X006
Datasheet
0.8 A 600 V logic level gate thyristor SCR in TO-92 package
G
A
K
K
TO-92 (preform)
G
A
TO-92 (straight)
K
G
A
Product status link
X006
Product summary
I
T(RMS)
V
DRM
/V
RRM
I
GT
T j max.
0.8 A
600 V
200 µA
125 °C
Features
• On-state RMS current, I
T(RMS)
0.8 A
• Repetitive peak off-state voltage 600 V
• Triggering gate current 200 μA
• ECOPACK2 compliant
Applications
• Limited gate current topologies
• Ground fault circuit interrupters
• Overvoltage crowbar protection in power supplies
• Protection in electronic ballasts
• Capacitive discharge ignitions
• Ignitors (lighting, oven...)
Description
Available in through hole package, the X006 SCR can be used as on/off function in applications where topology does not offer high current for gate triggering.
This device is optimized in forward voltage drop and inrush current capabilities for reduced power losses and high reliability in harsh environments.
Thanks to its highly sensitive triggering current the X006 is suitable for the applications such as breaker, ground fault interrupter, overvoltage crowbar protection of power supplies or capacitive ignition circuits.
DS1704 - Rev 6 - January 2022
For further information contact your local STMicroelectronics sales office.
www.st.com
1
X006
Characteristics
Characteristics
Symbol
I
T(RMS)
I
T(AV)
I
TSM
I 2 t dl/dt
Table 1. Absolute maximum ratings (limiting values, T j
= 25 °C unless otherwise specified)
I
GM
P
G(AV)
T stg
T j
Parameters
On-state RMS current (180° conduction angle)
Average on-state current (180° conduction angle)
Non repetitive surge peak on-state current,
T j
initial = 25 °C
I 2 t value for fusing
Critical rate of rise of on-state current
I
G
= 2 x I
GT
, t r
≤ 100 ns
Peak gate current
Average gate power dissipation
Storage junction temperature range
Operating junction temperature range
TO-92
TO-92 t p
= 8.3 ms t p
= 10 ms t p
= 10 ms
F = 60 Hz t p
= 20 µs
T
L
= 83 °C
T
L
= 83 °C
T j
= 25 °C
T j
= 25 °C
T j
= 125 °C
T j
= 125 °C
T j
= 125 °C
Value
0.8
0.5
10
9
0.4
50
1
0.1
-40 to +150
-40 to +125
Unit
A
A
A
A 2 s
A/µs
A
W
°C
°C
Symbol
I
GT
V
GT
V
GD
V
RG
I
H
I
L dV/dt
Table 2. Electrical characteristics (T j
= 25 °C, unless otherwise specified)
Parameters
V
D
= 12 V, R
L
= 140 Ω
V
D
= V
DRM
, R
L
= 3.3 kΩ, R
GK
= 1 kΩ, T j
= 125 °C
I
RG
= 10 µA
I
T
= 50 mA, R
GK
= 1 kΩ
I
G
= 1 mA, R
GK
= 1 kΩ
V
D
= 67 % V
DRM
, R
GK
= 1 kΩ, T j
= 125 °C
Value Unit
Min.
15
Max.
200
Max.
0.8
µA
V
V Min.
0.2
Min.
Max.
5
5
Max.
Min.
6
25 mA mA
V/µs
Symbol
V
TM
V
TO
R d
I
DRM
I
RRM
Table 3. Static electrical characteristics
Test conditions
I
TM
= 1 A, t p
= 380 µs
Threshold on-state voltage
Dynamic resistance
V
DRM
= V
RRM
, R
GK
= 1 kΩ
V
DRM
= V
RRM
, R
GK
= 1 kΩ
25 °C Max.
Value Unit
1.35
125 °C Max.
0.85
125 °C Max.
245
V
V mΩ
25 °C
125 °C
Max.
1
100
µA
Symbol
R th(j-l)
R th(j-a)
Junction to leads (DC)
Junction to ambient (DC)
Table 4. Thermal resistance
Parameters
TO-92
TO-92
Max.
value
70
150
Unit
°C/W
DS1704 - Rev 6 page 2/9
X006
Characteristics (curves)
1.1
Characteristics (curves)
0.4
0.3
0.2
0.1
0.0
0.0
Figure 1. Maximum average power dissipation versus average on-state current
0.6
P(W)
α = 180°
0.5
0.1
0.2
I
T(AV)
(A)
0.3
0.4
α
0.5
360°
0.6
Figure 2. Average and DC on-state current versus lead temperature (TO-92)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.0
I
T(AV)
(A)
0.9
0 25 50
D.C.
α = 180°
T l
(°C)
75
TO-92
100 125
Figure 3. Average and DC on-state current versus ambient temperature (epoxy printed circuit board FR4, copper thickness = 35 µm, S
CU
= 0.5 cm2)(TO-92)
Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration (PCB FR4, copper thickness = 35 µm, S
CU
= 0.5 cm2)(TO-92)
1.0
I
T(AV)
(A)
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
α = 180°
D.C.
25 50
T amb
(°C)
75
S
CU
TO-92
= 0.5 cm 2
100 125
1.00
Z th(j-a)
/R th(j-a)
S
CU
TO-92
= 0.5 cm 2
0.10
0.01
1.E-03 1.E-02 1.E-01 t p (s)
1.E+00 1.
E+01 1.E+02 1.E+03
Figure 5. Relative variation of gate trigger, holding and latching current versus junction temperature (typical values)
1.6
I
GT
,
H L
T ] / I
GT
,I
H
,I
L
[T j
=25°C]
1.4
1.2
1.0
0.8
0.6
0.4
I
GT
I
H
& I
L
0.2
T j
(°C)
0.0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130
Figure 6. Relative variation of holding current versus gate-cathode resistance (typical values)
3.5
I [R
G K
] / I [ R
GK
=1kΩ]
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.E-02 1.E-01
R GK (kΩ)
1.E+00 1.E+01 1.E+02
DS1704 - Rev 6 page 3/9
X006
Characteristics (curves)
Figure 7. Relative variation of static dV/dt immunity versus gate-cathode resistance (typical values)
100.0
dV/dt[R
GK
] / dV/dt[ R
GK
=1kΩ]
V
D
= 0.67 x V
DRM
Figure 8. Relative variation of static dV/dt immunity versus gate-cathode capacitance (typical values)
100 dV/dt[C
GK
] / dV/dt[R
GK
=1kΩ]
V
D
= 0.67 x V
DRM
R
GK
= 1k Ω
10.0
10
1.0
R
GK
(kΩ)
1.0E+00
C
GK
(nF)
0.1
1.0E-01 1.0E+01
1
1 10
Figure 9. Surge peak on-state current versus number of cycles
10
I
TSM
(A)
9
8
5
4
3
2
7
6
1
0
1
Repetitive
T
C
= 83 °C
Non repetitive
T j initial = 25 °C
10
Number of cycles
100 t p
= 10 ms
One cycle
1000
Figure 10. Non-repetitive surge peak on-state current for sinusoidal pulse (t p
< 10 ms)
1.
E+02
I
TSM
(A)
T j initial = 25 °C
I
TSM
1.
E+01
1.E+00
1.E-01
0.01
0.10
t p
(ms)
1.00
10.00
Figure 11. On-state characteristics (maximum values)
10.00
I
TM
(A)
T j max.:
V = 0.85 V
1.00
T j
= 125 °C
T j
= 25 °C
0.10
V
TM
(V)
0.01
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
DS1704 - Rev 6 page 4/9
2
2.1
X006
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com
. ECOPACK is an ST trademark.
•
•
TO-92 with straight leads (plastic) package information
Lead free plating + halogen-free molding resin
Epoxy meets UL94, V0
Figure 12. TO-92 with straight leads (plastic) package outline c
A
B C a b
F D E
Table 5. TO-92 with straight leads (plastic) package mechanical data
Dimensions
Ref.
Min.
Millimeters
Typ.
1.35
E
F a b c
C
D
A
B
4.40
12.70
2.54
1.27
1. Inches dimensions given for information
Max.
4.70
3.70
0.50
0.48
Min.
0.172
0.554
Inches
(1)
Typ.
0.048
0.100
0.050
Max.
0.190
0.152
0.022
0.019
DS1704 - Rev 6 page 5/9
2.2
X006
TO-92 with leads preform (plastic) package information
•
•
TO-92 with leads preform (plastic) package information
Lead free plating + halogen-free molding resin
Epoxy meets UL94, V0
Figure 13. TO-92 with leads preform (plastic) package outline
DS1704 - Rev 6
Table 6. TO-92 with leads preform (plastic) package mechanical data
Dimensions
Ref.
G
H d
θ
Min.
1.30
7.69
2.40
30°
Millimeters
Typ.
1.70
40°
1. Inches dimensions given for information
Max.
2.00
9.69
2.90
50°
Min.
0.051
0.303
0.094
30°
Inches
(1)
Typ.
0.067
40°
Max.
0.079
0.381
0.114
50° page 6/9
3
Ordering information
Figure 14. Ordering information scheme
X 006 02 M A 1AA2
X006
Ordering information
Sensitive SCR series
Current
006 = 0.8 A
Sensitivity
02 = 200 µA
Voltage
M = 600 V
Package
A = TO-92
Packing mode
1AA2 = Bulk (TO-92 with straight leads)
2AL2 = Ammopack (TO-92 with leads preform)
5AL2 = Tape and reel (TO-92 with leads preform)
Order code
X00602MA 1AA2
X00602MA 2AL2
X00602MA 5AL2
Marking
X0602 MA
Table 7. Ordering information
Package
TO-92 straight leads
TO-92 leads preform
Weight
0.2 g
0.2 g
0.2 g
Base qty.
2500
2000
2000
Delivery mode
Bulk
Ammopack
Tape and reel
DS1704 - Rev 6 page 7/9
Revision history
Date
26-May-2009
03-May-2012
03-Sep-2021
18-Jan-2022
5
6
Table 8. Document revision history
Revision
3
4
Changes
Last update.
SOT-223 package added.
Reformatted to current standards. Device X00605 removed. Updated dimensions in Table 5.
Removed SOT-223 package information. Added Section 2.2 TO-92 with leads preform (plastic) package information .
X006
DS1704 - Rev 6 page 8/9
X006
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DS1704 - Rev 6 page 9/9
