STMicroelectronics A3G4250D Datasheet
जाहिरात
जाहिरात
A3G4250D
MEMS motion sensor:
3-axis digital output gyroscope
Features
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
Wide supply voltage: 2.4 V to 3.6 V
±245 dps full scale
I
2
C/SPI digital output interface
16-bit rate value data output
8-bit temperature data output
Two digital output lines (interrupt and data ready)
Integrated low and high-pass filters with userselectable bandwidth
Ultra-stable over temperature and time
Low-voltage-compatible IOs (1.8 V)
Embedded power-down and sleep mode
Embedded temperature sensor
Embedded FIFO
High shock survivability
Extended operating temperature range (-40 °C to +85 °C)
ECOPACK
®
RoHS and “Green” compliant
AEC-Q100 qualification
Applications
■
■
■
■
In-dash car navigation
Telematics, e-Tolling
Motion control with MMI (man-machine interface)
Appliances and robotics
LGA-16 (4x4x1.1 mm
3
)
Description
The A3G4250D is a low-power 3-axis angular rate sensor able to provide unprecedented stability at zero rate level and sensitivity over temperature and time. It includes a sensing element and an IC interface capable of providing the measured angular rate to the external world through a standard SPI digital interface. An I
2
C-compatible interface is also available.
The sensing element is manufactured using a dedicated micro-machining process developed by
STMicroelectronics to produce inertial sensors and actuators on silicon wafers.
The IC interface is manufactured using a CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the sensing element characteristics.
The A3G4250D has a full scale of ±245 dps and is capable of measuring rates with a userselectable bandwidth.
The A3G4250D is available in a plastic land grid array (LGA) package and can operate within a temperature range of -40 °C to +85 °C.
Table 1.
Device summary
Order code Temperature range (°C)
A3G4250D
A3G4250DTR
-40 to +85
-40 to +85
Package
LGA-16 (4x4x1.1 mm
3
)
LGA-16 (4x4x1.1 mm
3
)
Packing
Tray
Tape and reel
February 2012 Doc 022768 Rev 3 1/44 www.st.com
44
Contents
Contents
A3G4250D
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Mechanical and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 9
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 11
SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
I2C - inter IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Stability over temperature and time . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Retrieve data from FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2/44 Doc 022768 Rev 3
A3G4250D Contents
SPI read in 3-wire mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Output register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
REFERENCE/DATACAPTURE (25h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
OUT_X_L (28h), OUT_X_H (29h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
OUT_Y_L (2Ah), OUT_Y_H (2Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
OUT_Z_L (2Ch), OUT_Z_H (2Dh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
FIFO_CTRL_REG (2Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
FIFO_SRC_REG (2Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
INT1_THS_XH (32h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
INT1_THS_YH (34h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
INT1_THS_ZH (36h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
INT1_DURATION (38h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Doc 022768 Rev 3 3/44
List of tables
List of tables
A3G4250D
Transfer when master is receiving (reading) one byte of data from slave . . . . . . . . . . . . . 23
Transfer when master is receiving (reading) multiple bytes of data from slave . . . . . . . . . 23
4/44 Doc 022768 Rev 3
A3G4250D List of tables
Doc 022768 Rev 3 5/44
List of figures
List of figures
A3G4250D
A3G4250D electrical connections and external component values . . . . . . . . . . . . . . . . . . 19
6/44 Doc 022768 Rev 3
A3G4250D
1
Block diagram and pin description
Block diagram and pin description
Figure 1.
Block diagram
+
Ω
x,y,z
X+
Y+
Z+
M
U
X
Z-
Y-
X-
CHARGE
AMP
MIXER LOW-PA SS
FILTER
DRIVING MA SS
Feed ba ck loop
E
R
A
T
E
M
P
T
U
R
E
S
O
R
S
E
N
A
D
C
1
A
D
C
2
I
T
A
L
D
I
G
T
E
R
I
N
G
F
I
L
I2C
S PI
C S
S CL/ S PC
S DA/ S DO/ S DI
S DO
REFERENCE
TRIMMING
CIRCUIT S
FIFO
CLOCK
&
PHA S E GENERATOR
CONTROL LOGIC
&
INTERRUPT GEN.
INT1
DRDY/INT2
AM07225v1
The vibration of the structure is maintained by drive circuitry in a feedback loop. The sensing signal is filtered and appears as a digital signal at the output.
Figure 2.
Pin connection
+Ω
Z
1
X
+Ω
Y
+Ω
X
(TOP VIEW)
DIRECTION
S
OF THE
DETECTABLE
ANGULAR RATE
S
RE
S
12
RE
S
RE
S
RE
S 9
1 3 16
8
BOTTOM
VIEW
1
4
Vdd_IO
S
CL/
S
PC
S
DA/
S
DI/
S
DO
S
DO/
S
A0
5
AM07226v1
Doc 022768 Rev 3 7/44
Block diagram and pin description A3G4250D
12
13
14
15
16
6
7
8
9
10
11
Table 2.
Pin#
1
2
3
4
5
Pin description
Name Function
Vdd_IO
SCL
SPC
SDA
SDI
SDO
SDO
SA0
CS
Power supply for I/O pins
I
2
C serial clock (SCL)
SPI serial port clock (SPC)
I
2
C serial data (SDA)
SPI serial data input (SDI)
3-wire interface serial data output (SDO)
SPI serial data output (SDO)
I
2
C least significant bit of the device address (SA0)
SPI enable
I
2
C/SPI mode selection (1: SPI idle mode / I
2
C communication enabled; 0: SPI communication mode / I
2
C disabled)
DRDY/INT2 Data ready/FIFO interrupt
INT1
Reserved
Programmable interrupt
Connect to GND
Reserved
Reserved
Reserved
Connect to GND
Connect to GND
Connect to GND
Reserved
GND
PLLFILT
Reserved
Vdd
Connect to GND
0 V supply
Phase-locked loop filter (see
)
Connect to Vdd
Power supply
Figure 3.
A3G4250D external low-pass filter values
(a)
#APACITORFOR
,OWPASSFILTER
TOPIN
#
# 2
'.$
!-V
8/44 a.
Pin 14 PLLFILT maximum voltage level is equal to Vdd.
Doc 022768 Rev 3
A3G4250D
Table 3.
Filter values
Parameter
C1
C2
R2
Block diagram and pin description
Typical value
10 nF
470 nF
10 k
Ω
Doc 022768 Rev 3 9/44
Mechanical and electrical characteristics
2 Mechanical and electrical characteristics
A3G4250D
@ Vdd = 3.0 V, T = -40... +85 °C, unless otherwise noted
(b)
.
Table 4.
Mechanical characteristics
Test condition Symbol
FS
So
Parameter
Measurement range
(2)
Sensitivity
(3)
SoDr
Sensitivity change vs. temperature
DVoff Digital zero-rate level
(3)
OffDr
NL
Zero-rate level change vs. temperature
Non linearity
(2)
DST Self-test output change
Best fit straight line
Min.
7.4
-25
-5
55
Rn Rate noise density BW = 50 Hz
ODR Digital output data rate
Top
Operating temperature range
1.
Typical specifications are not guaranteed; typical values at +25 °C.
2.
Guaranteed by design.
3.
Across temperature and after MSL3 preconditioning.
89/176/
357/714
-40
Typ.
(1)
±245
8.75
±2
±0.03
0.2
130
0.03
105/208/
420/840
Max.
10.1
+25
+5
245
0.15
121/239/
483/966
+85
Unit dps mdps/digit
% dps dps/°C
% FS dps dps/ sqrt(Hz)
Hz
°C
10/44 b.
The product is factory calibrated at 3.0 V. The operational power supply range is specified in
.
Doc 022768 Rev 3
A3G4250D Mechanical and electrical characteristics
@ Vdd = 3.0 V, T = -40... +85 °C, unless otherwise noted
(c)
.
Table 5.
Symbol
Electrical characteristics
Parameter
Vdd Supply voltage
Vdd_IO I/O pins supply voltage
(2)
Idd Supply current
Test condition Min.
2.4
1.71
4.8
Typ.
(1)
3.0
6.1
Max.
3.6
Vdd+0.1
7.0
IddSL
IddPdn
Top
Supply current in sleep mode
(3)
Supply current in power-down mode
(4)
Operating temperature range
Selectable by digital interface
Selectable by digital interface
-40
1.5
5 10
+85
1.
Typical specifications are not guaranteed; typical values at +25 °C.
2.
It is possible to remove Vdd maintaining Vdd_IO without blocking the communication busses, in this condition the measurement chain is powered off.
3.
Sleep mode introduces a faster turn-on time compared to power-down mode.
4.
Verified at wafer level.
Unit
V
V mA mA
µA
°C
@ Vdd = 3.0 V, T = 25 °C, unless otherwise noted
(d)
.
Table 6.
Symbol
Temp. sensor characteristics
Parameter Test condition
TSDr
TODR
Top
Temperature sensor output change vs. temperature
Temperature refresh rate
Operating temperature range
-
1.
Typical specifications are not guaranteed; typical values at +25 °C.
Min.
-40
Typ.
(1)
-1
1
Max.
Unit
+85
°C/digit
Hz
°C c.
The product is factory calibrated at 3.0 V.
d.
The product is factory calibrated at 3.0 V.
Doc 022768 Rev 3 11/44
Mechanical and electrical characteristics A3G4250D
2.4.1 SPI - serial peripheral interface
Subject to general operating conditions for Vdd and Top.
Table 7.
SPI slave timing values
Value
(1)
Symbol Parameter Unit
Min.
Max.
tc(SPC) fc(SPC) tsu(CS) th(CS) tsu(SI) th(SI) tv(SO) th(SO) tdis(SO)
SPI clock cycle
SPI clock frequency
CS setup time
CS hold time
SDI input setup time
SDI input hold time
SDO valid output time
SDO output hold time
SDO output disable time
100
5
8
5
15
6
10
50 ns
MHz ns
50
1.
Values are guaranteed at 10 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results; not tested in production.
Figure 4.
SPI slave timing diagram
(e)
&6
W
VX&6
63&
W
VX6,
W
K6,
6', 06%,1
W
Y62
W
F63&
6'2 06%287
W
K62
W
K&6
/6%,1
W
GLV62
/6%287
!-V e.
Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both input and output ports.
12/44 Doc 022768 Rev 3
A3G4250D Mechanical and electrical characteristics
2.4.2 I
2
C - inter IC control interface
Subject to general operating conditions for Vdd and Top.
Table 8.
I
2
C slave timing values
I
2
C standard mode
(1)
Symbol Parameter
Min.
Max.
f
(SCL) t w(SCLL) t w(SCLH) t su(SDA) t h(SDA) t h(ST)
SCL clock frequency
SCL clock low time
SCL clock high time
SDA setup time
SDA data hold time
START condition hold time
0
4.7
4.0
250
0
4
100
3.45
t su(SR)
Repeated START condition setup time
4.7
t su(SP)
STOP condition setup time 4 t w(SP:SR)
Bus free time between STOP and START condition
4.7
1.
Data based on standard I
2
C protocol requirement; not tested in production.
Figure 5.
I
2
C slave timing diagram
(f)
I
2
C fast mode
(1)
Min.
0
Max.
400
1.3
0.6
100
0
0.6
0.9
0.6
0.6
1.3
µs
Unit kHz
µs ns
µs
6'$
67$57
W
VX65
W
Z6365
5(3($7('
67$57
67$57
W
I6'$
W
U6'$
W
VX6'$
W
K6'$
W
VX63
6723
6&/
W
K67
W
Z6&//
W
Z6&/+
W
U6&/
W
I6&/
!-V f.
Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both ports.
Doc 022768 Rev 3 13/44
Mechanical and electrical characteristics A3G4250D
Any stress above that listed as “Absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Table 9.
Symbol
Absolute maximum ratings
Ratings
Vdd
T
STG
Sg
Supply voltage
Storage temperature range
Acceleration g for 0.1 ms
ESD Electrostatic discharge protection
Maximum value
-0.3 to 4.8
-40 to +125
10,000
2 (HBM)
Unit
V
°C g kV
This is a mechanical shock sensitive device, improper handling can cause permanent damage to the part
This is an ESD sensitive device, improper handling can cause permanent damage to the part
14/44 Doc 022768 Rev 3
A3G4250D Mechanical and electrical characteristics
2.6 Terminology
2.6.1 Sensitivity
An angular rate gyroscope is a device that produces a positive-going digital output for counter-clockwise rotation around the sensitive axis considered. Sensitivity describes the gain of the sensor and can be determined by applying a defined angular velocity to it. This value changes very little over temperature and time.
2.6.3
The zero-rate level describes the actual output signal if there is no angular rate present. The zero-rate level of precise MEMS sensors is, to some extent, a result of stress to the sensor and, therefore, the zero-rate level can slightly change after mounting the sensor onto a printed circuit board or after exposing it to extensive mechanical stress. This value changes very little over temperature and time.
Stability over temperature and time
Thanks to the unique single-driving mass approach and optimized design, ST gyroscopes are able to guarantee a perfect match of the MEMS mechanical mass and the ASIC interface, and deliver unprecedented levels of stability over temperature and time.
With the zero-rate level and sensitivity performances, up to ten times better than equivalent products currently available on the market, the A3G4250D allows the user to avoid any further compensation and calibration during production for a faster time to market, easy application implementation, higher performance, and cost saving.
The LGA package is compliant with the ECOPACK
®
, RoHS and “Green” standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave “pin 1 indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com/ .
Doc 022768 Rev 3 15/44
Main digital blocks
3 Main digital blocks
A3G4250D
Figure 6.
Block diagram
!$# ,0&
/UT?3EL
(0&
(0EN
,0&
).4?3EL
$ATA2EG
&)&/
XX
)NTERRUPT
GENERATOR
) #
30)
3#22%'
#/.&2%'
).4
!-V
3.2 FIFO
The A3G4250D embeds a 32-slot, 16-bit data FIFO for each of the three output channels: yaw, pitch, and roll. This allows consistent power saving for the system, as the host processor does not need to continuously poll data from the sensor. Instead, it can wake up only when needed and burst the significant data out from the FIFO. This buffer can work in five different modes. Each mode is selected by the FIFO_MODE bits in FIFO_CTRL_REG.
Programmable watermark level, FIFO_empty or FIFO_Full events can be enabled to generate dedicated interrupts on the DRDY/INT2 pin (configured through CTRL_REG3), and event detection information is available in FIFO_SRC_REG. The watermark level can be configured to WTM4: 0 in FIFO_CTRL_REG.
16/44
In bypass mode, the FIFO is not operational and for this reason it remains empty. As illustrated in
Figure 7 , only the first address is used for each channel. The remaining FIFO
slots are empty. When new data is available, the old data is overwritten.
Doc 022768 Rev 3
A3G4250D
Figure 7.
Bypass mode
X
I
Y
I
Z
I
X
EMPTY
X
X
Y
Y
I
Z
Z
Z
Main digital blocks
X Y Z
!-V
In FIFO mode, data from the yaw, pitch, and roll channels are stored in the FIFO. A watermark interrupt can be enabled (I2_WMK bit in CTRL_REG3), which is triggered when the FIFO is filled to the level specified in the WTM 4: 0 bits of FIFO_CTRL_REG. The FIFO continues filling until it is full (32 slots of 16-bit data for yaw, pitch, and roll). When full, the
FIFO stops collecting data from the input channels. To restart data collection, it is necessary to write FIFO_CTRL_REG back to bypass mode.
FIFO mode is represented in
Doc 022768 Rev 3 17/44
Main digital blocks
Figure 8.
FIFO mode
X
I
Y
I
Z
I
X
X
X
Y
Y
I
Z
Z
Z
A3G4250D
X Y Z
!-V
In stream mode, data from yaw, pitch, and roll measurements are stored in the FIFO. A watermark interrupt can be enabled and set as in FIFO mode. The FIFO continues filling until full (32 slots of 16-bit data for yaw, pitch, and roll). When full, the FIFO discards the older data as the new data arrives. Programmable watermark level events can be enabled to generate dedicated interrupts on the DRDY/INT2 pin (configured through CTRL_REG3).
Stream mode is represented in
18/44 Doc 022768 Rev 3
A3G4250D
Figure 9.
Stream mode
X
I
Y
I
Z
I
X
X
X
X
X
Y
Y
Y
Y
Y
Z
Z
Z
Z
Z
Main digital blocks
3.2.4
!-V
Retrieve data from FIFO
FIFO data is read through the OUT_X, OUT_Y, and OUT_Z registers. When the FIFO is in stream, trigger or FIFO mode, a read operation to the OUT_X, OUT_Y or OUT_Z registers provides the data stored in the FIFO. Each time data is read from the FIFO, the oldest pitch, roll, and yaw data are placed in the OUT_X, OUT_Y and OUT_Z registers, and both single read and read_burst (X, Y & Z with auto-incremental address) operations can be used. In read_burst mode, when data included in OUT_Z_H is read, the system again starts to read information from addr OUT_X_L.
The reading from FIFO may be executed either in synchronous or asynchronous mode. For correct data acquisition, the following points need to be followed:
1.
If reading is synchronous, all data should be acquired within one ODR cycle
2. If reading is asynchronous, an appropriate FIFO access sequence must be applied: a) A single dummy read @ 28h (increment bit = 0) to update data out b) A burst read of 6 bytes from 2Ah (Y low) up to 29h:
– Y(2A-2Bh)
– Z(2C - 2Dh)
– X(28-29h)
illustrates the correct sequence with a flow diagram:
Doc 022768 Rev 3 19/44
Main digital blocks
Figure 10.
FIFO access sequence in asynchronous mode
A3G4250D
No
WTM = ‘1’
Yes
Read FIFO SRC (2Fh) n = FSS<4-0> n--
No
Dummy Read from ‘28h’
(increment bit =‘0’)
Burst Read from ‘2Ah’ of
6 registers (Y, Z, X)
Yes
n = 0
Example:
FSS = 1 read twice
FSS = 2 read 3 times
AM1024 8 V1
If the above sequence is not followed, the acquisition from FIFO may lead to corrupted data.
20/44 Doc 022768 Rev 3
A3G4250D Application hints
Figure 11.
A3G4250D electrical connections and external component values
Vdd GND GND
+Ω
Z
100 nF 10 µ F
1
X
+Ω
Y
+Ω
X
(TOP VIEW)
DIRECTION S OF THE
DETECTABLE
ANGULAR RATE S
Vdd_IO
S CL/ S PC
S DA_ S DI_ S DO
S DO/ S A0
1
16
TOP
VIEW
1 3
12
4
5 8
9
10nF
C1
10kOhm
R2
C2
470nF
C S DR INT
Vdd I2C bus
Rp u Rp u = 10kOhm
S CL/ S PC
S DA_ S DI_ S DO
P u llu p to b e a dded when I2C interf a ce i s us ed
AM07949V1
Power supply decoupling capacitors (100 nF ceramic or polyester +10 µF) should be placed as near as possible to the device (common design practice).
If Vdd and Vdd_IO are not connected together, power supply decoupling capacitors
(100 nF and 10 µF between Vdd and common ground, 100 nF between Vdd_IO and common ground) should be placed as near as possible to the device (common design practice).
The A3G4250D IC includes a PLL (phase locked loop) circuit to synchronize driving and sensing interfaces. Capacitors and resistors must be added at the PLLFILT pin (as shown in
Figure 11 ) to implement a second-order low-pass filter. Table 10
summarizes the PLL lowpass filter component values.
Table 10.
PLL low-pass filter component values
Component
C1
Value
10 nF ± 10%
Doc 022768 Rev 3 21/44
Application hints
Table 10.
PLL low-pass filter component values
Component
C2
R2
Value
470 nF ± 10%
10 k
Ω
± 10%
A3G4250D
22/44 Doc 022768 Rev 3
A3G4250D Digital interfaces
The registers embedded in the A3G4250D may be accessed through both the I
2
C and SPI serial interfaces. The latter may be software-configured to operate either in 3-wire or 4-wire interface mode.
The serial interfaces are mapped onto the same pins. To select/exploit the I
2
C interface, the
CS line must be tied high (i.e., connected to Vdd_IO).
Table 11.
Serial interface pin description
Pin name Pin description
CS
SCL/SPC
SDA/SDI/SDO
SDO
SPI enable
I
2
C/SPI mode selection (1: SPI idle mode / I
2
C communication enabled; 0: SPI communication mode / I
2
C disabled)
I
2
C serial clock (SCL)
SPI serial port clock (SPC)
I
2
C serial data (SDA)
SPI serial data input (SDI)
3-wire interface serial data output (SDO)
SPI serial data output (SDO)
I
2
C least significant bit of the device address
5.1 I
2
C serial interface
The A3G4250D I
2
C is a bus slave. The I
2
C is employed to write data to registers whose content can also be read back.
The relevant I
2
C terminology is given in the table below.
Table 12.
I
2
C terminology
Term
Transmitter
Receiver
Master
Slave
Description
The device which sends data to the bus
The device which receives data from the bus
The device which initiates a transfer, generates clock signals and terminates a transfer
The device addressed by the master
There are two signals associated with the I
2
C bus: the serial clock line (SCL) and the serial data line (SDA). The latter is a bi-directional line used for sending and receiving the data to/from the interface. Both lines must be connected to Vdd_IO through an external pull-up resistor. When the bus is free both the lines are high.
The I
2
C interface is compliant with fast mode (400 kHz) I
2
C standards as well as with normal mode.
Doc 022768 Rev 3 23/44
Digital interfaces A3G4250D
5.1.1 I
2
C operation
The transaction on the bus is started through a START (ST) signal. A START condition is defined as a HIGH to LOW transition on the data line while the SCL line is held HIGH. After this has been transmitted by the master, the bus is considered busy. The next byte of data transmitted after the start condition contains the address of the slave in the first 7 bits and the eighth bit tells whether the master is receiving data from the slave or transmitting data to the slave. When an address is sent, each device in the system compares the first 7 bits after a start condition with its address. If they match, the device considers itself addressed by the master.
The slave address (SAD) associated with the A3G4250D is 110100xb. The SDO pin can be used to modify the least significant bit (LSb) of the device address. If the SDO pin is connected to the voltage supply, LSb is ‘1’ (address 1101001b). Otherwise, when the SDO pin is connected to ground, the LSb value is ‘0’ (address 1101000b). This solution permits the connection and addressing of two different gyroscopes to the same I
2
C bus.
Data transfer with acknowledge is mandatory. The transmitter must release the SDA line during the acknowledge pulse. The receiver must then pull the data line LOW so that it remains stable low during the HIGH period of the acknowledge clock pulse. A receiver which has been addressed is obliged to generate an acknowledge after each byte of data received.
The I
2
C embedded in the A3G4250D behaves like a slave device, and the following protocol must be adhered to. After the START (ST) condition, a slave address is sent. Once a slave acknowledge (SAK) has been returned, an 8-bit sub-address is transmitted. The 7 LSb represent the actual register address while the MSb enables address auto-increment. If the
MSb of the SUB field is 1, the SUB (register address) is automatically incremented to allow multiple data read/write.
The slave address is completed with a read/write bit. If the bit is ‘1’ (read), a REPEATED
START (SR) condition must be issued after the two sub-address bytes; if the bit is ‘0’ (write) the master transmits to the slave with the direction unchanged.
describes how the
SAD+read/write bit pattern is composed, listing all the possible configurations.
Table 13.
SAD+read/write patterns
Command SAD[6:1] SAD[0] = SDO
Read
Write
Read
Write
110100
110100
110100
110100
1
1
0
0
R/W
1
0
1
0
SAD+R/W
11010001 (D1h)
11010000 (D0h)
11010011 (D3h)
11010010 (D2h)
Table 14.
Transfer when master is writing one byte to slave
Master ST SAD + W SUB DATA
Slave SAK SAK SAK
SP
24/44 Doc 022768 Rev 3
A3G4250D Digital interfaces
Table 15.
Transfer when master is writing multiple bytes to slave
Master ST SAD + W SUB DATA DATA
Slave SAK SAK SAK SAK
SP
Table 16.
Transfer when master is receiving (reading) one byte of data from slave
Master ST SAD + W SUB SR SAD + R NMAK SP
Slave SAK SAK SAK DATA
Table 17.
Transfer when master is receiving (reading) multiple bytes of data from slave
Master ST SAD+W SUB SR SAD+R MAK MAK NMAK SP
Slave SAK SAK SAK DATA DATA DATA
Data are transmitted in byte format (DATA). Each data transfer contains 8 bits. The number of bytes transferred per transfer is unlimited. Data is transferred with the most significant bit
(MSb) first. If a receiver cannot receive another complete byte of data until it has performed some other function, it can hold the clock line SCL LOW to force the transmitter into a wait state. Data transfer only continues when the receiver is ready for another byte and releases the data line. If a slave receiver does not acknowledge the slave address (i.e., it is not able to receive because it is performing some real-time function) the data line must be left HIGH by the slave. The master can then abort the transfer. A LOW to HIGH transition on the SDA line while the SCL line is HIGH is defined as a STOP condition. Each data transfer must be terminated by the generation of a STOP (SP) condition.
In order to read multiple bytes, it is necessary to assert the most significant bit of the subaddress field. In other words, SUB(7) must be equal to 1, while SUB(6-0) represents the address of the first register to be read.
In the presented communication format, MAK is “master acknowledge” and NMAK is “no master acknowledge”.
5.2 SPI interface
The SPI is a bus slave. The SPI allows writing and reading of the device registers. The serial interface interacts with the external world through 4 wires: CS, SPC, SDI, and SDO .
Doc 022768 Rev 3 25/44
Digital interfaces A3G4250D
Figure 12.
Read and write protocol
CS
SPC
SDI
RW
MS AD5 AD4 AD3 AD2 AD1 AD0
DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0
SDO
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
CS is the serial port enable and is controlled by the SPI master. It goes low at the start of the transmission and returns to high at the end. SPC is the serial port clock and is controlled by the SPI master. It is stopped high when CS is high (no transmission). SDI and SDO are, respectively, the serial port data input and output. These lines are driven at the falling edge of SPC and should be captured at the rising edge of SPC .
Both the read register and write register commands are completed in 16 clock pulses, or in multiples of 8 in case of multiple read/write bytes. Bit duration is the time between two falling edges of SPC . The first bit (bit 0) starts at the first falling edge of SPC after the falling edge of CS while the last bit (bit 15, bit 23, etc.) starts at the last falling edge of SPC just before the rising edge of CS .
Bit 0 : RW bit. When 0, the data DI(7:0) is written to the device. When 1, the data DO(7:0) from the device is read. In the latter case, the chip drives SDO at the start of bit 8.
Bit 1 : MS bit. When 0, the address remains unchanged in multiple read/write commands.
When 1, the address is auto-incremented in multiple read/write commands.
Bit 2-7 : address AD(5:0). This is the address field of the indexed register.
Bit 8-15 : data DI(7:0) (write mode). This is the data that is written to the device (MSb first).
Bit 8-15 : data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
In multiple read/write commands, further blocks of 8 clock periods are added. When the MS bit is 0, the address used to read/write data remains the same for every block. When the MS bit is 1, the address used to read/write data is incremented at every block.
The function and the behavior of SDI and SDO remain unchanged.
Figure 13.
SPI read protocol
CS
SPC
SDI
RW
MS AD5 AD4 AD3 AD2 AD1 AD0
SDO
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
26/44 Doc 022768 Rev 3
A3G4250D Digital interfaces
The SPI read command is performed with 16 clock pulses. A multiple byte read command is performed by adding blocks of 8 clock pulses to the previous one.
Bit 0 : READ bit. The value is 1.
Bit 1 : MS bit. When 0, do not increment address; when 1, increment address in multiple reading.
Bit 2-7 : address AD(5:0). This is the address field of the indexed register.
Bit 8-15 : data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
Bit 16-...
: data DO(...-8). Further data in multiple byte reading.
Figure 14.
Multiple byte SPI read protocol (2-byte example)
CS
SPC
SDI
RW
MS AD5 AD4 AD3 AD2 AD1 AD0
SDO
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
Figure 15.
SPI write protocol
CS
SPC
SDI
RW
MS AD5 AD4 AD3 AD2 AD1 AD0
DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0
The SPI write command is performed with 16 clock pulses. A multiple byte write command is performed by adding blocks of 8 clock pulses to the previous one.
Bit 0 : WRITE bit. The value is 0.
Bit 1 : MS bit. When 0, do not increment address; when 1, increment address in multiple writing.
Bit 2 -7 : address AD(5:0). This is the address field of the indexed register.
Bit 8-15 : data DI(7:0) (write mode). This is the data that is written to the device (MSb first).
Bit 16-...
: data DI(...-8). Further data in multiple byte writing.
Doc 022768 Rev 3 27/44
Digital interfaces
Figure 16.
Multiple byte SPI write protocol (2-byte example)
CS
SPC
SDI
A3G4250D
RW
MS AD5 AD4 AD3 AD2 AD1 AD0
DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0 DI15 DI14 DI13 DI12 DI11 DI10 DI9 DI8
5.2.3
Note:
SPI read in 3-wire mode
3-wire mode is entered by setting the SIM (SPI serial interface mode selection) bit to 1 in
CTRL_REG2.
Figure 17.
SPI read protocol in 3-wire mode
CS
SPC
SDI/O
RW
MS AD5 AD4 AD3 AD2 AD1 AD0
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
The SPI read command is performed with 16 clock pulses:
Bit 0 : READ bit. The value is 1.
Bit 1 : MS bit. When 0, do not increment address; when 1, increment address in multiple reading.
Bit 2-7 : address AD(5:0). This is the address field of the indexed register.
Bit 8-15 : data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
The multiple read command is also available in 3-wire mode.
If the A3G4250D is used in a multi-SPI slave environment (several devices sharing the same SPI bus), the accelerometer can be forced by software to remain in SPI mode. This objective can be achieved by sending, at the beginning of the SPI communication, the following sequence to the device: a = read(0x05) write(0x05, (0x20 OR a))
The programming of this register makes it possible to enhance the robustness of the SPI system.
28/44 Doc 022768 Rev 3
A3G4250D
6 Output register mapping
Output register mapping
below provides a listing of the 8-bit registers embedded in the device and the related addresses:
Table 18.
Register address map
Name
Reserved
WHO_AM_I
Reserved
CTRL_REG1
CTRL_REG2
CTRL_REG3
CTRL_REG4
CTRL_REG5
REFERENCE
OUT_TEMP
STATUS_REG
OUT_X_L
OUT_X_H
OUT_Y_L
OUT_Y_H
OUT_Z_L
OUT_Z_H
FIFO_CTRL_REG
FIFO_SRC_REG
INT1_CFG
INT1_SRC
INT1_TSH_XH
INT1_TSH_XL
INT1_TSH_YH
INT1_TSH_YL
INT1_TSH_ZH
INT1_TSH_ZL
INT1_DURATION
Type r rw r rw r rw r r r r r r rw rw rw rw rw rw rw rw rw rw rw r
-
r rw
Register address
Default
Binary
-
000 1111 11010011
-
010 0000 00000111
010 0001 00000000
010 0010 00000000
010 0011 00000000
010 0100 00000000
010 0101 00000000
010 0110 Output
010 0111 Output
010 1000 Output
010 1001 Output
010 1010 Output
010 1011 Output
010 1100 Output
010 1101 Output
010 1110 00000000
010 1111 Output
011 0000 00000000
011 0001 Output
011 0010 00000000
011 0011 00000000
011 0100 00000000
011 0101 00000000
011 0110 00000000
011 0111 00000000
011 1000 00000000
Hex
2D
2E
2F
30
31
32
27
28
29
2A
2B
2C
33
34
35
36
37
38
21
22
23
24
25
26
00-0E
0F
10-1F
20
Comment
Doc 022768 Rev 3 29/44
Output register mapping A3G4250D
Registers marked as Reserved must not be changed. Writing to those registers may change calibration data and therefore lead to a non-proper working device.
The content of the registers that are loaded at boot should not be changed. They contain the factory calibration values. Their content is automatically restored when the device is powered up.
30/44 Doc 022768 Rev 3
A3G4250D Register description
The device contains a set of registers which are used to control its behavior and to retrieve rate data. The register addresses, made up of 7 bits, are used to identify them and to write the data through the serial interface.
Table 19.
WHO_AM_I register
1 1 0
Device identification register.
1 0 0 1 1
Table 20.
CTRL_REG1 register
DR1 DR0 BW1 BW0 PD Zen
Table 21.
CTRL_REG1 description
DR1-DR0 Output data rate selection. Refer to
BW1-BW0
PD
Zen
Yen
Xen
Bandwidth selection. Refer to Table 22
Power-down mode enable. Default value: 0
(0: power-down mode, 1: normal mode or sleep mode)
Z-axis enable. Default value: 1
(0: Z-axis disabled; 1: Z-axis enabled)
Y-axis enable. Default value: 1
(0: Y-axis disabled; 1: Y-axis enabled)
X-axis enable. Default value: 1
(0: X-axis disabled; 1: X-axis enabled)
Yen Xen
DR<1:0> is used to set ODR selection. BW <1:0> is used to set Bandwidth selection.
In the following table (
Table 22 ) all frequencies resulting in a combination of DR / BW bits
are reported.
Table 22.
DR and BW configuration setting
DR <1:0> BW <1:0>
00
00
00
00
00
01
10
11
100
100
100
100
ODR [Hz]
12.5
25
25
25
Cut-off
Doc 022768 Rev 3 31/44
Register description
Table 22.
DR and BW configuration setting (continued)
DR <1:0> BW <1:0> ODR [Hz]
01
10
10
01
01
01
10
10
11
11
11
11
11
00
01
00
01
10
10
11
00
01
10
11
200
200
200
200
400
400
400
400
800
800
800
800
70
20
25
12.5
25
50
50
110
30
35
50
110
A3G4250D
Cut-off
Combination of PD, Zen, Yen, and Xen are used to set the device in different modes
(power-down / normal / sleep mode) according to the following table.
Table 23.
Power mode selection configuration
Mode PD Zen
Power-down 0
Sleep 1
Normal 1 -
-
0
-
-
0
Yen
-
-
0
Xen
32/44
Table 24.
CTRL_REG2 register
0 (1)
0
(1)
HPM1 HPM1
1.
Value loaded at boot. This value must not be changed.
HPCF3
Table 25.
CTRL_REG2 description
HPM1-
HPM0
High-pass filter mode selection. Default value: 00
Refer to
HPCF3-
HPCF0
High-pass filter cut-off frequency selection
Refer to
HPCF2 HPCF1
Table 26.
High-pass filter mode configuration
HPM1 HPM0 High-pass filter mode
0 0 Normal mode (reset reading HP_RESET_FILTER)
Doc 022768 Rev 3
HPCF0
A3G4250D Register description
Table 26.
High-pass filter mode configuration
0 1 Reference signal for filtering
1
1
0
1
Normal mode
Auto-reset on interrupt event
Table 27.
High-pass filter cut-off frequency configuration [Hz]
HPCF3 ODR= 100 Hz ODR= 200 Hz ODR= 400 Hz
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
8
4
2
1
0.5
0.2
0.1
0.05
0.02
0.01
15
8
4
2
1
0.5
0.2
0.1
0.05
0.02
30
15
8
4
2
1
0.5
0.2
0.1
0.05
ODR= 800 Hz
56
30
4
2
1
15
8
0.5
0.2
0.1
Table 28.
CTRL_REG1 register
I1_Int1 I1_Boot H_Lactive PP_OD I2_DRDY I2_WTM I2_ORun I2_Empty
Table 29.
CTRL_REG3 description
I1_Int1 Interrupt enable on the INT1 pin. Default value 0. (0: disable; 1: enable)
I1_Boot
H_Lactive
Boot status available on INT1. Default value 0. (0: disable; 1: enable)
Interrupt active configuration on INT1. Default value 0. (0: high; 1: low)
PP_OD
I2_DRDY
I2_WTM
I2_ORun
I2_Empty
Push-pull / open drain. Default value: 0. (0: push-pull; 1: open drain)
Date ready on DRDY/INT2. Default value 0. (0: disable; 1: enable)
FIFO watermark interrupt on DRDY/INT2. Default value: 0. (0: disable; 1: enable)
FIFO overrun interrupt on DRDY/INT2 Default value: 0. (0: disable; 1: enable)
FIFO empty interrupt on DRDY/INT2. Default value: 0. (0: disable; 1: enable)
Table 30.
CTRL_REG4 register
0 BLE 0 0
Doc 022768 Rev 3
ST1 ST0 SIM
33/44
Register description
Table 31.
CTRL_REG4 description
BLE Big/little endian data selection. Default value 0.
(0: data LSB @ lower address; 1: data MSB @ lower address)
ST1-ST0 Self-test enable. Default value: 00
(00: self-test disabled; Other: see
SIM SPI serial interface mode selection. Default value: 0
(0: 4-wire interface; 1: 3-wire interface).
Table 32.
Self-test mode configuration
ST1 ST0
0
0
1
1
0
1
0
1
1.
DST sign (absolute value in
).
Normal mode
Self-test 0 (+)
(1)
--
Self-test 1 (-)
(1)
Self-test mode
A3G4250D
Table 33.
CTRL_REG5 register
BOOT FIFO_EN -HPen INT1_Sel1 INT1_Sel0 Out_Sel1 Out_Sel0
Table 34.
CTRL_REG5 description
BOOT Reboot memory content. Default value: 0
(0: normal mode; 1: reboot memory content)
FIFO_EN
HPen
INT1_Sel1-
INT1_Sel0
Out_Sel1-
Out_Sel1
FIFO enable. Default value: 0
(0: FIFO disable; 1: FIFO enable)
High-pass filter enable. Default value: 0
(0: HPF disabled; 1: HPF enabled (see
INT1 selection configuration. Default value: 0
Out selection configuration. Default value: 0
34/44 Doc 022768 Rev 3
A3G4250D Register description
Figure 18.
INT1_Sel and Out_Sel configuration block diagram
O u t_ S el <1:0>
00
01
D a t a Reg
0
LPF2
10
11
FIFO
3 2x16x 3
ADC LPF1 HPF
1
HPen
10
11
INT1_ S el <1:0>
01
00
Interr u pt gener a tor
AM07949V2
Table 35.
Out_Sel configuration settings
Hpen OUT_SEL1 OUT_SEL0 x x
0
1
0
0
1
1
0
1 x x
Description
Data in DataReg and FIFO are non-highpass-filtered
Data in DataReg and FIFO are high-passfiltered
Data in DataReg and FIFO are low-passfiltered by LPF2
Data in DataReg and FIFO are high-pass and low-pass-filtered by LPF2
Table 36.
INT_SEL configuration settings
Hpen INT_SEL1 INT_SEL2 x x
0
1
0
0
1
1
0
1 x x
Description
Non-high-pass-filtered data are used for interrupt generation
High-pass-filtered data are used for interrupt generation
Low-pass-filtered data are used for interrupt generation
High-pass and low-pass-filtered data are used for interrupt generation
Doc 022768 Rev 3 35/44
Register description A3G4250D
Table 37.
REFERENCE register
Ref7 Ref6 Ref5 Ref4 Ref3 Ref2 Ref1
Table 38.
REFERENCE register description
Ref 7-Ref0 Reference value for interrupt generation. Default value: 0
Ref0
Table 39.
OUT_TEMP register
Temp7 Temp6 Temp5 Temp4 Temp3 Temp2 Temp1
Table 40.
OUT_TEMP register description
Temp7-Temp0 Temperature data.
Temp0
36/44
Table 41.
STATUS_REG register
ZYXOR ZOR YOR XOR ZYXDA ZDA YDA XDA
Table 42.
STATUS_REG description
ZYXOR
X, Y, Z-axis data overrun. Default value: 0
(0: no overrun has occurred; 1: new data has overwritten the previous one before it was read)
ZOR
YOR
Z-axis data overrun. Default value: 0
(0: no overrun has occurred; 1: a new data for the Z-axis has overwritten the previous one)
Y-axis data overrun. Default value: 0
(0: no overrun has occurred; 1: a new data for the Y-axis has overwritten the previous one)
XOR
X-axis data overrun. Default value: 0
(0: no overrun has occurred; 1: a new data for the X-axis has overwritten the previous one)
ZYXDA X, Y, Z-axis new data available. Default value: 0
(0: a new set of data is not yet available; 1: a new set of data is available)
ZDA
YDA
XDA
Z-axis new data available. Default value: 0
(0: a new data for the Z-axis is not yet available; 1: a new data for the Z-axis is available)
Y-axis new data available. Default value: 0
(0: a new data for the Y-axis is not yet available;1: a new data for the Y-axis is available)
X-axis new data available. Default value: 0
(0: a new data for the X-axis is not yet available; 1: a new data for the X-axis is available)
Doc 022768 Rev 3
A3G4250D
7.10 OUT_X_L (28h), OUT_X_H (29h)
X-axis angular rate data. The value is expressed as 2’s complement.
Register description
7.11 OUT_Y_L (2Ah), OUT_Y_H (2Bh)
Y-axis angular rate data. The value is expressed as 2’s complement.
7.12 OUT_Z_L (2Ch), OUT_Z_H (2Dh)
Z-axis angular rate data. The value is expressed as 2’s complement.
Table 43.
REFERENCE register
FM2 FM1 FM0 WTM4 WTM3
Table 44.
REFERENCE register description
FM2-FM0 FIFO mode selection. Default value: 00
WTM4-WTM0 FIFO threshold. Watermark level setting
WTM2 WTM1 WTM0
0
0
0
Table 45.
FIFO mode configuration
FM2 FM1 FM0
0
0
1
0
1
0
Bypass mode
FIFO mode
Stream mode
FIFO mode
Table 46.
FIFO_SRC register
WTM OVRN EMPTY FSS4 FSS3 FSS2 FSS1 FSS0
Table 47.
FIFO_SRC register description
WTM Watermark status. (0: FIFO filling is lower than WTM level; 1: FIFO filling is equal or higher than WTM level)
OVRN Overrun bit status.
(0: FIFO is not completely filled; 1: FIFO is completely filled)
Doc 022768 Rev 3 37/44
Register description
Table 47.
FIFO_SRC register description (continued)
EMPTY FIFO empty bit.
(0: FIFO not empty; 1: FIFO empty)
FSS4-FSS1 FIFO stored data level
A3G4250D
Table 48.
INT1_CFG register
AND/OR LIR ZHIE ZLIE YHIE YLIE XHIE XLIE
Table 49.
INT1_CFG description
AND/OR
AND/OR combination of interrupt events. Default value: 0
(0: OR combination of interrupt events 1: AND combination of interrupt events
LIR
ZHIE
ZLIE
YHIE
YLIE
XHIE
XLIE
Latch interrupt request. Default value: 0
(0: interrupt request not latched; 1: interrupt request latched)
Cleared by reading the INT1_SRC reg.
Enable interrupt generation on Z high event. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured rate value higher than preset threshold)
Enable interrupt generation on Z low event. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured rate value lower than preset threshold)
Enable interrupt generation on Y high event. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured rate value higher than preset threshold)
Enable interrupt generation on Y low event. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured rate value lower than preset threshold)
Enable interrupt generation on X high event. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured rate value higher than preset threshold)
Enable interrupt generation on X low event. Default value: 0
(0: disable interrupt request; 1: enable interrupt request on measured rate value lower than preset threshold)
Configuration register for interrupt source.
Table 50.
INT1_SRC register
0 IA ZH ZL YH YL XH XL
38/44 Doc 022768 Rev 3
A3G4250D Register description
ZL
YH
YL
XH
XL
Table 51.
INT1_SRC description
IA
Interrupt active. Default value: 0
(0: no interrupt has been generated; 1: one or more interrupts have been generated)
ZH Z high. Default value: 0 (0: no interrupt, 1: Z high event has occurred)
Z low. Default value: 0 (0: no interrupt; 1: Z low event has occurred)
Y high. Default value: 0 (0: no interrupt, 1: Y high event has occurred)
Y low. Default value: 0 (0: no interrupt, 1: Y low event has occurred)
X high. Default value: 0 (0: no interrupt, 1: X high event has occurred)
X low. Default value: 0 (0: no interrupt, 1: X low event has occurred)
Interrupt source register. Read only register.
Reading at this address clears the INT1_SRC IA bit (and eventually the interrupt signal on the INT1 pin) and allows the refreshment of data in the INT1_SRC register if the latched option is chosen.
Table 52.
INT1_THS_XH register
THSX14 THSX13 THSX12 THSX11 THSX10 THSX9 THSX8
Table 53.
INT1_THS_XH description
THSX14 - THSX9 Interrupt threshold. Default value: 0000 0000
Table 54.
INT1_THS_XL register
THSX7 THSX6 THSX5 THSX4 THSX3 THSX2
Table 55.
INT1_THS_XL description
THSX7 - THSX0 Interrupt threshold. Default value: 0000 0000
THSX1 THSX0
Table 56.
INT1_THS_YH register
THSY14 THSY13 THSY12 THSY11 THSY10 THSY9 THSY8
Table 57.
INT1_THS_YH description
THSY14 - THSY9 Interrupt threshold. Default value: 0000 0000
Doc 022768 Rev 3 39/44
Register description A3G4250D
Table 58.
INT1_THS_YL register
THSR7 THSY6 THSY5 THSY4 THSY3 THSY2 THSY1 THSY0
Table 59.
INT1_THS_YL description
THSY7 - THSY0 Interrupt threshold. Default value: 0000 0000
Table 60.
INT1_THS_ZH register
THSZ14 THSZ13 THSZ12 THSZ11 THSZ10 THSZ9 THSZ8
Table 61.
INT1_THS_ZH description
THSZ14 - THSZ9 Interrupt threshold. Default value: 0000 0000
Table 62.
INT1_THS_ZL register
THSZ7 THSZ6 THSZ5 THSZ4 THSZ3 THSZ2 THSZ1 THSZ0
Table 63.
INT1_THS_ZL description
THSZ7 - THSZ0 Interrupt threshold. Default value: 0000 0000
40/44
Table 64.
INT1_DURATION register
WAIT D6 D5 D4 D3 D2 D1 D0
Table 65.
INT1_DURATION description
WAIT WAIT enable. Default value: 0 (0: disable; 1: enable)
D6 - D0 Duration value. Default value: 000 0000
D6 - D0 bits set the minimum duration of the interrupt event to be recognized. Duration steps and maximum values depend on the ODR chosen.
WAIT bit has the following meaning:
Wait =’0’: the interrupt falls immediately if signal crosses the selected threshold.
Doc 022768 Rev 3
A3G4250D Register description
Wait =’1’: if signal crosses the selected threshold, the interrupt falls only after the duration has counted a number of samples at the selected data rate, written into the duration counter register.
Figure 19.
Wait disabled
Figure 20.
Wait enabled
Doc 022768 Rev 3 41/44
Package information A3G4250D
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at www.st.com.
ECOPACK is an ST trademark.
Figure 21.
LGA-16: mechanical data and package dimensions
Dimen s ion s
N2
P1
P2
T1
T2 k
D1
E1
L2
M
N1
A1
A2
A 3 d
1.100
3 .
8 50
3 .
8 50
0.975
1.750
1.525
0.400
0.
3 00
0.050
0.
8 55
0.200
0.
3 00
4.000
4.000
1.950
0.100
0.650
4.150
4.150
LGA-16 (4x4x1.1 mm
Land Grid Array Packa
3 g
) e
42/44 Doc 022768 Rev 3
A3G4250D Revision history
Table 66.
Document revision history
Date
02-Feb-2012
08-Feb-2012
14-Feb-2012
Revision
1
2
3
Changes
Initial release.
Updated notes in Table 4: Mechanical characteristics
.
Updated Figure 21: LGA-16: mechanical data and package dimensions .
Doc 022768 Rev 3 43/44
A3G4250D
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2012 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
44/44 Doc 022768 Rev 3
डाउनलोड
सार्वजनिक दुवा अद्यतनित केला
आपल्या चॅटचा सार्वजनिक दुवा अद्यतनित केला गेला आहे. You may view and manage your chat links after registration here.
दस्तऐवजाचा सार्वजनिक दुवा
जाहिरात