Package mechanical data. STMicroelectronics Low voltage 0.9Ω max dual SPST switch
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Package mechanical data
5 Package mechanical data
STG3384 e
K
D
E
L
A
A1 b
L1
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
DFN10 (2.5x1.3) MECHANICAL DATA
DIM.
MIN.
0.50
0
0.18
2.40
1.30
2.50
1.40
0.50
mm.
TYP
0.55
0.02
0.23
MAX.
0.60
0.05
0.30
2.60
1.50
MIN.
19.7
0
7.1
94.5
51.2
98.4
55.1
19.7
mils
TYP.
21.7
0.8
9.1
MAX.
23.6
2.0
11.8
102.4
59.1
0.20
0.45
0.50
0.55
0.15
7.9
17.7
19.7
21.6
5.9
Obsolete Product(s) - Obsolete Product(s)
7771991A
10/12
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