STM32L151xC STM32L152xC
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Package information
WLCSP63, 0.400 mm pitch wafer level chip size package information
Figure 47. WLCSP63, 0.400 mm pitch wafer level chip size package outline
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Package information STM32L151xC STM32L152xC
Table 72. WLCSP63, 0.400 mm pitch wafer level chip size package mechanical data millimeters inches
(1)
Symbol
Min Typ Max Min Typ Max
G aaa bbb ccc ddd eee
A3
Øb
D
E
A
A1
A2 e e1 e2
F
0.540
-
-
-
0.240
3.193
4.129
-
-
-
-
-
-
-
-
-
-
0.570
0.190
0.380
0.025
0.270
3.228
4.164
0.400
2.400
3.200
0.414
0.482
-
-
-
-
-
0.0213
-
-
-
0.0094
0.1257
0.1626
-
-
-
-
-
-
-
-
-
1. Values in inches are converted from mm and rounded to 4 decimal digits.
-
0.100
0.100
0.100
0.050
0.050
-
-
-
-
0.600
-
-
-
0.300
3.263
4.199
0.0157
0.0945
0.1260
0.0163
0.0190
-
-
-
-
-
0.0224
0.0075
0.0150
0.0010
0.0106
0.1271
0.1639
-
-
-
-
-
0.0039
0.0039
0.0039
0.0020
0.0020
0.0236
-
-
-
0.0118
0.1285
0.1653
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STM32L151xC STM32L152xC Package information
WLCSP63 device marking
The following figure gives an example of topside marking orientation versus ball A1 identifier location.
Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below.
Figure 48. WLCSP63 device marking example
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1. Parts marked as ES or E or accompanied by an engineering sample notification letter are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity.
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