prescaling)
• When the peripherals are enabled f
PCLK1 f
PCLK2
/4
= f
HCLK/4
, f
PCLK2
= f
HCLK/2
, f
ADCCLK
=
The parameters given in
Table 16 are derived from tests performed under the ambient
temperature and V
DD
supply voltage conditions summarized in
Table 8
.
Table 16. Typical current consumption in Run mode, code with data processing running from Flash
Typ
(1)
Typ
(1)
Symbol Parameter Conditions f
HCLK All peripherals enabled
(2)
All peripherals disabled
Unit
36 MHz 17.2
13.8
I
DD
Supply current in
Run mode
External clock
(3)
Running on high speed internal RC
(HSI), AHB prescaler used to reduce the frequency
24 MHz
16 MHz
8 MHz
4 MHz
2 MHz
1 MHz
500 kHz
125 kHz
36 MHz
24 MHz
16 MHz
8 MHz
4 MHz
2 MHz
1 MHz
500 kHz
125 kHz
2
1.5
1.2
1.05
16.5
10.5
11.2
8.1
5
3
1.5
1
0.7
0.5
7.4
4.3
2.4
mA
1.8
1.4
1.2
1
13.1
8.2
8.9
6.6
4.2
2.6
5.9
3.6
2
1.3
0.9
0.65
0.45
1. Typical values are measures at T
A
= 25 °C, V
DD
= 3.3 V.
2. Add an additional power consumption of 0.8 mA per ADC for the analog part. In applications, this consumption occurs only while the ADC is on (ADON bit is set in the ADC_CR2 register).
3. External clock is 8 MHz and PLL is on when f
HCLK
> 8 MHz.
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Table 17. Typical current consumption in Sleep mode, code running from Flash or
RAM
Typ (1) Typ (1)
Symbol Parameter Conditions f
HCLK All peripherals enabled
(2)
All peripherals disabled
Unit
I
DD
External clock
(3)
Supply current in
Sleep mode
125 kHz
36 MHz
24 MHz
Running on High
Speed Internal RC
(HSI), AHB prescaler used to reduce the frequency
16 MHz
8 MHz
4 MHz
2 MHz
1 MHz
36 MHz
24 MHz
16 MHz
8 MHz
4 MHz
2 MHz
1 MHz
500 kHz
6.7
4.8
3.4
2
1.5
1.25
1.1
1.05
1
6.1
4.2
2.8
1.4
0.9
0.7
0.55
1.1
1
0.98
0.96
3.1
2.3
1.8
1.2
500 kHz
125 kHz
0.48
0.4
0.4
0.38
1. Typical values are measures at T
A
= 25 °C, V
DD
= 3.3 V.
2. Add an additional power consumption of 0.8 mA per ADC for the analog part. In applications, this consumption occurs only while the ADC is on (ADON bit is set in the ADC_CR2 register).
3. External clock is 8 MHz and PLL is on when f
HCLK
> 8 MHz.
0.95
2.5
1.7
1.2
0.55
0.5
0.45
0.42
mA
On-chip peripheral current consumption
The current consumption of the on-chip peripherals is given in
Table 18 . The MCU is placed
under the following conditions:
• all I/O pins are in input mode with a static value at V
DD
or V
SS
(no load)
• all peripherals are disabled unless otherwise mentioned
• the given value is calculated by measuring the current consumption
– with all peripherals clocked off
– with only one peripheral clocked on
• ambient operating temperature and V
DD
Table 5
.
supply voltage conditions summarized in
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