®
TMM 6263
SMALL SIGNAL SCHOTTKY DIODE
DESCRIPTION
Metal to silicon junction diode featuring high breakdown, low turn-on voltage and ultrafast switching.
Primarly intended for high level UHF/VHF detection and pulse application with broad dynamic range.
ABSOLUTE MAXIMUM RATINGS (limiting values)
Symbol
V
RRM
I
F
I
FSM
T stg
T j
T
L
Parameter
Repetitive Peak Reverse Voltage
Forward Continuous Current
Surge non Repetitive Forward Current
Storage and Junction Temperature Range
Maximum Temperature for Soldering during 15s
T i
= 25
°
C t p
≤
1s
THERMAL RESISTANCE
Symbol
R th(j-l)
Junction-leads
Test Conditions
MINIMELF
(Glass)
Value
60
15
50
- 65 to 200
-65 to 200
260
Value
400
Unit
°
C/W
ELECTRICAL CHARACTERISTICS
STATIC CHARACTERISTICS
Symbol
V
BR
V
F
*
I
R
*
Test Conditions
T amb
= 25
°
C
T amb
= 25
°
C
I
R
= 10
µ
I
F
= 1mA
A
T amb
= 25
°
C I
F
= 15mA
T amb
= 25
°
C V
R
= 50V
Min.
60
Typ.
Max.
Unit
V
V 0.41
1
0.2
µ
A
DYNAMIC CHARACTERISTICS
Symbol
C
τ
T amb
= 25
°
C
T amb
= 25
°
C
Test Conditions
V
R
= 0V
I
F
= 5mA f = 1MHz
Krakauer Method
Min.
Typ.
Max.
2.2
100
* Pulse test: t p
≤
300
µ s
δ <
2%.
Matched batches available on request. Test conditions (forward voltage and/or capacitance) according to customer specification.
Unit pF ps
Unit
V mA mA
°
C
°
C
August 1999 Ed: 1A 1/3
TMM 6263
Figure 1. Forward current versus forward voltage (typical values).
Figure 2. Capacitance C versus reverse applied voltage V
R
(typical values).
Figure 3. Reverse current versus ambient temperature.
Figure 4. Reverse current versus continuous reverse voltage (typical values).
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TMM 6263
PACKAGE MECHANICAL DATA
MINIMELF Glass
A
C C
FOOT PRINT DIMENSIONS (Millimeter)
2
2.5
5
Marking: ring at cathode end.
Weight: 0.05g
B
A
B
C
D
REF.
DIMENSIONS
Millimeters Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
3.30
3.40
3.6
0.130
0.134
0.142
1.59
1.60
1.62
0.063
0.063
0.064
0.40
0.45
0.50
0.016
0.018
0.020
1.50
0.059
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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