MP34DTW01
MEMS audio sensor ultra-wide dynamic range omnidirectional
digital microphone
Datasheet
-
production data
A/V eLearning devices
Gaming and virtual reality input devices
Digital still and video cameras
Antitheft systems
Description
HCLGA (3 x 4 x 1) 4LD The MP34DTW01 is an ultra-compact, ultra-wide dynamic range, low-power MEMS microphone.
The MEMS microphone is capable of sensing both moderate and high sound pressure level of
Features
Ultra-wide dynamic range 140 dBSPL AOP
Wide dynamic operation and high SNR
Single low-voltage supply operation
Low power consumption
Sleep mode for extended battery life
PDM output
Omnidirectional sensitivity
HCLGA package
– SMD-compliant
– EMI-shielded
– ECOPACK
®
, RoHS, and “Green” compliant acoustic signals, exhibiting the widest ever, and thus, sound dynamic range in the digital domain.
The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors.
The MP34DTW01 interface is manufactured using a CMOS process that allows designing a dedicated circuit able to output a PDM digital signal.
The MP34DTW01 has an acoustic overload point of 140 dB SPL with a 60 dB signal-to-noise ratio.
The MP34DTW01 is available in an SMD- compliant, EMI-shielded package and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C
Applications
Mobile terminals Obsolete Product(s) - Obsolete Product(s)
Laptop and notebook computers
Portable media players
VoIP
Speech recognition
Table 1. Device summary
Order codes Temperature range [°C] Package Packing
MP34DTW01
MP34DTW01TR
-40 °C to +85 °C
-40 °C to +85 °C
HCLGA (3 x 4 x 1) mm 4LD
HCLGA (3 x 4 x 1) mm 4LD
Tray
Tape and reel
July 2014
This is information on a product in full production.
DocID023177 Rev 2 1/16 www.st.com
5
6
3
4
7
8
1
2
Contents
Contents
MP34DTW01
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Acoustic and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2
Timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.3
Frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Carrier tape mechanical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Process recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
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MP34DTW01 Pin description
Figure 1. Pin connections
GND 2 3 CLK
Pin #
1
2
3
4
5 (ground ring)
(TOP VIEW)
Vdd 1 4
5
GND
(BOTTOM VIEW)
DOUT
AM045336v2
Pin name
Vdd
GND
CLK
DOUT
GND
Table 2. Pin description
Function
Power supply
0 V supply
Synchronization input clock
PDM data output
0 V supply
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Acoustic and electrical specifications
2 Acoustic and electrical specifications
MP34DTW01
2.1 Acoustic electrical characteristics
The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz,
T = 25 °C, unless otherwise noted.
Symbol Parameter
Vdd
Idd_D
Idd_sleep
Icc
Supply voltage
Current consumption in normal mode
Current consumption in sleep mode
(2)
Short-circuit current
Membrane characteristics
Table 3. Acoustic and electrical characteristics
Test condition Min. Typ.
(1)
1.62
1
1.8
1.0
AOP Acoustic overload point
SNR Signal-to-noise ratio
A-weighted at 1 kHz,
1 Pa
So
PSR
Clock
Ton
Sensitivity
Power supply rejection
Input clock frequency
(3)
Turn-on time
(4)
Guaranteed by design
Guaranteed by design
Top Operating temperature range
V
IOL
V
IOH
Low level logic input/output voltage
High level logic input/output voltage I
1.
Typical specifications are not guaranteed.
2.
Input clock in static mode.
3.
Duty cycle: min = 40% max = 60%.
4.
Time from the first clock edge to valid output data.
I out out
= 1 mA
= 1 mA
-23
1
-40
-0.3
0.65xVdd
140
60
-26
2.4
Max.
3.6
1.15
45
10
Unit
V mA
µA mA dBSPL dB
-29
-70
3.25
10
+85
0.35xVdd
Vdd+0.3
dBFS dBFS
MHz ms
°C
V
V
Parameter
Distortion
Distortion
Distortion
Test condition
120 dBSPL (200 Hz)
135 dBSPL (200 Hz)
140 dBSPL (200 Hz)
Value
< 1% THD + N
< 5% THD + N
< 10% THD + N
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MP34DTW01 Acoustic and electrical specifications
Parameter
Table 5. Timing characteristics
Description f
CLK f
PD
T
CLK
Clock frequency for normal mode
Clock frequency for power-down mode
Clock period for normal mode
1.
From design simulations
(1)
Min.
1
308
Max.
3.25
0.23
1000
Unit
MHz
MHz ns
Figure 2. Frequency response
6
5
4
3
0
-1
2
1
9
8
7
-2
-3
-4
-5
-6
-7
-8
-9
10 100 10000 100000 1000
Frequency [H z]
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Sensing element MP34DTW01
The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate placed in a tiny silicon chip. This sensor transducers the sound pressure into the changes of coupled capacity between those two plates.
Omron Corporation supplies this element for STMicroelectronics.
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MP34DTW01
4 Absolute maximum ratings
Absolute maximum ratings
Stresses above those listed as “Absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Symbol
Table 6. Absolute maximum ratings
Ratings
Vdd Supply voltage
Vin Input voltage on any control pin
T
STG
Storage temperature range
ESD Electrostatic discharge protection
Maximum value
-0.3 to 4.8
-0.3 to Vdd +0.3
-40 to +125
2 (HBM)
Unit
V
V
°C kV
This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part.
This device is ESD-sensitive, improper handling can cause permanent damage to the part.
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Package mechanical data
5 Package mechanical data
MP34DTW01
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Soldering information
The HCLGA 3x4x1 4LD + GND ring package is also compliant with the RoHS and “Green” standards and is qualified for soldering heat resistance according to JEDEC J-STD-020.
Land pattern and soldering recommendations are available at www.st.com
.
T
P
Figure 3. Recommended soldering profile limits t p
RAMP-UP
CRITICAL ZONE
T
L to T
P
T
L
T
SMAX t
L
T
SMIN ts
PREHEAT
RAMP-DOWN
T25°C to PEAK
TIME
30 60 90 120 150 180 210 240 270 300 330 360 390
AM045166v1
Table 7. Recommended soldering profile limits
Description Parameter Pb free
Average ramp rate 3 °C/sec max
Preheat
Minimum temperature T
SMIN
T
SMAX
150 °C
Obsolete Product(s) - Obsolete Product(s)
60 sec to 120 sec Time (T
SMIN
to T
SMAX
) t
S
Ramp-up rate
T
L
to T
P
Time maintained above liquidus temperature
Liquidus temperature
Peak temperature
T
SMAX
to T
L t
L
T
L
T
P
60 sec to 150 sec
217 °C
260 °C max
Time within 5 °C of actual peak temperature 20 sec to 40 sec
Ramp-down rate 6 °C/sec max
Time 25 °C (t25 °C) to peak temperature 8 minutes max
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MP34DTW01
6
Carrier tape mechanical specifications
Carrier tape mechanical specifications
Figure 4. Carrier tape without microphone-top view
Figure 5. Carrier tape with microphone-top view
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Process recommendations MP34DTW01
To ensure a consistent manufacturing process it is strongly advised to comply with following recommendations:
– The recommended pick-up area for the MP34DTW01 package must be defined using the worst case (ie. no device alignment during picking process). This area has been defined considering all the tolerances of the components involved (reel, package, sound inlet). Picker tolerance shall be considered as well.
– To prevent damage to the MEMS membrane or incorrect pick-up and placement, do not pick up the component on the inlet area
–
For the package outline please refer to Figure 5
. Nozzle shape, size, and placement accuracy are the other key factors to consider when deciding on the coordinates for the picking.
– Device alignment before picking is highly recommended.
– A vacuum force greater than 7 psi must be avoided
– 1 kPa = 0.145 psi (lb/in2) = 0.0102 kgf/cm² = 0.0098 atm
– All the recommended dimensions (device safe pick area) do not include the pick and place equipment tolerances
Figure 6. Recommended picking area
Obsolete Product(s) - Obsolete Product(s)
To have a safe pick-up "by design", ST it is strongly advised to an ad hoc nozzle.
Following picker ensures that the holes for the vacuum and the air blow are ALWAYS away from the porthole of the device (4 vacuum ports located at the corner of the device).
The suggested nozzle has also a recess, in the form of a cross, that guarantees the porthole to be always left at atmospheric pressure. By using the suggested nozzle the membrane will not suffer any sudden air disturbances during the picking or placing of the devices in the tape and reel.
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MP34DTW01 Process recommendations
Figure 7. Recommended picker design
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Process recommendations
Figure 8. HCLGA (3 x 4 x 1 mm) 4LD package outline
MP34DTW01
G2
T1 T1
G1
N1
L1
6
G
4X
D2
Obsolete Product(s) - Obsolete Product(s)
D1
1
R
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MP34DTW01 Process recommendations
Symbol
Table 8. HCLGA (3 x 4 x 1 mm) 4LD package dimensions mm.
Min.
Typ.
Max.
G2
G3
G4
G5
G6
N1
N2
T1
T2
G1
M
K
E1
E2
L1
L2
A1
D1
D2
R1
1.300
0.800
0.625
0.375
0.900
0.400
3.050
3.750
2.050
2.750
0.250
0.900
3.900
0.300
0.300
2.900
0.675
0.425
0.950
0.450
3.100
3.800
2.100
2.800
0.300
0.400
0.100
0.050
1.000
4.000
0.500
0.400
3.000
0.000
1.350
0.850
0.725
0.475
1.000
0.500
3.150
3.850
2.150
2.850
0.350
1.100
4.100
0.700
0.500
3.100
±0.200
1.400
0.900
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Process recommendations
0.85
Figure 9. Land pattern
1.30
GND
0.40
MP34DTW01
0.35
GND
Pad + solder paste
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MP34DTW01 Revision history
Date
05-Apr-2013
21-Jul-2014
Revision
Table 9. Document revision history
Changes
1
2
Initial release
Added
Section 6 on page 9
and Section 7 on page 10
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MP34DTW01
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
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