Packaging. Infineon CY8C6347FMI-BUD33T, CY8C6347FMI-BLD43T, CY8C6347BZI-BLD53T, CY8C6347BZI-BLD43T, CY8C6347FMI-BLD33T, CY8C6347BZI-BLD34, CY8C6347FMI-BLD53T, CY8C6347BZI-BLD44, CY8C6347FMI-BUD13T, CY8C6336LQI-BLF42
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PSoC 6 MCU: CY8C63x6,
CY8C63x7 Datasheet
Packaging
This product line is offered in four packages: 68-QFN, 116-BGA, 124-BGA, and 104-M-CSP.
Table 60. Package Dimensions
Spec ID# Package Description
PKG_1 124-BGA 124-BGA, 9 9 1 mm height with 0.65-mm pitch
PKG_2 104-M-CSP 104-M-CSP, 3.8 5 0.65 mm height with 0.35-mm pitch
PKG_4 116-BGA 116-BGA, 5.2 6.4 0.70 mm height with 0.5-mm pitch
PKG_5 68-QFN 68-QFN, 8 8 1 mm height with 0.4-mm pitch
Table 61. Package Characteristics
Parameter
T
A
T
J
T
JA
T
JC
T
JA
T
JC
T
JA
T
JC
T
JA
T
JC
Description
Operating ambient temperature
Operating junction temperature
Package
JA
(124-BGA)
Package
JC
(124-BGA)
Package
JA
(116-BGA)
Package
JC
(116-BGA)
Package
JA
(104-CSP)
Package
JC
(104-CSP)
Package
JA
(68-QFN)
Package
JC
(68-QFN)
Table 62. Solder Reflow Peak Temperature
Package
124-BGA, 116-BGA, and 68-QFN
104-M-CSP
Conditions
–
–
–
–
–
–
–
–
–
–
Maximum Peak Temperature
260 °C
260 °C
–
–
–
–
Min
–40
–40
–
–
–
–
Package Drawing Number
001-97718
002-16508
002-16574
001-96836
Typ
25.00
–
64.3
37
36.5
12
33.7
0.2
21.6
7.2
–
–
–
–
Max
85
100
–
–
–
–
Maximum Time at Peak Temperature
30 seconds
30 seconds
Unit
°C
°C
°C/watt
°C/watt
°C/watt
°C/watt
°C/watt
°C/watt
°C/watt
°C/watt
Table 63. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Package
124-BGA, 116-BGA, and 68-QFN
104-M-CSP
MSL
MSL 3
MSL 1
Document Number: 002-18787 Rev. *Q Page 76 of 86
7.
Figure 21. 104-M-CSP 3.8 × 5.0 × 0.65 mm
PSoC 6 MCU: CY8C63x6,
CY8C63x7 Datasheet
5.
6.
TOP VIEW
BOTTOM VIEW
6.
SIDE VIEW
SYMBOL
D1
E1
MD
ME
N b eD eE
SD
SE
D
E
A
A1
MIN.
-
0.167
3.791
4.95
0.215
0.335
0.335
DIMENSIONS
NOM.
-
0.185
3.841
5.00
2.80 BSC
4.55 BSC
9
14
104
0.245
0.350
0.350
0.35 BSC
0.175 BSC
0.275
0.365
0.365
MAX.
0.650
0.203
3.891
5.05
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2.
SOLDER BALL POSITION DESIGNATION PER JEP95, SECTION 3, SPP-020.
3.
4.
"e" REPRESENTS THE SOLDER BALL GRID PITCH.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.
N IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS FOR MATRIX
SIZE MD X ME.
5.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A
PLANE PARALLEL TO DATUM C.
6.
"SD" AND "SE" ARE MEASURED WITH RESPECT TO DATUMS A AND B AND
DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW,
"SD" OR "SE" = 0.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW,
"SD" = eD/2 AND "SE" = eE/2.
7.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK
METALIZED MARK, INDENTATION OR OTHER MEANS.
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED SOLDER
BALLS.
9.
JEDEC SPECIFICATION NO. REF. : N/A.
002-16508 *E
Document Number: 002-18787 Rev. *Q Page 77 of 86
Figure 22. 116-BGA 5.2 × 6.4 × 0.70 mm
PSoC 6 MCU: CY8C63x6,
CY8C63x7 Datasheet
Document Number: 002-18787 Rev. *Q
002-16574 *B
Page 78 of 86
Figure 23. 124-BGA 9.0 × 9.0 ×1.0 mm
PSoC 6 MCU: CY8C63x6,
CY8C63x7 Datasheet
Document Number: 002-18787 Rev. *Q
001-97718 *B
Page 79 of 86
Figure 24. 68 QFN 8 × 8 × 1 mm
PSoC 6 MCU: CY8C63x6,
CY8C63x7 Datasheet
001-96836 *A
Document Number: 002-18787 Rev. *Q Page 80 of 86
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