STMicroelectronics MP34DT04 Datasheet
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MP34DT04
MEMS audio sensor omnidirectional digital microphone
Datasheet - production data
•
Gaming and virtual reality input devices
•
Digital still and video cameras
•
Antitheft systems
Description
The MP34DT04 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface.
The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors.
Features
•
Single supply voltage
•
Low power consumption
•
120 dBSPL acoustic overload point
•
64 dB signal-to-noise ratio
•
Omnidirectional sensitivity
•
–26 dBFS sensitivity
•
PDM output
•
HCLGA package
−
Top-port design
−
SMD-compliant
−
EMI-shielded
−
ECOPACK ® , RoHS, and “Green” compliant
The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.
The MP34DT04 has an acoustic overload point of
120 dBSPL with a 64 dB signal-to-noise ratio and
–26 dBFS sensitivity.
The MP34DT04 is available in a top-port, SMDcompliant, EMI-shielded package and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
Table 1: Device summary
Temp.
Order codes Package Packing range [°C]
Applications
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Laptop and notebook computers
•
Portable media players
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VoIP
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Speech recognition
•
A/V eLearning devices
MP34DT04TR -40 to +85
HCLGA
4LD
HCLGA
(3x4x1.095 mm)
4LD
Tray
Tape and reel
November 2016 DocID027586 Rev 3
This is information on a product in full production.
1/21 www.st.com
Contents
Contents
MP34DT04
1 Pin description ................................................................................ 5
2 Acoustic and electrical specifications ........................................... 6
Acoustic and electrical characteristics ............................................... 6
Timing characteristics ....................................................................... 7
Frequency response ......................................................................... 8
3 Application recommendations ....................................................... 9
4 Carrier tape mechanical specifications ....................................... 11
5 Process recommendations ........................................................... 12
6 Sensing element ............................................................................ 14
7 Absolute maximum ratings ........................................................... 15
L/R channel selection ...................................................................... 16
9 Package information ..................................................................... 17
Soldering information ...................................................................... 17
HCLGA package information........................................................... 18
10 Revision history ............................................................................ 20
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MP34DT04
List of tables
List of tables
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List of figures
List of figures
MP34DT04
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MP34DT04
1 Pin description
Figure 1: Pin connections
Pin description
Pin #
1
2
3
4
5 (ground ring)
Pin name
Vdd
LR
CLK
DOUT
GND
Table 2: Pin description
Function
Power supply
Left/Right channel selection
Synchronization input clock
Left/Right PDM data output
0 V supply
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Acoustic and electrical specifications MP34DT04
2 Acoustic and electrical specifications
2.1 Acoustic and electrical characteristics
The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz,
T = 25 °C, unless otherwise noted.
Parameter
Table 3: Acoustic and electrical characteristics
Test condition Min.
Max. Unit Symbol
Vdd
Idd
IddPdn
Scc
AOP
So
Supply voltage
Current consumption in normal mode
Current consumption in power-
Short-circuit current
Acoustic overload point
Sensitivity
Mean value
1.6 1.8
600
120
-26
3.6
700
10
SNR Signal-to-noise ratio
A-weighted at 1 kHz,
94 dB SPL
100 mVpp sine 1 kHz
1
-29
64
10
-23
PSR f
CLK
Ton
Top
V
IOL
V
IOH
Power supply rejection
Operating temperature range
Low-level logic input/output voltage
High-level logic input/output voltage
Guaranteed by design
I out
= 1 mA
I out
= 1 mA
1
-40
-0.3
0.65xVdd
-70
2.4 3.25
10
+85
0.35xVdd
Vdd+0.3
C
LOAD
Capacitive load 100
Notes:
(1)
Typical specifications are not guaranteed.
(2)
Input clock in static mode.
(3)
Duty cycle: min = 40% max = 60%.
(4)
Time from the first clock edge to valid output data.
Parameter
Table 4: Distortion specifications
Value
Distortion
Distortion
100 dBSPL (50 Hz - 4 kHz)
115 dBSPL (1 kHz)
< 1% THD + N
< 5% THD + N
V
μA
µA mA dBSPL dBFS dB (A) dBFS
MHz ms
°C
V
V pF
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2.2 Timing characteristics
Parameter
Acoustic and electrical specifications
Table 5: Timing characteristics
Description Min. Max. Unit f
CLK f
PD
T
CLK
T
R,EN
T
R,DIS
T
L,EN
T
L,DIS
Clock frequency for normal mode
Clock frequency for power-down mode
Clock period for normal mode
Data enabled on DATA line, L/R pin = 1
Data disabled on DATA line, L/R pin = 1
Data enabled on DATA line, L/R pin = 0
Data disabled on DATA line, L/R pin = 0
1
308
3.25
0.23
1000
MHz
MHz ns ns ns ns ns
Notes:
(1)
From design simulations
Figure 2: Timing waveforms
T
CLK
CLK
PDM R
PDM L
T
R,EN
T
R,DIS
High Z
T
L,DIS
High Z
T
L,EN
High Z
High Z
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Acoustic and electrical specifications
2.3 Frequency response
Figure 3: Frequency response and mask
MP34DT04
Table 6: Frequency response mask for digital microphones
Lower limit Upper limit
100...4000
4000...10000
-2
-2
+2
+4
Notes:
(1)
At T = 20 °C and acoustic stimulus = 1 Pa (94 dB SPL)
Unit dBr 1 kHz dBr 1 kHz
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3
Application recommendations
Application recommendations
Figure 4: MP34DT04 electrical connections for stereo configuration
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Application recommendations MP34DT04
Figure 5: MP34DT04 electrical connections for stereo configuration (top view
Power supply decoupling capacitors (100 nF ceramic, 1 µF ceramic) should be placed as near as possible to pin 1 of the device (common design practice).
The L/R pin must be connected to Vdd or GND (refer to Table 8: "L/R channel selection" ).
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4
Carrier tape mechanical specifications
Carrier tape mechanical specifications
Figure 6: Carrier tape without microphone (top view)
Figure 7: Carrier tape with microphone (top view)
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Process recommendations
5 Process recommendations
MP34DT04
To ensure a consistent manufacturing process it is strongly advised to comply with the following recommendations:
•
The recommended pick-up area for the MP34DT04 package must be defined using the worst case (ie. no device alignment during the picking process). This area has been defined considering all the tolerances of the components involved (reel, package, sound inlet). The picker tolerance shall be considered as well.
•
To prevent damage to the MEMS membrane or incorrect pick-up and placement, do not pick up the component on the inlet area.
•
consider when deciding on the coordinates for picking.
•
Device alignment before picking is highly recommended.
•
A vacuum force greater than 7 psi must be avoided
•
1 kPa = 0.145 psi (lb/in 2 ) = 0.0102 kgf/cm² = 0.0098 atm
•
MSL (moisture sensitivity level) Class 3
•
Maximum of 3 reflow cycles is recommended.
•
All recommended dimensions (device safe-picking area) do not include the pick-andplace equipment tolerances
Figure 8: Recommended picking area
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To have a safe pick-up "by design", ST strongly advises an ad hoc nozzle.
The following picker ensures that the holes for the vacuum and the air stream are ALWAYS away from the porthole of the device (4 vacuum ports located at each corner of the device).
The recommended nozzle also has a recess, in the form of a cross, which guarantees that the porthole is always left at atmospheric pressure. By using the recommended nozzle, the membrane will not suffer any sudden air disturbances during the picking or placing of the devices in the tape and reel.
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Figure 9: Recommended picker design
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Sensing element
6 Sensing element
MP34DT04
The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound pressure into the changes of coupled capacity between those two plates.
Omron Corporation supplies this element for STMicroelectronics.
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7
Absolute maximum ratings
Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Symbol
Table 7: Absolute maximum ratings
Ratings Maximum value Unit
Vdd
Vin
T
STG
ESD
Supply voltage
Input voltage on any control pin
Storage temperature range
Electrostatic discharge protection
-0.3 to 5
-0.3 to Vdd +0.3
-40 to +125
±2000 (HBM)
±200 (MM)
±750 (CBM)
V
V
°C
V
ESD
Product standard EN 55024:2010 - 3 air discharge
±15000 V
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Functionality
8
8.1
MP34DT04
Functionality
L/R channel selection
L/R
Table 8: L/R channel selection
CLK low CLK high
GND
Vdd
Data valid
High impedance
High impedance
Data valid
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9
9.1
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK ® is an ST trademark.
Soldering information
The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards and is qualified for soldering heat resistance according to JEDEC J-STD-020.
Land pattern and soldering recommendations are available at www.st.com.
Figure 10: Recommended soldering profile limits t p
T
P
RAMP-UP
CRITICAL ZONE
T
L to T
P
T
L
T
SMAX t
L
T
SMIN t s
PREHEAT
RAMP-DOWN
T25° to PEAK
TIME
30 60 90 120 150 180 210 240 270 300 330 360 390
Table 9: Recommended soldering profile limits
Description Parameter Pb free
Average ramp rate T
L
to T
P
3 °C/sec max
Preheat
T
SMIN
150 °C
Minimum temperature
T
SMAX
200 °C
Maximum temperature t
S
60 sec to 120 sec
Time (T
SMIN
to T
SMAX
)
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60 sec to 150 sec Time maintained above liquids temperature t
L
Liquids temperature T
L
217 °C
Peak temperature
Time within 5 °C of actual peak temperature
Ramp-down rate
Time 25 °C (t25 °C) to peak temperature
T
P
260 °C max
20 sec to 40 sec
6 °C/sec max
8 minutes max
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Package information
9.2 HCLGA package information
MP34DT04
Figure 11: HCLGA (3x4x1.095) 4-lead package outline and mechanical data
Dimensions are in millimeter unless otherwise specified
General Tolerance is +/-0.15mm unless otherwise specified
OUTER DIMENSIONS
ITEM
L e n g t h [ L ]
W i d t h
H e i g h t
[ W ]
[ H ]
AP
DIMENSION [mm]
3
4
1 ɸ
.
0 9 5
0 .
4
TOLERANCE [mm]
± 0 .
1
± 0 .
1
± 0 .
1
± 0 .
1
8579626_B
1. The MEMS microphone plastic cap can exhibit some level of variation in color when the device is subjected to thermal processes. This variation does not affect acoustic or electrical performance.
2. Ring plating can be subject to change not affecting acoustic and electrical Obsolete Product(s) - Obsolete Product(s)
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0.85
Figure 12: Land pattern
1.30
GND
0.40
Package information
0.35
GND
Pad + solder paste
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Revision history
10
Date
10-Mar-2015
07-May-2015
Revision history
Revision
Table 10: Document revision history
Changes
04-Nov-2016
1
2
3
Initial release
Updated Section 9.2: "HCLGA package information"
Added C
LOAD
to Table 3: "Acoustic and electrical characteristics"
Updated Section 3: "Application recommendations"
Updated Section 5: "Process recommendations"
MP34DT04
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© 2016 STMicroelectronics – All rights reserved
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