STMicroelectronics IMP34DT05 Datasheet
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IMP34DT05
Datasheet
MEMS audio sensor omnidirectional digital microphone for industrial applications
Product status link
IMP34DT05
Product summary
Order code
Temperature range [°C]
IMP34DT05TR
-40 to +85
Package
Packing
HCLGA 4LD
(3 x 4 x 1 mm)
Tape and reel
Product label
Features
• Single supply voltage
• Low power consumption
• AOP = 122.5 dBSPL
• 64 dB signal-to-noise ratio
• Omnidirectional sensitivity
• –26 dBFS ±3 dB sensitivity
• PDM output
• HCLGA package
– Top-port design
– SMD-compliant
– EMI-shielded
– ECOPACK , RoHS, and “Green” compliant
Applications
• Anti-tampering devices
• Vibration monitoring
• Audio-activated functions
• Predictive maintenance
• Noise cancelling
• Sound detection for alarm systems
• Human / machine voice interface
• Anti-theft systems
Description
The IMP34DT05 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface.
The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to producing audio sensors.
The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.
The IMP34DT05 is a low-distortion digital microphone with a 64 dB signal-to-noise ratio and –26 dBFS ±3 dB sensitivity.
The IMP34DT05 is available in a top-port, SMD-compliant, EMI-shielded package and is guaranteed to operate over an extended temperature range from -40 °C to
+85 °C.
DS12725 - Rev 4 - June 2021
For further information contact your local STMicroelectronics sales office.
www.st.com
1
Pin description
Pin #
1
2
3
4
5 (ground ring)
Figure 1. Pin connections
LR CLK
Vdd
DOUT
BOTTOM VIEW
GND
Table 1. Pin description
Pin name
Vdd
LR
CLK
DOUT
GND
Power supply
Left/Right channel selection
Function
Synchronization input clock
Left/Right PDM data output
Ground
IMP34DT05
Pin description
DS12725 - Rev 4 page 2/20
IMP34DT05
Acoustic and electrical specifications
2
Acoustic and electrical specifications
2.1
Acoustic and electrical characteristics
The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz, T = 25 °C, unless otherwise noted.
Table 2. Acoustic and electrical characteristics
Test condition Symbol Parameter
Vdd
Idd
Supply voltage
Current consumption in normal mode
IddPdn Current consumption in power-down mode
Scc
AOP
Short-circuit current
Acoustic overload point
So
SNR
PSR f
CLK
Ton
Top
V
IOL
V
IOH
C
LOAD
Sensitivity
Signal-to-noise ratio
Power supply rejection
Turn-on time
Operating temperature range
Low-level logic input/output voltage
High-level logic input/output voltage
Capacitive load
1. Typical specifications are not guaranteed.
2. Input clock in static mode.
3. Duty cycle: min = 40% max = 60%.
4. Time from the first clock edge to valid output data.
Mean value
A-weighted @1 kHz, 94 dB SPL
100 mVpp sine 1 kHz
Specified by design - not tested in production
I out
= 1 mA
I out
= 1 mA
Min.
1.6
1
-29
1.2
-40
-0.3
0.65xVdd
1.8
650
122.5
-26
64
2.4
Max.
3.6
5
10
-23
-90
3.25
10
+85
0.35xVdd
Vdd+0.3
100
Unit
V
µA
µA mA dBSPL dBFS dB(A) dBFS
MHz ms
°C
V
V pF
Table 3. Distortion specifications @ 1 kHz
Parameter
Distortion
Distortion
Distortion
1. Typical specifications are not guaranteed.
Test condition
94 dBSPL
110 dBSPL
120 dBSP
0.2% THD + N
0.7% THD + N
6% THD + N
DS12725 - Rev 4 page 3/20
2.2
IMP34DT05
Timing characteristics
Timing characteristics
Parameter f
CLK f
PD
T
CLK
Tdv
Ten
Tdis
Table 4. Timing characteristics
Description
Clock frequency for normal mode
Clock frequency for power-down mode
Clock period for normal mode
Time delay to valid data (C
LOAD
= 100 pF)
Time delay to driven data
Time delay to High-Z
Figure 2. Timing waveforms
1/fclk
CLK
DOUT
(L/R = Vdd)
High-Z
Tdv
Ten
Mic Data
Tdis
High-Z
Tdv
Ten
DOUT
(L/R = Gnd)
High-Z
Mic Data
308
-
18
2
Min.
1.2
Max.
3.25
0.23
1000
105
-
10
Unit
MHz
MHz ns
Tdis
DS12725 - Rev 4 page 4/20
2.3
Frequency response
Figure 3. Typical frequency response normalized to 1 kHz
IMP34DT05
Frequency response
DS12725 - Rev 4 page 5/20
3
Application recommendations
Figure 4. IMP34DT05 electrical connections (top view)
Vdd
1µF
IMP34DT05
Application recommendations
100nF
TOP VIEW
L / R
1 4
Dout
CLK
2 3
5
Ground ring
Figure 5. IMP34DT05 electrical connections for stereo configuration (top view)
Vdd
1µF
100nF
TOP VIEW
1 4
Dout
1 4
Dout
L / R
2 3
Vdd
2 3
5
Ground ring
CLK
CODEC
Power supply decoupling capacitors (100 nF ceramic, 1 μF ceramic) should be placed as near as possible to pin
1 of the device (common design practice).
The L/R pin must be connected to Vdd or GND (refer to Table 6. L/R channel selection ).
DS12725 - Rev 4 page 6/20
4
IMP34DT05
Carrier tape mechanical specifications
Carrier tape mechanical specifications
Figure 6. Carrier tape without microphone (top view)
Figure 7. Carrier tape with microphone (top view)
DS12725 - Rev 4 page 7/20
5
IMP34DT05
Process recommendations
Process recommendations
•
•
•
•
•
•
To ensure a consistent manufacturing process it is strongly advised to comply with following recommendations:
• The recommended pick-up area for the IMP34DT05 package must be defined using the worst case (ie. no device alignment during picking process). This area has been defined considering all the tolerances of the components involved (reel, package, sound inlet). Picker tolerance shall be considered as well.
• To prevent damage to the MEMS membrane or incorrect pick-up and placement, do not pick up the component on the inlet area
• For the package outline please refer to
Figure 7. Carrier tape with microphone (top view)
. Nozzle shape, size, and placement accuracy are the other key factors to consider when deciding on the coordinates for the picking.
Device alignment before picking is highly recommended.
A vacuum force greater than 7 psi must be avoided
1 kPa = 0.145 psi (lb/in²) = 0.0102 kgf/cm² = 0.0098 atm
MSL (moisture sensitivity level) Class 3
Maximum of 3 reflow cycles is recommended
All recommended dimensions (device safe-picking area) do not include the pick-and-place equipment tolerances
Figure 8. Recommended picking area
DS12725 - Rev 4
To have a safe pick-up "by design", ST strongly advises an ad hoc nozzle.
The following picker ensures that the holes for the vacuum and the air stream are ALWAYS away from the porthole of the device (4 vacuum ports located at each corner of the device).
The recommended nozzle also has a recess, in the form of a cross, which guarantees that the porthole is always left at atmospheric pressure. By using the recommended nozzle, the membrane will not suffer any sudden air disturbances during the picking or placing of the devices in the tape and reel.
page 8/20
Figure 9. Recommended picker design
IMP34DT05
Process recommendations
DS12725 - Rev 4 page 9/20
6
IMP34DT05
Sensing element
Sensing element
The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound pressure into the changes of coupled capacity between those two plates.
DS12725 - Rev 4 page 10/20
7
IMP34DT05
Absolute maximum ratings
Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Symbol
Vdd
Vin
T
STG
ESD
ESD
Table 5. Absolute maximum ratings
Ratings
Supply voltage
Input voltage on any control pin
Storage temperature range
Electrostatic discharge protection
Product standard EN 55024:2010 - 3 air discharges
Maximum value
-0.3 to 5
-0.3 to Vdd +0.3
-40 to +125
±2000 (HBM)
±200 (MM)
±750 (CBM)
±15000
Unit
V
V
°C
V
V
This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part.
This device is sensitive to electrostatic discharge (ESD), improper handling can cause permanent damage to the part.
DS12725 - Rev 4 page 11/20
8
8.1
IMP34DT05
Functionality
Functionality
L/R channel selection
The L/R digital pad lets the user select the DOUT signal pattern as shown in
Table 6. L/R channel selection . The
L/R pin must be connected to Vdd or GND.
L/R
GND
Vdd
Table 6. L/R channel selection
CLK low
Data valid
High impedance
CLK high
High impedance
Data valid
Note: As the L/R pin is internally connected to GND via a 200 kohm pull/down resistor, it is not mandatory to connect the pin itself to GND for the respective channel selection.
DS12725 - Rev 4 page 12/20
9
9.1
IMP34DT05
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com
. ECOPACK is an ST trademark.
Soldering information
The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards and is qualified for soldering heat resistance according to JEDEC J-STD-020.
Land pattern and soldering recommendations are available at www.st.com.
T
P
Figure 10. Recommended soldering profile limits t p
RAMP-UP CRITICAL ZONE
T
L to T
P
T
L
T
SMAX t
L
T
SMIN ts
PREHEAT
RAMP-DOWN
T25° to PEAK
TIME
30 60 90 120 150 180 210 240 270 300 330 360 390
Table 7. Recommended soldering profile limits
Description
Average ramp rate
Preheat
Minimum temperature
Maximum temperature
Time (T
SMIN
to T
SMAX
)
Ramp-up rate
Time maintained above liquidus temperature
Liquidus temperature
Peak temperature
Time within 5 °C of actual peak temperature
Ramp-down rate
Time 25 °C (t25 °C) to peak temperature
Parameter
T
L
to T
P
T
SMIN
T
SMAX t
S
T
SMAX
to T
L t
L
T
L
T
P
Pb free
3 °C/sec max
150 °C
200 °C
60 sec to 120 sec
60 sec to 150 sec
217 °C
260 °C max
20 sec to 40 sec
6 °C/sec max
8 minutes max
DS12725 - Rev 4 page 13/20
9.2
IMP34DT05
HCLGA package information
HCLGA package information
Figure 11. HCLGA (3 x 4 x 1 mm) 4-lead package outline and mechanical data
DS12725 - Rev 4
ITEM
L e
W n i d g t t h h
[ L
[ W
]
]
H e i g h t
A P
[ H ]
Dimensions are in millimeter unless otherwise specified
General Tolerance is +/-0.15mm unless otherwise specified
OUTER DIMENSIONS
DIMENSION [mm]
3
4
Ø
1 .
0
0 0
.
2 5
TOLERANCE [mm]
± 0
± 0
± 0
± 0
.
1
.
1
.
1
.
1
DM00231908_3
1.
The MEMS microphone plastic cap can exhibit some level of variation in color when the device is subjected to thermal processes. This variation does does not affect acoustic or electrical performance.
2.
Ring plating can be subject to change not affecting acoustic and electrical performance.
page 14/20
0.85
Figure 12. Land pattern
1.30
GND
0.40
IMP34DT05
HCLGA package information
0.35
GND
Pad + solder paste
DS12725 - Rev 4 page 15/20
IMP34DT05
Revision history
Date
02-Aug-2018
04-Sep-2018
29-Apr-2019
30-Jun-2021
Table 8. Document revision history
Version
1
2
3
4
Changes
Initial release
Added product label indicating ST's 10-year longevity commitment
Updated Table 4. Timing characteristics
Updated Section 2.2 Timing characteristics
DS12725 - Rev 4 page 16/20
IMP34DT05
Contents
Contents
DS12725 - Rev 4 page 17/20
IMP34DT05
List of tables
List of tables
DS12725 - Rev 4 page 18/20
IMP34DT05
List of figures
List of figures
DS12725 - Rev 4 page 19/20
IMP34DT05
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks . All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2021 STMicroelectronics – All rights reserved
DS12725 - Rev 4 page 20/20
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