STPS8170DEE
Power Schottky rectifier
Datasheet
production data
Features
■
■
■
■
■
■
■
Very low conduction losses
Negligible switching losses
Extremely fast switching
Low thermal resistance
Avalanche capacity specified
High junction temperature
ECOPACK
®
2 compliant component
Description
This Schottky rectifier is designed for switch mode power supply and high frequency DC to DC converters.
Packaged in PowerFLAT™, this device is intended for use in low voltage, high frequency, inverters, free-wheeling, by-pass diode and polarity protection applications.Its low profile was especially designed to be used in applications with space-saving constraints.
NC
A
A
A
NC
A
A
A
K
A
A
NC
A
K
PowerFLAT(3.3 x 3.3)
STPS8170DEE-TR
Table 1.
Device summary
Symbol
I
F(AV)
V
RRM
T j
(max)
V
F
(typ)
Value
8 A
170 V
175 °C
0.66 V
K
September 2012
This is information on a product in full production.
TM: PowerFLAT is a trademark of STMicroelectronics
Doc ID 023260 Rev 1 1/8 www.st.com
8
Characteristics
1 Characteristics
STPS8170DEE
Table 2.
Symbol
Absolute ratings (limiting values T amb
= 25 °C unless otherwise specified)
Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
P
ARM
(1)
T stg
T j
Repetitive peak reverse voltage
Forward rms current
Average forward current
Surge non repetitive forward current tp = 10 ms sinusoidal
Repetitive peak avalanche power
Storage temperature range
Tc = 145 °C
= 0.5
t p
= 10 µs T j =
125 °C
Maximum operating junction temperature
170
15
8
100
400
-65 to +175 °C
175
V
A
A
A
W
°C
1.
For pulse time duration deratings, please refer to Figure 3
. More details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the STMicroelectronics Application notes AN1768, “Admissible avalanche power of schottky diodes” and AN2025, “Converter improvement using Schottky rectifier avalanche specification”.
Table 3.
Symbol
Thermal resistance
Parameter Value Unit
R th(j-c)
Junction to case 4 °C/W
Table 4.
Symbol
Static electrical characteristics
Parameter Test conditions
I
R
(1)
V
F
(2)
Reverse leakage current
Forward voltage drop
T j
= 25 °C
T j
= 125 °C
T j
= 25 °C
T j
= 125 °C
V
R
= V
RRM
I
F
= 8A
1.
Pulse test: t p
= 5 ms,
< 2%
2.
Pulse test: t p
= 380 µs,
< 2%
To evaluate the conduction losses use the following equation:
P = 0.62 x I
F(AV)
+ 0.0125 x I
F
2
(RMS)
Min.
Typ.
Max.
Unit
-
-
-
1.5
0.66
15
15
0.90
0.72
µA mA
V
2/8 Doc ID 023260 Rev 1
STPS8170DEE Characteristics
Figure 1.
Average forward power dissipation versus average forward current
Figure 2.
Average forward current versus ambient temperature(
= 0.5)
9
PF(AV)(W)
8
7
6
5
4
3
2
1
0
0 1
δ
= 0.05
2 3
δ
= 0.1
4
IF(AV)(A)
5
δ
= 0.2
6 7
δ = 0.5
δ =tp/T
8 9
T
δ
= 1 tp
10 11
10
I
F(AV)
(A)
8
6
4
2
0
0
δ =tp/T
25
T
50 tp
75 100
Rth(j-a)=Rth(j-c)
T amb
(°C)
125 150 175
Figure 3.
1
P
ARM
(tp)
P
ARM
(10 µs)
0.1
0.01
0.001
1
Normalized avalanche power derating versus pulse duration
10 100 1000
Figure 4.
Relative variation of thermal impedance junction to case versus pulse duration
Zth(j-c)/Rth(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-05
Single pulse
1.E-04 1.E-03 1.E-02 1.E-01 tp(s)
1.E+00
Figure 5.
Reverse leakage current versus reverse voltage applied (typical values)
1.E+01
I
R
(mA)
Tj = 150 °C
1.E+00
1.E-01
Tj = 125 °C
Tj = 100 °C
Tj = 75 °C
1.E-02
1.E-03
Tj = 50 °C
Tj = 25 °C
1.E-04
V
R
(V)
1.E-05
0 20 40 60 80 100 120 140 160 180
Figure 6.
Junction capacitance versus reverse voltage applied (typical values)
C(pF)
1000
F=1 MHz
V
OSC
=30 mV
RMS
Tj =25 °C
100
10
1 10 100
VR(V)
1000
Doc ID 023260 Rev 1 3/8
Characteristics STPS8170DEE
100.0
IFM(A)
0.1
0.0
Figure 7.
Forward voltage drop versus
10.0
1.0
forward current
T j
=125 °C
(Typical values)
0.4
T j
=125 °C
(Maximum values)
0.6
0.8
T j
=25 °C
(Maximum values)
VFM(V)
1.0
1.2
Figure 8.
Thermal resistance junction to ambient versus copper surface under tab
250
Rth(j-a)(°C/W) epoxy printed board FR4, copper thickness=35µm
200
PowerFLAT (3.3x3.3)
150
100
50
0
0 1 2 3 4 5 6 7 8
SCu(cm²)
9 10 0.2
4/8 Doc ID 023260 Rev 1
STPS8170DEE Package information
●
●
Epoxy meets UL94,V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Figure 9.
PowerFLAT-3.3x3.3-8L dimensions (definitions)
Exposed pad
L1
E2
L
A3
E
E/2 b nc
D3 e/2 e a k
D2 k nc
D/2
D a
L2 A
Index area
(D/2 x E/2)
Projection
D
D2
D3 e
A
A3
A4 b
E
E2
L
L1
L2
Table 5.
Ref.
PowerFLAT-8L dimensions (values)
Dimensions
Min.
0.95
3.20
1.68
0.31
0.55
0.86
0.30
3.20
2.24
1.60
Millimeters
Typ.
1.00
0.20
0.20
0.37
3.30
2.31
1.67
0.65
3.30
1.75
0.38
0.62
0.93
Max.
1.05
3.40
1.82
0.45
0.69
1.00
0.44
3.40
2.38
1.74
Min.
0.037
0.012
0.126
0.088
0.063
0.126
0.066
0.012
0.22
0.034
Inches
Typ.
0.039
0.0079
0.0079
0.015
0.130
0.091
0.066
0.026
0.130
0.069
0.015
0.024
0.037
Max.
0.041
0.017
0.134
0.094
0.069
0.134
0.072
0.018
0.027
0.039
Doc ID 023260 Rev 1 5/8
Package information
Figure 10.
Footprint (dimensions in mm)
3.50
1.75
1.25
1.79
0.21
0.52
STPS8170DEE
6/8 Doc ID 023260 Rev 1
STPS8170DEE Ordering information
Table 6.
Ordering information
Order code Marking
STPS8170DEE-TR PS8170
Package
PowerFLAT
(3.3 x 3.3)
Weight Base qty Delivery mode
34 mg 3000
Tape and reel
13” reel
Table 7.
Date
Document revision history
Revision
09-Sep-2012 1 First issue.
Changes
Doc ID 023260 Rev 1 7/8
STPS8170DEE
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