Package information
7.5
STM32L151xC STM32L152xC
UFBGA100, 7 x 7 mm, 100-ball ultra thin, fine pitch ball grid array package information
Figure 44. UFBGA100, 7 x 7 mm, 0.5 mm pitch package outline
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Table 70. UFBGA100, 7 x 7 mm, 0.5 mm pitch package mechanical data millimeters inches
(1)
Symbol
Min Typ Max Min Typ Max
D1
E
E1 e
F ddd
A3
A4 b
D
A
A1
A2
5.450
6.950
5.450
-
0.700
-
0.460
0.050
0.400
0.080
0.270
0.200
6.950
5.500
7.000
5.500
0.500
0.750
-
0.530
0.080
0.450
0.130
0.320
0.250
7.000
5.550
7.050
5.550
-
0.800
0.100
0.600
0.110
0.500
0.180
0.370
0.300
7.050
0.2146
0.2736
0.2146
-
0.0276
-
0.0181
0.0020
0.0157
0.0031
0.0106
0.0079
0.2736
0.2165
0.2756
0.2165
0.0197
0.0295
-
0.0209
0.0031
0.0177
0.0051
0.0126
0.0098
0.2756
0.2185
0.2776
0.2185
-
0.0315
0.0039
0.0236
0.0043
0.0197
0.0071
0.0146
0.0118
0.2776
122/136 DocID022799 Rev 13
STM32L151xC STM32L152xC Package information
Table 70. UFBGA100, 7 x 7 mm, 0.5 mm pitch package mechanical data (continued) millimeters inches (1)
Symbol
Min Typ Max Min Typ Max eee fff
-
-
-
-
0.150
0.050
-
-
1. Values in inches are converted from mm and rounded to 4 decimal digits.
-
0.0059
0.0020
Figure 45. UFBGA100, 7 x 7 mm, 0.5 mm pitch, package recommended footprint
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Table 71. UFBGA100, 7 x 7 mm, 0.50 mm pitch, recommended PCB design rules
Dimension Recommended values
Pitch
Dpad
Dsm
Stencil opening
Stencil thickness
0.5
0.280 mm
0.370 mm typ. (depends on the soldermask registration tolerance)
0.280 mm
Between 0.100 mm and 0.125 mm
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135
Package information STM32L151xC STM32L152xC
UFBGA100 device marking
The following figure gives an example of topside marking orientation versus ball A1 identifier location.
Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below.
Figure 46. UFBGA100, 7 x 7 mm, 0.5 mm pitch, package top view example
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1. Parts marked as ES or E or accompanied by an engineering sample notification letter are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity.
124/136 DocID022799 Rev 13
