STB75NF75
STP75NF75 - STP75NF75FP
N-channel 75V - 0.0095
Ω - 80A - TO-220 - TO-220FP - D
2
PAK
STripFET™ II Power MOSFET
General features
Type
STB75NF75
STP75NF75
STP75NF75FP
V
DSS
75V
75V
75V
1.
Current limited by package
■
■
Exceptional dv/dt capability
100% avalanche tested
R
DS(on)
I
D
<0.011
Ω 80A
(1)
<0.011
Ω 80A
(1)
<0.011
Ω 80A
(1)
Description
This Power MOSFET series realized with
STMicroelectronics unique STripFET™ process has specifically been designed to minimize input capacitance and gate charge. It is therefore suitable as primary switch in advanced highefficiency, high-frequency isolated DC-DC converters for Telecom and Computer applications. It is also intended for any applications with low gate drive requirements.
Applications
■ Switching application
TO-220
1
2
3
1
3
D²PAK
1
2
3
TO-220FP
Internal schematic diagram
Order codes
Part number
STB75NF75T4
STP75NF75
STP75NF75FP
February 2007
Marking
B75NF75
P75NF75
P75NF75
Rev 8
Package
D²PAK
TO-220
TO-220FP
Packaging
Tape & reel
Tube
Tube
1/16 www.st.com
16
5
6
3
4
1
2
Contents
Contents
STB75NF75 - STP75NF75 - STP75NF75FP
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2/16
STB75NF75 - STP75NF75 - STP75NF75FP Electrical ratings
Table 1.
Absolute maximum ratings
Symbol Parameter
V
DS
V
DGR
V
GS
I
D
(1)
I
D
(1)
I
DM
(2)
Drain-source voltage (V
GS
Drain-gate voltage (R
GS
Gate-source voltage
= 0)
= 20K Ω )
Drain current (continuous) at T
Drain current (continuous) at T
Drain current (pulsed)
C
C
= 25°C
=100°C
P
TOT
Total dissipation at T
C
= 25°C
Derating factor dv/dt
(3)
E
AS
(4)
Peak diode recovery voltage slope
Single pulse avalanche energy
V
ISO
T
J
T stg
Insulation withstand voltage (RMS) from all three leads to external heat sink (t=1s;T
C
=25°C)
Operating junction temperature
Storage temperature
1.
Current limited by package
2.
Pulse width limited by safe operating area
3.
I
SD
≤ ≤
300A/µs, V
DD
V
(BR)DSS
, T j
T
JMAX
4.
Starting T
J
= 25 o
C, I
D
= 40A, V
DD
= 37.5V
Value
D
2
PAK /TO-220 TO-220FP
75
75
± 20
80
70
320
300
2.0
--
12
700
-55 to 175
80
70
320
45
0.3
2000
Unit
V
A
V
V
A
A
W
W/°C
V/ns mJ
V
°C
Table 2.
Thermal data
Symbol Parameter
R
R thJC thJA
T l
Thermal resistance junction-case max
Thermal resistance junction-ambient max
Maximum lead temperature for soldering purpose
(1)
1.
1.6mm from case for 10sec)
Value
D
2
PAK /TO-220 TO-220FP
0.5
62.5
3.33
Unit
°C/W
°C/W
300 °C
3/16
Electrical characteristics STB75NF75 - STP75NF75 - STP75NF75FP
(T
CASE
=25°C unless otherwise specified)
Table 3.
Symbol
On/off states
Parameter
V
(BR)DSS
Drain-source breakdown voltage
V
R
I
I
DSS
GSS
GS(th)
DS(on)
Zero gate voltage drain current (V
GS
= 0)
Gate body leakage current
(V
DS
= 0)
Gate threshold voltage
Static drain-source on resistance
Test conditions
I
D
= 250
µ
A, V
GS
= 0
V
DS
= Max rating,
V
DS
= Max rating @125°C
V
GS
= ±20V
V
DS
= V
GS
, I
D
= 250µA
V
GS
= 10V, I
D
= 40A
Min.
Typ.
Max.
Unit
75
2 3
1
10
V
µA
µA
±100 nA
4
0.0095
0.011
V
Ω
Table 4.
Symbol
Dynamic
Parameter Test conditions g fs
(1)
C
C
C iss oss rss
Forward transconductance V
Input capacitance
Output capacitance
Reverse transfer capacitance
V
V
DS
DS
GS
= 15V, I
D
= 40A
=25V, f = 1 MHz,
= 0
Q g
Q gs
Q gd
Total gate charge
Gate-source charge
Gate-drain charge
V
V
DD
GS
1.
Pulsed: pulse duration=300µs, duty cycle 1.5%
= 60V, I
D
=10V
= 80A
Min.
Typ.
Max.
Unit
20 S
3700
730
240
117
27
47
160 pF pF pF nC nC nC
4/16
STB75NF75 - STP75NF75 - STP75NF75FP Electrical characteristics
Table 5.
Symbol t d(on) t r t d(off) t f
Switching times
Parameter
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Test conditions
V
DD
= 37.5V, I
D
= 45A,
R
G
=4.7
Ω, V
GS
=10V
Figure 15 on page 9
Min.
Typ.
Max.
Unit
25
100
66
30 ns ns ns ns
Table 6.
Symbol
I
SD
I
SDM
(1)
V
SD
(2)
Source drain diode
Parameter
Source-drain current
Source-drain current (pulsed)
Forward on voltage t rr
Q rr
I
RRM
Reverse recovery time
Reverse recovery charge
Reverse recovery current
1.
Pulse width limited by safe operating area
2.
Pulsed: pulse duration=300µs, duty cycle 1.5%
Test conditions
I
SD
= 80A, V
GS
= 0
I
SD
= 80A, di/dt = 100A/µs,
V
DD
= 25V, T
J
= 150°C
Figure 17 on page 9
Min Typ.
Max Unit
80
320
A
A
1.5
V
132
660
10 ns nC
A
5/16
Electrical characteristics STB75NF75 - STP75NF75 - STP75NF75FP
Figure 1.
Safe operating area for TO-220 -
D²PAK
Figure 2.
Thermal impedancefor TO-220 -
D²PAK
Figure 3.
Safe operating area for TO-220FP Figure 4.
Thermal impedance for TO-220FP
Figure 5.
Output characterisics Figure 6.
Transfer characteristics
6/16
STB75NF75 - STP75NF75 - STP75NF75FP
Figure 7.
Transconductance
Electrical characteristics
Figure 8.
Static drain-source on resistance
Figure 9.
Gate charge vs gate-source voltage Figure 10. Capacitance variations
Figure 11. Normalized gate threshold voltage vs temperature
Figure 12. Normalized on resistance vs temperature
7/16
Electrical characteristics
Figure 13. Source-drain diode forward characteristics
STB75NF75 - STP75NF75 - STP75NF75FP
Figure 14. Normalized B
VDSS
vs temperature
8/16
STB75NF75 - STP75NF75 - STP75NF75FP
3 Test circuit
Figure 15. Switching times test circuit for resistive load
Figure 16. Gate charge test circuit
Test circuit
Figure 17. Test circuit for inductive load switching and diode recovery times
Figure 18. Unclamped inductive load test circuit
Figure 19. Unclamped inductive waveform
9/16
Package mechanical data
4 Package mechanical data
STB75NF75 - STP75NF75 - STP75NF75FP
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
10/16
STB75NF75 - STP75NF75 - STP75NF75FP Package mechanical data
DIM.
L
L1
L20
L30
øP
Q e1
F
H1
J1
A b b1 c
D
E e
MIN.
4.40
0.61
1.15
0.49
15.25
10
2.40
4.95
1.23
6.20
2.40
13
3.50
3.75
2.65
TO-220 MECHANICAL DATA
mm.
TYP MAX.
4.60
0.88
1.70
0.70
15.75
10.40
2.70
5.15
1.32
6.60
2.72
14
3.93
MIN.
0.173
0.024
0.045
0.019
0.60
0.393
0.094
0.194
0.048
0.244
0.094
0.511
0.137
16.40
28.90
3.85
2.95
0.147
0.104
inch
TYP.
0.645
1.137
MAX.
0.181
0.034
0.066
0.027
0.620
0.409
0.106
0.202
0.052
0.256
0.107
0.551
0.154
0.151
0.116
11/16
Package mechanical data STB75NF75 - STP75NF75 - STP75NF75FP
DIM.
L
L2
L3
M
D1
E
E1
G
R
V2
B2
C
C2
D
A
A1
A2
B
10
4.88
15
1.27
1.4
2.4
0º
0.7
1.14
0.45
1.23
8.95
MIN.
4.4
2.49
0.03
D
2
PAK MECHANICAL DATA
TO-247 MECHANICAL DATA
mm.
TYP
0.93
1.7
0.6
1.36
9.35
MAX.
4.6
2.69
0.23
MIN.
0.173
0.098
0.001
0.027
0.044
0.017
0.048
0.352
8
10.4
0.393
8.5
5.28
15.85
1.4
1.75
3.2
0.192
0.590
0.050
0.055
0.094
0.4
4º inch
TYP.
0.315
0.334
0.015
0.208
0.625
0.055
0.068
0.126
MAX.
0.181
0.106
0.009
0.036
0.067
0.023
0.053
0.368
1
12/16
STB75NF75 - STP75NF75 - STP75NF75FP Package mechanical data
DIM.
F1
F2
G
G1
H
A
B
D
E
F
L5
L6
L7
Ø
L2
L3
L4
MIN.
4.4
2.5
2.5
0.45
0.75
1.15
1.15
4.95
2.4
10
28.6
9.8
2.9
15.9
9
3
TO-220FP MECHANICAL DATA
mm.
TYP
16
MAX.
4.6
2.7
2.75
0.7
1
1.7
1.7
5.2
2.7
10.4
30.6
10.6
3.6
16.4
9.3
3.2
MIN.
0.173
0.098
0.098
0.017
0.030
0.045
0.045
0.195
0.094
0.393
1.126
.0385
0.114
0.626
0.354
0.118
inch
TYP.
0.630
MAX.
0.181
0.106
0.108
0.027
0.039
0.067
0.067
0.204
0.106
0.409
1.204
0.417
0.141
0.645
0.366
0.126
L6
L7
L3
L2
L5
L4
1 2 3
13/16
Packaging mechanical data
5 Packaging mechanical data
D
2
PAK FOOTPRINT
STB75NF75 - STP75NF75 - STP75NF75FP
14/16
TAPE MECHANICAL DATA
DIM.
mm inch
MIN.
MAX.
MIN.
MAX.
A0 10.5
10.7
0.413 0.421
B0 15.7
15.9
0.618 0.626
D 1.5
1.6
0.059 0.063
D1 1.59
1.61
0.062 0.063
P2
R
T
W
E
F
1.65
1.85
0.065 0.073
11.4
11.6
0.449 0.456
K0 4.8
5.0
0.189 0.197
P0 3.9
4.1
0.153 0.161
P1 11.9
12.1
0.468 0.476
1.9
50
2.1
0.075 0.082
1.574
0.25
0.35 0.0098 0.0137
23.7
24.3
0.933 0.956
* on sales type
TAPE AND REEL SHIPMENT
A
B
N
T
C
D
G
REEL MECHANICAL DATA
DIM.
mm inch
MIN.
MAX.
MIN.
MAX.
330 12.992
1.5
0.059
12.8
13.2
0.504
0.520
20.2
0795
24.4
26.4
0.960
1.039
100 3.937
30.4
1.197
BASE QTY
1000
BULK QTY
1000
STB75NF75 - STP75NF75 - STP75NF75FP
Table 7.
Date
Revision history
Revision
03-Aug-2006
15-Sep-2006
27-Feb-2007
6
7
8
Changes
Complete version
R
DS(on)
value update
The document has been reformatted
Revision history
15/16
STB75NF75 - STP75NF75 - STP75NF75FP
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