STMicroelectronics VNS3NV04DP-E Datasheet
Reklam
Reklam
VNS3NV04DP-E
OMNIFET II fully autoprotected Power MOSFET
Features
Max on-state resistance (per ch.)
Current limitation (typ)
Drain-source clamp voltage
R
ON
I
LIMH
V
CLAMP
120 m
Ω
3.5 A
40 V
■
■
■
■
■
■
■
■
■
■
■
ECOPACK
®
: lead free and RoHS compliant
Automotive Grade: compliance with AEC guidelines
Linear current limitation
Thermal shutdown
Short circuit protection
Integrated clamp
Low current drawn from input pin
Diagnostic feedback through input pin
ESD protection
Direct access to the gate of the Power
MOSFET (analog driving)
Compatible with standard Power MOSFET
SO-8
Description
The VNS3NV04DP-E device is made up of two monolithic chips (OMNIFET II) housed in a standard SO-8 package. The OMNIFET II is designed using STMicroelectronics™ VIPower™
M0-3 technology and is intended for replacement of standard Power MOSFETs in up to 50 kHz DC applications.
Built-in thermal shutdown, linear current limitation and overvoltage clamp protect the chip in harsh environments.
Fault feedback can be detected by monitoring voltage at the input pin
Table 1.
Device summary
Package
SO-8
September 2013
Tube
VNS3NV04DP-E
Order codes
Tape and reel
VNS3NV04DPTR-E
Doc ID 018529 Rev 2 1/21
www.st.com
1
Contents
Contents
VNS3NV04DP-E
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Overvoltage clamp protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Overtemperature and short circuit protection . . . . . . . . . . . . . . . . . . . . . . 16
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
®
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2/21 Doc ID 018529 Rev 2
VNS3NV04DP-E
List of tables
List of tables
Doc ID 018529 Rev 2 3/21
List of figures
List of figures
VNS3NV04DP-E
4/21 Doc ID 018529 Rev 2
VNS3NV04DP-E
1
Block diagram and pin description
Block diagram and pin description
Figure 1.
Block diagram
INPUT1
OVERVOLTAGE
CLAMP
GATE
CONTROL
OVER
TEMPERATURE
LINEAR
CURRENT
LIMITER
DRAIN1
DRAIN2
OVERVOLTAGE
CLAMP
LINEAR
CURRENT
LIMITER
SOURCE1
SOURCE2
GATE
CONTROL
OVER
TEMPERATURE
INPUT2
Figure 2.
Configuration diagram (top view)
SOURCE 1
INPUT 1
SOURCE 2
INPUT 2
1
4
8
5
DRAIN 1
DRAIN 1
DRAIN 2
DRAIN 2
Doc ID 018529 Rev 2 5/21
Electrical specifications VNS3NV04DP-E
Figure 3.
Current and voltage conventions
I
IN1
V
IN1
V
IN2
I
IN2
R
IN1
R
IN2
INPUT 1
INPUT 2
SOURCE 1
DRAIN 1
DRAIN 2
SOURCE 2
I
D2
I
D1
V
DS1
V
DS1
2.1 Absolute maximum ratings
Stressing the device above the rating listed in the “Absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to Absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE program and other relevant quality document.
Table 2.
Symbol
Absolute maximum ratings
Parameter
V
DSn
V
INn
I
INn
R
IN MINn
I
Dn
I
Rn
V
ESD1
V
ESD2
P
T tot j
T c
T stg
Drain-Source Voltage (V
INn
Input voltage
Input current
Minimum input series impedance
Drain current
Reverse DC output current
Case operating temperature
Storage temperature
= 0 V)
Electrostatic discharge (R = 1.5 K
Ω, C = 100 pF)
Electrostatic discharge on output pins only (R = 330
Ω,
C = 150 pF)
Total dissipation at T c
= 25 °C
Operating junction temperature
Value
Internally clamped
Internally clamped
+/- 20
220
Internally limited
-5.5
4000
16500
4
Internally limited
Internally limited
-55 to 150
Unit
V
V mA
Ω
A
A
V
V
Ω
°C
°C
°C
6/21 Doc ID 018529 Rev 2
VNS3NV04DP-E Electrical specifications
Table 3.
Symbol
Thermal data
Parameter Max value Unit
R thj-lead
Thermal resistance junction-lead (per channel) 30 °C/W
R thj-amb
Thermal resistance junction-ambient 80
(1)
°C/W
1.
When mounted on a standard single-sided FR4 board with 50mm
2
of Cu (at least 35
μm thick) connected to all DRAIN pins of the relative channel
Values specified in this section are for -40 °C < T j
< 150 °C, unless otherwise stated.
Table 4.
Symbol
Off
Parameter
V
CLAMP
V
V
I
CLTH
INTH
ISS
Drain-source clamp voltage
Drain-source clamp threshold voltage
Input threshold voltage
Supply current from input pin
Test conditions
V
IN
= 0 V; I
D
= 1.5 A 40
V
IN
= 0 V; I
D
= 2 mA 36
V
DS
= V
IN
; I
D
= 1 mA
Min Typ Max Unit
0.5
45 55
2.5
V
DS
= 0 V; V
IN
= 5 V 100 150
V
V
V
µA
V
INCL
I
DSS
Input-source clamp voltage
Zero input voltage drain current
(V
IN
= 0 V)
I
IN
= 1 mA
I
IN
= -1 mA
V
DS
= 13 V; V
IN
= 0 V; T j
= 25 °C
V
DS
= 25 V; V
IN
= 0 V
6
-1
6.8
8
-0.3
30
75
V
V
µA
µA
Table 5.
Symbol
R
DS(on)
On
Parameter Test conditions
Static drain-source on resistance
V
IN
= 5 V; I
D
= 1.5 A; T j
= 25 °C
V
IN
= 5 V; I
D
= 1.5 A
Min Typ Max Unit
—
—
—
—
120
240 m
Ω m
Ω
T j
= 25 °C, unless otherwise specified
Table 6.
Symbol
g fs
(1)
C
OSS
Dynamic
Parameter
Forward transconductance
Output capacitance
Test conditions
V
DD
= 13 V; I
D
= 1.5 A
Min Typ Max Unit
—
V
DS
= 13 V; f = 1 MHz; V
IN
= 0 V —
5.0
150
—
—
S pF
Doc ID 018529 Rev 2 7/21
Electrical specifications VNS3NV04DP-E
Table 7.
Symbol
t d(on) t r t d(off) t f t d(on) t r t d(off) t f
Switching
Parameter
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Test conditions
V
DD
= 15 V; I
D
= 1.5 A;
V gen
MIN
= 5 V; R gen
= R
IN
= 220
V
DD
V gen
= 15 V; I
= 5 V; R
D
(see
)
= 1.5 A; gen
= 2.2 K
Ω
(dI/dt) on
Turn-on current slope
Q i
Total input charge
V
DD
V gen
R gen
= 15 V; I
D
= 5 V;
= R
IN MIN
= 1.5 A;
= 220
Ω
V
DD
I gen
= 12 V; I
D
= 1.5 A; V
IN
= 5 V;
= 2.13 mA (see
Min Typ Max Unit
90 300
250 750
450 1350
250 750
0.45
1.35
2.5
7.5
3.3
10.0
2.0
6.0
ns
µs
µs
µs
µs ns ns ns
4.7
8.5
A/µs nC
Table 8.
Symbol
V
SD
(1) t rr
Source drain diode
Parameter Test conditions
Forward on voltage
Reverse recovery time
I
SD
= 1.5 A; V
IN
= 0 V
Q rr
Reverse recovery charge
I
SD
V
DD
= 1.5 A; dI/dt = 12 A/µs;
= 30 V; L = 200 µH
(see
I
RRM
Reverse recovery current
1.
Pulsed: Pulse duration = 300 µs, duty cycle 1.5%
Min Typ Max Unit
0.8
107
V ns
37 µC
0.7
A
-40 °C < T j
< 150 °C, unless otherwise specified
Table 9.
Symbol
Protections
Parameter Test conditions
V
IN
= 5 V; V
DS
Min Typ Max Unit
= 13 V 3.5
5 7 A I lim
Drain current limit t dlim
T jsh
Step response current limit
Overtemperature shutdown
T jrs reset
I gf
Fault sink current
E as
Single pulse avalanche energy
V
IN
= 5 V; V
DS
= 13 V
V
IN
= 5 V; V
DS
= 13 V; T j
= T jsh
Starting T
V
IN j
= 25 °C; V
= 5 V; R gen
DD
= R
IN MIN
= 24 V;
= 220
Ω;
L = 24 mH (see
and
)
10 µs
150 175 200 °C
135 °C
10 15 20 mA
100 mJ
8/21 Doc ID 018529 Rev 2
VNS3NV04DP-E
Figure 4.
Switching time test circuit for resistive load
Electrical specifications
V
D
V gen
R gen
I
D
90%
V gen t d(on) t r
10% t d(off) t f
t t
Figure 5.
Test circuit for diode recovery times
220
Ω
D
I
OMNIFET
S
B
A
FAST
DIODE
R gen
A
B
I
OMNIFET
D
L=100uH
V
DD
V gen
S
8.5
Ω
Doc ID 018529 Rev 2 9/21
Electrical specifications
Figure 6.
Unclamped inductive load test circuits
VNS3NV04DP-E
V
IN
P
W
R
GEN
Figure 7.
Input charge test circuit
V
IN
GEN
ND8003
10/21 Doc ID 018529 Rev 2
VNS3NV04DP-E
Figure 8.
Unclamped inductive waveforms
Electrical specifications
Doc ID 018529 Rev 2 11/21
Electrical specifications VNS3NV04DP-E
12/21
Figure 9.
Source-drain diode forward characteristics
800
750
700
650
600
0
Vsd (mV)
1100
1050
1000
950
900
850
1
Vin=0V
2 3 4 5 6
Id (A)
7
Figure 11. Derating curve
8 9 10 11 12
Figure 10. Static drain-source on resistance
Rds(on) (mohms)
1000
900
800
Tj=-40ºC
Vin=2.5V
700
600
500
400
300
Tj=25ºC
Tj=150ºC
200
100
0
0.05
0.1 0.15
0.2
0.25
0.3
Id(A)
0.35
0.4
0.45
0.5
0.55
Figure 12. Static drain-source on resistance vs input voltage
(part 1)
Rds(on) (mohms)
300
175
150
125
100
75
50
25
0
275
250
225
200
Tj=150ºC
Tj=25ºC
Tj=-40ºC
3 3.5
4 4.5
Vin(V)
5 5.5
6
Id=3.5A
Id=1A
Id=3.5A
Id=1A
Id=3.5A
Id=1A
6.5
Figure 14. Transconductance Figure 13. Static drain-source on resistance vs input voltage
(part 2)
Rds(on) (mohms)
250
225
200
175
150
125
100
75
50
25
0
3 3.5
4 4.5
Vin(V)
5
Id=1.5A
Tj=150ºC
Tj=25ºC
Tj=-40ºC
5.5
6 6.5
Gfs (S)
11
5
4
3
2
1
0
0
10
9
8
7
6
Vds=13V
0.5
1 1.5
2 2.5
Id (A)
3
Tj=-40ºC
Tj=25ºC
Tj=150ºC
3.5
4 4.5
5 5.5
Doc ID 018529 Rev 2
VNS3NV04DP-E Electrical specifications
Figure 15. Static drain-source on resistance vs Id
Figure 16. Transfer characteristics
Rds(on) (mohms)
250
225
200
Vin=5V
175
150
125
100
75
50
25
0
0 0.5
1 1.5
2
Id (A)
2.5
Tj=150ºC
Tj=25ºC
Tj= - 40ºC
3 3.5
4
Idon (A)
6
5.5
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
1.5
2
Vds=13.5V
Tj=150ºC
Tj=25ºC
2.5
3
Tj=-40ºC
3.5
Vin (V)
4 4.5
5 5.5
6
Figure 17. Turn-on current slope (part 1) Figure 18. Turn-on current slope (part 2)
di/dt(A/us)
5
3
2.5
2
1.5
4.5
4
3.5
0.5
1
0
0
Vin=5V
Vdd=15V
Id=1.5A
250
500
750 1000 1250 1500 1750 2000 2250 2500
Rg(ohm) di/dt(A/usec)
1.75
1.5
1.25
1
Vin=3.5V
Vdd=15V
Id=1.5A
0.75
0.5
0.25
0
0 250 500 750 1000 1250 1500 1750 2000 2250 2500
Rg(ohm)
Figure 19. Input voltage vs input charge Figure 20. Turn-off drain source voltage slope (part 1)
Vin (V)
9
3
2
5
4
1
0
0
8
7
6
1
Vds=1V
Id=1.5A
2 3 4 5 6
Qg (nC)
7 8 9 10 11 dv/dt(V/usec)
300
275
250
225
200
175
150
125
100
75
50
25
0
0
250
500
Vin=5V
Vdd=15V
Id=1.5A
750
1000
1250
1500
1750
2000
2250
Rg(ohm)
2500
Doc ID 018529 Rev 2 13/21
Electrical specifications VNS3NV04DP-E
Figure 21. Turn-off drain-source voltage slope (part 2)
Figure 22. Capacitance variations
dv/dt(V/usec)
300
275
250
225
200
175
150
125
100
75
50
25
0
0
250
500
Vin=3.5V
Vdd=15V
Id=1.5A
750
1000 1500
1250
Rg(ohm)
1750
2000
2250
2500
C(pF)
350
300
250
200
150
100
50
0 5 10 15
Vds(V)
20
f=1MHz
Vin=0V
25 30 35
Figure 23. Switching time resistive load
(part 1)
Figure 24. Switching time resistive load
(part 1)
t(usec)
4
3.5
3
2.5
2
1.5
Vdd=15V
Id=1.5A
Vin=5V td(off) tr tf
1
0.5
0
0
td(on)
250
500
750
1000
1250
1500
Rg(ohm)
1750
2000
2250
2500
Figure 25. Output characteristics
t(nsec)
900
800
tr
700
600
500
400
300
200
100
tf td(off) td(on)
0
3.25
3.5
3.75
Vdd=15V
Id=1.5A
Rg=220ohm
4 4.25
Vin(V)
4.5
4.75
Figure 26. Normalized on resistance vs temperature
5 5.25
Id (A)
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
0 1 2 3 4 5
Vds (V)
6
Vin=5V
Vin=4V
Vin=3V
7 8 9 10
Rds(on) (mOhm)
4
3.5
3
2.5
2
1.5
1
Vin=5V
Id=1.5A
0.5
-50 -25 0 25 50 75
Tc )ºC)
100 125 150 175
14/21 Doc ID 018529 Rev 2
VNS3NV04DP-E Electrical specifications
Figure 27. Normalized input threshold voltage vs temperature
Figure 28. Normalized current limit vs junction temperature
Vinth (V)
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
-50 -25
Vds=Vin
Id=1mA
0 25 50 75
Tc (ºC)
100 125 150 175
Figure 29. Step response current limit
Tdlim(usec)
13
12.5
12
11.5
11
10.5
10
9.5
9
8.5
8
7.5
Vin=5V
Rg=220ohm
5 7.5
10 12.5 15 17.5 20 22.5 25 27.5 30 32.5
Vdd(V)
Ilim (A)
10
9
8
7
6
5
4
3
2
1
0
-50 -25
Vin=5V
Vds=13V
0 25 50 75
Tc (ºC)
100 125 150 175
Doc ID 018529 Rev 2 15/21
Protection features VNS3NV04DP-E
3.1
During normal operation, the INPUT pin is electrically connected to the gate of the internal power MOSFET through a low impedance path.
The device then behaves like a standard power MOSFET and can be used as a switch from
DC up to 50 KHz. The only difference from the user’s standpoint is that a small DC current
I
ISS
(typ. 100 µA) flows into the INPUT pin in order to supply the internal circuitry.
The following sections describe the device features.
Overvoltage clamp protection
Internally set at 45 V, along with the rugged avalanche characteristics of the Power
MOSFET stage give this device unrivalled ruggedness and energy handling capability. This feature is mainly important when driving inductive loads.
3.2 Linear current limiter circuit
Limits the drain current I
D
to I lim
whatever the INPUT pin voltages. When the current limiter is active, the device operates in the linear region, so power dissipation may exceed the capability of the heatsink. Both case and junction temperatures increase, and if this phase lasts long enough, junction temperature may reach the overtemperature threshold T jsh.
3.3 Overtemperature short circuit protection
These are based on sensing the chip temperature and are not dependent on the input voltage. The location of the sensing element on the chip in the power stage area ensures fast, accurate detection of the junction temperature. Overtemperature cutout occurs in the range 150 to 190 °C, a typical value being 170 °C. The device is automatically restarted when the chip temperature falls of about 15 °C below shutdown temperature.
In the case of an overtemperature fault condition (T j
> T jsh
), the device tries to sink a diagnostic current I gf
through the INPUT pin in order to indicate fault condition. If driven from a low impedance source, this current may be used in order to warn the control circuit of a device shutdown. If the drive impedance is high enough so that the INPUT pin driver is not able to supply the current I gf
, the INPUT pin falls to 0 V. This however not affects the device operation: no requirement is put on the current capability of the INPUT pin driver except to be able to supply the normal operation drive current I
ISS
.
Additional features of this device are ESD protection according to the Human Body model and the ability to be driven from a TTL Logic circuit.
16/21 Doc ID 018529 Rev 2
VNS3NV04DP-E
4
Package and packing information
Package and packing information
4.1 ECOPACK
®
packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at:
www.st.com
.
ECOPACK
®
is an ST trademark.
4.2 SO-8 mechanical data
Table 10.
SO-8 mechanical data
Dim. mm
Min. Typ. Max.
A
A1 0.10
A2 1.25
b 0.28
c 0.17
D
(1)
4.80
E 5.80
E1
(2)
3.80
4.90
6.00
3.90
1.75
0.25
0.48
0.23
5.00
6.20
4.00 h 0.25
L 0.40
L1 k 0° ccc
1.04
0.50
1.27
8°
0.10
1.
Dimension “D” does not include mold Flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm in total (both side).
2.
Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per side.
Doc ID 018529 Rev 2 17/21
Package and packing information
Figure 30. SO-8 package dimension
VNS3NV04DP-E
0016023 D
18/21 Doc ID 018529 Rev 2
VNS3NV04DP-E
4.3 SO-8 packing information
Figure 31. SO-8 tube shipment (no suffix)
B
C
A
Package and packing information
Base Q.ty
Bulk Q.ty
Tube length (± 0.5)
A
B
C (± 0.1)
All dimensions are in mm.
100
2000
532
3.2
6
0.6
Figure 32. Tape and reel shipment (suffix “TR”)
REEL DIMENSIONS
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
2500
2500
330
1.5
13
20.2
12.4
60
18.4
All dimensions are in mm.
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 (± 0.1)
12
4
P
8
D (± 0.1/-0)
1.5
D1 (min)
F (± 0.05)
K (max)
P1 (± 0.1)
1.5
5.5
4.5
2
All dimensions are in mm.
End
Top cover tape
No components
500mm min
Components No components
Empty components pockets saled with cover tape.
500mm min
User direction of feed
Start
Doc ID 018529 Rev 2 19/21
Revision history
Table 11.
Document revision history
Date Revision
09-Mar-2011
18-Sep-2013
1
2
Initial release.
Updated Disclaimer
Changes
VNS3NV04DP-E
20/21 Doc ID 018529 Rev 2
VNS3NV04DP-E
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Doc ID 018529 Rev 2 21/21
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