TEA2025
Stereo audio amplifier
Datasheet
−
production data
Features
■
■
■
■
■
■
■
■
■
■
■
Dual or bridge connection modes
Few external components
Supply voltage 3 V to 15 V
High channel separation
Very low switch-on/off noise
Max gain of 45 dB with adjustable external resistor
Soft clipping
Thermal protection
P
O
= 2 · 1 W, V
S
= 6 V, R
L
= 4 Ω
P
O
= 2 · 2.3 W, V
S
= 9 V, R
L
= 4 Ω
P
O
= 2 · 0.1 W, V
S
= 3 V, R
L
= 4 Ω
PowerDIP16
Description
The TEA2025B is a monolithic integrated circuit housed in the 12+2+2 PowerDIP16 package, intended for use as a dual or bridge power audio amplifier in portable radio cassette players.
Table 1.
Device summary
Part number
TEA2025B
Package
PowerDIP16 (12+2+2)
Figure 1.
Block diagram
GND(Sub) IN 1+ FEED
50
Ω
THERMAL
PROTECT.
-
+
1
START
CIRCUIT
GND
10K
Ω
GND
SVR
BOOT 1
1
OUT 1
5K
Ω
VS+
BRIDGE
IN 2+ -
+
2
10K
Ω
2
50
Ω
D94AU120
50 Ω
FEED GND GND BOOT 2 OUT 2
October 2012
This is information on a product in full production.
Doc ID 1523 Rev 4 1/11 www.st.com
11
Device overview and electrical specifications
1 Device overview and electrical specifications
TEA2025
Table 2.
Symbol
V
S
I
O
T
J
T stg
Absolute maximum ratings
Supply voltage
Ouput peak current
Junction temperature
Storage temperature
Parameter
Figure 2.
Pin connections PowerDIP16 (12+2+2)
Value
15
1.5
150
150
Unit
V
A
°C
°C
Table 3.
Thermal data
Symbol Description
PowerDIP16
(12+2+2)
(1)
Unit
R th j-case
R th j-amb
Thermal resistance junction-case
Thermal resistance junction-ambient
Max
Max
15
60
°C/W
°C/W
1.
R th j-amb
is measured on devices bonded on a 10 x 5 x 0.15 cm glass-epoxy substrate with a 35 mm thick copper surface of 5 cm
2
.
Obsolete Product(s) - Obsolete Product(s)
2/11 Doc ID 1523 Rev 4
TEA2025 Device overview and electrical specifications
Table 4.
Symbol
Electrical characteristcs (T amb
= 25 ° C, V
S
= 9 V, stereo unless otherwise specified )
Parameter Test conditions Min.
Typ.
Max.
Unit
V
S
I
Q
V
O
A
V
Δ A
V
R j
Supply voltage
Quiescent current
Quiescent output voltage
Voltage gain
Voltage gain difference
Input Impedance
Stereo
Bridge
3
43
49
35
4.5
45
51
12
50
47
53
±1
P
O d
Output power (d = 10%)
Distortion
Stereo 8 (per channel)
Bridge
Vs = 9 V; R
L
= 4 Ω
9 V 4 Ω 1.7
9 V 8 Ω
6 V 4 Ω 0.7
6 V 8 Ω
6 V 16 Ω
6 V 32
Ω
3 V 4 Ω
3 V 32 Ω
12 V 8 Ω
9 V 8 Ω
6 V 4 Ω
6 V 8
Ω
3 V 16 Ω
3 V 32 Ω
Stereo
Bridge
1.5
SVR
E
N(IN)
Supply voltage rejection
Input noise voltage f = 100 Hz, V
R
= 0.5 V, R g
= 0
R
G
= 0
R
G
= 10 4 Ω
40 46
1.5
3
3
6 mV mV
CT Crosstalk f = 1 kHz,
R g
= 10 k Ω
40 52 Obsolete Product(s) - Obsolete Product(s) dB dB
%
2.4
4.7
2.8
1.5
0.18
0.06
0.3
0.5
30
2.3
1.3
1
0.6
0.25
0.13
0.1
0.02
W
W
W
W
W
W
W
W
W
W
W
W dB dB dB k Ω
W
W
V mA
V
Term. N ° (PowerDIP16) 1
DC volt. (V) 0.04
2
4.5
3
8.9
4
0
5 6 7 8 9 10 11 12 13 14 15 16
0 0.6
0.04
8.5
0 0.04
0.6
0 0 8.9
4.5
9
Doc ID 1523 Rev 4 3/11
Device overview and electrical specifications
Figure 3.
Bridge application Figure 4.
Stereo application
TEA2025
Figure 5.
Supply current vs. supply voltage
(R
L
= 4 Ω )
Figure 6.
Output voltage vs. supply voltage
Figure 7.
Output power vs. supply voltage
(THD = 10%, f = 1 kHz)
Figure 8.
THD vs. output power
(f = 1 kHz, V
S
= 6 V)
Obsolete Product(s) - Obsolete Product(s)
4/11 Doc ID 1523 Rev 4
TEA2025 Application information
The input capacitor is PNP type allowing the source to be referenced to ground. In this way no input coupling capacitor is required. However, a series capacitor (0.22 µF) to the input side can be useful in case of noise due to variable resistor contact.
2.2 Bootstrap
The bootstrap connection allows increasing the output swing.
The recommended value for the bootstrap capacitors (100 µF) avoids a reduction of the output signal also at low frequencies and low supply voltages.
2.3 Voltage gain adjustment
The voltage gain is determined by on-chip resistors R1 and R2 together with the external
RfC1 series connected between pin 6 (11) and ground. The frequency response is approximated by:
V
--------------
V
IN
=
Rf ÷ R2 +
JWC1
With Rf = 0, C1 = 100 µF, the gain results in 46 dB with pole at f = 32 Hz.
The purpose of Rf is to reduce the gain. It is recommended to not reduce it under 36 dB.
Figure 9.
Internal voltage divider
Obsolete Product(s) - Obsolete Product(s)
The bridge configuration is realized very easily thanks to an internal voltage divider which provides (at pin 1) the CH 1 output signal after reduction.
Doc ID 1523 Rev 4 5/11
Application information TEA2025
It is sufficient to connect pin 6 (inverting input of CH 2) with a capacitor to pin 1 and to connect pin 7 to ground. The total gain of the bridge is given by:
V
--------------
V
IN
=
Rf ÷ R2
R1
1
+
JWC1
⎝
⎜
⎛
⎜ +
R4
R2 + R4 +
JWC1
⎠
⎟
⎟
⎞ and with the recommended values (C1 = C2 = 100 µF, Rf= 0), then Gv = 52 dB with first pole at f = 32 Hz
Figure 10.
Bridge configuration (stereo)
The low cutoff frequency due to the output capacitor depending on the load is given by:
F
L
=
2 Π C
OUT
⋅ R
L with C
OUT
470 µF and R
L
= 4 ohm, then F
L
= 80 Hz.
Obsolete Product(s) - Obsolete Product(s)
6/11 Doc ID 1523 Rev 4
TEA2025 Application information
Most amplifiers similar to the TEA2025B need external resistors between the DC outputs and ground in order to minimize pop on/off noise and crossover distortion.
Figure 11.
Internal resistor
The TEA2025B requires less components as these resistors (800 ohm) are in the device.
2.6 Stability
A good layout is recommended in order to avoid oscillations.
Generally the designer must pay attention to the following points:
●
●
●
Short wires of components and short connections.
No ground loops
Bypass of supply voltage with capacitors as close as possible to the supply IC pin. The low value (polyester) capacitors must have suitable temperature and frequency characteristics.
■ No sockets
The heatsink can have a smaller factor of safety compared with that of a conventional circuit. There is no device damage in the case of excessive junction temperature: P
O
(and therefore P tot
) and I d
are simply reduced.
Obsolete Product(s) - Obsolete Product(s)
Doc ID 1523 Rev 4 7/11
Application suggestions TEA2025
The recommended values of the components are those shown in the stereo application circuit of
Figure 4 , although different values can be used (refer to the following table).
Table 5.
Recommended values for stereo applications
Component
Recommended value
Purpose
Larger than
C1, C2 0.22 µF
Input DC decoupling in case of slider contact noise of variable resistor
Smaller than
Degradation of SVR, increase of at low frequency and low voltage
C3
C4, C5
C6, C7
C8, C9
C10, C11
100 µF
100 µF
470 µF
0.15 µF
100 µF
Ripple rejecton
Bootstrap
Output DC decoupling
Frequency stability
Inverting input DC decoupling
Increase of low frequency cutoff
Danger of oscillations
Increase of low frequency cutoff
Obsolete Product(s) - Obsolete Product(s)
8/11 Doc ID 1523 Rev 4
TEA2025
4 Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Figure 12.
PowerDIP16 mechanical data and package dimensions
F
I e e 3
D
E b b 1
DIM.
mm inch
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
a 1
B
0.51
0.77
1.65
0.020
0.0
3 0 0.065
0.5
0.25
0.020
0.010
20 0.7
8 7
8 .5
2.54
17.7
8
0.
33 5
0.100
0.700
7.1
5.1
0.2
8 0
0.201
L
Z
3 .
3
1.27
0.1
3 0
0.050
OUTLINE AND
MECHANICAL DATA
PowerDIP16
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Doc ID 1523 Rev 4 9/11
Revision history TEA2025
Table 6.
Date
Revision history
Revision
September 2003 2
30-Apr-2010
01-Oct-2012
3
4
Changes
Updates not recorded
Updated title and added environmental compliance statement for package
Removed SO20 package option from datasheet
Minor textual updates
Revised document presentation
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10/11 Doc ID 1523 Rev 4
TEA2025
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Doc ID 1523 Rev 4 11/11
